HK1207161A1 - Substrate treatment device and device manufacturing method - Google Patents

Substrate treatment device and device manufacturing method

Info

Publication number
HK1207161A1
HK1207161A1 HK15107656.3A HK15107656A HK1207161A1 HK 1207161 A1 HK1207161 A1 HK 1207161A1 HK 15107656 A HK15107656 A HK 15107656A HK 1207161 A1 HK1207161 A1 HK 1207161A1
Authority
HK
Hong Kong
Prior art keywords
substrate treatment
treatment device
manufacturing
device manufacturing
substrate
Prior art date
Application number
HK15107656.3A
Other languages
Chinese (zh)
Inventor
熊澤雅人
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of HK1207161A1 publication Critical patent/HK1207161A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/24—Optical objectives specially designed for the purposes specified below for reproducing or copying at short object distances
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B17/00—Systems with reflecting surfaces, with or without refracting elements
    • G02B17/08—Catadioptric systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/7015—Details of optical elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70316—Details of optical elements, e.g. of Bragg reflectors, extreme ultraviolet [EUV] multilayer or bilayer mirrors or diffractive optical elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Lenses (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Microscoopes, Condenser (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
HK15107656.3A 2012-07-13 2015-08-08 Substrate treatment device and device manufacturing method HK1207161A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012157811 2012-07-13
JP2012157810 2012-07-13
PCT/JP2013/058704 WO2014010274A1 (en) 2012-07-13 2013-03-26 Substrate treatment device and device manufacturing method

Publications (1)

Publication Number Publication Date
HK1207161A1 true HK1207161A1 (en) 2016-01-22

Family

ID=49915752

Family Applications (2)

Application Number Title Priority Date Filing Date
HK16109756.7A HK1221778A1 (en) 2012-07-13 2015-08-08 Exposure device and exposure method
HK15107656.3A HK1207161A1 (en) 2012-07-13 2015-08-08 Substrate treatment device and device manufacturing method

Family Applications Before (1)

Application Number Title Priority Date Filing Date
HK16109756.7A HK1221778A1 (en) 2012-07-13 2015-08-08 Exposure device and exposure method

Country Status (5)

Country Link
JP (6) JP6137182B2 (en)
KR (4) KR102096891B1 (en)
CN (4) CN105652609B (en)
HK (2) HK1221778A1 (en)
WO (1) WO2014010274A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105652609B (en) * 2012-07-13 2018-12-04 株式会社尼康 Exposure device and exposure method
CN103984209B (en) * 2014-04-04 2016-08-17 中国科学院上海光学精密机械研究所 Refraction-reflection lithographic illumination relay lens group
KR102075755B1 (en) * 2017-06-19 2020-02-10 에스케이텔레콤 주식회사 Illumination optical system for projector and method for constructing same
KR102439935B1 (en) * 2018-02-27 2022-09-02 가부시키가이샤 오크세이사쿠쇼 Projection exposure apparatus
JP7145620B2 (en) * 2018-02-27 2022-10-03 株式会社オーク製作所 projection exposure equipment
CN114070971A (en) * 2020-07-27 2022-02-18 奥林巴斯株式会社 Observation device, light deflection unit, and image forming method
CN112013954B (en) * 2020-09-08 2024-08-02 中国科学院西安光学精密机械研究所 Curved prism-based offner hyperspectral imaging system

