FI20115151A0 - Uudet mikromekaaniset laitteet - Google Patents
Uudet mikromekaaniset laitteetInfo
- Publication number
- FI20115151A0 FI20115151A0 FI20115151A FI20115151A FI20115151A0 FI 20115151 A0 FI20115151 A0 FI 20115151A0 FI 20115151 A FI20115151 A FI 20115151A FI 20115151 A FI20115151 A FI 20115151A FI 20115151 A0 FI20115151 A0 FI 20115151A0
- Authority
- FI
- Finland
- Prior art keywords
- micromechanical devices
- new
- new micromechanical
- devices
- micromechanical
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02433—Means for compensation or elimination of undesired effects
- H03H9/02448—Means for compensation or elimination of undesired effects of temperature influence
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0081—Thermal properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0067—Mechanical properties
- B81B3/0078—Constitution or structural means for improving mechanical properties not provided for in B81B3/007 - B81B3/0075
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/0072—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/0072—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks
- H03H3/0076—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks for obtaining desired frequency or temperature coefficients
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2447—Beam resonators
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0271—Resonators; ultrasonic resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02488—Vibration modes
- H03H2009/02496—Horizontal, i.e. parallel to the substrate plane
- H03H2009/02503—Breath-like, e.g. Lam? mode, wine-glass mode
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02488—Vibration modes
- H03H2009/02519—Torsional
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H2009/241—Bulk-mode MEMS resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H2009/2442—Square resonators
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Micromachines (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI20115151A FI126586B (fi) | 2011-02-17 | 2011-02-17 | Uudet mikromekaaniset laitteet |
| US13/985,876 US9559660B2 (en) | 2011-02-17 | 2012-02-17 | Micromechanical devices comprising n-type doping agents |
| KR1020137024650A KR101724661B1 (ko) | 2011-02-17 | 2012-02-17 | 신규한 마이크로메카닉 디바이스 |
| JP2013553977A JP6109752B2 (ja) | 2011-02-17 | 2012-02-17 | 新規な微小機械デバイス |
| PCT/FI2012/050157 WO2012110708A1 (en) | 2011-02-17 | 2012-02-17 | Novel micromechanical devices |
| CN201280009253.4A CN103444079B (zh) | 2011-02-17 | 2012-02-17 | 微机械装置及制造微机械装置的方法 |
| EP12747759.4A EP2676366B1 (en) | 2011-02-17 | 2012-02-17 | Novel micromechanical devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI20115151A FI126586B (fi) | 2011-02-17 | 2011-02-17 | Uudet mikromekaaniset laitteet |
Publications (4)
| Publication Number | Publication Date |
|---|---|
| FI20115151A0 true FI20115151A0 (fi) | 2011-02-17 |
| FI20115151L FI20115151L (fi) | 2012-08-18 |
| FI20115151A FI20115151A (fi) | 2012-08-18 |
| FI126586B FI126586B (fi) | 2017-02-28 |
Family
ID=43629823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FI20115151A FI126586B (fi) | 2011-02-17 | 2011-02-17 | Uudet mikromekaaniset laitteet |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9559660B2 (fi) |
| EP (1) | EP2676366B1 (fi) |
| JP (1) | JP6109752B2 (fi) |
| KR (1) | KR101724661B1 (fi) |
| CN (1) | CN103444079B (fi) |
| FI (1) | FI126586B (fi) |
| WO (1) | WO2012110708A1 (fi) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8234774B2 (en) | 2007-12-21 | 2012-08-07 | Sitime Corporation | Method for fabricating a microelectromechanical system (MEMS) resonator |
