JPWO2014010274A1 - Substrate processing apparatus and device manufacturing method - Google Patents

Abstract

The substrate processing apparatus (EX) projects a reflected light beam (L2) generated from the illumination area (IR) toward the substrate, and forms a mask pattern image on the substrate, and an illumination area. A light separation unit (10) that passes one of the illumination light directed to the light and the imaging light flux generated from the illumination area and reflects the other, and forms a primary light source image, and illuminates the illumination light from the primary light source image And an illumination optical system (IL) that irradiates the region and forms a first conjugate surface optically conjugate with the primary light source image between the center line and the cylindrical surface.

Description

The present invention relates to a substrate processing apparatus and a device manufacturing method.
This application claims priority based on Japanese Patent Application No. 2012-157810 filed on July 13, 2012 and Japanese Patent Application No. 2012-15781 filed on July 13, 2012, and its contents Is hereby incorporated by reference.

  As a substrate processing apparatus for patterning electronic circuits such as semiconductor integrated devices and display panels, precise exposure apparatuses are widely used. In general, the exposure apparatus optically transfers a pattern of an electronic circuit formed on a mask onto a photosensitive substrate such as a semiconductor wafer or a glass substrate via a projection optical system. The mask used there is usually a circuit pattern formed with a light shielding material such as chrome on a flat quartz plate. In a scanning projection exposure apparatus, the mask is photosensitive while moving the mask back and forth in one dimension. The circuit pattern of the mask is transferred so as to be aligned in a matrix (two-dimensional) on the substrate.

  In such a step-and-scan projection exposure apparatus, it is known that throughput (productivity) can be increased by reducing the number of times of stepping (the number of times of acceleration / deceleration of the movable stage that moves the substrate). . Therefore, an exposure apparatus that achieves high throughput by preparing a reflective cylindrical mask and repeatedly arranging a plurality of circuit patterns in the circumferential direction of the cylindrical surface is described in, for example, Patent Document 1 below.

  On the other hand, in the field where large display panels are produced, a scanning exposure apparatus having a movable stage mounted with a large glass substrate (2 m × 2 m or more) and a large glass substrate are developed, etched, and deposited. Various process devices and transfer devices that perform the above are used. These exposure equipment, process equipment, and transport equipment are all not only very large and expensive, but also the total cost for manufacturing the display panel (expenses for various utilities associated with the operation of the equipment, maintenance expenses for a vast clean room, It is difficult to suppress waste, etc. due to a material disposal process such as etching.

  Therefore, as a more resource-saving manufacturing method, printed electronics, which forms electronic circuits directly on flexible resin substrates and plastic substrates by using high-precision printing technology, is attracting attention. Technology. A method of manufacturing a display panel using organic EL by a roll-to-roll method using this technique is described in, for example, Patent Document 2 below. In the roll-to-roll method, a flexible long substrate (film) is pulled out from a supply roll, and the substrate is subjected to various treatments in the middle of the conveyance path that is wound up on a collection roll. is there.

  Further, as a substrate processing apparatus such as an exposure apparatus, for example, as described in Patent Document 1 below, in order to improve throughput when a plurality of chip devices are continuously projected and exposed by a scanning method on a semiconductor wafer. In addition, an apparatus using a cylindrical rotating mask has been proposed. Further, as one method for manufacturing an electronic device such as a display panel or a solar cell, a roll-to-roll method as described in Patent Document 2 below is known, for example. The roll-to-roll method is a method in which various processes are performed on a substrate on a transport path while a flexible substrate such as a film is transported from a delivery roll to a collection roll.

International Publication No. 2008/029917 International Publication No. 2008/1229819

  In the exposure apparatus disclosed in Patent Document 1, for example, a plurality of shot areas arranged in a line in the direction of scanning exposure on a substrate (wafer) can be collectively scanned and exposed while rotating a cylindrical mask. , The number of steppings is drastically reduced, and exposure processing with high throughput can be performed. However, in the projection optical system of the exposure apparatus disclosed in Patent Document 1, since the pattern formed on the outer peripheral surface of the cylindrical mask is cylindrical, the quality (image quality) of the pattern image projected on the substrate is deteriorated. In other words, the minimum line width that can be projected becomes thick, and high-accuracy (faithful) transfer may not be desired.

  Also, in the display panel manufacturing method disclosed in Patent Document 2, the exposure apparatus is introduced when high-definition patterning cannot be performed only by the printing method or the ink jet (droplet) method. It will be. In that case, it is necessary to stably convey the flexible sheet substrate under the projection system. An effective method for this is, for example, a method in which a sheet substrate is wound around a part of the surface of the rotating drum while being tensioned in the longitudinal direction. Also in this method, the pattern image of the mask by the projection system is projected onto a sheet substrate curved in a cylindrical surface, and similarly, the quality (image quality) of the pattern image on the substrate deteriorates or can be projected. In some cases, the minimum line width becomes thick and high-precision (faithful) transfer cannot be expected.

  An aspect of the present invention is a substrate processing apparatus capable of exposing a projection image on a substrate with high accuracy in projection of a pattern on a mask surface curved in a cylindrical shape or pattern projection onto a substrate curved in a cylindrical shape, and An object is to provide a device manufacturing method.

  In addition, the exposure apparatus as described above can perform an efficient exposure process by continuously rotating a mask pattern curved in a roll shape, for example, and scanning and moving the substrate (wafer) in synchronization with the rotation. . However, since the mask pattern is curved in the shape of a cylindrical surface, when a part of the mask pattern is projected onto a planar semiconductor wafer via a normal projection optical system, the quality of the projected image (distortion error, unequality) There is a possibility that the lateral magnification error, focus error, etc.) may be reduced.

  Another object of the present invention is to provide a substrate processing apparatus and a device manufacturing method capable of accurately performing projection exposure using a curved mask pattern (cylindrical mask) without reducing the quality of a projected image. To do.

  According to the first aspect of the present invention, a substrate that projects and exposes an image of a reflective mask pattern arranged along a cylindrical surface curved with a predetermined radius around a predetermined center line on a sensitive substrate. A processing apparatus, which holds the mask pattern along the cylindrical surface and is rotatable around the center line and a reflection generated from an illumination area set in a part of the mask pattern A projection optical system that forms an image of a part of the mask pattern on the sensitive substrate by projecting a light beam toward the sensitive substrate, and an incident light of the projection optical system for epi-illuminating the illumination area. A light separation unit that is disposed in an optical path and passes one of the illumination light directed to the illumination area and a reflected light beam generated from the illumination area and reflects the other, and a primary source of the illumination light Shape the light source image The illumination light from the primary light source image is applied to the illumination area via the light separation unit and a part of the optical path of the projection optical system, and the first optically conjugate with the primary light source image. There is provided a substrate processing apparatus comprising: an illumination optical system that forms a conjugate plane between the center line and the cylindrical surface.

  According to the second aspect of the present invention, the substrate processing apparatus according to the first aspect causes the mask pattern to be applied to the sensitive substrate while the sensitive substrate is conveyed in a predetermined direction while rotating the mask holding member. A device manufacturing method is provided that includes exposing and performing subsequent processing utilizing changes in the sensitive layer of the exposed sensitive substrate.

  According to the third aspect of the present invention, a substrate that projects and exposes an image of a reflective mask pattern arranged along a cylindrical surface curved with a predetermined radius around a predetermined center line on a sensitive substrate. A processing apparatus, which holds the mask pattern along the cylindrical surface and is rotatable around the center line and a reflection generated from an illumination area set in a part of the mask pattern A projection optical system that forms an image of a part of the mask pattern on the sensitive substrate by projecting a light beam toward the sensitive substrate, and an incident light of the projection optical system for epi-illuminating the illumination area. A light separating unit that is disposed in an optical path and transmits one of the illumination light directed to the illumination area and a reflected light beam generated from the illumination area and reflects the other; and the illumination light generated from a light source The above An illumination optical system that irradiates the illumination region via the separation unit and tilts the principal ray of the illumination light with respect to the circumferential direction of the cylindrical surface so as to go to a predetermined position between the center line and the cylindrical surface And a substrate processing apparatus comprising:

  According to the fourth aspect of the present invention, the substrate for projecting and exposing the image of the reflective mask pattern arranged along the cylindrical surface curved with the predetermined radius around the predetermined center line on the sensitive substrate A processing apparatus, which holds the mask pattern along the cylindrical surface and is rotatable around the center line, and illumination light directed to an illumination area set in a part of the mask pattern A primary light source image that is a source of the first light source, irradiates the illumination area with the illumination light from the primary light source image, and forms a first conjugate plane optically conjugate with the primary light source image with the center line and the cylinder. An illumination optical system formed between surfaces and a reflected light beam generated from the illumination area irradiated with the illumination light are guided to an intermediate image surface, and an image of a part of the mask pattern is formed on the intermediate image surface. A first projection optical system; The first projection optical system is formed on the intermediate image plane by projecting the concave mirror disposed at or near the intermediate image plane and the reflected light beam reflected by the concave mirror toward the sensitive substrate. There is provided a substrate processing apparatus comprising: a second projection optical system that projects an image onto the sensitive substrate.

  According to the fifth aspect of the present invention, the substrate processing apparatus of the third aspect conveys the sensitive substrate in a predetermined direction while rotating the mask holding member, and the mask pattern is transferred to the sensitive substrate. There is provided a device manufacturing method including continuous exposure and performing subsequent processing using a change in the sensitive layer of the exposed sensitive substrate.

  According to the sixth aspect of the present invention, the substrate on which the image of the reflective mask pattern arranged along the cylindrical surface curved with the predetermined radius around the predetermined center line is projected and exposed on the sensitive substrate. In the processing apparatus, the mask pattern is held along the cylindrical surface and rotated around the center line, and toward an illumination area set in a part on the mask pattern, An illumination optical system that irradiates illumination light from a light source and tilts a principal ray of the illumination light with respect to a circumferential direction of the cylindrical surface so as to go to a predetermined position between the center line and the cylindrical surface; A first projection optical system that guides a reflected light beam generated from the illumination area to the intermediate image plane by illumination light irradiation, and forms an image of a part of the mask pattern on the intermediate image plane, and a position of the intermediate image plane or Place near it And a second projection optical system that enters the reflected light beam reflected by the concave mirror and projects an image formed on the intermediate image plane by the first projection optical system onto the sensitive substrate. A substrate processing apparatus is provided.

  ADVANTAGE OF THE INVENTION According to the aspect of this invention, while being able to expose a projection image on a board | substrate with high precision, the substrate processing apparatus and device manufacturing method which can be exposed efficiently can be provided.

  According to another aspect of the present invention, a curved mask pattern image can be projected with high quality, and a substrate that can be projected and exposed with high precision when patterning a display device or the like with high definition and miniaturization. A processing apparatus and a device manufacturing method can be provided.

It is a figure which shows the device manufacturing system by 1st Embodiment. It is a schematic diagram for demonstrating the outline of the optical system of exposure apparatus. It is a figure which shows the light beam which injects into an illumination area, and the light beam radiate | emitted from an illumination area. It is a figure which shows the structure of a substrate processing apparatus (exposure apparatus). It is a figure which shows the structure from the light source to the 2nd aperture member of an illumination optical system. It is a figure which shows the structure of the 1st aperture member of an illumination optical system. It is a figure which shows the structure from the 1st aperture member of an illumination optical system to a light separation part. It is a figure which shows the structure from the 1st aperture member of an illumination optical system to a light separation part. It is a figure which shows the structure from the light separation part of an illumination optical system to the image surface of a projection optical system. It is a figure which shows the light separation part by 1st Embodiment. It is a figure which shows the light beam which injects into an illumination area, and the light beam radiate | emitted from an illumination area. It is a top view which shows the light beam radiate | emitted from an illumination area | region. It is a figure which shows the representative position of the illumination area referred by description of a spot. It is a figure which shows the spot in the 1st conjugate surface conjugate with a light source image. It is a figure which shows the structure of the substrate processing apparatus by 2nd Embodiment. It is a figure which expands and shows a part of optical system of exposure apparatus. It is a figure which shows the device manufacturing system by 3rd Embodiment. It is a schematic diagram for demonstrating the optical system of the exposure apparatus by 3rd Embodiment. It is a figure which shows the light beam which injects into an illumination area, and the light beam radiate | emitted from an illumination area. It is a figure which shows the structure of the substrate processing apparatus (exposure apparatus) by 3rd Embodiment. It is a figure which shows the structure of a homogenization optical system. It is a figure which shows the structure of a 1st aperture member. It is a figure which shows the structure from a 1st aperture member to a light separation part. It is a figure which shows the structure from a 1st aperture member to a light separation part. It is a figure which shows the structure of a light separation part. It is a figure which shows the light beam which injects into an illumination area, and the light beam radiate | emitted from an illumination area. It is a figure which shows the light beam radiate | emitted from an illumination area | region. It is a figure which shows the representative position of the illumination area referred by description of a spot. It is a figure which shows the spot in the 1st conjugate surface conjugate with a light source image. It is a figure which shows the optical path in a 1st projection optical system. It is a figure which shows the optical path in a 2nd projection optical system. It is a figure which shows the structure of the substrate processing apparatus (exposure apparatus) by 4th Embodiment. It is a figure which shows the optical path in an illumination optical system. It is a figure which shows the optical path in a 1st projection optical system. It is a figure which shows the optical path in a 2nd projection optical system. It is a flowchart which shows a device manufacturing method.

[First Embodiment]
FIG. 1 is a diagram illustrating a configuration of an example of a device manufacturing system SYS (flexible display manufacturing line) according to the present embodiment. Here, the flexible substrate P (sheet, film, etc.) pulled out from the supply roll FR1 passes through n processing devices U1, U2, U3, U4, U5,. The example until it winds up to FR2 is shown.

  In the following description, the XYZ orthogonal coordinate system is set so that the front surface (or back surface) of the substrate P is perpendicular to the XZ plane, and the width direction orthogonal to the transport direction (long direction) of the substrate P is the Y-axis direction. Shall be set to In the following description, the rotation direction around the X axis direction is defined as the θX axis direction, and similarly, the rotation directions around the Y axis direction and the Z axis direction are defined as the θY axis direction and the θZ axis direction, respectively.

  The substrate P wound around the supply roll FR1 is pulled out by the nipped driving roller DR1 and conveyed to the processing apparatus U1. The center of the substrate P in the Y-axis direction (width direction) is servo-controlled by the edge position controller EPC1 so as to be within a range of about ± 10 μm to several tens μm with respect to the target position.

  The processing device U1 applies a photosensitive functional liquid (photoresist, photosensitive coupling material, photosensitive plating reducing agent, UV curable resin liquid, etc.) to the surface of the substrate P by the printing method, and the substrate P transport direction (long direction). ) Is a coating device that applies continuously or selectively. In the processing apparatus U1, a photosensitive functional liquid (sensitive functional liquid) is uniformly or partially applied to the surface of the substrate P on the pressure drum DR2 around which the substrate P is wound, and the pressure drum DR2. There are provided a coating device Gp1 including a coating roller and the like, a drying device Gp2 for rapidly removing a solvent or moisture contained in the photosensitive functional liquid applied to the substrate P, and the like.

