KR101923360B1 - 기판 처리 장치 및 디바이스 제조 방법 - Google Patents

기판 처리 장치 및 디바이스 제조 방법 Download PDF

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Publication number
KR101923360B1
KR101923360B1 KR1020187028868A KR20187028868A KR101923360B1 KR 101923360 B1 KR101923360 B1 KR 101923360B1 KR 1020187028868 A KR1020187028868 A KR 1020187028868A KR 20187028868 A KR20187028868 A KR 20187028868A KR 101923360 B1 KR101923360 B1 KR 101923360B1
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KR
South Korea
Prior art keywords
substrate
temperature
pattern
processing apparatus
drum member
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KR1020187028868A
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English (en)
Korean (ko)
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KR20180112881A (ko
Inventor
도모나리 스즈키
Original Assignee
가부시키가이샤 니콘
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Publication of KR20180112881A publication Critical patent/KR20180112881A/ko
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Publication of KR101923360B1 publication Critical patent/KR101923360B1/ko

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/24Curved surfaces

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020187028868A 2012-09-14 2013-08-12 기판 처리 장치 및 디바이스 제조 방법 KR101923360B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2012-203578 2012-09-14
JP2012203578 2012-09-14
PCT/JP2013/071823 WO2014041941A1 (ja) 2012-09-14 2013-08-12 基板処理装置及びデバイス製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020187018983A Division KR101908269B1 (ko) 2012-09-14 2013-08-12 기판 처리 장치 및 디바이스 제조 방법

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020187033760A Division KR101973349B1 (ko) 2012-09-14 2013-08-12 기판 처리 장치 및 디바이스 제조 방법

Publications (2)

Publication Number Publication Date
KR20180112881A KR20180112881A (ko) 2018-10-12
KR101923360B1 true KR101923360B1 (ko) 2018-11-28

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ID=50278066

Family Applications (5)

Application Number Title Priority Date Filing Date
KR1020187028868A KR101923360B1 (ko) 2012-09-14 2013-08-12 기판 처리 장치 및 디바이스 제조 방법
KR1020187033760A KR101973349B1 (ko) 2012-09-14 2013-08-12 기판 처리 장치 및 디바이스 제조 방법
KR1020187007927A KR101890099B1 (ko) 2012-09-14 2013-08-12 기판 처리 장치 및 디바이스 제조 방법
KR1020157006339A KR101861904B1 (ko) 2012-09-14 2013-08-12 기판 처리 장치 및 디바이스 제조 방법
KR1020187018983A KR101908269B1 (ko) 2012-09-14 2013-08-12 기판 처리 장치 및 디바이스 제조 방법

Family Applications After (4)

Application Number Title Priority Date Filing Date
KR1020187033760A KR101973349B1 (ko) 2012-09-14 2013-08-12 기판 처리 장치 및 디바이스 제조 방법
KR1020187007927A KR101890099B1 (ko) 2012-09-14 2013-08-12 기판 처리 장치 및 디바이스 제조 방법
KR1020157006339A KR101861904B1 (ko) 2012-09-14 2013-08-12 기판 처리 장치 및 디바이스 제조 방법
KR1020187018983A KR101908269B1 (ko) 2012-09-14 2013-08-12 기판 처리 장치 및 디바이스 제조 방법

Country Status (6)

Country Link
JP (4) JP6256338B2 (ja)
KR (5) KR101923360B1 (ja)
CN (2) CN104620178B (ja)
HK (1) HK1207162A1 (ja)
TW (4) TWI645262B (ja)
WO (1) WO2014041941A1 (ja)

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EP3120107B1 (en) * 2014-03-21 2018-11-21 Carpe Diem Technologies, Inc. System and method for fabricating miniature structures on a flexible substrate
TWI674484B (zh) * 2014-04-01 2019-10-11 日商尼康股份有限公司 基板處理方法
JP6311450B2 (ja) * 2014-05-23 2018-04-18 株式会社ニコン 搬送装置
WO2016013417A1 (ja) * 2014-07-23 2016-01-28 株式会社ニコン 円筒部材の位置検出装置、基板処理装置及びデバイス製造方法及びシート基板の搬送装置
KR102680203B1 (ko) * 2015-06-17 2024-07-02 가부시키가이샤 니콘 패턴 묘화 장치 및 패턴 묘화 방법
JP6942555B2 (ja) * 2017-08-03 2021-09-29 東京エレクトロン株式会社 基板処理方法、コンピュータ記憶媒体及び基板処理システム
JP6516030B2 (ja) * 2018-03-05 2019-05-22 株式会社ニコン パターン形成方法
JP7131334B2 (ja) * 2018-11-29 2022-09-06 株式会社安川電機 基板支持装置、基板搬送ロボットおよびアライナ装置
JP6680376B2 (ja) * 2019-03-06 2020-04-15 株式会社ニコン パターン形成装置
CN109884861A (zh) * 2019-03-26 2019-06-14 中山新诺科技股份有限公司 一种柔性板双面激光直写数字化曝光机
JP7370019B2 (ja) * 2019-06-07 2023-10-27 パナソニックIpマネジメント株式会社 入力装置及び入力システム
JP7004016B2 (ja) * 2020-02-28 2022-01-21 株式会社ニコン パターン形成装置

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Also Published As

Publication number Publication date
CN106933065A (zh) 2017-07-07
JP2019152885A (ja) 2019-09-12
KR101973349B1 (ko) 2019-04-26
KR20180033595A (ko) 2018-04-03
KR20180112881A (ko) 2018-10-12
JP6256338B2 (ja) 2018-01-10
KR20180127548A (ko) 2018-11-28
KR101908269B1 (ko) 2018-10-15
TW201908876A (zh) 2019-03-01
TW202026775A (zh) 2020-07-16
KR20150056547A (ko) 2015-05-26
TW201809906A (zh) 2018-03-16
KR101890099B1 (ko) 2018-08-20
KR101861904B1 (ko) 2018-05-28
JP6690697B2 (ja) 2020-04-28
TWI606306B (zh) 2017-11-21
TWI724850B (zh) 2021-04-11
TWI692677B (zh) 2020-05-01
TW201411298A (zh) 2014-03-16
CN104620178B (zh) 2016-10-26
HK1207162A1 (en) 2016-01-22
CN106933065B (zh) 2019-03-05
JP2018045248A (ja) 2018-03-22
JP2019061279A (ja) 2019-04-18
WO2014041941A1 (ja) 2014-03-20
JPWO2014041941A1 (ja) 2016-08-18
JP6780742B2 (ja) 2020-11-04
JP6540774B2 (ja) 2019-07-10
KR20180079476A (ko) 2018-07-10
TWI645262B (zh) 2018-12-21
CN104620178A (zh) 2015-05-13

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