| US8941191B2 (en) * | 2010-07-30 | 2015-01-27 | Cornell University | Method of actuating an internally transduced pn-diode-based ultra high frequency micromechanical resonator |
| US9695036B1 (en) | 2012-02-02 | 2017-07-04 | Sitime Corporation | Temperature insensitive resonant elements and oscillators and methods of designing and manufacturing same |
| US8916407B1 (en) | 2012-03-29 | 2014-12-23 | Sitime Corporation | MEMS device and method of manufacturing same |
| SG11201501005YA (en) | 2012-09-13 | 2015-05-28 | Murata Manufacturing Co | Vibrating device and manufacturing method therefor |
| JP6094671B2 (ja) | 2013-05-13 | 2017-03-15 | 株式会社村田製作所 | 振動装置 |
| CN105210295B (zh) | 2013-05-13 | 2017-10-03 | 株式会社村田制作所 | 振动装置 |
| SG11201508860QA (en) | 2013-05-13 | 2015-11-27 | Murata Manufacturing Co | Vibrating device |
| US9412934B2 (en) * | 2013-05-20 | 2016-08-09 | Murata Manufacturing Co., Ltd. | Microelectromechanical resonator |
| WO2014188317A1 (en) | 2013-05-20 | 2014-11-27 | Murata Manufacturing Co., Ltd. | An improved microelectromechanical resonator |
| US9712128B2 (en) | 2014-02-09 | 2017-07-18 | Sitime Corporation | Microelectromechanical resonator |
| US9705470B1 (en) | 2014-02-09 | 2017-07-11 | Sitime Corporation | Temperature-engineered MEMS resonator |
| US10291200B2 (en) * | 2014-07-02 | 2019-05-14 | The Royal Institution For The Advancement Of Learning / Mcgill University | Methods and devices for microelectromechanical resonators |
| WO2016051023A1 (en) | 2014-10-03 | 2016-04-07 | Teknologian Tutkimuskeskus Vtt Oy | Temperature compensated compound resonator |
| WO2016051025A1 (en) | 2014-10-03 | 2016-04-07 | Teknologian Tutkimuskeskus Vtt Oy | Temperature compensated plate resonator |
| CN107005223B (zh) * | 2014-10-03 | 2021-06-04 | 芬兰国家技术研究中心股份公司 | 温度补偿梁谐振器 |
| WO2016098868A1 (ja) * | 2014-12-17 | 2016-06-23 | 株式会社村田製作所 | 圧電振動子及び圧電振動装置 |
| US20190112181A1 (en) | 2016-04-01 | 2019-04-18 | Teknologian Tutkimuskeskus Vtt Oy | Stabile micromechanical devices |
| EP3444947B1 (en) | 2016-05-26 | 2023-03-22 | Murata Manufacturing Co., Ltd. | Resonator and resonance device |
| FI127787B (fi) * | 2016-07-01 | 2019-02-28 | Teknologian Tutkimuskeskus Vtt Oy | Mikromekaaninen resonaattori |
| US10291203B2 (en) * | 2016-07-12 | 2019-05-14 | Murata Manufacturing Co., Ltd. | Piezoelectric MEMS resonator with a high quality factor |
| US10676349B1 (en) | 2016-08-12 | 2020-06-09 | Sitime Corporation | MEMS resonator |
| FI128032B (fi) | 2017-09-05 | 2019-08-15 | Tikitin Oy | Uuniohjattu taajuusreferenssioskillaattori ja menetelmä sen valmistamiseksi |
| FI128208B (fi) * | 2018-02-08 | 2019-12-31 | Tikitin Oy | Kytketty MEMS-resonaattori |
| FI128436B (fi) * | 2018-02-08 | 2020-05-15 | Tikitin Oy | MEMS-resonaattorijärjestely |
| FI20195302A1 (fi) | 2019-04-12 | 2020-10-13 | Tikitin Oy | Mems-resonaattori |
| US10958235B2 (en) * | 2019-08-21 | 2021-03-23 | Murata Manufacturing Co., Ltd. | Thickness mode resonator |
| US11448085B2 (en) * | 2019-11-11 | 2022-09-20 | Raytheon Technologies Corporation | Remote temperature measurement system for gas turbine engine |
| CN113285687B (zh) * | 2021-03-05 | 2023-02-03 | 天津大学 | 温度补偿型薄膜体声波谐振器及其形成方法、电子设备 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4358745A (en) | 1981-03-16 | 1982-11-09 | International Business Machines Corporation | Semiconductor surface acoustic wave device |
| US4719383A (en) | 1985-05-20 | 1988-01-12 | The United States Of America As Represented By The United States Department Of Energy | Piezoelectric shear wave resonator and method of making same |
| US5815054A (en) * | 1997-05-27 | 1998-09-29 | Motorola Inc. | Surface micromachined acoustic wave piezoelectric crystal with electrodes on raised ridges and in spaces therebetween |