  The processing apparatus U2 heats the substrate P conveyed from the processing apparatus U1 to a predetermined temperature (for example, about several tens of degrees Celsius to 120 degrees Celsius), and the photosensitive functional layer (sensitive functional layer) applied to the surface. It is a heating device for fixing stably. In the processing device U2, a plurality of rollers and an air turn bar for returning and conveying the substrate P, a heating chamber HA1 for heating the substrate P that has been carried in, and the temperature of the heated substrate P are as follows: A cooling chamber HA2 and a nipped drive roller DR3 are provided for lowering the temperature so as to match the environmental temperature of the post-process (processing apparatus U3, substrate processing apparatus).

  The processing device U3 (substrate processing device) includes an exposure device and supports display circuit patterns and wiring patterns for the photosensitive functional layer (sensitive functional layer) of the substrate P conveyed from the processing device U2. Irradiate the patterned UV light. In the processing apparatus U3, an edge position controller EPC2 that controls the center of the substrate P in the Y-axis direction (width direction) to a fixed position, a nipped drive roller DR4, and a substrate P at a position where patterning light is irradiated onto the substrate P. Are provided with a substrate support roll DR5 (substrate support member) and two sets of drive rollers DR6 and DR7 for giving a predetermined slack (play) DL to the substrate P.

  In the processing device U3, a reflective mask pattern M is formed on a cylindrical outer peripheral surface, and a drum mask DM that rotates around a center line parallel to the Y-axis direction, and a mask pattern M of the drum mask DM has Y An image of a portion in the circumferential direction of the mask pattern M of the drum mask DM is projected onto an illumination unit IU that irradiates slit-like exposure illumination light extending in the axial direction and a portion of the substrate P supported by the substrate support roll DR5. And an alignment microscope AM that detects an alignment mark or the like previously formed on the substrate P in order to relatively align (align) the image of a portion of the projected pattern with the substrate P. , Is provided.

  The processing apparatus U4 is a wet processing apparatus that performs at least one of various wet processes such as a wet development process and an electroless plating process on the photosensitive functional layer of the substrate P conveyed from the process apparatus U3. It is. In the processing apparatus U4, there are provided three processing tanks BT1, BT2, BT3 layered in the Z-axis direction, a plurality of rollers for bending and transporting the substrate P, a nipped drive roller DR8, and the like. .

  The processing apparatus U5 is a heating and drying apparatus that warms the substrate P conveyed from the processing apparatus U4 and adjusts the moisture content of the substrate P wetted by the wet process to a predetermined value, but the details are omitted. After that, the substrate P that has passed through several processing devices and passed through the last processing device Un of the series of processes is wound up on the collection roll FR2 via the nipped drive roller DR9. Also during the winding, the drive roller DR9 and the recovery roll are driven by the edge position controller EPC3 so that the center of the substrate P in the Y-axis direction (width direction) or the substrate end in the Y-axis direction does not vary in the Y-axis direction. The relative position of the FR2 in the Y-axis direction is successively corrected and controlled.

  The host control device CONT performs overall control of the operation of the processing devices U1 to Un constituting the production line. The host control device CONT monitors the processing status and processing status of each processing device U1 to Un, monitors the transport status of the substrate P between the processing devices, and performs feedback correction and feedforward based on the results of prior and subsequent inspections and measurements. Correction is also performed.

  The board | substrate P used by this embodiment is flexible boards, such as foil (foil) which consists of metals or alloys, such as a resin film and stainless steel, for example. The material of the resin film is, for example, one of polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin. Or two or more.

  As the substrate P, it is desirable to select a substrate whose thermal expansion coefficient is not remarkably large so that the amount of deformation caused by heat in various processing steps can be substantially ignored. The thermal expansion coefficient may be set smaller than a threshold corresponding to the process temperature or the like, for example, by mixing an inorganic filler with a resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, silicon oxide or the like. The substrate P may be a single layer of ultrathin glass having a thickness of about 100 μm manufactured by a float process or the like, or a laminate in which the above resin film, foil, or the like is bonded to the ultrathin glass. It may be. Further, the substrate P is obtained by modifying and activating the surface in advance by a predetermined pretreatment, or by forming a fine partition structure (uneven structure) for precise patterning on the surface by an imprint method. But you can.

  The device manufacturing system SYS of the present embodiment repeatedly or continuously executes various processes for manufacturing a device (display panel or the like) on the substrate P. The substrate P that has been subjected to various types of processing is divided (diced) for each device to form a plurality of devices. As for the dimension of the substrate P, for example, the dimension in the width direction (short Y-axis direction) is about 10 cm to 2 m, and the dimension in the length direction (long X-axis direction) is 10 m or more. The dimension in the width direction (short Y-axis direction) of the substrate P may be 10 cm or less, or 2 m or more. The dimension in the length direction (long X-axis direction) of the substrate P may be 10 m or less.

  Next, the principle of exposure by the processing apparatus U3 (exposure apparatus EX, substrate processing apparatus) will be described. FIG. 2 is a schematic diagram for explaining a schematic configuration of the optical system of the exposure apparatus EX. FIG. 3 is an explanatory diagram showing the state of the light beam incident on the illumination region IR and the light beam emitted from the illumination region IR.

  The exposure apparatus EX shown in FIG. 2 includes a drum mask DM, an illumination optical system IL, a projection optical system PL, a light separation unit 10, and a deflection member 11. The drum mask DM has a cylindrical outer peripheral surface (hereinafter referred to as a cylindrical surface 12), and is formed by curving a reflective mask pattern M along the cylindrical surface 12. The cylindrical surface 12 is a surface curved with a predetermined radius around a predetermined center line, and is, for example, at least a part of an outer peripheral surface of a column or a cylinder. The drum mask DM is rotatable around a rotation center axis AX1 (center line).

  The illumination optical system IL illuminates the illumination area IR on the mask pattern M held by the drum mask DM with illumination light L1 through a part of the projection optical system PL. The illumination optical system IL includes a first optical system 13 that forms a light source image L0 that is a source of illumination light L1, and a second optical system 14 that also serves as a part of the projection optical system PL (its optical axis is 14a). Including. The illumination light L1 from the light source image L0 is incident on the second optical system 14 through the passage portion 15 of the light separation portion 10 made of a glass material that is a base material of the concave mirror disposed on the pupil plane of the projection optical system PL. Then, after passing through the second optical system 14 and being deflected by the reflection plane on the upper side of the deflecting member 11, the illumination area IR is irradiated. The projection optical system PL includes a light separation unit 10 and a second optical system (optical system) 14 disposed in the optical path between the light separation unit 10 and the illumination region IR.

  As will be described in detail later, in the light separation unit 10, the upper half from the optical axis 14a in FIG. 2 is a passage part (transmission part) 15, and a light source image L0 (for example, a number of points formed by fly-eye lenses) A collection of light source images). Alternatively, in FIG. 2, the lower half from the optical axis 14 a of the light separating portion 10 is a concave reflecting portion 16.

  The projection optical system PL (including the second optical system 14) projects a reflected light beam generated in the illumination region IR toward the substrate P, thereby obtaining a partial image of the mask pattern M appearing in the illumination region IR. Project to P. In the following description, a light beam generated from the mask pattern M and projected onto the substrate by irradiation with the illumination light L1 is appropriately referred to as an imaging light beam L2.

  The imaging light beam L2 generated in the illumination region IR is deflected by the reflection plane on the upper side of the deflecting member 11, enters the second optical system 14, passes through the second optical system 14, and is reflected by the reflecting unit 16 of the light separating unit 10. After the reflection, the light passes through the second optical system 14 again and reaches the lower reflection plane of the deflecting member 11. The imaging light beam L2 reflected by the lower reflection plane of the deflecting member 11 forms an intermediate image Im corresponding to a part of the mask pattern M appearing in the illumination area IR at a position conjugate with the illumination area IR. This intermediate image Im is re-imaged on the substrate P by a projection optical system (shown by reference symbol PL2 in FIG. 4) disposed thereafter.

  By the way, as shown in FIG. 3, since the illumination area IR is curved in a cylindrical shape, the incident angle of the chief ray L1a of the illumination light L1 with respect to the illumination area IR is the incidence of the chief ray L1a in the circumferential direction of the cylindrical face 12 Different depending on the position. This is because the principal rays L2a of the imaging light beam L2 generated from the illumination region IR are parallel to each other in a plane perpendicular to the rotation center axis AX1.

  In the present embodiment, the illumination optical system IL emits the principal ray L1a in a plane perpendicular to the rotation center axis AX1 so that the principal rays L2a of the imaging light beam L2 are almost parallel to each other (telecentric state). It is configured to irradiate the illumination region IR with the non-parallel illumination light L1. That is, the illumination optical system IL is configured so that the illumination light L1 incident on the illumination region IR is in a non-telecentric state so that the incident side of the imaging light beam L2 on the projection optical system PL is in a telecentric state.

  In order to achieve such an illumination state, each principal ray L1a of the illumination light L1 is converged at an intermediate position between the cylindrical surface 12 and the rotation center axis AX1 (near the position of half the radius of the cylindrical surface 12). Set to Accordingly, the intermediate position is a conjugate position with the pupil plane of the illumination optical system IL (passing section 15 of the light separating section 10 in FIG. 2).

  Further, the traveling direction of each principal ray L2a of the imaging light beam L2 in the plane perpendicular to the rotation center axis AX1 is, for example, a line connecting the generation position of each principal ray L2a on the illumination region IR and the rotation center axis AX1 ( (Radial direction). This is because, as shown in FIG. 2, it is necessary to separate the illumination light L1 and the imaging light beam L2 vertically at the position of the light separation unit 10 with the optical axis 14a interposed therebetween. Therefore, as shown in FIG. 2, the traveling direction of each principal ray L2a of the imaging light beam L2 in the plane perpendicular to the rotation center axis AX1 is a plane perpendicular to the optical axis 14a of the second optical system 14 (on the paper surface). It is inclined by a certain angle within this plane (paper plane) with respect to (vertical).

  Next, the configuration of the processing apparatus U3 (exposure apparatus EX) will be described in more detail. FIG. 4 is a view showing the arrangement of the exposure apparatus EX. The exposure apparatus EX includes a drum mask DM (mask holding member) that holds the mask pattern M and can rotate about the rotation center axis AX1, and a rotating drum that supports the substrate P and can rotate about the rotation center axis AX2. DP (substrate support member). The illumination optical system IL illuminates the illumination area IR on the mask pattern M held on the drum mask DM with uniform brightness by Koehler illumination.

  The projection optical system PL projects a part of the mask pattern M (inside the illumination area IR) by projecting the imaging light beam L2 generated from the illumination area IR toward the projection area PR on the substrate P supported by the rotary drum DP. ) Is formed on the substrate P.

  The projection optical system PL shown in FIG. 4 includes a first projection optical system PL1 that forms an intermediate image Im of the mask pattern M in the illumination region IR, and a second projection optical system PL2 that projects the intermediate image Im onto the substrate P. Is provided. The first projection optical system PL1 and the second projection optical system PL2 shown in FIG. 4 are, for example, half-image field type reflection flexures in which a circular image field is divided by upper and lower reflection planes of prism mirrors (deflection members 11 and 35). Telecentric as a sex-type projection optical system.

  The exposure apparatus EX is a so-called scanning exposure apparatus, and the image of the mask pattern M held on the drum mask DM is rotated by rotating the drum mask DM and the rotary drum DP synchronously at a predetermined rotation speed ratio. The projection exposure is continuously repeated on the surface of the substrate P supported by (a surface curved along the cylindrical surface).

  The drum mask DM is a columnar or cylindrical member, and a reflective mask pattern M only needs to be formed along the outer peripheral surface (cylindrical surface 12).

  The mask pattern M is created as a sheet-like mask obtained by patterning a highly reflective metal film deposited on a flexible glass sheet having a thickness of about 100 μm, for example, and is wound around the outer peripheral surface of the drum mask DM. Alternatively, the drum mask DM may be exchangeably attached.

  The rotating drum DP (the substrate support roll DR5 in FIG. 1) is a columnar or cylindrical member, and the outer peripheral surface thereof is cylindrical. For example, the substrate P is supported by the rotating drum DP by being wound around a part of the outer peripheral surface of the rotating drum DP. The projection area PR on which the image of the mask pattern M is projected is disposed in the vicinity of the outer peripheral surface of the rotary drum DP.

  The substrate P may be supported by being suspended by a plurality of transport rollers. In this case, the projection region PR may be disposed between the plurality of transport rollers.

  The exposure apparatus EX includes, for example, a drive unit for rotating and driving the drum mask DM and the rotary drum DP, a detection unit for detecting the positions of the drum mask DM and the rotary drum DP, and the drum mask DM and the rotary drum DP. And a control unit for controlling each part of the exposure apparatus EX.

  The control unit of the exposure apparatus EX controls the drive unit based on the detection result of the detection unit, thereby rotating the drum mask DM and the rotary drum DP synchronously at a predetermined rotation speed ratio. Moreover, this control part adjusts the relative position of drum mask DM and rotary drum DP by controlling a moving part based on the detection result of a detection part.

  The illumination unit IU shown in FIG. 1 includes the light source 20 shown in FIG. 4 and the first optical system 13 of the illumination optical system IL. The first optical system 13 of the illumination optical system IL forms a light source image L0 that becomes the source of the illumination light L1 by the light emitted from the light source 20, and makes the light intensity distribution of the illumination light L1 uniform.

  The light source 20 includes, for example, a lamp light source such as a mercury lamp, or a solid light source such as a laser diode or a light emitting diode (LED). Illumination light L1 emitted from the light source 20 is, for example, far ultraviolet light (DUV light) such as bright line (g line, h line, i line), KrF excimer laser light (wavelength 248 nm), ArF excimer laser light (wavelength 193 nm). Etc.

  FIG. 5 is a diagram illustrating a configuration from the light source 20 illustrated in FIG. 4 to the second diaphragm member 26 of the illumination optical system IL. The first optical system 13 shown in FIG. 5 includes an input lens 21, a fly-eye lens 22, a first diaphragm member 23, a relay lens 24, a cylindrical lens 25, and a second diaphragm member 26.

  The input lens 21 is disposed at a position where the illumination light L1 emitted from the light source 20 enters. The input lens 21 condenses the illumination light L <b> 1 so that it falls on the incident end face 22 a of the fly-eye lens 22. The fly-eye lens 22 has a plurality of lens elements 22 b that are two-dimensionally arranged on a plane orthogonal to the optical axis of the input lens 21.

  The fly-eye lens 22 spatially divides the illumination light L1 emitted from the input lens 21 for each lens element 22b. A primary light source image (a converged point light source or the like) is formed for each lens element 22b on the emission end face 22c from which light is emitted from the fly-eye lens 22. The surface on which the primary light source image is formed includes the light separation unit 10 in the vicinity of the pupil plane of the first projection optical system PL1 (also the pupil plane of the illumination optical system IL) in FIG. 4 and a conjugate plane described later. 40 (first conjugate plane, shown in FIG. 10 and the like) and optically conjugate.

