JP2000058920A - 半導体およびその製造方法 - Google Patents
半導体およびその製造方法Info
- Publication number
- JP2000058920A JP2000058920A JP21460299A JP21460299A JP2000058920A JP 2000058920 A JP2000058920 A JP 2000058920A JP 21460299 A JP21460299 A JP 21460299A JP 21460299 A JP21460299 A JP 21460299A JP 2000058920 A JP2000058920 A JP 2000058920A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- ingan
- iii
- nitride
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
- H10H20/01335—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
Landscapes
- Semiconductor Lasers (AREA)
- Led Devices (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/127,038 | 1998-07-31 | ||
| US09/127,038 US6233265B1 (en) | 1998-07-31 | 1998-07-31 | AlGaInN LED and laser diode structures for pure blue or green emission |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010292773A Division JP2011082563A (ja) | 1998-07-31 | 2010-12-28 | 半導体およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000058920A true JP2000058920A (ja) | 2000-02-25 |
| JP2000058920A5 JP2000058920A5 (enExample) | 2006-09-14 |
Family
ID=22428012
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21460299A Pending JP2000058920A (ja) | 1998-07-31 | 1999-07-29 | 半導体およびその製造方法 |
| JP2010292773A Pending JP2011082563A (ja) | 1998-07-31 | 2010-12-28 | 半導体およびその製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010292773A Pending JP2011082563A (ja) | 1998-07-31 | 2010-12-28 | 半導体およびその製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (3) | US6233265B1 (enExample) |
| EP (1) | EP0977279A3 (enExample) |
| JP (2) | JP2000058920A (enExample) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003158297A (ja) * | 2001-11-13 | 2003-05-30 | Lumileds Lighting Us Llc | 分極電界が減少された窒化物半導体デバイス |
| JP2005136005A (ja) * | 2003-10-28 | 2005-05-26 | Matsushita Electric Works Ltd | 発光素子 |
| JP2005311374A (ja) * | 2004-04-21 | 2005-11-04 | Lumileds Lighting Us Llc | 歪みを制御したiii族窒化物発光装置 |
| JP2007096330A (ja) * | 2005-09-27 | 2007-04-12 | Philips Lumileds Lightng Co Llc | Iii−v族発光デバイス |
| JP2009026956A (ja) * | 2007-07-19 | 2009-02-05 | Sumitomo Electric Ind Ltd | 発光素子、発光素子のための基板生産物、および発光素子を作製する方法 |
| JP2009267239A (ja) * | 2008-04-28 | 2009-11-12 | Toyoda Gosei Co Ltd | 発光装置 |
| JP2010500741A (ja) * | 2006-08-11 | 2010-01-07 | シリウム テクノロジーズ インコーポレイテッド | 界面特性及び拡散テールが制御された半導体デバイスをiv族基板上に製作する方法 |
| WO2010020065A1 (en) * | 2008-08-19 | 2010-02-25 | Lattice Power (Jiangxi) Corporation | Method for fabricating ingan-based multi-quantum well layers |
| US8362460B2 (en) | 2006-08-11 | 2013-01-29 | Cyrium Technologies Incorporated | Method of fabricating semiconductor devices on a group IV substrate with controlled interface properties and diffusion tails |
| WO2014017303A1 (ja) * | 2012-07-26 | 2014-01-30 | シャープ株式会社 | 半導体発光素子 |
Families Citing this family (97)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6423984B1 (en) | 1998-09-10 | 2002-07-23 | Toyoda Gosei Co., Ltd. | Light-emitting semiconductor device using gallium nitride compound semiconductor |
| JP3685306B2 (ja) * | 1999-03-03 | 2005-08-17 | パイオニア株式会社 | 2波長半導体レーザ素子及びその製造方法 |
| US6133589A (en) | 1999-06-08 | 2000-10-17 | Lumileds Lighting, U.S., Llc | AlGaInN-based LED having thick epitaxial layer for improved light extraction |
