JP5998169B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP5998169B2 JP5998169B2 JP2014063289A JP2014063289A JP5998169B2 JP 5998169 B2 JP5998169 B2 JP 5998169B2 JP 2014063289 A JP2014063289 A JP 2014063289A JP 2014063289 A JP2014063289 A JP 2014063289A JP 5998169 B2 JP5998169 B2 JP 5998169B2
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- 239000004065 semiconductor Substances 0.000 title claims description 54
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 79
- 229910052710 silicon Inorganic materials 0.000 claims description 79
- 239000010703 silicon Substances 0.000 claims description 79
- 229910052782 aluminium Inorganic materials 0.000 claims description 76
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 76
- 238000001556 precipitation Methods 0.000 claims description 43
- 230000008021 deposition Effects 0.000 claims description 22
- 238000000151 deposition Methods 0.000 description 18
- 239000000956 alloy Substances 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 210000000746 body region Anatomy 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
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- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42356—Disposition, e.g. buried gate electrode
- H01L29/4236—Disposition, e.g. buried gate electrode within a trench, e.g. trench gate electrode, groove gate electrode
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
- H01L29/7396—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions
- H01L29/7397—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions and a gate structure lying on a slanted or vertical surface or formed in a groove, e.g. trench gate IGBT
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
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- H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
- H01L29/0692—Surface layout
- H01L29/0696—Surface layout of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
2;シリコン層
3;表面側アルミニウム層
4;裏面側アルミニウム層
5;絶縁膜
10;絶縁膜本体
11;第1ノジュール析出部
12;第2ノジュール析出部
15;コンタクトホール
20;側面
21;側面
22;側面
25;側面
26;側面
31;第1角部
32;第2角部
33;第3角部
36;凹部
41;ドリフト領域
42;コンタクト領域
50;トレンチゲート
51;トレンチ
52;ゲート電極
53;ゲート絶縁膜
61;第1の凸部
62;第2の凸部
141;ドリフト領域
142;コンタクト領域
143;コレクタ領域
144;ボディ領域
145;エミッタ領域
Claims (9)
- 半導体層と、
前記半導体層の表面の一部に接触して積層されたシリコンを含有するアルミニウム層と、
前記半導体層の表面の一部に接触して積層され、前記アルミニウム層に隣り合って接触している絶縁膜と、を備え、
前記絶縁膜は、前記半導体層の表面に対して垂直方向から観察したときに、絶縁膜本体と、前記絶縁膜本体から前記アルミニウム層側に突出する複数の第1ノジュール析出部と、を有し、
前記垂直方向から観察したときに、前記絶縁膜本体の側面と前記第1ノジュール析出部の側面によって角部が形成されており、
前記第1ノジュール析出部は、前記絶縁膜本体から突出する第1凸部と、前記第1凸部から突出する第2凸部とを含む、半導体装置。 - 前記垂直方向から観察したときに、前記絶縁膜本体が環状に配置されている、請求項1に記載の半導体装置。
- 前記半導体層の表面から内部に向けて延びるトレンチゲートをさらに備え、
前記垂直方向から観察したときに、前記絶縁膜本体のレイアウトと前記トレンチゲートのレイアウトが一致する、請求項1又は2に記載の半導体装置。 - 前記絶縁膜は、前記垂直方向から観察したときに、前記絶縁膜本体から離間して配置されている第2ノジュール析出部をさらに有している、請求項1から3のいずれかに記載の半導体装置。
- 前記垂直方向から観察したときに、前記第2ノジュール析出部の側面が屈曲しており、前記屈曲した側面によって前記第2ノジュール析出部に角部が形成されている、請求項4に記載の半導体装置。
- 半導体層と、
前記半導体層の表面の一部に接触して積層されたシリコンを含有するアルミニウム層と、
前記半導体層の表面の一部に接触して積層され、前記アルミニウム層に隣り合って接触している絶縁膜と、を備え、
前記絶縁膜は、前記半導体層の表面に対して垂直方向から観察したときに、絶縁膜本体と、前記絶縁膜本体から前記アルミニウム層側に突出する複数の第1ノジュール析出部と、を有し、
前記垂直方向から観察したときに、前記絶縁膜本体の側面と前記第1ノジュール析出部の側面によって角部が形成されており、
前記絶縁膜は、前記垂直方向から観察したときに、前記絶縁膜本体から離間して配置されている第2ノジュール析出部をさらに有している、半導体装置。 - 前記垂直方向から観察したときに、前記絶縁膜本体が環状に配置されている、請求項6に記載の半導体装置。
- 前記半導体層の表面から内部に向けて延びるトレンチゲートをさらに備え、