  The first diaphragm member 23 is a so-called aperture diaphragm (illumination σ diaphragm), and is disposed on the emission end face 22 c of the fly-eye lens 22 or in the vicinity thereof.

  FIG. 6 is a diagram showing a configuration of the first diaphragm member 23 of the illumination optical system IL. As shown in FIG. 6, the first diaphragm member 23 has an oval or elliptical opening 23 a through which at least part of the illumination light L <b> 1 from the fly-eye lens 22 passes.

  5 and 6, the first diaphragm member 23 is disposed on a plane orthogonal to the optical axis of the relay lens 24 (parallel to the XY plane). The opening 23a has an inner dimension (dimension) D1 in the first direction (X-axis direction) larger than an inner dimension (dimension) D2 in the second direction (Y-axis direction) corresponding to the direction parallel to the rotation center axis AX1. small. The first direction of the inner dimension (dimension) D1 coincides with the circumferential direction of the cylindrical surface 12 in the illumination area IR on the drum mask DM in FIG.

  The first direction is a direction projected in the circumferential direction on the cylindrical surface 12, and the second direction is a direction projected in a direction parallel to the rotation center axis AX1 of the cylindrical surface 12. That is, the first diaphragm member 23 has a spread angle (NA) of the illumination light L1 in the circumferential direction of the cylindrical surface 12 from a spread angle (NA) of the illumination light L1 in a direction parallel to the rotation center axis AX1 of the cylindrical surface 12. Is also provided to make it smaller.

  7A and 7B are diagrams illustrating an example of a specific optical system (lens arrangement) from the first diaphragm member 23 to the light separation unit 10 of the illumination optical system IL illustrated in FIGS. 4 and 5. FIG. 7A shows a plan view of a plane orthogonal to the rotation center axis AX1. FIG. 7B shows a plan view in a plane parallel to the rotation center axis AX1.

  As shown in FIG. 7A, the opening 23 a of the first diaphragm member 23 is arranged so as to be biased to one side (+ X axis side) with respect to the optical axis 13 a parallel to the Z axis of the first optical system 13. As shown in FIG. 7B, the opening 23a of the first diaphragm member 23 is arranged symmetrically with respect to the optical axis 13a of the first optical system 13 in the Y-axis direction. That is, the first aperture member 23 is arranged so that the optical axis 13a of the first optical system 13 passes through the center of the opening 23a when viewed from the X-axis direction.

  The relay lens 24 is disposed at a position where light that has passed through the first diaphragm member 23 enters. The relay lens 24 is provided so as to superimpose light beams from a plurality of primary light source images formed on the fly-eye lens 22. The light intensity distribution of the light from the plurality of primary light source images formed on the exit side of the fly-eye lens 22 is made uniform at the superimposed position.

  The cylindrical lens 25 is disposed on the optical path from the position where the primary light source image is formed in the fly-eye lens 22 to the second diaphragm member 26.

  Similar to the cylindrical lens 25 in FIGS. 4 and 5, the cylindrical lens 25 in FIGS. 7A and 7B has a power (refractive power) in the XZ plane in the YZ plane parallel to the rotation center axis AX1. It is an optical member larger than the power (refractive power) at. The direction in which the power (refractive power) of the cylindrical lens 25 is large coincides with the circumferential direction of the cylindrical surface 12 in the illumination region IR on the drum mask DM in FIG.

  The second diaphragm member 26 is a so-called field diaphragm, and defines the position and shape of the illumination region IR. The second diaphragm member 26 is disposed at a position conjugate with the illumination region IR or in the vicinity thereof. Light from a plurality of primary light source images formed on the fly-eye lens 22 is superimposed on the position of the second diaphragm member 26 by the relay lens 24 and the cylindrical lens 25, and the light intensity distribution in the second diaphragm member 26 is made uniform. The That is, the input lens 21, the fly-eye lens 22, the relay lens 24, and the cylindrical lens 25 constitute a uniformizing optical system 19 that uniformizes the light intensity distribution of the illumination light L1.

  The illumination optical system IL is disposed in at least a part of the optical path from the primary light source image to the second diaphragm member 26, and the light intensity distribution of the illumination light L1 using the primary light source image as a source is determined by the position of the second diaphragm member 26. Alternatively, a homogenizing optical system 19 that makes it uniform in the vicinity thereof is included. The illumination optical system IL may not include the second diaphragm member 26. The homogenizing optical system 19 can also be configured using a rod lens instead of the fly-eye lens 22. In this case, the configuration of the illumination optical system IL is appropriately changed so that the emission end face from which light is emitted from the rod lens is optically conjugate with the illumination region IR.

  As shown in FIGS. 7A and 7B, the first optical system 13 includes a lens group 27 disposed in the optical path between the second diaphragm member 26 and the light separation unit 10. The lens group 27 is composed of, for example, a plurality of axisymmetric lenses with the optical axis 13a of the first optical system 13 as the rotation center. As shown in FIG. 7B, the lens group 27 forms a pupil plane 28 (second conjugate plane) optically conjugate with the first diaphragm member 23 when viewed from the X-axis direction. On the pupil plane 28, as shown in FIG. 2 (or FIG. 4), a light source image L0 (secondary light source image) that is a source of the illumination light L1 irradiated to the illumination region IR is formed.

  The secondary light source image L0 formed on the pupil plane 28 of the projection optical system PL has a dimension in the X-axis direction in FIG. 2 (or FIG. 4), FIG. 7A, and FIG. 7B that is the rotation center axis (center line) AX1. It is set to be larger than the dimension in the parallel Y-axis direction. The X-axis direction in which the size of the secondary light source image L0 increases coincides with the circumferential direction of the cylindrical surface 12 in the illumination region IR on the drum mask DM in FIG.

  7A and 7B, the distribution range of the secondary light source image L0 formed on the second conjugate plane (pupil plane 28) has a dimension in the Y-axis direction parallel to the rotation center axis (center line) AX1. It is set to be smaller than the dimension in the X-axis direction. The X-axis direction in which the size of the distribution range of the secondary light source image L0 is relatively large coincides with the circumferential direction of the cylindrical surface 12 in the illumination region IR on the drum mask DM in FIG. .

  By the way, the lens group 27 is configured to converge on the pupil plane 28 a component that spreads in the Y-axis direction out of the light flux from the primary light source image formed on the first diaphragm member 23. Here, since the power of the cylindrical lens 25 is different between the X-axis direction and the Y-axis direction, the component spreading in the X-axis direction from each point of the primary light source image (the opening of the first diaphragm member 23) is shown in FIG. As shown in FIG. 2, the light does not converge on one point on the pupil plane 28. In other words, the pupil plane 28 is not optically conjugate with the first diaphragm member 23 when viewed from the Y-axis direction.

  The light separating unit 10 is arranged at or near the pupil plane 28 so that at least a part of the light separating unit 10 is arranged on the pupil plane 28. Here, the position of the pupil plane 28 or the vicinity thereof is a plane substantially corresponding to a Fourier transform plane with respect to the illumination region IR. Therefore, the direction of the principal ray L1a of the illumination light L1 incident on the illumination region IR on the drum mask DM is defined by defining a range (passage 15 in FIG. 2) through which the illumination light L1 passes in the light separation unit 10. (Orientation characteristics) can be defined. As described with reference to FIG. 3, the light separating unit 10 (defining unit) is configured so that the incident side of the illumination light L1 to the illumination region IR is set to be telecentric on the incident side of the imaging light beam L2 to the projection optical system PL. The passage range (distribution range) of the illumination light L1 in the light separation unit 10 is defined so as to be non-telecentric. The light separating unit 10 is disposed in the optical path of the projection optical system PL in order to illuminate the illumination region IR by epi-illumination.

  FIG. 8 is a diagram showing a configuration from the light separation unit 10 of the illumination optical system IL to the intermediate image plane 32 (Im) of the projection optical system PL. FIG. 9 is a plan view showing the light separating unit 10 according to the present embodiment.

  8 includes a lens member 30 made of a material that transmits light, and a reflective film 31 (corresponding to the reflective portion 16 in FIG. 2) formed on the surface of the lens member 30. The lens member 30 is shaped like a meniscus lens, for example, and the surface 30a side on which the illumination light L1 enters from the first optical system 13 is a convex surface, and the surface 30b side facing the surface 30a is a concave surface. The reflective film 31 is provided on the surface 30 b of the lens member 30.

  As shown in FIG. 9, the light separating unit 10 includes an imaging light beam L <b> 2 generated in a passing unit 15 through which at least part of the illumination light L <b> 1 from the first optical system 13 passes and an illumination region IR on the mask pattern M. (Refer to FIG. 2). In the light separating unit 10, the reflecting film 31 is formed except for a part of the surface 30 b of the lens member 30, and the passing part 15 is formed by the reflecting film 31 when viewed from the Z-axis direction in the light separating unit 10. It is placed in the area that is not.

  The passage 15 is disposed on the −X axis side with respect to the intersection 13b between the optical axis 13a of the first optical system 13 and the surface 30b. The passage portion 15 is disposed in a region of the surface 30b that does not overlap the intersection 13b. In FIG. 8, the passage portion 15 (light passage window) is formed in an oval shape with the X-axis direction as the longitudinal direction and the Y-axis direction parallel to the rotation center axis AX1 of the drum mask DM as the short direction. . Accordingly, the longitudinal direction of the oval passage portion 15 corresponds to the circumferential direction of the cylindrical surface 12 in the illumination region IR on the drum mask DM in FIG. 2 (or FIG. 4) or FIG.

  Of the light separating unit 10, the region where the reflective film 31 is formed as viewed from the Z-axis direction is used for the reflecting unit 16 that reflects the imaging light beam L <b> 2, and the illumination region IR via the passing unit 15. It is also used as a defining part that defines the passing range of the illuminating light L1 that travels. In other words, the reflective film 31 is provided so that the illumination light L <b> 1 does not pass through a region other than the passage portion 15 in the light separation portion 10. Further, the reflective film 31 is disposed so as to include at least a region of the light separating unit 10 that is substantially symmetrical with the passing unit 15 with respect to the intersection 13b so as to reflect the imaging light beam L2.

  Returning to the description of FIG. 8, the second optical system 14 is disposed at a position where the illumination light L <b> 1 that has passed through the passage portion 15 of the light separation portion 10 enters. The second optical system 14 condenses the illumination light L1 so that the illumination region IR is optically conjugate with the first diaphragm member 23. That is, the second optical system 14 and the lens group 27 shown in FIGS. 7A and 7B form a surface optically conjugate with the second diaphragm member 26 in the illumination region IR.

  The second optical system 14 is composed of, for example, a plurality of axisymmetric lenses around a predetermined central axis (optical axis 14a). The optical axis 14a of the second optical system 14 is set coaxially with the optical axis 13a of the first optical system 13, for example. The illumination light L1 incident on the second optical system 14 is emitted from the second optical system 14 through one side with respect to the surface (YZ surface) including the optical axis 14a of the second optical system 14.

  The deflecting member 11 is disposed at a position where the illumination light L1 emitted from the second optical system 14 enters. The deflecting member 11 is, for example, a triangular prism-shaped member, and has a first reflecting surface 11a and a second reflecting surface 11b that are orthogonal to each other. For example, the first reflecting surface 11a and the second reflecting surface 11b are disposed so as to form an angle of approximately 45 ° with the optical axis 14a of the second optical system 14, respectively.

  The illumination light L1 emitted from the second optical system 14 is reflected and deflected by the first reflecting surface 11a, and enters the illumination region IR on the mask pattern M held on the drum mask DM. The illumination light L1 is reflected and diffracted by the mask pattern M to generate an imaging light beam L2. The illumination light L1 incident on the illumination area IR and the imaging light beam L2 emitted from the illumination area IR will be described in detail later with reference to FIGS.

  The imaging light beam L2 emitted from the illumination region IR is incident on the first reflecting surface 11a of the deflecting member 11. The imaging light beam L2 is deflected by being reflected by the first reflecting surface 11a, and enters the second optical system 14. As described with reference to FIGS. 2 and 3, the imaging light beam L2 incident on the second optical system 14 passes through a different optical path from the illumination light L1 toward the illumination region IR. The optical path of the imaging light beam L2 in the second optical system 14 is arranged on the opposite side (+ X axis side) to the optical path of the illumination light L1 with respect to the plane (YZ plane) including the optical axis 14a of the second optical system 14. Is done.

  The imaging light beam L2 that has passed through the second optical system 14 is incident on the light separation unit 10. As shown in FIG. 9, the range R1 in which the imaging light beam L2 is incident on the light separation unit 10 does not overlap with the range R2 (passage unit 15) in which the illumination light L1 enters the light separation unit 10 from the first optical system 13. As set. The range R1 in which the imaging light beam L2 is incident is set, for example, on the side opposite to the passing portion 15 with respect to the YZ plane and is the reflecting portion 16 of the light separating portion 10. The reflecting part 16 is disposed at or near the pupil plane 28, and the principal rays L2a emitted from the respective points in the illumination area IR as shown in FIG. The light flux generated at each point in the region IR is incident on the reflecting portion 16 so that the spots are overlapped in the range R2.

  As shown in FIG. 8, the imaging light beam L <b> 2 that has entered the reflecting unit 16 is reflected by the reflecting unit 16 and then enters the second optical system 14 again. The imaging light beam L2 that has passed through the second optical system 14 enters the second reflecting surface 11b of the deflecting member 11, and is reflected and deflected by the second reflecting surface 11b. The traveling direction of the principal ray of the imaging light beam L2 reflected by the second reflecting surface 11b is a direction substantially parallel to the traveling direction of the principal ray when emitted from the illumination region IR, and the optical axis 14a of the second optical system 14 is. Is a direction that intersects non-perpendicular to

  Of the imaging light beam L2, the light beam emitted from each point in the illumination area IR passes through the second optical system 14 twice, and converges at approximately one point on the intermediate image plane 32 optically conjugate with the illumination area IR. To do. In this way, the first projection optical system PL1 shown in FIG. 4 of the projection optical system PL forms an intermediate image of a part of the mask pattern M (illumination region IR) on the intermediate image plane 32 (Im). . The intermediate image plane 32 is an optically conjugate plane with the projection region PR, and a field stop (third stop member) for defining the position and shape of the projection region PR may be disposed.

  In the second projection optical system PL2 shown in FIG. 4, for example, the concave mirror 33 is disposed at a position optically conjugate with the light separation unit 10 instead of the light separation unit 10 in the optical path of the first projection optical system PL1. Consists of. That is, the second projection optical system PL2 includes a third optical system 34 similar to the second optical system 14 of the first projection optical system PL1. The imaging light beam L <b> 2 that has passed through the intermediate image plane 32 is reflected and deflected by the first reflecting surface 35 a of the deflecting member 35, and then enters the concave mirror 33 through the third optical system 34. The imaging light beam L2 incident on the concave mirror 33 is reflected by the concave mirror 33, passes through the third optical system 34 again, is reflected and deflected by the second reflecting surface 35b of the deflecting member 35, and is supported by the rotary drum DP. The light enters the projection region PR on the substrate P. Of the imaging light beam L2, the light beam emitted from each point on the intermediate image surface 32 passes through the third optical system 34 twice, thereby corresponding points in the projection region PR optically conjugate with the intermediate image surface 32. To converge. In this way, the second projection optical system PL2 projects the intermediate image Im formed by the first projection optical system PL1 onto the projection region PR.