| JP3511372B2 (ja) * | 1999-08-31 | 2004-03-29 | シャープ株式会社 | 半導体発光素子およびそれを使用した表示装置 |
| US6563144B2 (en) * | 1999-09-01 | 2003-05-13 | The Regents Of The University Of California | Process for growing epitaxial gallium nitride and composite wafers |
| JP2001119102A (ja) * | 1999-10-15 | 2001-04-27 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体レーザダイオード |
| DE20122488U1 (de) | 2000-03-08 | 2005-12-15 | Given Imaging Ltd. | Vorrichtung und System für In-Vivo-Bildgebung |
| US6535536B2 (en) * | 2000-04-10 | 2003-03-18 | Fuji Photo Film Co., Ltd. | Semiconductor laser element |
| AU2001274810A1 (en) * | 2000-04-17 | 2001-10-30 | Virginia Commonwealth University | Defect reduction in gan and related materials |
| GB2365208A (en) * | 2000-07-19 | 2002-02-13 | Juses Chao | Amorphous alingan light emitting diode |
| US6495867B1 (en) | 2000-07-26 | 2002-12-17 | Axt, Inc. | InGaN/AlGaN/GaN multilayer buffer for growth of GaN on sapphire |
| US6504183B1 (en) * | 2000-09-08 | 2003-01-07 | United Epitaxy Company | Epitaxial growth of nitride semiconductor device |
| US6683324B2 (en) * | 2000-09-26 | 2004-01-27 | Fuji Photo Film Co., Ltd. | Semiconductor laser device in which thicknesses of optical guide region and AlGaN cladding layers satisfy predetermined condition |
| JP2002190621A (ja) * | 2000-10-12 | 2002-07-05 | Sharp Corp | 半導体発光素子およびその製造方法 |
| JP2002141551A (ja) * | 2000-10-31 | 2002-05-17 | Fuji Photo Film Co Ltd | 発光ダイオード |
| US6777253B2 (en) * | 2000-12-20 | 2004-08-17 | Matsushita Electric Industrial Co., Ltd. | Method for fabricating semiconductor, method for fabricating semiconductor substrate, and semiconductor light emitting device |
| EP2402359A1 (en) * | 2000-12-28 | 2012-01-04 | Wyeth LLC | Recombinant protective protein from streptococcus pneumoniae |
| TW488088B (en) * | 2001-01-19 | 2002-05-21 | South Epitaxy Corp | Light emitting diode structure |
| US6712478B2 (en) * | 2001-01-19 | 2004-03-30 | South Epitaxy Corporation | Light emitting diode |
| WO2002067334A1 (en) * | 2001-02-20 | 2002-08-29 | University Of Maryland, Baltimore County | Multiple quantum well broad spectrum gain medium and method for forming same |
| US6635904B2 (en) * | 2001-03-29 | 2003-10-21 | Lumileds Lighting U.S., Llc | Indium gallium nitride smoothing structures for III-nitride devices |
| JP3876649B2 (ja) * | 2001-06-05 | 2007-02-07 | ソニー株式会社 | 窒化物半導体レーザ及びその製造方法 |
| TW492202B (en) * | 2001-06-05 | 2002-06-21 | South Epitaxy Corp | Structure of III-V light emitting diode (LED) arranged in flip chip configuration having structure for preventing electrostatic discharge |
| TW546855B (en) * | 2001-06-07 | 2003-08-11 | Sumitomo Chemical Co | Group 3-5 compound semiconductor and light emitting diode |
| TW541710B (en) * | 2001-06-27 | 2003-07-11 | Epistar Corp | LED having transparent substrate and the manufacturing method thereof |
| TWI262606B (en) | 2001-08-30 | 2006-09-21 | Osram Opto Semiconductors Gmbh | Radiation-emitting semiconductor-element and its production method |
| DE10142653A1 (de) * | 2001-08-31 | 2003-04-30 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement und Verfahren zu dessen Herstellung |
