ITMI20050253A1 - Struttura di porta dispositivo semiconduttore avente la medesima e procedimenti di formazione della struttura di porta e del dispositivo semiconduttore - Google Patents
Struttura di porta dispositivo semiconduttore avente la medesima e procedimenti di formazione della struttura di porta e del dispositivo semiconduttoreInfo
- Publication number
- ITMI20050253A1 ITMI20050253A1 IT000253A ITMI20050253A ITMI20050253A1 IT MI20050253 A1 ITMI20050253 A1 IT MI20050253A1 IT 000253 A IT000253 A IT 000253A IT MI20050253 A ITMI20050253 A IT MI20050253A IT MI20050253 A1 ITMI20050253 A1 IT MI20050253A1
- Authority
- IT
- Italy
- Prior art keywords
- semiconductor device
- door structure
- same time
- formation procedures
- procedures
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 2
- 230000015572 biosynthetic process Effects 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
- B26D1/157—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis
- B26D1/18—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis mounted on a movable carriage
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66666—Vertical transistors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/01—Means for holding or positioning work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823487—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of vertical transistor structures, i.e. with channel vertical to the substrate surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42384—Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4908—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET for thin film semiconductor, e.g. gate of TFT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78642—Vertical transistors
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040010882A KR100574317B1 (ko) | 2004-02-19 | 2004-02-19 | 게이트 구조물, 이를 갖는 반도체 장치 및 그 형성 방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
ITMI20050253A1 true ITMI20050253A1 (it) | 2005-08-20 |
Family
ID=34858739
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT000253A ITMI20050253A1 (it) | 2004-02-19 | 2005-02-18 | Struttura di porta dispositivo semiconduttore avente la medesima e procedimenti di formazione della struttura di porta e del dispositivo semiconduttore |
Country Status (7)
Country | Link |
---|---|
US (1) | US20050184348A1 (it) |
JP (1) | JP2005236290A (it) |
KR (1) | KR100574317B1 (it) |
CN (1) | CN1658401A (it) |
DE (1) | DE102005006899B4 (it) |
IT (1) | ITMI20050253A1 (it) |
TW (1) | TW200529304A (it) |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
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US7888721B2 (en) | 2005-07-06 | 2011-02-15 | Micron Technology, Inc. | Surround gate access transistors with grown ultra-thin bodies |
US7768051B2 (en) | 2005-07-25 | 2010-08-03 | Micron Technology, Inc. | DRAM including a vertical surround gate transistor |
US7358194B2 (en) * | 2005-08-18 | 2008-04-15 | Tokyo Electron Limited | Sequential deposition process for forming Si-containing films |
US7696567B2 (en) | 2005-08-31 | 2010-04-13 | Micron Technology, Inc | Semiconductor memory device |
US7687342B2 (en) | 2005-09-01 | 2010-03-30 | Micron Technology, Inc. | Method of manufacturing a memory device |
US7557032B2 (en) | 2005-09-01 | 2009-07-07 | Micron Technology, Inc. | Silicided recessed silicon |
US7416943B2 (en) | 2005-09-01 | 2008-08-26 | Micron Technology, Inc. | Peripheral gate stacks and recessed array gates |
JP4525928B2 (ja) | 2005-12-27 | 2010-08-18 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
US8643087B2 (en) * | 2006-09-20 | 2014-02-04 | Micron Technology, Inc. | Reduced leakage memory cells |
US20080119044A1 (en) * | 2006-11-22 | 2008-05-22 | Macronix International Co., Ltd. | Systems and methods for back end of line processing of semiconductor circuits |
