DE602004031524D1 - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung

Info

Publication number
DE602004031524D1
DE602004031524D1 DE602004031524T DE602004031524T DE602004031524D1 DE 602004031524 D1 DE602004031524 D1 DE 602004031524D1 DE 602004031524 T DE602004031524 T DE 602004031524T DE 602004031524 T DE602004031524 T DE 602004031524T DE 602004031524 D1 DE602004031524 D1 DE 602004031524D1
Authority
DE
Germany
Prior art keywords
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004031524T
Other languages
English (en)
Inventor
Katsuhiko Nishiwaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Publication of DE602004031524D1 publication Critical patent/DE602004031524D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
    • H01L29/0692—Surface layout
    • H01L29/0696—Surface layout of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
    • H01L29/41725—Source or drain electrodes for field effect devices
    • H01L29/41741—Source or drain electrodes for field effect devices for vertical or pseudo-vertical devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312—Gate electrodes for field effect devices
    • H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/42324—Gate electrodes for transistors with a floating gate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
DE602004031524T 2003-07-11 2004-06-10 Halbleitervorrichtung Expired - Lifetime DE602004031524D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003195498A JP4082295B2 (ja) 2003-07-11 2003-07-11 半導体装置
PCT/JP2004/008516 WO2005010996A1 (en) 2003-07-11 2004-06-10 Semiconductor device

Publications (1)

Publication Number Publication Date
DE602004031524D1 true DE602004031524D1 (de) 2011-04-07

Family

ID=34100198

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004031524T Expired - Lifetime DE602004031524D1 (de) 2003-07-11 2004-06-10 Halbleitervorrichtung

Country Status (6)

Country Link
US (1) US7579652B2 (de)
EP (1) EP1636848B1 (de)
JP (1) JP4082295B2 (de)
CN (1) CN100470832C (de)
DE (1) DE602004031524D1 (de)
WO (1) WO2005010996A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5984282B2 (ja) * 2006-04-27 2016-09-06 富士電機株式会社 縦型トレンチ型絶縁ゲートｍｏｓ半導体装置
KR101420528B1 (ko) * 2012-12-07 2014-07-16 삼성전기주식회사 전력 반도체 소자
JP5998169B2 (ja) * 2014-03-26 2016-09-28 株式会社豊田中央研究所 半導体装置
JP6820811B2 (ja) * 2017-08-08 2021-01-27 三菱電機株式会社 半導体装置および電力変換装置
US11488985B2 (en) * 2019-11-06 2022-11-01 Innolux Corporation Semiconductor device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4809045A (en) * 1985-09-30 1989-02-28 General Electric Company Insulated gate device
US5304831A (en) * 1990-12-21 1994-04-19 Siliconix Incorporated Low on-resistance power MOS technology
JPH0590595A (ja) 1991-09-27 1993-04-09 Nissan Motor Co Ltd 半導体装置
US5321281A (en) * 1992-03-18 1994-06-14 Mitsubishi Denki Kabushiki Kaisha Insulated gate semiconductor device and method of fabricating same
US5410170A (en) * 1993-04-14 1995-04-25 Siliconix Incorporated DMOS power transistors with reduced number of contacts using integrated body-source connections
KR100206555B1 (ko) * 1995-12-30 1999-07-01 윤종용 전력용 트랜지스터
US6008092A (en) * 1996-02-12 1999-12-28 International Rectifier Corporation Short channel IGBT with improved forward voltage drop and improved switching power loss
JP3692684B2 (ja) 1997-02-17 2005-09-07 株式会社デンソー 絶縁ゲート型電界効果トランジスタ及びその製造方法
JPH11251592A (ja) * 1998-01-05 1999-09-07 Denso Corp 炭化珪素半導体装置
DE19808348C1 (de) * 1998-02-27 1999-06-24 Siemens Ag Durch Feldeffekt steuerbares Halbleiterbauelement
JP3878353B2 (ja) 1999-03-15 2007-02-07 株式会社東芝 電流検出セルを有する縦型ｍｏｓ半導体装置
JP4666708B2 (ja) * 1999-10-13 2011-04-06 新電元工業株式会社 電界効果トランジスタ

Also Published As

Publication number Publication date
CN1823419A (zh) 2006-08-23
WO2005010996A1 (en) 2005-02-03
JP4082295B2 (ja) 2008-04-30
US7579652B2 (en) 2009-08-25
CN100470832C (zh) 2009-03-18
JP2005032939A (ja) 2005-02-03
EP1636848A1 (de) 2006-03-22
EP1636848B1 (de) 2011-02-23
US20060163653A1 (en) 2006-07-27

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