| US6833564B2 (en) * | 2001-11-02 | 2004-12-21 | Lumileds Lighting U.S., Llc | Indium gallium nitride separate confinement heterostructure light emitting devices |
| US6841406B2 (en) * | 2001-11-06 | 2005-01-11 | Edward Brittain Stokes | Methods and apparatus for a semiconductor device |
| JP2003163369A (ja) * | 2001-11-27 | 2003-06-06 | Toyota Central Res & Dev Lab Inc | 半導体発光素子及び光伝送装置 |
| US6724013B2 (en) * | 2001-12-21 | 2004-04-20 | Xerox Corporation | Edge-emitting nitride-based laser diode with p-n tunnel junction current injection |
| US6888875B2 (en) * | 2002-01-28 | 2005-05-03 | Fuji Photo Film Co., Ltd. | Light source apparatus equipped with a GaN type semiconductor laser, a method of eliminating stray light, and an image forming apparatus |
| AU2003299500A1 (en) * | 2002-05-17 | 2004-06-07 | The Regents Of The University Of California | Hafnium nitride buffer layers for growth of gan on silicon |
| US6783592B2 (en) * | 2002-10-10 | 2004-08-31 | The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration | Lateral movement of screw dislocations during homoepitaxial growth and devices yielded therefrom free of the detrimental effects of screw dislocations |
| US6990132B2 (en) * | 2003-03-20 | 2006-01-24 | Xerox Corporation | Laser diode with metal-oxide upper cladding layer |
| KR20040087121A (ko) * | 2003-04-04 | 2004-10-13 | 삼성전기주식회사 | 질화 갈륨계 반도체 led 소자 |
| EP1467415B1 (en) * | 2003-04-08 | 2019-06-12 | Lumileds Holding B.V. | Improved LED efficiency using photonic crystal structure |
| KR101034055B1 (ko) | 2003-07-18 | 2011-05-12 | 엘지이노텍 주식회사 | 발광 다이오드 및 그 제조방법 |
| US20050110040A1 (en) * | 2003-11-26 | 2005-05-26 | Hui Peng | Texture for localizing and minimizing effects of lattice constants mismatch |
| KR20050061994A (ko) * | 2003-12-19 | 2005-06-23 | 삼성전기주식회사 | In 도핑을 통한 GaN 측면 성장 방법 |
| KR100506739B1 (ko) * | 2003-12-23 | 2005-08-08 | 삼성전기주식회사 | 알루미늄(Al)을 함유한 질화물 반도체 결정 성장방법 |
| US20050211291A1 (en) * | 2004-03-23 | 2005-09-29 | The Boeing Company | Solar cell assembly |
| KR100678854B1 (ko) * | 2004-04-13 | 2007-02-05 | 엘지이노텍 주식회사 | 발광 다이오드 및 그 제조방법 |
| KR100541111B1 (ko) * | 2004-06-25 | 2006-01-11 | 삼성전기주식회사 | 다파장 반도체 레이저 제조방법 |
| KR100541110B1 (ko) * | 2004-06-25 | 2006-01-11 | 삼성전기주식회사 | 다파장 반도체 레이저 제조방법 |
| US6979835B1 (en) * | 2004-09-11 | 2005-12-27 | Formosa Epitaxy Incorporation | Gallium-nitride based light-emitting diode epitaxial structure |
| US7751455B2 (en) * | 2004-12-14 | 2010-07-06 | Palo Alto Research Center Incorporated | Blue and green laser diodes with gallium nitride or indium gallium nitride cladding laser structure |
| TWI245440B (en) * | 2004-12-30 | 2005-12-11 | Ind Tech Res Inst | Light emitting diode |
| RU2277736C1 (ru) * | 2005-02-02 | 2006-06-10 | Закрытое акционерное общество "Нитридные источники света" | Полупроводниковый элемент, излучающий свет в синей области видимого спектра |
| KR100712753B1 (ko) * | 2005-03-09 | 2007-04-30 | 주식회사 실트론 | 화합물 반도체 장치 및 그 제조방법 |
| CN100433372C (zh) * | 2005-04-15 | 2008-11-12 | 香港理工大学 | 一种紫外线检测装置 |
| CN100369280C (zh) * | 2005-04-26 | 2008-02-13 | 华宇电脑股份有限公司 | 发光半导体器件及其形成方法 |
