IT1150089B - Strutture vetroceramiche a piu'strati aventi una distribuzione interna di conduttori - Google Patents
Strutture vetroceramiche a piu'strati aventi una distribuzione interna di conduttoriInfo
- Publication number
- IT1150089B IT1150089B IT20408/80A IT2040880A IT1150089B IT 1150089 B IT1150089 B IT 1150089B IT 20408/80 A IT20408/80 A IT 20408/80A IT 2040880 A IT2040880 A IT 2040880A IT 1150089 B IT1150089 B IT 1150089B
- Authority
- IT
- Italy
- Prior art keywords
- conductors
- glass ceramic
- layer glass
- ceramic structures
- internal distribution
- Prior art date
Links
- 239000004020 conductor Substances 0.000 title abstract 2
- 239000002241 glass-ceramic Substances 0.000 title abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000010304 firing Methods 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
- C03C10/0036—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and a divalent metal oxide as main constituents
- C03C10/0045—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and a divalent metal oxide as main constituents containing SiO2, Al2O3 and MgO as main constituents
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/4807—Ceramic parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Crystallography & Structural Chemistry (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Glass Compositions (AREA)
- Communication Cables (AREA)
- Insulated Conductors (AREA)
- Surface Treatment Of Glass (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/023,112 US4234367A (en) | 1979-03-23 | 1979-03-23 | Method of making multilayered glass-ceramic structures having an internal distribution of copper-based conductors |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8020408A0 IT8020408A0 (it) | 1980-03-07 |
IT1150089B true IT1150089B (it) | 1986-12-10 |
Family
ID=21813197
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT20408/80A IT1150089B (it) | 1979-03-23 | 1980-03-07 | Strutture vetroceramiche a piu'strati aventi una distribuzione interna di conduttori |
Country Status (7)
Country | Link |
---|---|
US (1) | US4234367A (it) |
EP (1) | EP0016307B1 (it) |
JP (1) | JPS55128899A (it) |
AT (1) | ATE346T1 (it) |
CA (1) | CA1123115A (it) |
DE (1) | DE3060057D1 (it) |
IT (1) | IT1150089B (it) |
Families Citing this family (91)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4355055A (en) * | 1980-02-25 | 1982-10-19 | E. I. Du Pont De Nemours And Company | Use of prolonged tack toners for the preparation of multilayer electric circuits |
US4340436A (en) * | 1980-07-14 | 1982-07-20 | International Business Machines Corporation | Process for flattening glass-ceramic substrates |
US5271887A (en) * | 1980-08-04 | 1993-12-21 | Witec Cayman Patents, Ltd. | Method of fabricating complex micro-circuit boards, substrates and microcircuits and the substrates and microcircuits |
JPS5817651A (ja) * | 1981-07-24 | 1983-02-01 | Hitachi Ltd | 多層回路板とその製造方法 |
JPS58105595A (ja) * | 1981-12-17 | 1983-06-23 | 富士通株式会社 | 多層セラミツク回路基板の製造方法 |
JPS58108792A (ja) * | 1981-12-23 | 1983-06-28 | 株式会社日立製作所 | 多層回路板とその製造方法 |
JPS58108793A (ja) * | 1981-12-23 | 1983-06-28 | 株式会社日立製作所 | 多層回路板とその製造方法 |
US4517155A (en) * | 1982-05-18 | 1985-05-14 | Union Carbide Corporation | Copper base metal termination for multilayer ceramic capacitors |
JPS59995A (ja) * | 1982-06-16 | 1984-01-06 | 富士通株式会社 | 銅導体多層構造体の製造方法 |
JPS59182283A (ja) * | 1983-03-29 | 1984-10-17 | 株式会社東芝 | 導電性セラミツクス焼結体の製造方法 |
JPS6030196A (ja) * | 1983-07-28 | 1985-02-15 | 富士通株式会社 | 多層回路基板の製造方法 |
JPS60221358A (ja) * | 1984-04-13 | 1985-11-06 | 日本碍子株式会社 | 電気絶縁体用セラミック組成物 |
US4671928A (en) * | 1984-04-26 | 1987-06-09 | International Business Machines Corporation | Method of controlling the sintering of metal particles |
JPS60254697A (ja) * | 1984-05-31 | 1985-12-16 | 富士通株式会社 | 多層セラミック回路基板および製法 |
US4594181A (en) * | 1984-09-17 | 1986-06-10 | E. I. Du Pont De Nemours And Company | Metal oxide-coated copper powder |
FR2575331B1 (fr) * | 1984-12-21 | 1987-06-05 | Labo Electronique Physique | Boitier pour composant electronique |
