ITMI913373A0 - Dispositivo di memoria a semiconduttore suscettibile di prova ad alta velocita' e procedimento di prova di esso - Google Patents

Dispositivo di memoria a semiconduttore suscettibile di prova ad alta velocita' e procedimento di prova di esso

Info

Publication number
ITMI913373A0
ITMI913373A0 IT91MI3373A ITMI913373A ITMI913373A0 IT MI913373 A0 ITMI913373 A0 IT MI913373A0 IT 91MI3373 A IT91MI3373 A IT 91MI3373A IT MI913373 A ITMI913373 A IT MI913373A IT MI913373 A0 ITMI913373 A0 IT MI913373A0
Authority
IT
Italy
Prior art keywords
memory device
high speed
semiconductor memory
device suitable
testing procedure
Prior art date
Application number
IT91MI3373A
Other languages
English (en)
Inventor
Youichi Tobita
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of ITMI913373A0 publication Critical patent/ITMI913373A0/it
Publication of ITMI913373A1 publication Critical patent/ITMI913373A1/it
Application granted granted Critical
Publication of IT1252532B publication Critical patent/IT1252532B/it

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G11C29/18—Address generation devices; Devices for accessing memories, e.g. details of addressing circuits
    • G11C29/30—Accessing single arrays
    • G11C29/34—Accessing multiple bits simultaneously
ITMI913373A 1990-12-18 1991-12-17 Dispositivo di memoria a semiconduttore suscettibile di prova ad alta velocita' e procedimento di prova di esso IT1252532B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2403381A JP2863012B2 (ja) 1990-12-18 1990-12-18 半導体記憶装置

Publications (3)

Publication Number Publication Date
ITMI913373A0 true ITMI913373A0 (it) 1991-12-17
ITMI913373A1 ITMI913373A1 (it) 1993-06-17
IT1252532B IT1252532B (it) 1995-06-19

Family

ID=18513117

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI913373A IT1252532B (it) 1990-12-18 1991-12-17 Dispositivo di memoria a semiconduttore suscettibile di prova ad alta velocita' e procedimento di prova di esso

Country Status (5)

Country Link
US (1) US5548596A (it)
JP (1) JP2863012B2 (it)
KR (1) KR950015040B1 (it)
DE (1) DE4141478A1 (it)
IT (1) IT1252532B (it)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960008824B1 (en) * 1993-11-17 1996-07-05 Samsung Electronics Co Ltd Multi bit test circuit and method of semiconductor memory device
JP3563779B2 (ja) * 1994-09-13 2004-09-08 株式会社ルネサステクノロジ 半導体記憶装置
KR0147632B1 (ko) * 1995-04-24 1998-11-02 김광호 반도체 메모리장치의 멀티 비트 테스트방법 및 테스트 회로
KR0172372B1 (ko) * 1995-12-22 1999-03-30 김광호 반도체 메모리 장치의 병합 데이타 출력 모드 선택 방법
DE19607724A1 (de) * 1996-02-29 1997-09-04 Siemens Ag Schaltungsanordnung für einen programmierbaren nichtflüchtigen Speicher
JP3839869B2 (ja) * 1996-05-30 2006-11-01 株式会社ルネサステクノロジ 半導体記憶装置
JP4052697B2 (ja) * 1996-10-09 2008-02-27 富士通株式会社 信号伝送システム、および、該信号伝送システムのレシーバ回路
TW397982B (en) * 1997-09-18 2000-07-11 Sanyo Electric Co Nonvolatile semiconductor memory device
JP4197755B2 (ja) 1997-11-19 2008-12-17 富士通株式会社 信号伝送システム、該信号伝送システムのレシーバ回路、および、該信号伝送システムが適用される半導体記憶装置
US5936901A (en) * 1998-03-19 1999-08-10 Micron Technology, Inc. Shared data lines for memory write and memory test operations
JP2001332100A (ja) * 2000-05-22 2001-11-30 Hitachi Ltd ダイナミック型ｒａｍ
JP2002170399A (ja) * 2000-12-05 2002-06-14 Fujitsu Ltd 半導体装置
FR2820545B1 (fr) * 2001-02-02 2003-05-30 St Microelectronics Sa Procede et dispositif de verification d'un groupe de cellules de memoire non volatile
KR100400309B1 (ko) 2001-05-04 2003-10-01 주식회사 하이닉스반도체 반도체 메모리 소자의 내부 동작명령 발생장치 및 방법
JP2004185691A (ja) * 2002-11-29 2004-07-02 Nec Electronics Corp 半導体記憶装置のテスト方法、半導体記憶装置のテスト回路、半導体記憶装置及び半導体装置
KR100541811B1 (ko) * 2003-07-05 2006-01-11 삼성전자주식회사 반도체 메모리장치의 컬럼 디코더회로
US7900099B2 (en) * 2005-01-25 2011-03-01 Micron Technology, Inc. Enabling test modes of individual integrated circuit devices out of a plurality of integrated circuit devices
JP2007066392A (ja) * 2005-08-30 2007-03-15 Matsushita Electric Ind Co Ltd 半導体記憶装置
JP2007120991A (ja) * 2005-10-25 2007-05-17 Sharp Corp テストパターンの検出率算出方法、コンピュータプログラム及びテストパターンの検出率算出装置
US7477551B2 (en) * 2006-11-08 2009-01-13 Texas Instruments Incorporated Systems and methods for reading data from a memory array
US20090103350A1 (en) * 2007-10-18 2009-04-23 Michael Kund Method of Testing an Integrated Circuit, Method of Manufacturing an Integrated Circuit, and Integrated Circuit
KR101188261B1 (ko) * 2010-07-30 2012-10-05 에스케이하이닉스 주식회사 멀티 비트 테스트 회로
US10566034B1 (en) * 2018-07-26 2020-02-18 Winbond Electronics Corp. Memory device with control and test circuit, and method for test reading and writing using bit line precharge voltage levels