  Next, the state of the illumination light L1 when entering the illumination area IR and the state of the imaging light beam L2 emitted from the illumination area IR will be described in more detail.

  FIG. 10 illustrates a light beam (illumination light L1) incident on the illumination region IR and an imaging light beam L2 emitted from the illumination region IR from the direction of the rotation center axis AX1 of the drum mask DM (in the XZ plane perpendicular to the Y axis). FIG. FIG. 11 is a top view of the imaging light beam L2 emitted from the illumination region IR as seen from a direction (Z-axis direction) orthogonal to FIG.

  As shown in FIG. 10 (see FIG. 3), the principal ray L1a of the illumination light L1 is viewed from the direction of the rotation center axis AX1 (Y-axis direction) of the drum mask DM and the cylindrical surface 12. Illumination so that a conjugate surface 40 (conjugated with the pupil plane 28 of the first projection optical system PL1 on which the secondary light source image is formed) conjugate with the primary light source image (first diaphragm member 23) is formed between It enters the region IR. The conjugate plane 40 (first conjugate plane) is disposed, for example, at the center position between the rotation center axis AX1 and the illumination region IR or in the vicinity thereof. That is, the positional relationship between the passing portion 15 and the reflecting portion 16 of the light separating portion 10 is such that the distance D3 from the rotation center axis AX1 to the conjugate plane 40 is about half of the radius r, where r is the radius of the mask pattern M. To be set.

  Here, the extended line 41 of the principal ray L1a of the illumination light L1 is arranged so as to intersect on the conjugate plane 40 in a cross section orthogonal to the rotation center axis AX1 of the drum mask DM. The intersection 142 of the extension line 41 of the principal ray L1a is continuously arranged along a line parallel to the rotation center axis AX1 of the drum mask DM. In other words, the positional relationship between the passing portion 15 and the reflecting portion 16 of the light separating portion 10 is a conjugate plane in which the extension line 41 of the principal ray L1a distributed in the circumferential direction of the cylindrical surface 12 of the illumination light L1 is parallel to the rotation center axis AX1. It is set to intersect the line on 40. That is, the illumination optical system IL irradiates the illumination region IR with the illumination light L1 generated from the light source 20 and also emits the principal ray L1a of the illumination light L1 with the rotation center axis AX1 and the cylindrical surface 12. Is inclined with respect to the circumferential direction of the cylindrical surface 12 so as to be directed to a predetermined position.

  In addition, chief rays L1a distributed in a direction parallel to the rotation center axis AX1 of the drum mask DM in the illumination light L1 are incident on the illumination region IR in a substantially parallel relationship with each other. As shown in FIG. 11, the principal rays L2a of the imaging light beam L2 are substantially parallel to each other when viewed from a direction orthogonal to the rotation center axis AX1 (Z-axis direction) of the drum mask DM. Emit from IR. Here, the principal ray L1a of the illumination light L1 is incident on the illumination region IR from substantially the normal direction (X-axis direction) of the cylindrical surface 12 of the drum mask DM when viewed from the Z-axis direction, and the principal ray of the imaging light beam L2 L2a is emitted from the illumination region IR toward the normal direction (X-axis direction) of the cylindrical surface 12 of the drum mask DM when viewed from the Z-axis direction.

  Next, the shape of the pupil on the plane conjugate with the light source image will be described with reference to FIGS. 9, 12, and 13. FIG. 12 is a diagram illustrating a representative position of the illumination region IR referred to in the description of the pupil. FIG. 13 is a diagram showing spots on the conjugate plane 40 conjugate with the light source image. Here, for convenience of explanation, the light beam (illumination light L1 and imaging light beam L2) passing through each point of the illumination region IR has a circular spot shape on a plane conjugate with the light source image (pupil plane 28 and conjugate plane 40). It shall be.

  In FIG. 12, symbols P1 to P9 indicate points on the illumination region IR as viewed in plan from the X-axis direction. Point P1, point P2, and point P3 are a group of points (referred to as a first group) arranged in the circumferential direction of the cylindrical surface 12 shown in FIG. The point P1 is disposed at the + Z-axis end of the illumination area IR, the point P3 is disposed at the −Z-axis end of the illumination area IR, and the point P2 is disposed at the center between the points P1 and P3. Similarly, the second group of points P4, P5 and P6, and the third group of points P7, P8 and P9 are groups of points arranged in the circumferential direction of the cylindrical surface 12, respectively. The first group of points P1 to P3 is arranged at the end of the illumination area IR on the −Y axis side, and the third group of points P7 to P9 is arranged at the end of the illumination area IR on the + Y axis side. The second group of points P4 to P6 is arranged between the first group and the third group.

  First, the passage range of the illumination light L1 on the pupil plane 28 will be described with reference to FIGS. 9 and 12. In the illumination area IR shown in FIG. 12, the principal rays of the illumination light L1 incident on the points P1, P4, and P7 aligned in the direction parallel to the rotation center axis AX1 have substantially the same incident position in the circumferential direction of the illumination area IR. And the incident angle with respect to the illumination region IR is substantially the same.

  For this reason, the light beams incident on the points P1, P4, and P7 have substantially the same positions in the X-axis direction with reference to FIG. Therefore, the light beams incident on the points P1, P4, and P7 in the illumination area IR on the drum mask DM are light beams that travel from substantially the same direction when viewed from the illumination area IR side. Here, the light beams incident on the points P1, P4, and P7 all pass through substantially the same range R3 on the pupil plane 28 shown in FIG. Similarly, the light beams incident on the points P3, P6, and P9 aligned in the direction parallel to the rotation center axis AX1 pass through substantially the same range R4 on the pupil plane 28.

  Further, the chief ray of the illumination light L1 incident on the point P1 and the chief ray of the illumination light L1 incident on the point P3 have different incident positions in the circumferential direction of the illumination region IR, and have different incident angles with respect to the illumination region IR. Yes.

  Therefore, the position of the passing range (range R3) where the light beam incident on the point P1 in the illumination area IR passes through the pupil plane 28 and the passing range where the light flux incident on the point P3 in the illumination area IR passes through the pupil plane 28. (Range R4) is shifted in the X-axis direction.

  In FIG. 9, the position of the range R3 in the Y-axis direction is substantially the same as the range R4. Further, the position of the range R3 in the X-axis direction is farther from the intersection 13b of the optical axis 13a of the first optical system 13 and the light separating unit 10 than the position of the range R4 in the X-axis direction.

  Note that the passing range of light beams incident on the points P2, P5, and P8 aligned in the direction parallel to the rotation center axis AX1 in the illumination region IR shown in FIG. 12 is not shown in FIG. It arrange | positions between the ranges R4. Similarly, the light beam passing through an arbitrary point on the line connecting the points P1 and P3 passes through a range shifted from the range R3 toward the range R4 according to the shift amount from the point P1 of the arbitrary point. become. Therefore, the passing range on the pupil plane 28 of the illumination light L1 incident on the illumination region IR is, for example, an oval range R2 connecting the range R3 and the range R4.

  As described above, when the range R2 of the passage portion 15 is formed in an oval shape, the principal ray L2a of the imaging light beam L2 distributed in the circumferential direction of the rotation center axis AX1 is more than the case where the illumination light is incident on the illumination region as a parallel light beam. However, they become close to each other in a parallel relationship (telecentric state). This is achieved in combination with setting the light separation unit 10 and the previous illumination optical system so that the conjugate plane 40 is arranged at or near the center between the rotation center axis AX1 and the illumination region IR. The

  Next, the shape of the pupil on the conjugate plane 40 will be described with reference to FIGS. 10, 12, and 13. The shape of the pupil on the conjugate plane 40 corresponds to the shape of the secondary light source image formed on the conjugate plane 40 when the illumination light L1 incident on the illumination area IR is virtually propagated inside the drum mask DM. It is.

  The illumination light L1 is such that the extended line 41 of the principal ray L1a overlaps almost one point on the conjugate plane 40 at points P1, P2, and P3 arranged in the circumferential direction in the illumination region IR on the cylindrical surface 12. The chief ray L1a is incident. Therefore, if the light beams incident on the points P1, P2, and P3 propagate to the inside of the cylindrical surface 12, the positions of the passing ranges on the conjugate surface 40 are aligned, and all of them are shown in FIG. It will pass through the range R5 shown. For the same reason, the light beams incident on the points P4, P5, and P6 arranged in the circumferential direction in the illumination region IR on the cylindrical surface 12 all pass through the same range R6, and the illumination region IR on the cylindrical surface 12 All of the light beams incident on the points P7, P8, and P9 arranged in the circumferential direction pass through the same range R7.

  Further, the principal ray L1a of the illumination light L1 is incident on the points P1, P4, and P7 arranged in a direction parallel to the rotation center axis AX1 (Y-axis direction) in a substantially parallel relationship with each other. Therefore, if the light beams incident on the points P1, P4, and P7 propagate to the inside of the cylindrical surface 12, they pass through the conjugate plane 40 in the Y-axis direction parallel to the rotation center axis AX1. The position will shift. That is, the range R5 is disposed at the −Y-axis side end on the conjugate plane 40, the range R7 is disposed at the + Y-axis side end on the conjugate plane 40, and the range R6 is the center of the range R5 and the range R7. Will be placed. As a result, the illumination light L1 incident on the illumination region IR has an elliptical range R8 in which the shape of the pupil on the conjugate plane 40 connects the range R5 and the range R7.

  As described above, the principal ray L2a generated at each position of the illumination region IR in the imaging light beam L2 is in the circumferential direction of the cylindrical surface 12 and the directions parallel to the rotation center axis AX1 (Y-axis direction). Are substantially parallel to each other. Therefore, the projection optical system PL can be configured to be telecentric on the incident side (the exit side of the illumination region IR).

  In the processing apparatus U3 (exposure apparatus EX) of the present embodiment as described above, the illumination optical system IL is configured such that the imaging light beam L2 incident on the projection optical system PL is close to a parallel light beam. Even if the system PL is not complicated, the curved mask pattern M image can be accurately projected and exposed. Therefore, the processing apparatus U3 can efficiently expose the substrate P by executing the exposure process while rotating the mask pattern M.

  In addition, since the processing device U3 has the light separation unit 10 disposed on the pupil plane 28 of the projection optical system PL, the optical path of the illumination light L1 and the optical path of the imaging light beam L2 can be separated. Therefore, the processing device U3 can reduce the loss of light quantity and the generation of stray light in the PBS as compared with a configuration in which the optical path is divided using, for example, a polarization separation splitter (PBS). The light separation unit 10 may be configured with PBS or the like.

  Moreover, since the light separation part 10 prescribes | regulates the passage range of the illumination light L1 which goes to the illumination area | region IR via the passage part 15, the direction of the chief ray L1a of the illumination light L1 at the time of entering into the illumination area IR is highly accurate. Can be specified. Further, since the light separating unit 10 defines the passing range of the illumination light L1 using the reflecting unit 16, the configuration can be simplified.

  By the way, the relationship (for example, mutually parallel) of the principal rays L1a distributed in the direction parallel to the rotation center axis AX1 in the illumination light L1 is the principal ray distributed in the direction parallel to the rotation center axis AX1 in the imaging light beam L2. It is also maintained in the L2a relationship (for example, parallel to each other). Further, the relationship (for example, parallel to each other) of the principal rays L2a distributed in the circumferential direction of the cylindrical surface 12 in the imaging light beam L2 is the relationship (for example, the principal rays L1a distributed in the circumferential direction of the cylindrical surface 12 of the illumination light L1). , Non-parallel to each other). Therefore, for example, an optical member having an isotropic power for the divergence angle (NA) of the illumination light L1 so that the principal rays L2a distributed in the circumferential direction of the cylindrical surface 12 in the imaging light beam L2 have a parallel relationship with each other. In this case, the principal rays L2a distributed in the direction parallel to the rotation center axis AX1 in the imaging light beam L2 do not become parallel to each other.

  In the present embodiment, the divergence angle of the illumination light L1 reaching the illumination area IR on the cylindrical surface 12 of the drum mask DM is changed by the cylindrical lens 25 in the direction corresponding to the rotation center axis AX1 (Y-axis direction) and the illumination area. It is different depending on the circumferential direction of the cylindrical surface 12 in the IR.

  That is, the cylindrical lens 25 has principal rays L1a arranged in the direction parallel to the rotation center axis AX1 among the principal rays L1a of the illumination light L1 reaching the illumination region IR, and are arranged in the circumferential direction of the cylindrical surface 12 while being parallel to each other. The light beam L1a is deflected so that the extended line 41 intersects a line on the conjugate plane 40 parallel to the rotation center axis AX1. Therefore, the principal rays L2a of the imaging light beam L2 distributed in the direction parallel to the rotation center axis AX1 are made substantially parallel to each other, and the principal rays L2a of the imaging light beam L2 distributed in the circumferential direction of the cylindrical surface 12 are also substantially parallel to each other. Can be. In addition, as a method of giving anisotropy to the spread angle of the illumination light L1, using a light guide member in which optical fibers are bundled, the shape of the light emission side of the light guide member is, for example, the first in FIG. It may be oval or elliptical like the opening 23a of the diaphragm member 23, and the light emission side thereof may be arranged at the position of the first diaphragm member 23 in FIG.

[Second Embodiment]
Next, a second embodiment will be described. In the present embodiment, the same components as those in the above embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 14 is a view showing the arrangement of the processing apparatus (exposure apparatus EX2) according to this embodiment. The exposure apparatus EX2 shown in FIG. 14 is different from the first embodiment in that the projection optical system PL is an optical system such as an Offner optical system.

  The projection optical system PL includes a first projection optical system PL1 that forms an intermediate image Im of a part of the mask pattern M (illumination region IR) and an intermediate image formed by the first projection optical system PL1 as a projection region on the substrate P. And a second projection optical system PL2 that projects onto the PR. Here, each of the first projection optical system PL1 and the second projection optical system PL2 is composed of an optical system such as an Offner optical system.

  The illumination optical system IL can be configured in the same manner as in the first embodiment with respect to the elements arranged from the light source 20 to the light separation unit 50. The illumination light L1 emitted from the light source 20 passes through the homogenizing optical system 19, and the light intensity distribution in the second diaphragm member 26 is made uniform. The illumination light L1 that has passed through the second diaphragm member 26 enters the light separation unit 50 through the lens group 27.

  FIG. 15 is an enlarged view showing a part of the illumination optical system IL and the first projection optical system PL1 in FIG. The light separating unit 50 includes the passing unit 15 and the reflecting unit 16 as described in the first embodiment. The light separation unit 50 is disposed at or near the position of the pupil plane where the light source image that is the source of the illumination light L1 is formed. The arrangement of the passage part 15 and the reflection part 16 is the same as in the first embodiment.