JPS61155243A (ja) * | 1984-12-28 | 1986-07-14 | 富士通株式会社 | グリ−ンシ−ト組成物 |
JPH0132364Y2 (it) * | 1985-03-04 | 1989-10-03 | ||
JPS61270897A (ja) * | 1985-05-25 | 1986-12-01 | 株式会社住友金属セラミックス | 多層回路基板 |
KR900008781B1 (ko) * | 1985-06-17 | 1990-11-29 | 마쯔시다덴기산교 가부시기가이샤 | 후막도체조성물 |
FR2585181B1 (fr) * | 1985-07-16 | 1988-11-18 | Interconnexions Ceramiques | Procede de fabrication d'un substrat d'interconnexion pour composants electroniques, et substrat obtenu par sa mise en oeuvre |
US4627160A (en) * | 1985-08-02 | 1986-12-09 | International Business Machines Corporation | Method for removal of carbonaceous residues from ceramic structures having internal metallurgy |
JPS6248097A (ja) * | 1985-08-28 | 1987-03-02 | 日本特殊陶業株式会社 | 多層回路基板の製造法 |
US4678683A (en) * | 1985-12-13 | 1987-07-07 | General Electric Company | Process for cofiring structure comprised of ceramic substrate and refractory metal metallization |
JPS62191460A (ja) * | 1986-02-14 | 1987-08-21 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | ガラス・セラミック電気回路積層板の形成方法 |
US4898842A (en) * | 1986-03-03 | 1990-02-06 | International Business Machines Corporation | Organometallic-derived cordierite and other compounds comprising oxides of silicon |
US4885038A (en) * | 1986-05-01 | 1989-12-05 | International Business Machines Corporation | Method of making multilayered ceramic structures having an internal distribution of copper-based conductors |
US4879156A (en) * | 1986-05-02 | 1989-11-07 | International Business Machines Corporation | Multilayered ceramic substrate having solid non-porous metal conductors |
US5130067A (en) * | 1986-05-02 | 1992-07-14 | International Business Machines Corporation | Method and means for co-sintering ceramic/metal mlc substrates |
JP2527744B2 (ja) * | 1986-08-01 | 1996-08-28 | インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション | 電子回路パッケ−ジングに含まれる構造体、及び、製造方法 |
US5045402A (en) * | 1986-08-01 | 1991-09-03 | International Business Machines Corporation | Zirconia toughening of glass-ceramic materials |
JPS63128791A (ja) * | 1986-11-12 | 1988-06-01 | インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション | 金属導体を有する高密度多層ガラス・セラミツク構造体の製造方法 |
US4766027A (en) * | 1987-01-13 | 1988-08-23 | E. I. Du Pont De Nemours And Company | Method for making a ceramic multilayer structure having internal copper conductors |
JPS63249394A (ja) * | 1987-04-06 | 1988-10-17 | 日本電気株式会社 | 多層回路基板 |
US4778549A (en) * | 1987-04-13 | 1988-10-18 | Corning Glass Works | Catalysts for accelerating burnout or organic materials |
US4794048A (en) * | 1987-05-04 | 1988-12-27 | Allied-Signal Inc. | Ceramic coated metal substrates for electronic applications |
US4788046A (en) * | 1987-08-13 | 1988-11-29 | Ceramics Process Systems Corporation | Method for producing materials for co-sintering |
EP0308851A3 (en) * | 1987-09-24 | 1990-03-21 | Air Products And Chemicals, Inc. | A process for the manufacture of copper thick-film conductors using an infrared furnace |
US5147484A (en) * | 1987-10-19 | 1992-09-15 | International Business Machines Corporation | Method for producing multi-layer ceramic substrates with oxidation resistant metalization |
JPH01249651A (ja) * | 1988-02-18 | 1989-10-04 | E I Du Pont De Nemours & Co | セラミツク/蒸留可能な結合剤組成物 |
JPH0728128B2 (ja) * | 1988-03-11 | 1995-03-29 | 松下電器産業株式会社 | セラミック多層配線基板とその製造方法 |
US4971738A (en) * | 1988-07-18 | 1990-11-20 | International Business Machines Corporation | Enhanced removal of carbon from ceramic substrate laminates |
US5053361A (en) * | 1988-07-18 | 1991-10-01 | International Business Machines Corporation | Setter tile for use in sintering of ceramic substrate laminates |
US5202154A (en) * | 1988-09-19 | 1993-04-13 | Ngk Spark Plug Co., Ltd. | Method of producing thick-film gas sensor element having improved stability |
US5070050A (en) * | 1988-10-14 | 1991-12-03 | Raychem Corporation | Metal oxide dielectric dense bodies, precursor powders therefor, and methods for preparing same |