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4406013A (en) * 1980-10-01 1983-09-20 Intel Corporation Multiple bit output dynamic random-access memory
JPS5854756A (ja) * 1981-09-28 1983-03-31 Hitachi Ltd 多重伝送システムの信号診断方法およびその診断装置
JPS6194290A (ja) * 1984-10-15 1986-05-13 Fujitsu Ltd 半導体メモリ
US4686456A (en) * 1985-06-18 1987-08-11 Kabushiki Kaisha Toshiba Memory test circuit
JPS62170094A (ja) * 1986-01-21 1987-07-27 Mitsubishi Electric Corp 半導体記憶回路
JPS63244400A (ja) * 1987-03-16 1988-10-11 シーメンス・アクチエンゲゼルシヤフト メモリセルの検査回路装置および方法
JP2523736B2 (ja) * 1987-12-24 1996-08-14 三菱電機株式会社 半導体記憶装置
JPH0787035B2 (ja) * 1988-01-20 1995-09-20 三菱電機株式会社 半導体記億装置
JPH01184700A (ja) * 1988-01-11 1989-07-24 Advantest Corp メモリ試験装置
US4866676A (en) * 1988-03-24 1989-09-12 Motorola, Inc. Testing arrangement for a DRAM with redundancy
JP2831683B2 (ja) * 1989-03-20 1998-12-02 富士通株式会社 半導体記憶装置
JP2616005B2 (ja) * 1989-05-24 1997-06-04 日本電気株式会社 半導体メモリの組込み検査回路
JP2780354B2 (ja) * 1989-07-04 1998-07-30 富士通株式会社 半導体メモリ装置
JP2554174B2 (ja) * 1989-10-03 1996-11-13 シャープ株式会社 半導体メモリ装置のテスト方法
US5113399A (en) * 1989-10-16 1992-05-12 Rockwell International Corporation Memory test methodology
EP0446847B1 (en) * 1990-03-12 1998-06-17 Nec Corporation Semiconductor memory device having improved write function

Also Published As

Publication number Publication date
ITMI913373A1 (it) 1993-06-17
US5548596A (en) 1996-08-20
JP2863012B2 (ja) 1999-03-03
KR920013472A (ko) 1992-07-29
KR950015040B1 (ko) 1995-12-21
DE4141478A1 (de) 1992-07-02
DE4141478C2 (it) 1993-09-16
IT1252532B (it) 1995-06-19
JPH04216399A (ja) 1992-08-06

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Legal Events

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0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19961227