US7923373B2 (en) | 2007-06-04 | 2011-04-12 | Micron Technology, Inc. | Pitch multiplication using self-assembling materials |
KR100871546B1 (ko) | 2007-08-08 | 2008-12-01 | 주식회사 동부하이텍 | 플래시 메모리 소자 및 그 제조 방법 |
KR101024741B1 (ko) * | 2007-10-31 | 2011-03-25 | 주식회사 하이닉스반도체 | 반도체 소자의 패턴 형성 방법 |
KR101111919B1 (ko) * | 2008-05-28 | 2012-10-04 | 에스케이하이닉스 주식회사 | 반도체 소자의 제조방법 |
US7928577B2 (en) | 2008-07-16 | 2011-04-19 | Micron Technology, Inc. | Interconnect structures for integration of multi-layered integrated circuit devices and methods for forming the same |
CN101752236B (zh) * | 2009-10-26 | 2011-10-19 | 南京大学 | 一种调控GaAs半导体与栅介质间能带补偿的原子层沉积Al2O3/HfO2方法 |
KR101194973B1 (ko) * | 2010-04-27 | 2012-10-25 | 에스케이하이닉스 주식회사 | 반도체 소자의 트랜지스터 및 그 형성방법 |
US8871576B2 (en) * | 2011-02-28 | 2014-10-28 | International Business Machines Corporation | Silicon nanotube MOSFET |
CN103107088B (zh) * | 2011-11-11 | 2016-06-01 | 中芯国际集成电路制造(上海)有限公司 | 具有周围栅极结构的鳍型场效应晶体管及其制造方法 |
US8586455B1 (en) * | 2012-05-15 | 2013-11-19 | International Business Machines Corporation | Preventing shorting of adjacent devices |
US20170186866A1 (en) * | 2014-03-20 | 2017-06-29 | Skokie Swift Corporation | Vertical field effect transistor having a disc shaped gate |
CN105448989B (zh) * | 2014-08-26 | 2018-12-25 | 中芯国际集成电路制造(上海)有限公司 | 半导体装置及其制造方法 |
KR102352245B1 (ko) * | 2014-11-13 | 2022-01-18 | 삼성전자주식회사 | 반도체 장치 제조 방법 |
JP6233531B2 (ja) * | 2014-12-08 | 2017-11-22 | 富士電機株式会社 | 炭化ケイ素半導体装置及びその製造方法 |
KR102404780B1 (ko) * | 2015-02-25 | 2022-06-02 | 삼성디스플레이 주식회사 | 플렉서블 표시 장치 |
EP3070737A1 (en) * | 2015-03-17 | 2016-09-21 | IMEC vzw | Vertical Fin-FET semiconductor device |
CN107204362B (zh) * | 2016-03-18 | 2021-01-29 | 株式会社日本显示器 | 半导体装置 |
CN106328729A (zh) * | 2016-10-19 | 2017-01-11 | 天津大学 | 基于石墨烯电极的量子点垂直沟道场效应管及其制备方法 |
CN109904229A (zh) * | 2017-12-08 | 2019-06-18 | 萨摩亚商费洛储存科技股份有限公司 | 垂直式铁电薄膜储存晶体管和资料写入及读出方法 |
US10693056B2 (en) | 2017-12-28 | 2020-06-23 | Spin Memory, Inc. | Three-dimensional (3D) magnetic memory device comprising a magnetic tunnel junction (MTJ) having a metallic buffer layer |
US10541268B2 (en) | 2017-12-28 | 2020-01-21 | Spin Memory, Inc. | Three-dimensional magnetic memory devices |
US10403343B2 (en) | 2017-12-29 | 2019-09-03 | Spin Memory, Inc. | Systems and methods utilizing serial configurations of magnetic memory devices |
US10803916B2 (en) | 2017-12-29 | 2020-10-13 | Spin Memory, Inc. | Methods and systems for writing to magnetic memory devices utilizing alternating current |
US10347308B1 (en) | 2017-12-29 | 2019-07-09 | Spin Memory, Inc. | Systems and methods utilizing parallel configurations of magnetic memory devices |
US10424357B2 (en) | 2017-12-29 | 2019-09-24 | Spin Memory, Inc. | Magnetic tunnel junction (MTJ) memory device having a composite free magnetic layer |
US10192789B1 (en) * | 2018-01-08 | 2019-01-29 | Spin Transfer Technologies | Methods of fabricating dual threshold voltage devices |
US10770510B2 (en) * | 2018-01-08 | 2020-09-08 | Spin Memory, Inc. | Dual threshold voltage devices having a first transistor and a second transistor |
US10192787B1 (en) * | 2018-01-08 | 2019-01-29 | Spin Transfer Technologies | Methods of fabricating contacts for cylindrical devices |
US10192788B1 (en) * | 2018-01-08 | 2019-01-29 | Spin Transfer Technologies | Methods of fabricating dual threshold voltage devices with stacked gates |
US10319424B1 (en) | 2018-01-08 | 2019-06-11 | Spin Memory, Inc. | Adjustable current selectors |
US10497415B2 (en) | 2018-01-08 | 2019-12-03 | Spin Memory, Inc. | Dual gate memory devices |
US10692556B2 (en) | 2018-09-28 | 2020-06-23 | Spin Memory, Inc. | Defect injection structure and mechanism for magnetic memory |