US5188886A (en) * | 1988-10-14 | 1993-02-23 | Raychem Corporation | Metal oxide dielectric dense bodies, precursor powders therefor, and methods for preparing same |
US5130280A (en) * | 1988-10-14 | 1992-07-14 | Raychem Corporation | Metal oxide dielectric dense bodies, precursor powders therefor, and methods for preparing same |
CA2007199C (en) * | 1989-02-03 | 1993-05-18 | Satish S. Tamhankar | Single atmosphere for firing copper compatible thick film materials |
US5302412A (en) * | 1989-02-03 | 1994-04-12 | The Boc Group, Inc. | Single atmosphere for firing compatible thick film material |
US5278135A (en) * | 1989-02-18 | 1994-01-11 | E. I. Du Pont De Nemours And Company | Ceramic/distillable binder compositions |
US5194294A (en) * | 1989-02-20 | 1993-03-16 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Process for preparing electrical connection means, in particular interconnection substances of hybrid circuits |
EP0396806B1 (en) * | 1989-05-12 | 1994-02-02 | Ibm Deutschland Gmbh | Glass-ceramic structure and method for making same |
JPH02119164A (ja) * | 1989-09-20 | 1990-05-07 | Hitachi Ltd | 半導体モジユール |
US5102720A (en) * | 1989-09-22 | 1992-04-07 | Cornell Research Foundation, Inc. | Co-fired multilayer ceramic tapes that exhibit constrained sintering |
US5194196A (en) * | 1989-10-06 | 1993-03-16 | International Business Machines Corporation | Hermetic package for an electronic device and method of manufacturing same |
JPH03204995A (ja) * | 1989-10-27 | 1991-09-06 | Matsushita Electric Ind Co Ltd | セラミック多層基板の製造方法 |
US5089070A (en) * | 1989-12-07 | 1992-02-18 | Pac Polymers Inc. | Poly(propylene carbonate)-containing ceramic tape formulations and the green tapes resulting therefrom |
KR920002589B1 (ko) * | 1990-03-30 | 1992-03-30 | 삼성코닝 주식회사 | 금속 인쇄된 세라믹 팩키지의 제조방법 |
US5073180A (en) * | 1991-03-20 | 1991-12-17 | International Business Machines Corporation | Method for forming sealed co-fired glass ceramic structures |
US5215610A (en) * | 1991-04-04 | 1993-06-01 | International Business Machines Corporation | Method for fabricating superconductor packages |
JP2584911B2 (ja) * | 1991-06-18 | 1997-02-26 | 富士通株式会社 | ガラス−セラミック多層回路基板の製造方法 |
US5925443A (en) | 1991-09-10 | 1999-07-20 | International Business Machines Corporation | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias |
US5682018A (en) * | 1991-10-18 | 1997-10-28 | International Business Machines Corporation | Interface regions between metal and ceramic in a metal/ceramic substrate |
JPH05218654A (ja) * | 1991-10-25 | 1993-08-27 | Internatl Business Mach Corp <Ibm> | マイクロ波を用いたセラミック複合構造の製造方法 |
EP0569799B1 (en) * | 1992-05-14 | 2000-09-06 | Matsushita Electric Industrial Co., Ltd. | Method for making via conductors in multilayer ceramic substrates |
US5336444A (en) * | 1992-05-29 | 1994-08-09 | International Business Machines Corporation | Ceramic via composition, multilayer ceramic circuit containing same, and process for using same |
JPH06169174A (ja) * | 1992-08-17 | 1994-06-14 | Praxair Technol Inc | 多層セラミック構造物からのバインダー除去 |
US5293504A (en) * | 1992-09-23 | 1994-03-08 | International Business Machines Corporation | Multilayer ceramic substrate with capped vias |
US5260519A (en) * | 1992-09-23 | 1993-11-09 | International Business Machines Corporation | Multilayer ceramic substrate with graded vias |
US5302562A (en) * | 1992-10-28 | 1994-04-12 | International Business Machines Corporation | Method of controlling the densification behavior of a metallic feature in a ceramic material |
JPH06223623A (ja) * | 1992-12-28 | 1994-08-12 | Internatl Business Mach Corp <Ibm> | 銅を素材とするペーストおよびセラミックパッケージ |
JP3150479B2 (ja) * | 1993-03-11 | 2001-03-26 | 株式会社日立製作所 | 多層配線セラミック基板の製造方法 |
US5686790A (en) * | 1993-06-22 | 1997-11-11 | Candescent Technologies Corporation | Flat panel device with ceramic backplate |
JP2570617B2 (ja) * | 1994-05-13 | 1997-01-08 | 日本電気株式会社 | 多層配線セラミック基板のビア構造及びその製造方法 |
JP2606155B2 (ja) * | 1994-10-13 | 1997-04-30 | 日本電気株式会社 | 多層配線基板とその製造方法、及びそれに用いるシリカ焼結体の製造方法 |