  The light separation unit 50 has a surface 50a on which the illumination light L1 is incident and a surface 50b facing the opposite side of the surface 50a. The surface 50b is a surface on which the imaging light beam L2 enters in the optical path of the first projection optical system PL1, and is convex toward the outside (incident side of the imaging light beam L2).

  The illumination light L1 that has passed through the passage portion 15 of the light separation portion 50 is incident on the reflection surface 53a of the concave mirror 53 through the lens group 51 used for aberration correction and the like. The reflection surface 53a is disposed so as to face the surface 50b of the light separation unit 50. The reflecting surface 53a of the concave mirror 53 and the surface 50b of the light separating unit 50 are curved surfaces with the centers of curvature arranged at substantially the same position.

  The illumination light L1 incident on the reflecting surface 53a is collected by being reflected by the reflecting surface 53a, and enters the reflecting surface 54a of the deflecting member (planar reflecting mirror) 54 while converging. The illumination light L1 that has entered the reflecting surface 54a of the deflecting member 54 is deflected by being reflected by the reflecting surface 54a, and then enters the illumination region IR through the image adjusting member 55. The image adjusting member 55 is an optical member (a lens element having power) used for adjusting the light intensity distribution, adjusting the spread angle, correcting aberrations, and the like.

  As described above with reference to FIG. 3, the illumination optical system IL as described above has illumination light L1 incident on the illumination region IR so that the principal rays of the imaging light beam L2 generated in the illumination region IR are parallel to each other. The extension lines of the chief rays are configured to intersect inside the drum mask DM.

  The imaging light beam L2 generated in the illumination region IR passes through the image adjusting member 55 and enters the reflecting surface 54a of the deflecting member 54, is reflected by the reflecting surface 54a, and enters the reflecting surface 53a of the concave mirror 53. The imaging light beam L2 that has entered the reflecting surface 53a is collected by being reflected by the reflecting surface 53a, and enters the reflecting unit 16 of the light separating unit 50 through the lens group 51 while converging. The imaging light beam L <b> 2 that has entered the reflecting portion 16 is reflected by the reflecting portion 16, passes through the lens group 51, and enters the reflecting surface 53 a of the concave mirror 53. The imaging light beam L2 incident on the reflecting surface 53a is collected by being reflected by the reflecting surface 53a, and enters the reflecting surface 56a of the deflecting member (planar reflecting mirror) 56 while converging.

  Here, the deflecting member 54 and the deflecting member 56 are provided so that the imaging light beam L <b> 2 can pass between the deflecting member 54 and the deflecting member 56. The imaging light beam L2 that has entered the reflecting surface 56a of the deflecting member 56 is deflected by being reflected by the reflecting surface 56a, and enters the intermediate image surface 32 through the image adjusting member 57. The image adjustment member 57 is an optical member having the same function as the image adjustment member 55. In this way, the first projection optical system PL1 forms an intermediate image Im of a part of the mask pattern M (illumination region IR) on the intermediate image plane 32.

  Returning to the description of FIG. 14, the second projection optical system PL <b> 2 is configured, for example, by arranging a convex mirror 60 instead of the light separation unit 50. The imaging light beam L2 that has passed through the intermediate image plane 32 is reflected by the first reflecting surface 61a of the deflecting member 61 and enters the concave mirror 62, and is reflected by the concave mirror 62 and enters the convex mirror 60. The imaging light beam L2 incident on the convex mirror 60 is reflected by the convex mirror 60, is incident on the concave mirror 62, is reflected by the concave mirror 62, is then reflected by the second reflecting surface 61b of the deflecting member 61, and is supported by the rotary drum DP. Is incident on the projection region PR on the substrate P. In this way, the second projection optical system PL2 projects the intermediate image Im of the illumination area IR of the mask pattern M onto the projection area PR on the substrate P.

[Third Embodiment]
Next, a third embodiment will be described. In the present embodiment, the same components as those in the above embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 16 is a diagram showing a configuration of a device manufacturing system SYS2 (flexible display manufacturing line) of the present embodiment. Here, the flexible substrate P (sheet, film, etc.) pulled out from the supply roll FR1 passes through n processing devices U1, U2, U3, U4, U5,. The example until it winds up to FR2 is shown.

  Also in FIG. 16, the XYZ orthogonal coordinate system is set such that the front surface (or back surface) of the substrate P is perpendicular to the XZ plane, and the direction (width direction) orthogonal to the transport direction (long direction) of the substrate P is set. It is assumed that it is set in the Y-axis direction.

  Next, the principle of exposure by the processing apparatus U3 (exposure apparatus EX, substrate processing apparatus) of the device manufacturing system SYS2 of the present embodiment will be described. FIG. 17 is a schematic diagram for explaining the optical system of the exposure apparatus EX3. FIG. 18 is a diagram showing the illumination light L1 incident on the illumination region IR and the imaging light beam L2 emitted from the illumination region IR.

  An exposure apparatus EX3 shown in FIG. 17 includes a drum mask DM that holds a mask pattern M, an illumination optical system IL, a projection optical system PL, and a rotary drum DP that supports the substrate P (substrate support roll DR5 shown in FIG. 16). Prepare.

  The drum mask DM has a cylindrical outer peripheral surface (hereinafter also referred to as a cylindrical surface 12), and holds the reflective mask pattern M curved along the cylindrical surface 12 along the cylindrical surface 12. The cylindrical surface is a surface curved with a predetermined radius around a predetermined center line (rotation center axis AX1), and is, for example, at least a part of an outer peripheral surface of a cylinder or a cylinder.

  The illumination optical system IL illuminates the illumination area IR on the mask pattern M held by the drum mask DM with illumination light L1 through a part of the projection optical system PL. The illumination optical system IL includes a first optical system 13 that forms a light source image L0 that is a source of illumination light L1, and a second optical system 14 that also serves as a part of the projection optical system PL. The light source image L0 formed by the first optical system 13 is formed in the vicinity of the passage part 15 (transmission part) of the light separation unit 10, and the illumination light L1 traveling from the light source image L0 is second via the passage part 15. The light enters the optical system 14 and enters the illumination region IR through the second optical system 14.

  The projection optical system PL projects the image of the illumination region IR on the mask pattern M onto the substrate P by projecting the reflected light beam generated in the illumination region IR onto the substrate P supported by the rotary drum DP. The projection optical system PL includes a first projection optical system PL1 that forms an intermediate image Im of the illumination area IR, and a second projection optical system PL2 that projects the intermediate image Im formed by the first projection optical system PL1 onto the substrate P. Prepare. The first projection optical system PL includes a light separating unit 10 and a second optical system (optical system) 14 disposed in the optical path between the light separating unit 10 and the illumination region IR. In the following description, the light beam generated by the mask pattern M illuminated by the illumination light L1 and projected onto the substrate is appropriately referred to as an imaging light beam L2.

  The imaging light beam L2 generated in the illumination region IR passes through the second optical system 14 of the first projection optical system PL1 and is reflected by the reflection unit 16 of the light separation unit 10, and then passes through the second optical system 14 again and is deflected. Incident on the member 17. The imaging light beam L2 incident on the deflecting member 17 is deflected by the deflecting member 17 and enters the concave mirror 18.

  A light beam (imaging light beam L2) generated from a certain point in the illumination region IR passes through the second optical system 14 twice, thereby corresponding points on the intermediate image plane 42 optically conjugate with the illumination region IR ( Converge to the conjugate point). As described above, the first projection optical system PL1 forms an intermediate image Im of a part (illumination region IR) of the mask pattern M illuminated by the illumination light L1 on the intermediate image plane 42. Since the illumination region IR has a convex cylindrical surface shape toward the light emitting side, the intermediate image surface 42 has a concave cylindrical surface shape toward the light incident side (the deflecting member 17 side).

  A concave cylindrical mirror (hereinafter simply referred to as a concave mirror) 18 is disposed at or near the intermediate image plane 42. The concave mirror 18 is curved in the shape of a concave cylindrical surface along the intermediate image plane 42 toward the light incident side. The imaging light beam L2 reflected by the concave mirror 18 is projected onto the projection region PR via the optical member (lens, mirror, etc.) of the second projection optical system PL2. In this way, the image of the illumination area IR of the mask pattern M is projected onto the projection area PR on the substrate P supported by the rotary drum DP.

  Here, a configuration in which the concave mirror 18 is not provided (in the case of a simple plane mirror) is assumed. In this configuration, the image plane of the second projection optical system PL2 has a concave cylindrical surface toward the light incident side in the same manner as the image plane (intermediate image plane) of the first projection optical system PL1, and is in contact with the projection area. It is curved to the opposite side to the projection area with respect to the plane (the projection area and the direction of the projections and depressions are reversed). Therefore, the defocus increases as the distance from the tangent to the tangential plane increases in the circumferential direction of the curved projection region.

  In the exposure apparatus EX3 shown in FIG. 17, the concave mirror 18 converts the image plane so that the image plane of the second projection optical system PL2 becomes convex toward the light incident side. In other words, the concave mirror 18 has the image of the second projection optical system PL2 such that the center of curvature of the image plane of the second projection optical system PL2 is arranged on the same side as the center of curvature of the projection area PR with respect to the projection area PR. Convert faces. Therefore, the image plane of the second projection optical system PL2 has a shape that follows the projection region PR on the substrate P that is curved into a cylindrical surface. As a result, the exposure apparatus EX3 faithfully reproduces the desired pattern with high accuracy. Transfer can be performed, and high-definition pattern exposure is possible.

  By the way, as shown in FIG. 18, since the illumination area IR is curved in a cylindrical surface shape, in the present embodiment, the incident angle of the chief ray L1a of the illumination light L1 with respect to the illumination area IR is set in the circumferential direction of the cylindrical surface 12. It varies depending on the incident position of the principal ray L1a. That is, as in the Koehler illumination method using a normal illumination system, the chief rays of the illumination light incident on the object surface are not parallel to each other, but are converged to approximately half the radius of the cylindrical surface 12. To do. In this way, the principal rays L2a of the reflected light beam (imaging light beam L2) generated at each point in the illumination area IR become parallel to each other in the circumferential direction of the cylindrical surface 12 (telecentric).

  In the present embodiment, the illumination optical system IL is configured as a non-telecentric system in which the chief ray of the illumination light L1 is non-parallel with respect to the circumferential direction of the cylindrical surface 12, and the chief ray of the imaging light beam L2 is parallel to the circumferential direction. To be. Therefore, as shown in FIG. 18, the extension line 41 obtained by extending the principal ray L1a of the illumination light L1 is configured to intersect at a position about half the radius inside the cylindrical surface 12.

  In such an imaging light beam L2, principal rays L2a generated at each point on the illumination area IR are emitted from the illumination area IR in a parallel relationship, for example. The traveling direction of each principal ray L2a when viewed from the direction of the center line (rotation center axis AX1) of the drum mask DM, for example, connects the generation position of each principal ray L2a on the illumination area IR and the rotation center axis AX1. The direction intersects the line (radial direction). As shown in FIG. 17, the traveling direction of each principal ray L2a when viewed from the direction of the rotation center axis AX1 is, for example, a direction that intersects the optical axis 14a of the second optical system 14 non-perpendicularly. .

  As described above, the illumination optical system IL is configured so that the incident side of the first projection optical system PL1 is telecentric. However, the imaging light beam L2 passing through the projection optical system PL is, for example, the first projection optical system PL1. The telecentric relationship may be disrupted due to aberrations and the like. The concave mirror 18 is provided so as to adjust the characteristics of the image projected on the substrate P in consideration of, for example, aberrations generated in the first projection optical system PL1. Therefore, the exposure apparatus EX3 can perform exposure accurately even when the curved mask pattern M is used.

  The first projection optical system PL1 is configured as a reduction optical system having a magnification of N times (where N <1), for example. That is, the first projection optical system PL1 forms an image of a part of the mask pattern M on the intermediate image plane 42 with a reduction magnification. By adopting such a configuration, it is possible to reduce the amount of deviation from the telecentric relationship of the principal ray L2a in the imaging light beam L2. The projection optical system PL is, for example, an equal magnification optical system that forms an image of a part of the projection region PR of the mask pattern M in the projection region PR at the same magnification. The second projection optical system PL2 has a magnification of 1 / N times. It is configured as a magnifying optical system.

  When the projection optical system PL is an equal magnification optical system as a whole, both the first projection optical system PL1 and the second projection optical system PL2 may be equal magnification optical systems, or one of them is a reduction optical system. It may be a system and the other may be a magnifying optical system. Further, the projection optical system PL may be a reduction optical system as a whole, or may be an enlargement optical system as a whole.

  Next, the configuration of the processing apparatus U3 (exposure apparatus EX3) will be described in more detail.

  FIG. 19 is a view showing the arrangement of the exposure apparatus EX3. The exposure apparatus EX3 includes a drum mask DM (mask holding member) that holds the mask pattern M and can rotate about the rotation center axis AX1, and a rotating drum that supports the substrate P and can rotate about the rotation center axis AX2. DP (substrate support member). For example, the rotation center axis AX2 of the rotary drum DP is set substantially parallel to the rotation center axis AX1 of the drum mask DM.

  The drum mask DM is a columnar or cylindrical member having a constant radius, and the outer peripheral surface thereof is a cylindrical surface 12. For example, the mask pattern M is wound around the outer peripheral surface of the drum mask DM and is releasably attached to the drum mask DM. For example, the mask pattern M may be formed on the surface of the drum mask DM using a vapor deposition method or the like, or may not be released from the drum mask DM. As the releasable mask pattern M, a pattern obtained by patterning a chromium layer deposited on an ultrathin glass sheet (thickness of about 100 μm), or a pattern obtained by patterning a transparent resin or plastic sheet with a light shielding layer is used. In both cases where such a sheet-like mask pattern M is wound around the drum mask DM or when the mask pattern M is drawn and formed directly on the surface of the drum mask DM, the radius ( It is important to know the diameter accurately.

  The rotary drum DP is a columnar or cylindrical member having a constant radius, and its outer peripheral surface is cylindrical. For example, the substrate P is supported by the rotating drum DP by being wound around a part of the outer peripheral surface of the rotating drum DP. The projection area PR on which the image of the mask pattern M is projected is disposed in the vicinity of the outer peripheral surface of the rotary drum DP. The configuration of the substrate support member that supports the substrate P can be changed as appropriate. For example, the substrate P may be supported by being suspended by a plurality of transport rollers, and in this case, the projection region PR may be arranged in a plane between the plurality of transport rollers.

  As shown in FIG. 19, the illumination optical system IL illuminates the illumination area IR on the mask pattern M held by the drum mask DM with uniform brightness by an illumination method such as Koehler illumination. The projection optical system PL projects the imaging light beam L2 generated in the illumination area IR toward the projection area PR on the substrate P supported by the rotary drum DP, thereby a part of the mask pattern M (in the illumination area IR). ) Is formed on the projection region PR on the substrate P.

  The exposure apparatus EX3 is a so-called scanning exposure apparatus. By rotating the drum mask DM and the rotating drum DP synchronously at a predetermined rotation speed ratio, the image of the mask pattern M held on the drum mask DM is converted into the rotating drum DP. The projection exposure is continuously repeated on the surface (surface curved along the cylindrical surface) of the substrate P supported by the substrate.