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6018383A (en) * 1997-08-20 2000-01-25 Anvik Corporation Very large area patterning system for flexible substrates
JP2001085314A (en) * 1999-09-13 2001-03-30 Nikon Corp Exposure method and aligner for exposure and method for manufacturing device
JP2004061584A (en) * 2002-07-25 2004-02-26 Fuji Photo Film Co Ltd Method for making planographic printing plate
JP2003295062A (en) * 2003-03-10 2003-10-15 Nikon Corp Catadioptic imaging optical system
CN100508119C (en) * 2003-07-09 2009-07-01 株式会社尼康 Linking unit, exposure apparatus and method for manufacturing device
KR100550560B1 (en) * 2003-12-16 2006-02-10 전자부품연구원 Pattern manufacturing device and manufacture method for the same
US7102733B2 (en) * 2004-08-13 2006-09-05 Asml Holding N.V. System and method to compensate for static and dynamic misalignments and deformations in a maskless lithography tool
JP2006098719A (en) * 2004-09-29 2006-04-13 Fuji Photo Film Co Ltd Exposure apparatus
JP4893310B2 (en) * 2004-10-26 2012-03-07 株式会社ニコン Optical apparatus, lens barrel, exposure apparatus, and device manufacturing method
JP4251158B2 (en) * 2005-06-24 2009-04-08 パナソニック電工株式会社 Charger and electric tool set using the same
JP2007227438A (en) * 2006-02-21 2007-09-06 Nikon Corp Exposure apparatus and exposure method, and mask for light exposure
US7936445B2 (en) * 2006-06-19 2011-05-03 Asml Netherlands B.V. Altering pattern data based on measured optical element characteristics
KR101422298B1 (en) * 2006-09-08 2014-08-13 가부시키가이샤 니콘 Mask, exposure apparatus and device manufacturing method
JP5181451B2 (en) * 2006-09-20 2013-04-10 株式会社ニコン Mask, exposure apparatus, exposure method, and device manufacturing method
WO2008129819A1 (en) 2007-04-13 2008-10-30 Nikon Corporation Display element manufacturing method, display element manufacturing apparatus and display element
JP5272348B2 (en) * 2007-08-14 2013-08-28 株式会社ニコン Wafer bonding equipment
NL1036558A1 (en) * 2008-03-25 2009-09-28 Asml Netherlands Bv Method and lithographic apparatus for acquiring height data related to a substrate surface.
JP5282895B2 (en) * 2009-03-06 2013-09-04 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
US8264666B2 (en) * 2009-03-13 2012-09-11 Nikon Corporation Exposure apparatus, exposure method, and method of manufacturing device
JP2011221536A (en) * 2010-04-13 2011-11-04 Nikon Corp Mask moving device, exposure device, substrate processor and device manufacturing method
JP5724564B2 (en) 2010-04-13 2015-05-27 株式会社ニコン Mask case, mask unit, exposure apparatus, substrate processing apparatus, and device manufacturing method
WO2013094286A1 (en) * 2011-12-20 2013-06-27 株式会社ニコン Substrate processing device, device manufacturing system and device manufacturing method
CN105652609B (en) * 2012-07-13 2018-12-04 株式会社尼康 Exposure device and exposure method

Also Published As

Publication number Publication date
WO2014010274A1 (en) 2014-01-16
CN107229190B (en) 2020-03-20
JP2017037347A (en) 2017-02-16
JP6137356B2 (en) 2017-05-31
JP6137182B2 (en) 2017-05-31
KR101914895B1 (en) 2018-11-02
CN107229190A (en) 2017-10-03
CN107272348B (en) 2020-04-07
HK1221778A1 (en) 2017-06-09
JP2017068289A (en) 2017-04-06
KR102096891B1 (en) 2020-04-03
JP2016085475A (en) 2016-05-19
JP2018136577A (en) 2018-08-30
KR20180120800A (en) 2018-11-06
KR102007616B1 (en) 2019-08-05
JP6350687B2 (en) 2018-07-04
KR20190091574A (en) 2019-08-06
JP6245342B2 (en) 2017-12-13
CN104428715B (en) 2017-06-30
JP2016122202A (en) 2016-07-07
JP6128240B2 (en) 2017-05-17
CN104428715A (en) 2015-03-18
KR20150035991A (en) 2015-04-07
JPWO2014010274A1 (en) 2016-06-20
CN105652609B (en) 2018-12-04
CN105652609A (en) 2016-06-08
KR20170130628A (en) 2017-11-28
JP6519694B2 (en) 2019-05-29
KR101880792B1 (en) 2018-07-20
CN107272348A (en) 2017-10-20

Similar Documents

Publication Publication Date Title
SG11201503639YA (en) Semiconductor device and manufacturing method thereof
SG11201602220TA (en) Substrate treatment method and substrate treatment device
EP2843707A4 (en) Semiconductor device and semiconductor device manufacturing method
HK1198303A1 (en) Semiconductor device and method of manufacturing the same
EP2833404A4 (en) Semiconductor device and method for manufacturing semiconductor device
EP2913854A4 (en) Semiconductor device and method for manufacturing same
EP2816598A4 (en) Semiconductor device and method for manufacturing same
EP2709149A4 (en) Semiconductor device and manufacturing method thereof
TWI563558B (en) Substrate treatment apparatus and substrate treatment method
EP2793267A4 (en) Semiconductor device and semiconductor device manufacturing method
EP2688102A4 (en) Semiconductor device and manufacturing method therefor
EP2804214A4 (en) Semiconductor device and method of manufacturing thereof
EP2854174A4 (en) Semiconductor device and method for manufacturing same
EP2790216A4 (en) Semiconductor device and semiconductor device manufacturing method
HK1207162A1 (en) Substrate processing device and device manufacturing method
EP2709148A4 (en) Semiconductor device and manufacturing method thereof
EP2802005A4 (en) Semiconductor device and method for manufacturing same
EP2804216A4 (en) Semiconductor device and method of manufacturing thereof
EP2860760A4 (en) Semiconductor device and method for manufacturing same
EP2775515A4 (en) Semiconductor device and manufacturing method thereof
GB201213673D0 (en) Semiconductor device and fabrication method
HK1207161A1 (en) Substrate treatment device and device manufacturing method
EP2835828A4 (en) Semiconductor device and semiconductor device fabrication method
EP2849231A4 (en) Semiconductor device and method for manufacturing same
EP2830085A4 (en) Semiconductor device and method for manufacturing same

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20220328