US5728470A (en) * | 1994-05-13 | 1998-03-17 | Nec Corporation | Multi-layer wiring substrate, and process for producing the same |
DE4443365A1 (de) * | 1994-12-06 | 1996-06-13 | Philips Patentverwaltung | Brenn- und Sinterverfahren für ein keramisches elektronisches Bauteil |
US5613181A (en) * | 1994-12-21 | 1997-03-18 | International Business Machines Corporation | Co-sintered surface metallization for pin-join, wire-bond and chip attach |
US5671116A (en) * | 1995-03-10 | 1997-09-23 | Lam Research Corporation | Multilayered electrostatic chuck and method of manufacture thereof |
US6002951A (en) * | 1997-11-12 | 1999-12-14 | International Business Machines Corporation | Multi-layer ceramic substrate having high TC superconductor circuitry |
US6258191B1 (en) * | 1998-09-16 | 2001-07-10 | International Business Machines Corporation | Method and materials for increasing the strength of crystalline ceramic |
US6231707B1 (en) | 1998-09-22 | 2001-05-15 | International Business Machines Corporation | Method of forming a multilayer ceramic substrate with max-punched vias |
US6341417B1 (en) | 1999-09-23 | 2002-01-29 | International Business Machines Corporation | Pre-patterned substrate layers for being personalized as needed |
US6569278B1 (en) | 1999-09-29 | 2003-05-27 | International Business Machines Corporation | Powder metal polymer organic sheet punching for substrate conductors |
US6395206B1 (en) | 2000-06-05 | 2002-05-28 | Praxair Technology, Inc. | Method of removing an organic binder from a green ceramic form |
JP2003136027A (ja) * | 2001-11-01 | 2003-05-13 | Ngk Insulators Ltd | 半導体製造装置中で使用するためのセラミック部材を洗浄する方法、洗浄剤および洗浄剤の組み合わせ |
KR20040008094A (ko) * | 2002-07-17 | 2004-01-28 | 엔지케이 스파크 플러그 캄파니 리미티드 | 동 페이스트, 이것을 이용한 배선기판 및 배선기판의제조방법 |
KR20040008093A (ko) * | 2002-07-17 | 2004-01-28 | 엔지케이 스파크 플러그 캄파니 리미티드 | 동 페이스트 및 그것을 이용한 배선기판 |
US20090238954A1 (en) * | 2008-03-20 | 2009-09-24 | Seigi Suh | Large area thin film capacitors on metal foils and methods of manufacturing same |
US10471418B2 (en) | 2015-10-16 | 2019-11-12 | International Business Machines Corporation | Selectively functionalized porous material |
WO2019191350A1 (en) | 2018-03-28 | 2019-10-03 | Corning Incorporated | Boron phosphate glass-ceramics with low dielectric loss |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3423517A (en) * | 1966-07-27 | 1969-01-21 | Dielectric Systems Inc | Monolithic ceramic electrical interconnecting structure |
US3604082A (en) * | 1968-10-30 | 1971-09-14 | Corning Glass Works | Method of making a capacitor |
US3637435A (en) * | 1969-07-08 | 1972-01-25 | Gen Motors Corp | Metallizing process for glass-free ceramics bodies |
US3770529A (en) * | 1970-08-25 | 1973-11-06 | Ibm | Method of fabricating multilayer circuits |
JPS4911903A (it) * | 1972-05-10 | 1974-02-01 | ||
US3902102A (en) * | 1974-04-01 | 1975-08-26 | Sprague Electric Co | Ceramic capacitor with base metal electrodes |
US4101952A (en) * | 1976-08-17 | 1978-07-18 | Sprague Electric Company | Monolithic base-metal glass-ceramic capacitor |
-
1979
- 1979-03-23 US US06/023,112 patent/US4234367A/en not_active Expired - Lifetime
-
1980
- 1980-01-09 CA CA343,365A patent/CA1123115A/en not_active Expired
- 1980-01-16 DE DE8080100192T patent/DE3060057D1/de not_active Expired
- 1980-01-16 AT AT80100192T patent/ATE346T1/de not_active IP Right Cessation
- 1980-01-16 EP EP80100192A patent/EP0016307B1/de not_active Expired
- 1980-01-18 JP JP370780A patent/JPS55128899A/ja active Granted
- 1980-03-07 IT IT20408/80A patent/IT1150089B/it active
Also Published As
Publication number | Publication date |
---|---|
DE3060057D1 (en) | 1982-01-14 |
JPS6245720B2 (it) | 1987-09-28 |
EP0016307A1 (de) | 1980-10-01 |
EP0016307B1 (de) | 1981-11-04 |
CA1123115A (en) | 1982-05-04 |
US4234367A (en) | 1980-11-18 |
ATE346T1 (de) | 1981-11-15 |
JPS55128899A (en) | 1980-10-06 |
IT8020408A0 (it) | 1980-03-07 |
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