CN106933065B - 基板处理装置 - Google Patents

基板处理装置 Download PDF

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Publication number
CN106933065B
CN106933065B CN201610861837.4A CN201610861837A CN106933065B CN 106933065 B CN106933065 B CN 106933065B CN 201610861837 A CN201610861837 A CN 201610861837A CN 106933065 B CN106933065 B CN 106933065B
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China
Prior art keywords
substrate
temperature
pattern
processing unit
cartridge unit
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CN201610861837.4A
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Chinese (zh)
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CN106933065A (zh
Inventor
铃木智也
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Nikon Corp
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Nikon Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201610861837.4A 2012-09-14 2013-08-12 基板处理装置 Active CN106933065B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-203578 2012-09-14
JP2012203578 2012-09-14
CN201380047645.4A CN104620178B (zh) 2012-09-14 2013-08-12 基板处理装置及元件制造方法

Related Parent Applications (1)

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CN201380047645.4A Division CN104620178B (zh) 2012-09-14 2013-08-12 基板处理装置及元件制造方法

Publications (2)

Publication Number Publication Date
CN106933065A CN106933065A (zh) 2017-07-07
CN106933065B true CN106933065B (zh) 2019-03-05

Family

ID=50278066

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201610861837.4A Active CN106933065B (zh) 2012-09-14 2013-08-12 基板处理装置
CN201380047645.4A Active CN104620178B (zh) 2012-09-14 2013-08-12 基板处理装置及元件制造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201380047645.4A Active CN104620178B (zh) 2012-09-14 2013-08-12 基板处理装置及元件制造方法

Country Status (6)

Country Link
JP (4) JP6256338B2 (ja)
KR (5) KR101923360B1 (ja)
CN (2) CN106933065B (ja)
HK (1) HK1207162A1 (ja)
TW (4) TWI606306B (ja)
WO (1) WO2014041941A1 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106415193B (zh) * 2014-03-21 2019-08-09 卡尔佩迪姆技术有限公司 用于在柔性基板上制造微型结构的系统和方法
TWI709006B (zh) * 2014-04-01 2020-11-01 日商尼康股份有限公司 圖案描繪裝置及圖案描繪方法
JP6311450B2 (ja) * 2014-05-23 2018-04-18 株式会社ニコン 搬送装置
WO2016013417A1 (ja) * 2014-07-23 2016-01-28 株式会社ニコン 円筒部材の位置検出装置、基板処理装置及びデバイス製造方法及びシート基板の搬送装置
CN107735715B (zh) * 2015-06-17 2020-07-17 株式会社尼康 图案描绘装置及图案描绘方法
JP6942555B2 (ja) * 2017-08-03 2021-09-29 東京エレクトロン株式会社 基板処理方法、コンピュータ記憶媒体及び基板処理システム
JP6516030B2 (ja) * 2018-03-05 2019-05-22 株式会社ニコン パターン形成方法
JP7131334B2 (ja) * 2018-11-29 2022-09-06 株式会社安川電機 基板支持装置、基板搬送ロボットおよびアライナ装置
JP6680376B2 (ja) * 2019-03-06 2020-04-15 株式会社ニコン パターン形成装置
CN109884861A (zh) * 2019-03-26 2019-06-14 中山新诺科技股份有限公司 一种柔性板双面激光直写数字化曝光机
US20220253155A1 (en) * 2019-06-07 2022-08-11 Panasonic Intellectual Property Management Co., Ltd. Input device and input system
JP7004016B2 (ja) * 2020-02-28 2022-01-21 株式会社ニコン パターン形成装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1309332A (zh) * 2000-02-15 2001-08-22 株式会社尼康 曝光方法及其曝光装置、以及器件制造方法
CN101099224A (zh) * 2005-04-25 2008-01-02 株式会社尼康 曝光方法和曝光装置、以及器件制造方法