| JP4193521B2 (ja) * | 2002-03-20 | 2008-12-10 | ソニー株式会社 | 燃料電池装置及び燃料電池の制御方法 |
| US6707351B2 (en) * | 2002-03-27 | 2004-03-16 | Motorola, Inc. | Tunable MEMS resonator and method for tuning |
| US6985051B2 (en) * | 2002-12-17 | 2006-01-10 | The Regents Of The University Of Michigan | Micromechanical resonator device and method of making a micromechanical device |
| FR2854993B1 (fr) * | 2003-05-15 | 2005-07-15 | Suisse Electronique Microtech | Resonateurs integres et base de temps incorporant de tels resonateurs |
| US7144750B2 (en) * | 2003-06-12 | 2006-12-05 | Dalsa Semiconductor Inc. | Method of fabricating silicon-based MEMS devices |
| KR20060119957A (ko) * | 2003-09-10 | 2006-11-24 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 전기기계 변환기 및 전기 장치 |
| US7068125B2 (en) * | 2004-03-04 | 2006-06-27 | Robert Bosch Gmbh | Temperature controlled MEMS resonator and method for controlling resonator frequency |
| DE602004030953D1 (de) | 2004-06-24 | 2011-02-17 | Nokia Siemens Networks Oy | Frequenzsynthesizer |
| CN101401303B (zh) * | 2006-03-09 | 2011-07-13 | Nxp股份有限公司 | 具有至少一种谐振器模式形状的mems谐振器及制造方法,含此mems谐振器的振荡器及滤波器 |
| US7446619B2 (en) * | 2006-06-14 | 2008-11-04 | Sitime Corporation | Temperature measurement system having a plurality of microelectromechanical resonators and method of operating same |
| US7564162B2 (en) * | 2006-12-13 | 2009-07-21 | Georgia Tech Research Corp. | Process compensated micromechanical resonators |
| US7907035B2 (en) * | 2007-12-18 | 2011-03-15 | Robert Bosch Gmbh | MEMS resonator array structure and method of operating and using same |
| JP2009190150A (ja) * | 2008-02-18 | 2009-08-27 | Sanyo Electric Co Ltd | マイクロエレクトロメカニカルデバイス及びその製造方法。 |
| US8354332B2 (en) | 2008-11-26 | 2013-01-15 | Georgia Tech Research Corporation | Methods of forming micro-electromichanical resonators having boron-doped resonator bodies containing eutectic alloys |
| EP2302792B1 (en) | 2009-09-22 | 2012-11-14 | Nxp B.V. | Resonator |
| US8513864B2 (en) * | 2009-10-14 | 2013-08-20 | Gavin Ho | Micromechanical resonator with enlarged portion |
| FI124453B (fi) | 2010-08-13 | 2014-09-15 | Valtion Teknillinen | Mikromekaaninen resonaattorijärjestelmä ja menetelmä sen valmistamiseksi |
| FI20105851A (fi) | 2010-08-13 | 2012-02-14 | Valtion Teknillinen | Mikromekaaninen resonaattori ja menetelmä sen valmistamiseksi |
-
2011
- 2011-02-17 FI FI20115151A patent/FI126586B/fi active IP Right Grant
-
2012
- 2012-02-17 JP JP2013553977A patent/JP6109752B2/ja active Active
- 2012-02-17 WO PCT/FI2012/050157 patent/WO2012110708A1/en active Application Filing
- 2012-02-17 US US13/985,876 patent/US9559660B2/en active Active
- 2012-02-17 EP EP12747759.4A patent/EP2676366B1/en active Active
- 2012-02-17 KR KR1020137024650A patent/KR101724661B1/ko active IP Right Grant
- 2012-02-17 CN CN201280009253.4A patent/CN103444079B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN103444079B (zh) | 2017-05-31 |
| WO2012110708A1 (en) | 2012-08-23 |
| JP6109752B2 (ja) | 2017-04-05 |
| JP2014507096A (ja) | 2014-03-20 |
| CN103444079A (zh) | 2013-12-11 |
| EP2676366A1 (en) | 2013-12-25 |
| FI126586B (fi) | 2017-02-28 |
| EP2676366B1 (en) | 2020-12-02 |
| EP2676366A4 (en) | 2014-08-06 |
| KR101724661B1 (ko) | 2017-04-18 |
| KR20140021571A (ko) | 2014-02-20 |
| FI20115151L (fi) | 2012-08-18 |
| US20140077898A1 (en) | 2014-03-20 |
| US9559660B2 (en) | 2017-01-31 |
| FI20115151A (fi) | 2012-08-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PC | Transfer of assignment of patent |
Owner name: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY |
|
| FG | Patent granted |
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