前記垂直方向から観察したときに、前記絶縁膜本体のレイアウトと前記トレンチゲートのレイアウトが一致する、請求項6又は7に記載の半導体装置。 - 前記垂直方向から観察したときに、前記第2ノジュール析出部の側面が屈曲しており、前記屈曲した側面によって前記第2ノジュール析出部に角部が形成されている、請求項6から8のいずれかに記載の半導体装置。
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JP2014063289A JP5998169B2 (ja) | 2014-03-26 | 2014-03-26 | 半導体装置 |
US14/640,566 US9437700B2 (en) | 2014-03-26 | 2015-03-06 | Semiconductor device |
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JP2014063289A JP5998169B2 (ja) | 2014-03-26 | 2014-03-26 | 半導体装置 |
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JP2015185793A JP2015185793A (ja) | 2015-10-22 |
JP5998169B2 true JP5998169B2 (ja) | 2016-09-28 |
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WO2014162498A1 (ja) * | 2013-04-02 | 2014-10-09 | トヨタ自動車株式会社 | トレンチゲート電極を利用するigbt |
WO2016042955A1 (ja) * | 2014-09-17 | 2016-03-24 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
JP2016096307A (ja) * | 2014-11-17 | 2016-05-26 | トヨタ自動車株式会社 | 半導体装置 |
JP6304221B2 (ja) * | 2015-12-08 | 2018-04-04 | トヨタ自動車株式会社 | Igbt |
JP6588363B2 (ja) * | 2016-03-09 | 2019-10-09 | トヨタ自動車株式会社 | スイッチング素子 |
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JPS59210667A (ja) * | 1983-05-16 | 1984-11-29 | Fujitsu Ltd | 半導体装置 |
JPS60117771A (ja) * | 1983-11-30 | 1985-06-25 | Fujitsu Ltd | 半導体装置 |
JPS61226958A (ja) * | 1985-03-30 | 1986-10-08 | Toshiba Corp | 半導体装置およびその製造法 |
JPH0616550B2 (ja) * | 1986-03-05 | 1994-03-02 | サンケン電気株式会社 | シヨツトキバリア半導体装置 |
JPS63133649A (ja) * | 1986-11-26 | 1988-06-06 | Fujitsu Ltd | 半導体装置 |
US4988423A (en) * | 1987-06-19 | 1991-01-29 | Matsushita Electric Industrial Co., Ltd. | Method for fabricating interconnection structure |
US4942451A (en) * | 1988-09-27 | 1990-07-17 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device having improved antireflection coating |
JPH04230024A (ja) * | 1990-12-27 | 1992-08-19 | Kawasaki Steel Corp | 半導体装置の製造方法 |
JPH06163719A (ja) | 1992-11-26 | 1994-06-10 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
US5308786A (en) | 1993-09-27 | 1994-05-03 | United Microelectronics Corporation | Trench isolation for both large and small areas by means of silicon nodules after metal etching |
US5492848A (en) | 1994-03-18 | 1996-02-20 | United Microelectronics Corp. | Stacked capacitor process using silicon nodules |
JPH08124877A (ja) | 1994-10-24 | 1996-05-17 | Sanyo Electric Co Ltd | 半導体集積回路の製造方法 |
JPH08236617A (ja) | 1995-02-23 | 1996-09-13 | Matsushita Electric Works Ltd | 半導体装置の製造方法 |
JP2000228403A (ja) | 1999-02-05 | 2000-08-15 | Matsushita Electric Works Ltd | アルミ配線の形成方法 |
JP2001308094A (ja) | 2000-04-19 | 2001-11-02 | Oki Electric Ind Co Ltd | 配線薄膜の堆積方法 |
JP3524850B2 (ja) | 2000-08-03 | 2004-05-10 | 三洋電機株式会社 | 絶縁ゲート型電界効果半導体装置 |
JP4608133B2 (ja) | 2001-06-08 | 2011-01-05 | ルネサスエレクトロニクス株式会社 | 縦型mosfetを備えた半導体装置およびその製造方法 |
JP4082295B2 (ja) * | 2003-07-11 | 2008-04-30 | トヨタ自動車株式会社 | 半導体装置 |
JP4501533B2 (ja) * | 2004-05-31 | 2010-07-14 | 株式会社デンソー | 半導体装置の製造方法 |
JP2008159967A (ja) | 2006-12-26 | 2008-07-10 | Fuji Electric Device Technology Co Ltd | 半導体装置の製造方法 |
JP2009088381A (ja) | 2007-10-02 | 2009-04-23 | Fuji Electric Device Technology Co Ltd | 半導体装置およびその製造方法 |
JP5549118B2 (ja) * | 2009-05-27 | 2014-07-16 | トヨタ自動車株式会社 | 半導体装置の製造方法 |
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US20150279953A1 (en) | 2015-10-01 |
US9437700B2 (en) | 2016-09-06 |
JP2015185793A (ja) | 2015-10-22 |
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