HK1207162A1 - Substrate processing device and device manufacturing method - Google Patents

Substrate processing device and device manufacturing method

Info

Publication number
HK1207162A1
HK1207162A1 HK15107671.4A HK15107671A HK1207162A1 HK 1207162 A1 HK1207162 A1 HK 1207162A1 HK 15107671 A HK15107671 A HK 15107671A HK 1207162 A1 HK1207162 A1 HK 1207162A1
Authority
HK
Hong Kong
Prior art keywords
substrate processing
processing device
manufacturing
device manufacturing
substrate
Prior art date
Application number
HK15107671.4A
Other languages
English (en)
Chinese (zh)
Inventor
鈴木智也
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of HK1207162A1 publication Critical patent/HK1207162A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
HK15107671.4A 2012-09-14 2015-08-08 Substrate processing device and device manufacturing method HK1207162A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012203578 2012-09-14
PCT/JP2013/071823 WO2014041941A1 (ja) 2012-09-14 2013-08-12 基板処理装置及びデバイス製造方法

Publications (1)

Publication Number Publication Date
HK1207162A1 true HK1207162A1 (en) 2016-01-22

Family

ID=50278066

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15107671.4A HK1207162A1 (en) 2012-09-14 2015-08-08 Substrate processing device and device manufacturing method

Country Status (6)

Country Link
JP (4) JP6256338B2 (ja)
KR (5) KR101923360B1 (ja)
CN (2) CN106933065B (ja)
HK (1) HK1207162A1 (ja)
TW (4) TWI606306B (ja)
WO (1) WO2014041941A1 (ja)

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CN106415193B (zh) * 2014-03-21 2019-08-09 卡尔佩迪姆技术有限公司 用于在柔性基板上制造微型结构的系统和方法
TWI709006B (zh) * 2014-04-01 2020-11-01 日商尼康股份有限公司 圖案描繪裝置及圖案描繪方法
JP6311450B2 (ja) * 2014-05-23 2018-04-18 株式会社ニコン 搬送装置
WO2016013417A1 (ja) * 2014-07-23 2016-01-28 株式会社ニコン 円筒部材の位置検出装置、基板処理装置及びデバイス製造方法及びシート基板の搬送装置
CN107735715B (zh) * 2015-06-17 2020-07-17 株式会社尼康 图案描绘装置及图案描绘方法
JP6942555B2 (ja) * 2017-08-03 2021-09-29 東京エレクトロン株式会社 基板処理方法、コンピュータ記憶媒体及び基板処理システム
JP6516030B2 (ja) * 2018-03-05 2019-05-22 株式会社ニコン パターン形成方法
JP7131334B2 (ja) * 2018-11-29 2022-09-06 株式会社安川電機 基板支持装置、基板搬送ロボットおよびアライナ装置
JP6680376B2 (ja) * 2019-03-06 2020-04-15 株式会社ニコン パターン形成装置
CN109884861A (zh) * 2019-03-26 2019-06-14 中山新诺科技股份有限公司 一种柔性板双面激光直写数字化曝光机
US20220253155A1 (en) * 2019-06-07 2022-08-11 Panasonic Intellectual Property Management Co., Ltd. Input device and input system
JP7004016B2 (ja) * 2020-02-28 2022-01-21 株式会社ニコン パターン形成装置

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JPS60158626A (ja) * 1984-01-30 1985-08-20 Canon Inc 半導体露光装置
JP2938799B2 (ja) * 1996-03-11 1999-08-25 信越ポリマー株式会社 リモコンフェース用プラスチックシート
JP2001308003A (ja) * 2000-02-15 2001-11-02 Nikon Corp 露光方法及び装置、並びにデバイス製造方法
JP3701007B2 (ja) * 2000-08-31 2005-09-28 株式会社朝日工業社 ガラス基板の温度制御方法及びその装置
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JP2010155439A (ja) * 2009-01-05 2010-07-15 Asahi Kasei Corp 凹凸パターンを有するポリマーシートの製造方法
JP5282895B2 (ja) * 2009-03-06 2013-09-04 株式会社ニコン 露光装置、露光方法、およびデバイス製造方法
US8264666B2 (en) 2009-03-13 2012-09-11 Nikon Corporation Exposure apparatus, exposure method, and method of manufacturing device
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JP2012099638A (ja) * 2010-11-02 2012-05-24 Fujifilm Corp インプリント用硬化性組成物
JP5424271B2 (ja) * 2010-11-08 2014-02-26 株式会社ブイ・テクノロジー 露光装置
JP5929761B2 (ja) * 2010-12-15 2016-06-08 株式会社ニコン 基板処理システム及び表示素子の製造方法
JP2012203151A (ja) * 2011-03-24 2012-10-22 Hitachi High-Technologies Corp フィルム基板露光装置、及びフィルム基板露光方法
JP4975180B2 (ja) * 2011-08-29 2012-07-11 株式会社朝日工業社 ガラス基板温調用ノズル構造

Also Published As

Publication number Publication date
WO2014041941A1 (ja) 2014-03-20
TWI692677B (zh) 2020-05-01
KR101973349B1 (ko) 2019-04-26
KR20180112881A (ko) 2018-10-12
KR20150056547A (ko) 2015-05-26
CN106933065B (zh) 2019-03-05
KR20180033595A (ko) 2018-04-03
TWI724850B (zh) 2021-04-11
TW201908876A (zh) 2019-03-01
TW202026775A (zh) 2020-07-16
JP6256338B2 (ja) 2018-01-10
KR101861904B1 (ko) 2018-05-28
JP2019061279A (ja) 2019-04-18
KR20180127548A (ko) 2018-11-28
JPWO2014041941A1 (ja) 2016-08-18
KR101908269B1 (ko) 2018-10-15
JP2018045248A (ja) 2018-03-22
KR20180079476A (ko) 2018-07-10
JP6780742B2 (ja) 2020-11-04
JP6690697B2 (ja) 2020-04-28
KR101923360B1 (ko) 2018-11-28
TW201809906A (zh) 2018-03-16
CN106933065A (zh) 2017-07-07
TWI606306B (zh) 2017-11-21
CN104620178A (zh) 2015-05-13
JP2019152885A (ja) 2019-09-12
CN104620178B (zh) 2016-10-26
KR101890099B1 (ko) 2018-08-20
JP6540774B2 (ja) 2019-07-10
TW201411298A (zh) 2014-03-16
TWI645262B (zh) 2018-12-21

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20210816