| US7265374B2 (en) * | 2005-06-10 | 2007-09-04 | Arima Computer Corporation | Light emitting semiconductor device |
| US7795050B2 (en) * | 2005-08-12 | 2010-09-14 | Samsung Electronics Co., Ltd. | Single-crystal nitride-based semiconductor substrate and method of manufacturing high-quality nitride-based light emitting device by using the same |
| KR100753152B1 (ko) * | 2005-08-12 | 2007-08-30 | 삼성전자주식회사 | 질화물계 발광소자 및 그 제조방법 |
| US9406505B2 (en) * | 2006-02-23 | 2016-08-02 | Allos Semiconductors Gmbh | Nitride semiconductor component and process for its production |
| JP5225549B2 (ja) | 2006-03-15 | 2013-07-03 | 日本碍子株式会社 | 半導体素子 |
| US7906357B2 (en) * | 2006-05-15 | 2011-03-15 | Koninklijke Philips Electronics N.V. | P-type layer for a III-nitride light emitting device |
| US7714340B2 (en) | 2006-09-06 | 2010-05-11 | Palo Alto Research Center Incorporated | Nitride light-emitting device |
| KR100765240B1 (ko) * | 2006-09-30 | 2007-10-09 | 서울옵토디바이스주식회사 | 서로 다른 크기의 발광셀을 가지는 발광 다이오드 패키지및 이를 채용한 발광 소자 |
| US7951693B2 (en) * | 2006-12-22 | 2011-05-31 | Philips Lumileds Lighting Company, Llc | III-nitride light emitting devices grown on templates to reduce strain |
| US7534638B2 (en) * | 2006-12-22 | 2009-05-19 | Philips Lumiled Lighting Co., Llc | III-nitride light emitting devices grown on templates to reduce strain |
| US7547908B2 (en) * | 2006-12-22 | 2009-06-16 | Philips Lumilieds Lighting Co, Llc | III-nitride light emitting devices grown on templates to reduce strain |
| US20090032799A1 (en) | 2007-06-12 | 2009-02-05 | Siphoton, Inc | Light emitting device |
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| US20090032828A1 (en) * | 2007-08-03 | 2009-02-05 | Philips Lumileds Lighting Company, Llc | III-Nitride Device Grown on Edge-Dislocation Template |
| TWI341600B (en) * | 2007-08-31 | 2011-05-01 | Huga Optotech Inc | Light optoelectronic device and forming method thereof |
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| TWI381547B (zh) * | 2007-11-14 | 2013-01-01 | Advanced Optoelectronic Tech | 三族氮化合物半導體發光二極體及其製造方法 |
| US7718455B2 (en) * | 2007-12-17 | 2010-05-18 | Palo Alto Research Center Incorporated | Method of forming a buried aperture nitride light emitting device |
| TWI398962B (zh) * | 2008-03-27 | 2013-06-11 | Epistar Corp | 氮化鎵半導體元件 |
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| WO2010011201A1 (en) * | 2008-07-21 | 2010-01-28 | Pan Shaoher X | Light emitting device |
| TWI415295B (zh) * | 2008-06-24 | 2013-11-11 | Advanced Optoelectronic Tech | 半導體元件的製造方法及其結構 |
| JP5053220B2 (ja) * | 2008-09-30 | 2012-10-17 | 古河電気工業株式会社 | 半導体電子デバイスおよび半導体電子デバイスの製造方法 |
| TWI401729B (zh) * | 2008-10-16 | 2013-07-11 | Advanced Optoelectronic Tech | 阻斷半導體差排缺陷之方法 |
| WO2010141945A1 (en) * | 2009-06-05 | 2010-12-09 | The Regents Of The University Of California | Asymmetrically cladded laser diode |
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| JP2013502079A (ja) | 2009-08-12 | 2013-01-17 | ジョージア ステート ユニバーシティ リサーチ ファウンデーション,インコーポレイテッド | 高圧化学蒸着装置、方法、およびそれにより製造される組成物 |
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| JP5148729B2 (ja) * | 2011-05-16 | 2013-02-20 | 株式会社東芝 | 窒化物半導体素子の製造方法 |