  The exposure apparatus EX3 includes, for example, a rotational drive unit for rotationally driving the drum mask DM and the rotary drum DP, a position detection unit (rotary encoder or the like) for detecting the respective positions of the drum mask DM and the rotary drum DP, A moving unit for adjusting the respective positions of the drum mask DM and the rotating drum DP and a control unit for controlling each part of the exposure apparatus EX3 are provided.

  The control unit of the exposure apparatus EX3 controls the rotation driving unit based on the rotation positions of the drum mask DM and the rotary drum DP detected by the position detection unit, thereby causing the drum mask DM and the rotary drum DP to have a predetermined rotation speed ratio. Rotate synchronously with. The control unit can adjust the relative position of the drum mask DM and the rotary drum DP by controlling the moving unit based on the detection result of the position detecting unit.

  Next, the illumination optical system IL will be described in more detail. The first optical system 13 of the illumination optical system IL is arranged in a homogenizing optical system 19 arranged in an optical path from the light source 20 to the light separating unit 10 and an optical path from the homogenizing optical system 19 to the light separating unit 10. A lens group 27.

  The homogenizing optical system 19 forms a plurality of primary light source images with the light emitted from the light source 20, and makes the light intensity distribution uniform by superimposing the light beams from the plurality of primary light source images. The illumination light L1 emitted from the homogenizing optical system 19 travels in a direction non-parallel to the optical axis 27a of the lens group 27 and enters the lens group 27. The lens group 27 forms a secondary light source image conjugate with the primary light source image formed by the uniformizing optical system 19. Here, the lens group 27 is an axially symmetric optical system, and the optical axis 27 a of the lens group 27 is the optical axis 13 a of the first optical system 13.

  The light source 20 of this embodiment can be configured in the same way as in the first embodiment, for example. In the present embodiment, the illumination unit IU illustrated in FIG. 16 includes, for example, the light source 20 and the first optical system 13.

  FIG. 20 is a diagram showing a configuration of the homogenizing optical system 19. 20 includes an input lens 21, a fly-eye lens 22, a first diaphragm member 23, a relay lens (condensing lens) 24, a cylindrical lens 25, and a second diaphragm member 26.

  For example, the input lens 21 of the present embodiment can be configured in the same manner as in the first embodiment. Note that the optical axis 21a of the input lens 21 of the present embodiment is substantially parallel to the optical axis 27a of the lens group 27 (see FIG. 19), and the + X axis from the optical axis 27a in the X-axis direction orthogonal to the optical axis 27a. It is shifted to the side.

  For example, the fly-eye lens 22 of the present embodiment can be configured similarly to the first embodiment. Note that the fly-eye lens 22 of the present embodiment spatially divides the illumination light L1 emitted from the input lens 21 for each lens element 22b. A primary light source image (condensing point) is formed for each lens element 22b on the emission end face 22c from which light is emitted from the fly-eye lens 22. The surface on which the primary light source image is formed is optically conjugate with a conjugate surface (first conjugate surface) 40 (shown in FIG. 24 and the like) described later.

  The first aperture member 23 is a so-called aperture stop, and is disposed on the exit end surface 22c of the fly-eye lens 22 (see FIG. 20) or in the vicinity thereof. FIG. 21 is a diagram showing a configuration of the first diaphragm member 23. The first diaphragm member 23 has an oval or elliptical opening 23a through which at least part of the illumination light L1 from the fly-eye lens 22 passes, and the center of the opening 23a is, for example, the input lens 21 (see FIG. 20). ) Of the optical axis 21a.

  As shown in FIG. 20, the first diaphragm member 23 is disposed on a surface orthogonal to the optical axis 21 a of the input lens 21 (parallel to the XY plane). The opening 23a has an inner dimension (dimension) D1 in the first direction (X-axis direction) larger than an inner dimension (dimension) D2 in the second direction (Y-axis direction) corresponding to the direction parallel to the rotation center axis AX1. small. The first direction of the inner dimension (dimension) D1 coincides with the circumferential direction of the cylindrical surface 12 in the illumination area IR on the drum mask DM in FIG.

  In the present embodiment, the first direction and the second direction can be defined similarly to the first embodiment.

  22A and 22B are diagrams showing the configuration from the first diaphragm member 23 to the light separation unit 10. FIG. FIG. 22A shows a plan view of a plane orthogonal to the rotation center axis AX1. FIG. 22B shows a plan view of a plane parallel to the rotation center axis AX1.

  As shown in FIG. 22A, the opening 23 a of the first diaphragm member 23 is arranged so as to be biased to one side (+ X axis side) with respect to the optical axis 13 a of the first optical system 13. As shown in FIG. 22B, the opening 23a of the first diaphragm member 23 is arranged symmetrically with respect to the optical axis 13a of the first optical system 13 in the Y-axis direction. That is, the first aperture member 23 is arranged so that the optical axis 13a of the first optical system 13 passes through the center of the opening 23a when viewed from the X-axis direction.

  The relay lens (condensing lens) 24 is disposed at a position where light passing through the first diaphragm member 23 enters. The relay lens 24 is provided so as to superimpose light beams from a plurality of primary light source images (condensing points) formed on the fly-eye lens 22. The illumination light L1 from the plurality of primary light source images formed on the fly-eye lens 22 has a uniform light intensity distribution at the superimposed position.

  The cylindrical lens 25 is disposed on the optical path from the position where the primary light source image is formed in the fly-eye lens 22 to the second diaphragm member 26. The cylindrical lens 25 rotates with a refractive power (power) relating to the surface including the circular arc in the circumferential direction of the cylindrical surface 12 (mask pattern surface) of the drum mask DM (see FIG. 17), that is, the XZ surface perpendicular to the rotation center axis AX1. The optical member (lens group) is configured to have a refractive power (power) larger than that of the YZ plane in a direction parallel to the central axis AX1.

  The second diaphragm member 26 is a so-called field diaphragm, and defines the position and shape of the illumination region IR. The second diaphragm member 26 is disposed at a position conjugate with the illumination region IR or in the vicinity thereof. As shown in FIG. 22A, the center position of the opening through which the illumination light L1 passes in the second diaphragm member 26 is also shifted to the + X-axis side with respect to the optical axis 13a of the first optical system 13. Further, as shown in FIG. 22B, the center position of the aperture through which the illumination light L1 passes in the second diaphragm member 26 is arranged at substantially the same position as the optical axis 13a of the first optical system 13.

  Light from a plurality of primary light source images formed on the fly-eye lens 22 is superimposed on the position of the second diaphragm member 26 by the relay lens 24 and the cylindrical lens 25, and the light intensity distribution in the second diaphragm member 26 is made uniform. The That is, the input lens 21, the fly-eye lens 22, the relay lens 24, and the cylindrical lens 25 make the light intensity distribution of the illumination light L1 uniform.

  The illumination optical system IL is disposed in at least a part of the optical path from the primary light source image to the second diaphragm member 26, and the light intensity distribution of the illumination light L1 using the primary light source image as a source is determined by the position of the second diaphragm member 26. Alternatively, a homogenizing optical system 19 that makes it uniform in the vicinity thereof is included. The illumination optical system IL may not include the second diaphragm member 26 when the projection optical system PL includes a field diaphragm, for example. The homogenizing optical system 19 can also be configured using a rod lens instead of the fly-eye lens 22. In this case, the configuration of the illumination optical system IL is appropriately changed so that the exit end face from which light is emitted from the rod lens is optically conjugate with the illumination region IR.

  The lens group 27 is composed of, for example, a plurality of axisymmetric lenses having a predetermined axis as a rotation center. As shown in FIG. 22B, the lens group 27 forms a pupil plane 28 that is optically conjugate with the first diaphragm member 23 when viewed from the X-axis direction. On the pupil plane 28, as shown in FIG. 17, a light source image L0 (secondary light source image) that is a source of the illumination light L1 irradiated to the illumination region IR is formed.

  When the secondary light source image L0 formed on the pupil plane 28 of the first projection optical system PL1 is projected onto the cylindrical surface 12 of the drum mask DM along the illumination optical path, the circumferential dimension of the cylindrical surface 12 is as follows. It is set larger than the dimension in the direction of the rotation center axis (center line) AX1.

  The distribution range of the secondary light source image L0 formed on the second conjugate plane (pupil plane 28) is projected onto the cylindrical surface 12 of the drum mask DM along the illumination optical path. Accordingly, the dimension in the direction of the rotation center axis (center line) AX1 is set to be smaller than the dimension in the circumferential direction of the cylindrical surface 12.

  By the way, the lens group 27 is configured to converge on the pupil plane 28 a component that spreads in the Y-axis direction out of the light flux from the primary light source image formed on the first diaphragm member 23. Here, since the power of the cylindrical lens 25 is different between the X-axis direction and the Y-axis direction, components that spread in the X-axis direction from each point of the primary light source image (the opening 23a of the first aperture member 23) are shown in FIG. It does not converge on each corresponding point on the pupil plane 28 as shown at 22A. In other words, the pupil plane 28 is optically conjugate with the first diaphragm member 23 when viewed from the X-axis direction, and optically conjugate with the first diaphragm member 23 when viewed from the Y-axis direction. It does not have to be.

  About the light separation part 10 of this embodiment, it can comprise similarly to 1st Embodiment, for example. The light separation unit 10 of the present embodiment includes a lens member 30 made of a material that transmits light, and a reflective film 31 formed on the surface of the lens member 30. The lens member 30 is shaped like a meniscus lens, for example, and the surface 30a side on which the illumination light L1 enters from the first optical system 13 is a convex surface, and the surface 30b side facing the surface 30a is a concave surface. The surface 30b is a curved surface including a part of a spherical surface, for example. The reflective film 31 is provided on the surface 30 b of the lens member 30.

  FIG. 23 is a plan view showing the configuration of the light separation unit 10. As shown in FIG. 23, the light separating unit 10 includes an imaging light beam L <b> 2 generated in a passing unit 15 through which at least part of the illumination light L <b> 1 from the first optical system 13 passes and an illumination region IR on the mask pattern M. (Refer FIG. 17) and the reflection part 16 which reflects. The light separation unit 10 is disposed across the optical path from the primary light source image to the illumination area IR and the optical path from the illumination area IR to the intermediate image plane 42. The reflection unit 16 of the light separation unit 10 according to the present embodiment includes, for example, a reflection surface (reflection film 31) curved in a concave shape including a part of a spherical surface.

  As illustrated in FIG. 19, the second optical system 14 is disposed at a position where the illumination light L <b> 1 that has passed through the passage 15 of the light separation unit 10 is incident. The second optical system 14 condenses the illumination light L1 so that the illumination region IR is optically conjugate with the first diaphragm member 23. That is, the lens group 27 and the second optical system 14 form a surface optically conjugate with the second diaphragm member 26 in the illumination region IR.

  The second optical system 14 is composed of, for example, a plurality of lenses that are axisymmetric about a predetermined central axis. In the present embodiment, the predetermined central axis is the optical axis 14a of the second optical system 14. The optical axis 14a of the second optical system 14 is set coaxially with the optical axis 13a of the first optical system 13, for example. The illumination light L1 incident on the second optical system 14 is emitted from the second optical system 14 through one side with respect to a surface (YZ surface) including the optical axis 14a of the second optical system 14. The illumination light L1 emitted from the second optical system 14 enters the illumination area IR on the mask pattern M held by the drum mask DM. The illumination light L1 is reflected and diffracted by the mask pattern M, so that an imaging light beam L2 is generated.

  Here, the illumination light L1 when entering the illumination region IR and the imaging light beam L2 emitted from the illumination region IR will be described in more detail.

  FIG. 24 is a side view of the light beam (illumination light L1) incident on the illumination region IR and the imaging light beam L2 emitted from the illumination region IR as viewed from the direction of the rotation center axis AX1 (Y-axis direction) of the drum mask DM. is there. FIG. 25 is a top view of the imaging light beam L2 emitted from the illumination region IR as seen from a direction (Z-axis direction) orthogonal to FIG. In the present embodiment, the descriptions in FIGS. 24 and 25 regarding the illumination light L1 and the imaging light beam L2 are the same as the descriptions in FIGS. 10 and 11 of the first embodiment, and thus the description thereof is omitted here.

  Next, the shape of the pupil on the plane conjugate with the light source image (pupil plane 28, conjugate plane 40) will be described. FIG. 26 is a diagram illustrating a representative position of the illumination region IR referred to in the description of the pupil. FIG. 27 is a diagram showing the shape of the pupil in the conjugate plane 40 conjugate with the light source image. Here, for convenience of explanation, the light beam (illumination light L1 and imaging light beam L2) passing through each point of the illumination region IR has a circular spot shape on a plane conjugate with the light source image (pupil plane 28 and conjugate plane 40). It shall be.

  In FIG. 26, symbols P1 to P9 indicate points on the illumination region IR as viewed in plan from the X-axis direction. Point P1, point P2, and point P3 are a group of points (referred to as a first group) arranged in the circumferential direction (X direction when viewed in plan) of the cylindrical surface 12 of the drum mask DM. The point P1 is disposed at the + X-axis side end of the illumination region IR, the point P3 is disposed at the −X-axis side end of the illumination region IR, and the point P2 is disposed at the center between the points P1 and P3. Similarly, the second group of points P4, P5 and P6, and the third group of points P7, P8 and P9 are groups of points arranged in the circumferential direction of the cylindrical surface 12, respectively. The first group of points P1 to P3 is arranged at the end of the illumination area IR on the −Y axis side, and the third group of points P7 to P9 is arranged at the end of the illumination area IR on the + Y axis side. The second group of points P4 to P6 is arranged between the first group and the third group.

  First, the passage range of the illumination light L1 on the pupil plane 28 (light separation unit 10) will be described. The chief rays of the illumination light L1 incident on the points P1, P4, and P7 aligned in the direction parallel to the rotation center axis AX1 (Y-axis direction) on the periphery of the illumination region IR shown in FIG. The incident positions in the circumferential direction are substantially the same, and the incident angles with respect to the illumination region IR are substantially the same. Therefore, the positions of the passing ranges on the light separating unit 10 (pupil plane 28) of the light beams incident on the points P1, P4, and P7 are aligned in the X-axis direction in FIG. 22A. Therefore, as shown in FIG. 23, the light beams incident on the points P1, P4, and P7 all pass through a range R3 on the light separating unit 10 (pupil plane 28). Similarly, all of the light beams incident on the points P3, P6, and P9 in the illumination region IR aligned in the direction parallel to the rotation center axis AX1 pass through the range R4 on the pupil plane 28.

  Further, the chief ray of the illumination light L1 incident on the point P1 and the chief ray of the illumination light L1 incident on the point P3 are different in the incident position in the circumferential direction of the illumination region IR (cylindrical surface 12). The incident angle is different.

  Therefore, a passing range (range R3) on the light separating unit 10 (pupil plane 28) through which the light beam incident on the point P1 passes and a passing range on the light separating unit 10 (pupil surface 28) through which the light beam incident on the point P3 passes. (Range R4) is shifted in the X-axis direction on the pupil plane 28, and shifted in the circumferential direction of the cylindrical surface 12 in the illumination region IR.