US10878870B2 (en) | 2018-09-28 | 2020-12-29 | Spin Memory, Inc. | Defect propagation structure and mechanism for magnetic memory |
KR102646792B1 (ko) | 2019-02-26 | 2024-03-13 | 삼성전자주식회사 | 반도체 소자 및 그 제조 방법 |
CN110752157B (zh) * | 2019-11-08 | 2021-06-22 | 中国科学院物理研究所 | 三维悬空环栅结构半导体场效应晶体管器件的制备方法 |
CN111739944B (zh) * | 2020-07-07 | 2021-06-01 | 上海大学 | 一种全包围栅极突触晶体管、制备方法及电路连接方法 |
CN113013248B (zh) * | 2021-02-19 | 2022-07-12 | 上海大学 | 一种突触晶体管及其制备方法 |
CN117276326A (zh) * | 2022-06-10 | 2023-12-22 | 中国科学院微电子研究所 | 一种晶体管器件及存储器 |
CN117253799A (zh) * | 2022-06-10 | 2023-12-19 | 中国科学院微电子研究所 | 一种晶体管器件的制造方法 |
CN115346988B (zh) * | 2022-10-18 | 2023-01-24 | 北京超弦存储器研究院 | 一种晶体管、3d存储器及其制备方法、电子设备 |
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JPH0214578A (ja) * | 1988-07-01 | 1990-01-18 | Fujitsu Ltd | 半導体装置 |
JPH03291973A (ja) * | 1990-04-09 | 1991-12-24 | Fuji Xerox Co Ltd | 薄膜半導体装置 |
JPH05129335A (ja) * | 1991-10-31 | 1993-05-25 | Sharp Corp | 縦型トランジスタの製造方法 |
KR0147584B1 (ko) * | 1994-03-17 | 1998-08-01 | 윤종용 | 매몰 비트라인 셀의 제조방법 |
US5497019A (en) * | 1994-09-22 | 1996-03-05 | The Aerospace Corporation | Silicon-on-insulator gate-all-around MOSFET devices and fabrication methods |
JP3307785B2 (ja) * | 1994-12-13 | 2002-07-24 | 三菱電機株式会社 | 絶縁ゲート型半導体装置 |
US5688704A (en) * | 1995-11-30 | 1997-11-18 | Lucent Technologies Inc. | Integrated circuit fabrication |
JP3217690B2 (ja) * | 1996-03-22 | 2001-10-09 | 株式会社東芝 | 半導体装置の製造方法 |
DE19705791C1 (de) * | 1997-02-14 | 1998-04-02 | Siemens Ag | Leistungs-MOSFET |
DE19743342C2 (de) * | 1997-09-30 | 2002-02-28 | Infineon Technologies Ag | Feldeffekttransistor hoher Packungsdichte und Verfahren zu seiner Herstellung |
KR100298438B1 (ko) * | 1998-01-26 | 2001-08-07 | 김영환 | 박막트랜지스터및이의제조방법 |
DE19837555A1 (de) * | 1998-08-19 | 2000-03-02 | Winkelstroeter Dentaurum | Kieferorthopädische Vorrichtung zum Vorverlagern des Unterkiefers |
DE19844997A1 (de) * | 1998-09-30 | 2000-04-13 | Siemens Ag | Vertikaler Feldeffekttransistor mit innenliegendem Gate und Herstellverfahren |
DE10004984A1 (de) * | 2000-02-04 | 2001-08-16 | Infineon Technologies Ag | Vertikales Halbleiterbauelement mit Source-Down-Design und entsprechendes Herstellungsverfahren |
US6413802B1 (en) * | 2000-10-23 | 2002-07-02 | The Regents Of The University Of California | Finfet transistor structures having a double gate channel extending vertically from a substrate and methods of manufacture |
JP2002203969A (ja) * | 2000-12-28 | 2002-07-19 | Toshiba Corp | 半導体装置 |
JP4932088B2 (ja) * | 2001-02-19 | 2012-05-16 | ルネサスエレクトロニクス株式会社 | 絶縁ゲート型半導体装置の製造方法 |
KR100364815B1 (en) * | 2001-04-28 | 2002-12-16 | Hynix Semiconductor Inc | High voltage device and fabricating method thereof |
CN100490180C (zh) * | 2004-10-04 | 2009-05-20 | 松下电器产业株式会社 | 纵向场效应晶体管及其制造方法 |
US7977736B2 (en) * | 2006-02-23 | 2011-07-12 | Samsung Electronics Co., Ltd. | Vertical channel transistors and memory devices including vertical channel transistors |
-
2004
- 2004-02-19 KR KR1020040010882A patent/KR100574317B1/ko not_active IP Right Cessation
-
2005
- 2005-02-15 US US11/059,145 patent/US20050184348A1/en not_active Abandoned
- 2005-02-15 DE DE102005006899A patent/DE102005006899B4/de not_active Expired - Fee Related
- 2005-02-16 JP JP2005039859A patent/JP2005236290A/ja active Pending
- 2005-02-17 TW TW094104597A patent/TW200529304A/zh unknown
- 2005-02-18 IT IT000253A patent/ITMI20050253A1/it unknown
- 2005-02-21 CN CN2005100095318A patent/CN1658401A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
KR100574317B1 (ko) | 2006-04-26 |
DE102005006899A1 (de) | 2005-10-06 |
JP2005236290A (ja) | 2005-09-02 |
CN1658401A (zh) | 2005-08-24 |
KR20050082460A (ko) | 2005-08-24 |
TW200529304A (en) | 2005-09-01 |
US20050184348A1 (en) | 2005-08-25 |
DE102005006899B4 (de) | 2010-11-25 |
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