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5651319A (en) * 1979-10-01 1981-05-08 Unitika Ltd Manufacture of nylon embossed film
JPS5922932A (ja) * 1982-07-30 1984-02-06 Teijin Ltd 薄膜の製造方法
JPS60158626A (ja) * 1984-01-30 1985-08-20 Canon Inc 半導体露光装置
JP2938799B2 (ja) * 1996-03-11 1999-08-25 信越ポリマー株式会社 リモコンフェース用プラスチックシート
JP3701007B2 (ja) * 2000-08-31 2005-09-28 株式会社朝日工業社 ガラス基板の温度制御方法及びその装置
JP4308458B2 (ja) * 2001-09-25 2009-08-05 富士フイルム株式会社 画像記録装置
JP4052558B2 (ja) * 2002-05-13 2008-02-27 富士フイルム株式会社 光学補償シートの製造方法及び装置
DE10308436C5 (de) * 2003-02-27 2010-08-26 Heidelberger Druckmaschinen Ag Druckplattenbelichter zur Aufzeichnung von Druckvorlagen
JP2004296773A (ja) * 2003-03-27 2004-10-21 Dainippon Printing Co Ltd 基板の温度管理方法及び温度管理装置
JP4376128B2 (ja) * 2003-05-23 2009-12-02 大日本印刷株式会社 光学シート及びその製造方法
DE10353029B3 (de) * 2003-11-13 2004-08-19 Heidelberger Druckmaschinen Ag Vorrichtung und Verfahren zur Messung der Längenänderung der Vorschubspindel in einem Belichter für Druckvorlagen
JP4669760B2 (ja) * 2004-09-14 2011-04-13 芝浦メカトロニクス株式会社 基板の処理装置及び処理方法
JP2006098727A (ja) * 2004-09-29 2006-04-13 Fuji Photo Film Co Ltd 伸縮状態の検出手段を設けた長尺の可撓性記録媒体と、この可撓性記録媒体に伸縮状態を補正して画像を描画可能な描画方法及び装置
JP2006098719A (ja) * 2004-09-29 2006-04-13 Fuji Photo Film Co Ltd 露光装置
US7375795B2 (en) * 2004-12-22 2008-05-20 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and device manufactured thereby
US7100510B2 (en) * 2005-02-09 2006-09-05 Eastman Kodak Company Method for registering patterns on a web
JP5181451B2 (ja) 2006-09-20 2013-04-10 株式会社ニコン マスク、露光装置及び露光方法、並びにデバイス製造方法
US20080229941A1 (en) * 2007-03-19 2008-09-25 Babak Heidari Nano-imprinting apparatus and method
KR20090120136A (ko) * 2008-05-19 2009-11-24 삼성전기주식회사 임프린트 장치
JP2010118557A (ja) * 2008-11-13 2010-05-27 Canon Inc 露光装置、基板処理装置、リソグラフィーシステムおよびデバイス製造方法
JP2010155439A (ja) * 2009-01-05 2010-07-15 Asahi Kasei Corp 凹凸パターンを有するポリマーシートの製造方法
JP5282895B2 (ja) * 2009-03-06 2013-09-04 株式会社ニコン 露光装置、露光方法、およびデバイス製造方法
US8264666B2 (en) 2009-03-13 2012-09-11 Nikon Corporation Exposure apparatus, exposure method, and method of manufacturing device
JP2011221536A (ja) * 2010-04-13 2011-11-04 Nikon Corp マスク移動装置、露光装置、基板処理装置及びデバイス製造方法
JP2012099638A (ja) * 2010-11-02 2012-05-24 Fujifilm Corp インプリント用硬化性組成物
JP5424271B2 (ja) * 2010-11-08 2014-02-26 株式会社ブイ・テクノロジー 露光装置
JP5929761B2 (ja) * 2010-12-15 2016-06-08 株式会社ニコン 基板処理システム及び表示素子の製造方法
JP2012203151A (ja) * 2011-03-24 2012-10-22 Hitachi High-Technologies Corp フィルム基板露光装置、及びフィルム基板露光方法
JP4975180B2 (ja) * 2011-08-29 2012-07-11 株式会社朝日工業社 ガラス基板温調用ノズル構造

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1309332A (zh) * 2000-02-15 2001-08-22 株式会社尼康 曝光方法及其曝光装置、以及器件制造方法
CN101099224A (zh) * 2005-04-25 2008-01-02 株式会社尼康 曝光方法和曝光装置、以及器件制造方法

Also Published As

Publication number Publication date
WO2014041941A1 (ja) 2014-03-20
TWI692677B (zh) 2020-05-01
KR101973349B1 (ko) 2019-04-26
KR20180112881A (ko) 2018-10-12
KR20150056547A (ko) 2015-05-26
KR20180033595A (ko) 2018-04-03
TWI724850B (zh) 2021-04-11
TW201908876A (zh) 2019-03-01
TW202026775A (zh) 2020-07-16
JP6256338B2 (ja) 2018-01-10
KR101861904B1 (ko) 2018-05-28
JP2019061279A (ja) 2019-04-18
KR20180127548A (ko) 2018-11-28
JPWO2014041941A1 (ja) 2016-08-18
KR101908269B1 (ko) 2018-10-15
JP2018045248A (ja) 2018-03-22
KR20180079476A (ko) 2018-07-10
JP6780742B2 (ja) 2020-11-04
JP6690697B2 (ja) 2020-04-28
KR101923360B1 (ko) 2018-11-28
TW201809906A (zh) 2018-03-16
CN106933065A (zh) 2017-07-07
TWI606306B (zh) 2017-11-21
CN104620178A (zh) 2015-05-13
JP2019152885A (ja) 2019-09-12
HK1207162A1 (en) 2016-01-22
CN104620178B (zh) 2016-10-26
KR101890099B1 (ko) 2018-08-20
JP6540774B2 (ja) 2019-07-10
TW201411298A (zh) 2014-03-16
TWI645262B (zh) 2018-12-21

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