| US9362719B2 (en) | 2012-03-30 | 2016-06-07 | The Regents Of The University Of Michigan | GaN-based quantum dot visible laser |
| US20180277713A1 (en) * | 2017-03-21 | 2018-09-27 | Glo Ab | Red light emitting diodes having an indium gallium nitride template layer and method of making thereof |
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| US10768515B2 (en) | 2017-12-12 | 2020-09-08 | Tectus Corporation | Method for manufacturing ultra-dense LED projector using thinned gallium nitride |
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| JPH07249795A (ja) * | 1994-03-09 | 1995-09-26 | Toshiba Corp | 半導体素子 |
| JPH09283799A (ja) * | 1996-04-09 | 1997-10-31 | Mitsubishi Cable Ind Ltd | 半導体発光素子 |
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| US5656832A (en) | 1994-03-09 | 1997-08-12 | Kabushiki Kaisha Toshiba | Semiconductor heterojunction device with ALN buffer layer of 3nm-10nm average film thickness |
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-
1998
- 1998-07-31 US US09/127,038 patent/US6233265B1/en not_active Expired - Lifetime
-
1999
- 1999-07-19 EP EP99305694A patent/EP0977279A3/en not_active Withdrawn
- 1999-07-28 US US09/363,314 patent/US6285696B1/en not_active Expired - Lifetime
- 1999-07-28 US US09/363,251 patent/US6345063B1/en not_active Expired - Lifetime
- 1999-07-29 JP JP21460299A patent/JP2000058920A/ja active Pending
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2010
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| JPH07249795A (ja) * | 1994-03-09 | 1995-09-26 | Toshiba Corp | 半導体素子 |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003158297A (ja) * | 2001-11-13 | 2003-05-30 | Lumileds Lighting Us Llc | 分極電界が減少された窒化物半導体デバイス |
| JP2005136005A (ja) * | 2003-10-28 | 2005-05-26 | Matsushita Electric Works Ltd | 発光素子 |
| JP2005311374A (ja) * | 2004-04-21 | 2005-11-04 | Lumileds Lighting Us Llc | 歪みを制御したiii族窒化物発光装置 |
| JP2007096330A (ja) * | 2005-09-27 | 2007-04-12 | Philips Lumileds Lightng Co Llc | Iii−v族発光デバイス |
| JP2010500741A (ja) * | 2006-08-11 | 2010-01-07 | シリウム テクノロジーズ インコーポレイテッド | 界面特性及び拡散テールが制御された半導体デバイスをiv族基板上に製作する方法 |
| US8362460B2 (en) | 2006-08-11 | 2013-01-29 | Cyrium Technologies Incorporated | Method of fabricating semiconductor devices on a group IV substrate with controlled interface properties and diffusion tails |
| JP2009026956A (ja) * | 2007-07-19 | 2009-02-05 | Sumitomo Electric Ind Ltd | 発光素子、発光素子のための基板生産物、および発光素子を作製する方法 |
| JP2009267239A (ja) * | 2008-04-28 | 2009-11-12 | Toyoda Gosei Co Ltd | 発光装置 |
| WO2010020065A1 (en) * | 2008-08-19 | 2010-02-25 | Lattice Power (Jiangxi) Corporation | Method for fabricating ingan-based multi-quantum well layers |
| WO2014017303A1 (ja) * | 2012-07-26 | 2014-01-30 | シャープ株式会社 | 半導体発光素子 |
| JP2014027092A (ja) * | 2012-07-26 | 2014-02-06 | Sharp Corp | 半導体発光素子 |
| US9324902B2 (en) | 2012-07-26 | 2016-04-26 | Sharp Kabushiki Kaisha | Semiconductor light-emitting element |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0977279A3 (en) | 2001-01-03 |
| US6285696B1 (en) | 2001-09-04 |
| US6345063B1 (en) | 2002-02-05 |
| JP2011082563A (ja) | 2011-04-21 |
| EP0977279A2 (en) | 2000-02-02 |
| US6233265B1 (en) | 2001-05-15 |
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