  In FIG. 23, the position in the Y-axis direction of the range R3 on the pupil plane 28 is substantially the same as the range R4. Further, the position of the range R3 in the X-axis direction is farther from the intersection 13b of the optical axis 13a of the first optical system 13 and the light separating unit 10 than the position of the range R4 in the X-axis direction.

  Note that the passing ranges of the light beams incident on the points P2, P5, and P8 aligned in the Y-axis direction parallel to the rotation center axis AX1 in the illumination region IR shown in FIG. 26 are not shown in FIG. Arranged between R3 and range R4. Similarly, the light beam passing through an arbitrary point on the line connecting the points P1 and P3 passes through a range shifted from the range R3 toward the range R4 according to the shift amount from the point P1 of the arbitrary point. become. Therefore, the passing range on the pupil plane 28 of the illumination light L1 incident on the illumination region IR is, for example, an oval range R2 connecting the range R3 and the range R4.

  As described above, when the range R2 of the passage portion 15 is formed in an oval shape, the principal ray L2a of the imaging light beam L2 distributed in the circumferential direction of the rotation center axis AX1 is more than the case where the illumination light is incident on the illumination region as a parallel light beam. However, they become close to each other in a parallel relationship (telecentric state). This is achieved in combination with setting the light separation unit 10 and the previous illumination optical system so that the conjugate plane 40 is arranged at or near the center between the rotation center axis AX1 and the illumination region IR. The

  Next, the shape of the pupil on the conjugate plane 40 will be described. The shape of the pupil on the conjugate plane 40 is substantially the same as the shape of the spot formed on the conjugate plane 40 when the illumination light L1 incident on the illumination area IR is virtually propagated inside the drum mask DM.

  At the points P1, P2, and P3 in the illumination region IR aligned in the circumferential direction of the cylindrical surface 12, the extension line 41 (see FIG. 24) of the principal ray L1a overlaps almost one point on the conjugate plane 40. The chief ray L1a of the illumination light L1 enters. Therefore, if the light beams incident on the points P1, P2, and P3 propagate to the inside of the cylindrical surface 12, the positions of the passing ranges on the conjugate plane 40 are aligned, and all of them are shown in FIG. It will pass through the range R5 shown. For the same reason, the light beams incident on the points P4, P5, and P6 in the illumination region IR aligned in the circumferential direction of the cylindrical surface 12 all pass through the range R6 and are aligned in the circumferential direction of the cylindrical surface 12 The light beams incident on the points P8 and P9 pass through the range R7.

  Further, the principal rays L1a of the illumination light L1 are incident on the points P1, P4, and P7 in the illumination region IR aligned in a direction parallel to the rotation center axis AX1 (Y-axis direction) in a substantially parallel relationship with each other. come. Therefore, if the light beams incident on the points P1, P4, and P7 propagate to the inside of the cylindrical surface 12, they pass through the conjugate plane 40 in the Y-axis direction parallel to the rotation center axis AX1. The position will shift. That is, the range R5 is disposed at the −Y-axis side end on the conjugate plane 40, the range R7 is disposed at the + Y-axis side end on the conjugate plane 40, and the range R6 is the center of the range R5 and the range R7. Will be placed. As a result, as shown in FIG. 27, the illumination light L1 incident on the illumination region IR has an elliptical range R8 in which the shape of the pupil on the conjugate plane 40 connects the range R5 and the range R7.

  As described above, the principal ray L2a generated at each position of the illumination region IR in the imaging light beam L2 is in the circumferential direction of the cylindrical surface 12 and the directions parallel to the rotation center axis AX1 (Y-axis direction). Are substantially parallel to each other. Therefore, the projection optical system PL can be configured to be telecentric on the incident side (illumination region IR side). As shown in FIG. 19 and the like, the traveling direction of the principal ray L2a of the imaging light beam L2 when exiting from the illumination region IR is the light of the second optical system 14 when viewed from the direction of the rotation center axis AX1. This is a direction that intersects the axis 14a non-perpendicularly.

  Next, the projection optical system PL will be described in more detail. FIG. 28 is a diagram showing an optical path that functions as the first projection optical system. FIG. 29 is a diagram illustrating an optical path that functions as the second projection optical system.

  The projection optical system PL includes a first projection optical system PL1 that forms an intermediate image Im as shown in FIG. 28, and a second projection optical system PL2 that projects the intermediate image Im onto a substrate P as shown in FIG. . The first projection optical system PL1 and the second projection optical system PL2 are configured telecentric as, for example, a half-image field type catadioptric projection optical system obtained by dividing a circular image field.

  The first projection optical system PL1 shown in FIG. 28 includes a second optical system 14, a light separation unit 10, a deflection member 17, a lens group 43, and a deflection member 44.

  As described above, the second optical system 14 also serves as a part of the illumination optical system IL, and includes a lens group 45 and a lens group 46. The lens group 45 and the lens group 46 form a plane conjugate with the light source image formed by the illumination optical system IL (the pupil plane 28 of the first projection optical system PL1).

  The lens group 45 is on the same side as the illumination area IR (drum mask DM) with respect to a plane (XY plane) including the optical axis PL2a of the second projection optical system PL2 and parallel to the rotation center axis AX1 (see FIG. 19). Has been placed. The lens group 46 is on the opposite side of the illumination area IR (drum mask DM) with respect to a plane (XY plane) including the optical axis PL2a of the second projection optical system PL2 and parallel to the rotation center axis AX1 (see FIG. 19). Has been placed.

  The imaging light beam L2 incident on the second optical system 14 passes through a different optical path from the illumination light L1 (see FIG. 19) that travels toward the illumination region IR. The optical path of the imaging light beam L2 in the second optical system 14 is arranged on the opposite side (+ X axis side) to the optical path of the illumination light L1 with respect to the plane (YZ plane) including the optical axis 14a of the second optical system 14. Is done.

  The imaging light beam L2 that has passed through the second optical system 14 is incident on the light separation unit 10. The range R1 in which the imaging light beam L2 is incident in the light separation unit 10 (see FIG. 23) does not overlap with the range R2 (passage unit 15) in which the illumination light L1 enters the light separation unit 10 from the first optical system 13. Is set. The range R1 in which the imaging light beam L2 is incident is set, for example, on the side opposite to the passing portion 15 with respect to the YZ plane and is the reflecting portion 16 of the light separating portion 10. The reflector 16 is disposed at or near the pupil plane 28, and the principal rays L2a emitted from the respective points in the illumination area IR are substantially parallel to each other as shown in FIG. The light flux generated at each point in the region IR is incident on the reflecting portion 16 so that the spots are overlapped in the range R2.

  As shown in FIG. 28, the imaging light beam L <b> 2 that has entered the reflection unit 16 of the light separation unit 10 is reflected by the reflection unit 16, passes through the lens group 46 of the second optical system 14, and enters the deflection member 17. The deflecting member 17 is, for example, a prism mirror, and the surface on which the imaging light beam L2 is incident from the light separating unit 10 is a planar reflecting surface.

  The deflecting member 17 is disposed at a position deviated from the optical path of the illumination light L1 so as not to block the illumination light L1 (see FIG. 19) that passes through the second optical system 14 and travels toward the illumination region IR. Here, the deflecting member 17 shields the imaging light beam L2 reflected by the light separating unit 10 so as not to go to the drum mask DM. The imaging light beam L2 incident on the deflecting member 17 is deflected by being reflected by the deflecting member 17 and enters the lens group 43.

  The lens group 43 condenses the imaging light beam L2 reflected by the deflecting member 17 so that an intermediate image plane 42 conjugate with the illumination region IR is formed. The lens group 43 is disposed, for example, on the same side as the projection region PR (rotary drum DP) with respect to the plane (YZ plane) including the optical axis 14a of the second optical system 14 and the rotation center axis AX1 (see FIG. 19). . The lens group 43 is configured to be optically equivalent to the lens group 45 of the second optical system 14, for example. The lens group 43 includes, for example, an optical member such as a lens that is rotationally symmetric around a predetermined axis (the optical axis PL2a of the second projection optical system PL2). The optical axis PL2a of the second projection optical system PL2 is set so as to be orthogonal to the optical axis 14a of the second optical system 14, for example.

  The imaging light beam L2 reflected by the deflecting member 17 and passing through the lens group 43 is incident on the reflecting surface 44a of the deflecting member 44, is deflected by being reflected by the reflecting surface 44a, and enters the concave mirror 18. The deflection member 17 is a prism mirror, for example, and the reflection surface 44a is substantially planar.

  The second projection optical system PL2 shown in FIG. 29 includes a concave mirror 18, a deflection member 44, a lens group 43, a lens group 47, and a concave mirror 48.

  The concave mirror 18 shown in FIGS. 28 and 29 is arranged at or near the position of the intermediate image plane 42 where the intermediate image Im is formed by the first projection optical system PL1. That is, the light beam emitted from each point on the illumination region IR in the imaging light beam L2 is converged to each corresponding point (conjugate point) on the concave mirror 18 and reflected at each point. In the concave mirror 18, the surface on which the imaging light beam L2 is incident from the deflecting member 44 is a substantially cylindrical reflecting surface. The radius of curvature of the concave mirror 18 is set to be substantially the same as the radius of curvature of the illumination region IR regardless of the magnification of the first projection optical system PL1.

  The imaging light beam L <b> 2 reflected by the concave mirror 18 travels in a direction non-parallel to the traveling direction when entering the concave mirror 18, and enters the deflecting member 44. For this reason, the incident angle of the imaging light beam L2 reflected by the concave mirror 18 with respect to the deflecting member 44 is different from the incident angle with respect to the deflecting member 44 when traveling toward the concave mirror 18. As a result, the imaging light beam L2 reflected by the concave mirror 18 and the deflecting member 44 passes through an optical path different from the optical path of the imaging light beam L2 when traveling from the deflecting member 17 toward the deflecting member 44 (see FIG. 28). Is incident on.

  The imaging light beam L <b> 2 that has passed through the lens group 43 enters the lens group 47 without being blocked by the deflecting member 17. In other words, the deflecting member 17 is disposed at a position where the imaging light beam L2 reflected by the light separating unit 10 is incident and where the imaging light beam L2 reflected by the deflecting member 44 after being reflected by the concave mirror 18 is not incident. Has been.

  The lens group 47 condenses the imaging light beam L2 that has been reflected by the deflecting member 44 and passed through the lens group 43 so that a pupil plane 47a conjugate with the pupil plane 28 of the first projection optical system PL1 is formed. For example, the lens group 47 is configured to be optically equivalent to the lens group 46 of the second optical system 14. The lens group 47 includes, for example, a lens that is rotationally symmetric around a predetermined axis (the optical axis PL2a of the second projection optical system PL2).

  The imaging light beam L <b> 2 reflected by the deflecting member 44 and passing through the lens group 43 and the lens group 47 enters the concave mirror 48. For example, the concave mirror 48 is disposed at or near the position of the pupil plane 47a in the second projection optical system PL2. For example, the concave mirror 48 is configured as a reflecting surface in which the incident end surface on the side on which the imaging light beam L2 is incident is curved in a spherical shape. In the concave mirror 48, at least a region of the incident end face on which the imaging light beam L2 is incident is a reflecting surface.

  In the concave mirror 48, a part of the region where the imaging light beam L2 is incident on the incident end surface may not be a reflecting surface. For example, the concave mirror 48 can function as a diaphragm member by forming a part of the incident end face where the imaging light beam L2 is incident as a transmission part through which the imaging light beam L2 is transmitted. Instead of at least a part of the transmission part, an absorption part for absorbing the imaging light beam L2 may be provided.

  The imaging light beam L2 reflected by the concave mirror 48 is projected onto the projection region PR through the lens group 47 and the lens group 43. Of the imaging light beam L2, the light beams from the respective points on the intermediate image surface 42 pass through the lens group 43 and the lens group 47 twice, respectively, so that a surface conjugate with the intermediate image surface 42 (of the second projection optical system PL2). Converge to each of the corresponding points (conjugate points) on the image plane). In this way, the intermediate image Im formed on the intermediate image plane 42 by the first projection optical system PL1 is projected onto the image plane of the second projection optical system PL2.

  The image plane of the second projection optical system PL2 is set at substantially the same position as the projection area PR on the substrate P supported on the outer peripheral surface of the rotary drum DP, and the image of the illumination area IR on the mask pattern M is Projection exposure is performed on the projection region PR. In such an exposure apparatus EX3, the concave mirror 18 converts the image plane of the second projection optical system PL2 so as to match the shape of the projection area PR, so that the image of the illumination area IR is accurately and faithfully projected.

  By the way, as described with reference to FIG. 25 and the like, the illumination optical system IL is configured such that the principal rays L2a of the imaging light beam L2 when entering the projection optical system PL are substantially parallel to each other. However, the imaging light beam L2 that has passed through at least a part of the projection optical system PL may deviate from the parallel relationship of principal rays due to, for example, aberration. The accuracy of exposure may decrease as the relationship between the principal rays of the imaging light beam L2 when entering the projection region PR deviates from the parallel relationship.

  Therefore, the projection optical system PL may include a correction unit that corrects the directions of the principal rays of the imaging light beam L2 so as to approach a substantially parallel relationship with each other. The correction unit may be disposed at any position on the optical path from the illumination region IR to the projection region PR. However, the closer to the intermediate image plane 42, the more effectively the direction of the principal ray L2a of the imaging light beam L2 can be corrected.

  For example, the concave mirror 18 is an optical member arranged closest to the intermediate image plane 42 in the projection optical system PL, and the above-described correction unit can be configured using the concave mirror 18. For example, the concave mirror 18 may have one or both of the shape and position of its reflecting surface so that the principal rays of the imaging light beam L2 reaching the pupil plane 47a of the second projection optical system PL2 are parallel to each other. Good.

  That is, the shape of the concave mirror 18 may be set to an ellipse whose cross-sectional shape perpendicular to the Y-axis direction is different from a circle so that the principal rays of the imaging light beam L2 are parallel to each other. The position of the concave mirror 18 is such that the intermediate image is within a range where the distance between the image plane of the second projection optical system PL2 and the projection region PR is equal to or less than the focal depth so that the principal rays of the imaging light beam L2 are parallel to each other. It may be arranged so as to deviate from the surface 42.

  Note that the correction unit described above may include one or both of the deflection member 17 and the deflection member 44. For example, the reflecting surface 44a of the deflecting member 44 may be curved so that the principal rays of the imaging light beam L2 reaching the pupil surface 47a of the second projection optical system PL2 are parallel to each other. The same applies to the deflection member 17.

  Since the deflection member 44 is disposed closer to the intermediate image plane 42 than the deflection member 17, the direction of the principal ray can be effectively adjusted by using the above-described correction unit. Further, since the imaging light beam L2 directed toward the intermediate image surface 42 is incident and the imaging light beam L2 emitted from the intermediate image surface 42 is not incident on the deflecting member 17, the orientation of the principal light beam of the imaging light beam L2 is adjusted. Design freedom is high. Further, the correction unit described above may include an optical member different from the concave mirror 18, the deflecting member 17, and the deflecting member 44, or may not be provided.

