IL236457B - A preparation for the manufacture of integrated circuit devices, optical devices, micro machines and mechanical precision devices - Google Patents

A preparation for the manufacture of integrated circuit devices, optical devices, micro machines and mechanical precision devices

Info

Publication number
IL236457B
IL236457B IL236457A IL23645714A IL236457B IL 236457 B IL236457 B IL 236457B IL 236457 A IL236457 A IL 236457A IL 23645714 A IL23645714 A IL 23645714A IL 236457 B IL236457 B IL 236457B
Authority
IL
Israel
Prior art keywords
devices
micromachines
composition
integrated circuit
manufacturing integrated
Prior art date
Application number
IL236457A
Other languages
English (en)
Hebrew (he)
Other versions
IL236457A0 (en
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of IL236457A0 publication Critical patent/IL236457A0/en
Publication of IL236457B publication Critical patent/IL236457B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/322—Aqueous alkaline compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
IL236457A 2012-07-16 2014-12-25 A preparation for the manufacture of integrated circuit devices, optical devices, micro machines and mechanical precision devices IL236457B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261671806P 2012-07-16 2012-07-16
PCT/IB2013/055728 WO2014013396A2 (en) 2012-07-16 2013-07-12 Composition for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices

Publications (2)

Publication Number Publication Date
IL236457A0 IL236457A0 (en) 2015-02-26
IL236457B true IL236457B (en) 2020-04-30

Family

ID=49949313

Family Applications (1)

Application Number Title Priority Date Filing Date
IL236457A IL236457B (en) 2012-07-16 2014-12-25 A preparation for the manufacture of integrated circuit devices, optical devices, micro machines and mechanical precision devices

Country Status (11)

Country Link
US (1) US20150192854A1 (enExample)
EP (1) EP2875406A4 (enExample)
JP (1) JP6328630B2 (enExample)
KR (1) KR102107370B1 (enExample)
CN (1) CN104471487B (enExample)
IL (1) IL236457B (enExample)
MY (1) MY171072A (enExample)
RU (1) RU2015104902A (enExample)
SG (1) SG11201500235XA (enExample)
TW (1) TWI665177B (enExample)
WO (1) WO2014013396A2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015028576A (ja) * 2013-07-01 2015-02-12 富士フイルム株式会社 パターン形成方法
KR102374206B1 (ko) 2017-12-05 2022-03-14 삼성전자주식회사 반도체 장치 제조 방법
CN115943199A (zh) * 2020-07-09 2023-04-07 巴斯夫欧洲公司 用于在处理线间距尺寸为50nm或更低的图案化材料时避免图案坍塌的包含硅氧烷和烷烃的组合物

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4628023A (en) * 1981-04-10 1986-12-09 Shipley Company Inc. Metal ion free photoresist developer composition with lower alkyl quaternary ammonium hydrozide as alkalai agent and a quaternary ammonium compound as surfactant
JP3707856B2 (ja) * 1996-03-07 2005-10-19 富士通株式会社 レジストパターンの形成方法
JPH11218932A (ja) * 1997-10-31 1999-08-10 Nippon Zeon Co Ltd ポリイミド系感光性樹脂組成物用現像液
KR19990037527A (ko) * 1997-10-31 1999-05-25 후지쯔 가부시끼가이샤 폴리이미드계 감광성 수지조성물용 현상액
JP4265741B2 (ja) * 2003-02-28 2009-05-20 日本カーリット株式会社 レジスト剥離剤
JP3993549B2 (ja) * 2003-09-30 2007-10-17 株式会社東芝 レジストパターン形成方法
US7157213B2 (en) * 2004-03-01 2007-01-02 Think Laboratory Co., Ltd. Developer agent for positive type photosensitive compound
SG138212A1 (enExample) * 2005-06-13 2008-01-28
JP5206304B2 (ja) * 2008-10-15 2013-06-12 東ソー株式会社 第四級アンモニウム塩の回収方法
WO2010103062A1 (de) * 2009-03-12 2010-09-16 Basf Se Verfahren zur herstellung von 1-adamantyltrimethylammoniumhydroxid
SG10201402081TA (en) * 2009-05-07 2014-07-30 Basf Se Resist stripping compositions and methods for manufacturing electrical devices
CN101963754B (zh) 2009-06-26 2012-12-19 罗门哈斯电子材料有限公司 形成电子器件的方法
CN101993377A (zh) * 2009-08-07 2011-03-30 出光兴产株式会社 具有金刚烷骨架的胺类和季铵盐的制造方法
JP2011145557A (ja) * 2010-01-15 2011-07-28 Tokyo Ohka Kogyo Co Ltd フォトリソグラフィ用現像液
JP6213296B2 (ja) * 2013-04-10 2017-10-18 信越化学工業株式会社 現像液を用いたパターン形成方法

Also Published As

Publication number Publication date
MY171072A (en) 2019-09-24
TWI665177B (zh) 2019-07-11
WO2014013396A3 (en) 2014-03-06
EP2875406A2 (en) 2015-05-27
RU2015104902A (ru) 2016-09-10
SG11201500235XA (en) 2015-02-27
US20150192854A1 (en) 2015-07-09
WO2014013396A2 (en) 2014-01-23
KR20150042796A (ko) 2015-04-21
JP2015524577A (ja) 2015-08-24
EP2875406A4 (en) 2016-11-09
IL236457A0 (en) 2015-02-26
CN104471487B (zh) 2019-07-09
TW201425279A (zh) 2014-07-01
KR102107370B1 (ko) 2020-05-07
JP6328630B2 (ja) 2018-05-23
CN104471487A (zh) 2015-03-25

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