  In the processing apparatus U3 (exposure apparatus EX3) of the present embodiment as described above, the illumination optical system IL is configured so that the imaging light beam L2 incident on the projection optical system PL is close to a parallel light beam. Even if the system PL is not complicated, the curved mask pattern M image can be accurately projected and exposed. Therefore, the processing apparatus U3 can expose the substrate P efficiently and accurately by executing the exposure process while rotating the mask pattern M.

  Further, in order to project the image of the mask pattern M curved in a cylindrical shape onto the substrate P curved in a cylindrical shape, the concave mirror 18 having a cylindrical reflecting surface is provided at the position of the intermediate image plane, so that the second projection is performed. The image plane of the optical system PL2 is converted along the projection region PR, and the processing device U3 sets the width of the illumination region IR and the projection region PR in the scanning exposure direction (circumferential direction of the mask pattern M). It is possible to ensure a wide range, high productivity, and high-precision exposure processing.

  Further, since the processing device U3 has the light separation unit 10 disposed on the pupil plane 28 of the first projection optical system PL1, it is possible to adopt an epi-illumination method in which the optical path of the illumination light L1 and the optical path of the imaging light beam L2 are separated. it can. Therefore, the processing device U3 can reduce the loss of light quantity and the generation of stray light in the PBS as compared with a configuration in which the optical path is divided using, for example, a polarization separation splitter (PBS). In the case where the light source 20 is a laser light source or the like and the light quantity loss can be reduced by utilizing the polarization characteristics of the illumination light, such a light separation unit 10 may be configured with PBS or the like.

  Moreover, since the light separation part 10 (regulation part) prescribes | regulates the passage range of the illumination light L1 which goes to the illumination area | region IR via the passage part 15, it is the main ray L1a of the illumination light L1 at the time of entering into the illumination area IR. The direction can be defined with high accuracy. Further, since the light separating unit 10 defines the passing range of the illumination light L1 using the reflecting unit 16, the configuration can be simplified.

  By the way, the relationship (for example, mutually parallel) of the principal rays L1a distributed in the direction parallel to the rotation center axis AX1 in the illumination light L1 is the principal ray distributed in the direction parallel to the rotation center axis AX1 in the imaging light beam L2. It is also maintained in the L2a relationship (for example, parallel to each other). Further, the relationship (for example, parallel to each other) of the principal rays L2a distributed in the circumferential direction of the cylindrical surface 12 in the imaging light beam L2 is the relationship (for example, the principal rays L1a distributed in the circumferential direction of the cylindrical surface 12 of the illumination light L1). , Non-parallel to each other). Therefore, for example, an optical member having an isotropic power for the divergence angle (NA) of the illumination light L1 so that the principal rays L2a distributed in the circumferential direction of the cylindrical surface 12 in the imaging light beam L2 have a parallel relationship with each other. In this case, the principal rays L2a distributed in the direction parallel to the rotation center axis AX1 in the imaging light beam L2 do not become parallel to each other.

  In the present embodiment, the divergence angle of the illumination light L <b> 1 (principal ray) is differentiated by the cylindrical lens 25 between the direction in which the rotation center axis AX <b> 1 of the drum mask DM extends and the circumferential direction of the cylindrical surface 12. That is, the cylindrical lens 25 is arranged in the circumferential direction of the cylindrical surface 12 while the principal rays L1a arranged in the direction parallel to the rotation center axis AX1 among the principal rays L1a of the illumination light L1 reaching the illumination region IR are parallel to each other ( The principal ray L1a (distributed) is deflected (set) so that the extended line 41 intersects the line on the conjugate plane 40 parallel to the rotation center axis AX1. Therefore, the principal rays L2a of the imaging light beam L2 distributed in the direction parallel to the rotation center axis AX1 are made substantially parallel to each other, and the principal rays L2a of the imaging light beam L2 distributed in the circumferential direction of the cylindrical surface 12 are also substantially parallel to each other. Can be. In addition, as a method of giving anisotropy to the divergence angle of the illumination light L1, as in the first embodiment, a light guide member in which optical fibers are bundled is used, and the shape of the light output side of the light guide member It is also possible to use a method of adjusting the above.

[Fourth Embodiment]
Next, a fourth embodiment will be described. In the present embodiment, the same components as those in the above embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 30 is a view showing the arrangement of a processing apparatus (exposure apparatus EX4) according to this embodiment. FIG. 31 is a diagram showing an optical path that functions as the illumination optical system IL in the configuration of FIG. FIG. 32 is a diagram showing an optical path that functions as the first projection optical system PL1 in the configuration of FIG. FIG. 33 is a diagram showing an optical path that functions as the second projection optical system PL2 in the configuration of FIG.

  The projection optical system PL includes a first projection optical system PL1 that forms an intermediate image Im of a part of the mask pattern M (illumination region IR) and an intermediate image formed by the first projection optical system PL1 as a projection region on the substrate P. And a second projection optical system PL2 that projects onto the PR. Here, each of the first projection optical system PL1 and the second projection optical system PL2 is composed of an optical system such as an Offner optical system. The illumination optical system IL illuminates the illumination area IR with the illumination light L1 through a part of the first projection optical system PL1.

  The illumination optical system IL can be configured in the same manner as in the third embodiment, for example, the elements (homogenization optical system 19) arranged from the light source to the first diaphragm member 23. The illumination light L1 emitted from the light source passes through the homogenizing optical system 19, whereby the light intensity distribution in the first diaphragm member 23 is made uniform.

  The illumination optical system IL shown in FIG. 31 includes a light separation unit 50, an image adjustment member 51, a concave mirror 52, a lens group 53, a convex mirror 54, a deflection member 55, and an image adjustment member 56.

  The illumination light L1 that has passed through the first diaphragm member 23 passes through the image adjustment member 51 and enters the reflecting portion 57 of the light separating portion 50. The image adjusting member 51 is provided in consideration of aberration and the like in order to adjust the image characteristics of the secondary light source image formed on the surface conjugate with the primary light source image. The image adjustment member 51 can be omitted as appropriate.

  The reflection unit 57 of the light separation unit 50 is disposed at a position where the illumination light L1 is incident from the homogenizing optical system 19 and a position where the imaging light beam L2 (see FIG. 30) passing through the projection optical system PL is not incident. Yes. The reflection unit 57 of the light separation unit 50 is, for example, a prism mirror, and the surface on which the illumination light L1 enters from the homogenizing optical system 19 is a planar reflection surface.

  The illumination light L 1 that has entered the reflecting portion 57 is deflected by being reflected by the reflecting portion 57 and then enters the concave mirror 52. The illumination light L 1 reflected by the reflecting portion 57 and incident on the concave mirror 52 is reflected by the concave mirror 52 and enters the convex mirror 54 through the lens group 53.

  The concave mirror 52 has a reflecting surface including a part of a spherical surface, for example, and forms a pupil plane 28 conjugate with the primary light source image (first diaphragm member 23 shown in FIG. 20) formed in the uniformizing optical system 19. Then, the illumination light L1 is condensed. That is, a secondary light source image is formed on the pupil plane 28.

  The lens group 53 is appropriately provided so as to adjust the image characteristics of the secondary light source image on the pupil plane 28, and includes, for example, a field lens. The convex mirror 54 has, for example, a reflective surface including a part of a spherical surface, and is provided so that the concave mirror 52 and the center of curvature coincide. Here, the axis connecting the center of the concave mirror 52 and the center of the convex mirror 54 is defined as the optical axis ILa of the illumination optical system IL (the optical axis PL1a of the first projection optical system PL1). The convex mirror 54 and the concave mirror 52 are provided so that the light (illumination light L1 and imaging light beam L2) reflected by the convex mirror 54 is incident on the concave mirror 52 again.

  The illumination light L1 from the concave mirror 52 is incident on the −X axis side of the convex mirror 54 with respect to the optical axis ILa of the illumination optical system IL, reflected by the convex mirror 54, and incident again on the concave mirror 52, and reflected by the convex mirror 54. The illumination light L1 incident on the concave mirror 52 is reflected by the concave mirror 52 and incident on the deflecting member 55, deflected by being reflected by the deflecting member 55, and incident on the illumination region IR through the image adjusting member 56. .

  The deflecting member 55 is, for example, a prism mirror, and the surface on which the illumination light L1 enters from the concave mirror 52 is a flat reflecting surface. Similar to the image adjusting member 51, the image adjusting member 56 is appropriately provided in consideration of aberrations and the like.

  As shown in FIG. 32, the first projection optical system PL1 includes an image adjustment member 56, a deflection member 55, a concave mirror 52, a lens group 53, a convex mirror 54, and an image adjustment member 58.

  The imaging light beam L2 emitted from the illumination area IR enters the deflection member 55 through the image adjustment member 56 and is deflected by being reflected by the deflection member 55. The imaging light beam L2 deflected by the deflecting member 55 enters the concave mirror 52 through an optical path different from the optical path of the illumination light L1 from the concave mirror 52 shown in FIG. The imaging light beam L2 incident on the concave mirror 52 passes through an optical path different from that of the illumination light L1 and enters the convex mirror 54 through the lens group 53. The position where the imaging light beam L2 is incident on the convex mirror 54 is disposed on the opposite side (+ X axis side) from the incident position of the illumination light L1 with respect to the optical axis PL1a of the first projection optical system PL1.

  The imaging light beam L2 reflected by the convex mirror 54 enters the concave mirror 52 through the lens group 53 and is reflected by the concave mirror 52. The imaging light beam L2 reflected by the concave mirror 52 enters the image adjustment member 58 through the passage part 59 of the light separation part 50. Here, the passage part 59 of the light separation part 50 is an area where the reflection part 57 is not provided. That is, the reflecting portion 57 is arranged at a position where the imaging light beam L2 reflected by the concave mirror 52 after being reflected by the convex mirror 54 is not incident. As described above, the light separation unit 50 is provided so as to define the passage range of the illumination light L1.

  Of the imaging light beam L2, the light beams emitted from the respective points on the illumination area IR converge on almost one point on the intermediate image plane 42 conjugate with the illumination area IR by passing through the optical path as described above. In other words, an image of the illumination area IR is formed on the intermediate image plane 42. The image adjusting member 56 and the image adjusting member 58 are appropriately provided in consideration of aberrations and the like so as to adjust the image characteristics of the intermediate image Im. One or both of the image adjustment member 56 and the image adjustment member 58 can be omitted as appropriate.

  As shown in FIG. 33, the second projection optical system PL2 includes a concave mirror 60, an image adjustment member 58, a deflection member 61, a concave mirror 62, a lens group 63, a convex mirror 64, a deflection member 65, and an image adjustment member 66.

  The concave mirror 60 is disposed at or near the intermediate image plane 42. A concave cylindrical surface is formed toward the incident side of the imaging light beam L2 so as to follow the shape of the intermediate image Im formed by the first projection optical system PL1. As described in the third embodiment, the concave mirror 60 converts the shape of the image plane of the second projection optical system PL2 so as to follow the projection region PR.

  The imaging light beam L2 that has entered the concave mirror 60 is reflected by the concave mirror 60, passes through the image adjustment member 58, and enters the deflection member 61. The deflecting member 61 is, for example, a prism mirror, and the surface on which the imaging light beam L2 from the concave mirror 60 is incident is a flat reflecting surface. The deflecting member 61 is a position where the imaging light beam L2 reflected by the concave mirror 60 is incident and at a position where the imaging light beam L2 directed from the concave mirror 52 (see FIG. 32) of the first projection optical system PL1 toward the concave mirror 60 is not blocked. Has been placed.

  The imaging light beam L2 incident on the deflecting member 61 is deflected by being reflected by the deflecting member 61 and enters the concave mirror 62. The imaging light beam L2 incident on the concave mirror 62 is reflected by the concave mirror 62, passes through the lens group 63, and enters the convex mirror 64.

  The concave mirror 62 condenses the imaging light beam L2 so as to form a pupil plane 67 conjugate with the pupil plane 28 of the first projection optical system PL1 shown in FIG. For example, the concave mirror 62 is configured to be optically equivalent to the concave mirror 52 of the first projection optical system PL1. The concave mirror 62 has a curved reflecting surface including a part of a spherical surface, for example.

  The lens group 63 is appropriately provided in consideration of aberration or the like so as to adjust the characteristics of the image formed in the projection region PR, and includes a field lens or the like.

  The convex mirror 64 is disposed at a position conjugate with the pupil plane 67 or in the vicinity thereof. For example, the convex mirror 64 is configured to be optically equivalent to the convex mirror 54 of the first projection optical system PL1. The convex mirror 64 has a curved reflecting surface including, for example, a part of a spherical surface, and the center of curvature of the reflecting surface is set at substantially the same position as the center of curvature of the concave mirror 62.

  The imaging light beam L2 reflected by the convex mirror 64 enters the concave mirror 62 again through the lens group 63, is reflected by the concave mirror 62, and enters the deflecting member 65. The imaging light beam L2 incident on the deflecting member 65 is deflected by being reflected by the deflecting member 65, and enters the projection region PR through the image adjusting member 66.

  As described above, the second projection optical system PL2 forms the intermediate image Im of the illumination area IR formed on the intermediate image plane 42 on the image plane of the second projection optical system PL2. Is set at or near the position of the projection region PR on the substrate P supported by the rotary drum DP, and the image of the illumination region IR is projected and exposed to the projection region PR on the substrate P.

  In the processing apparatus U3 (exposure apparatus EX4) of the present embodiment as described above, the illumination optical system IL is configured so that the principal ray of the imaging light beam L2 incident on the projection optical system PL is close to a parallel system. Even if the projection optical system PL is not complicated, the curved mask pattern M image can be accurately projected and exposed. Therefore, the processing apparatus U3 can expose the substrate P efficiently and accurately by executing the exposure process while rotating the mask pattern M.

  Further, the processing device U3 projects an image of the curved mask pattern M onto the curved substrate P. Further, in the processing apparatus U3, the concave mirror 18 converts the image plane of the second projection optical system PL2 so as to be along the projection region PR, so that the processing apparatus U3 can be exposed with high accuracy. In addition, for example, by providing a correction unit so that the imaging light beam L2 approaches telecentricity, the processing device U3 can perform exposure with high accuracy. For example, the correction unit can be configured using at least one of the concave mirror 60, the image adjustment member 58, and the deflection member 61.

  Further, since the processing device U3 has the light separation unit 10 disposed on the pupil plane 28 of the first projection optical system PL1, it is possible to separate the optical path of the illumination light L1 and the optical path of the imaging light beam L2. Therefore, the processing device U3 can reduce the loss of light amount and the generation of stray light, compared to a configuration in which the optical path is divided using, for example, a polarization separation splitter or the like.

  The technical scope of the present invention is not limited to the above-described embodiments. For example, one or more of the elements described in the above embodiments may be omitted. The elements described in the above embodiments can be combined as appropriate.

  In each of the above-described embodiments, the projection region PR on the substrate P is curved in a cylindrical surface shape, but the projection region PR may be a flat surface.

  That is, when the substrate P is a rigid substrate that does not substantially deform, or when a certain range including the projection region PR can be maintained flat (planar) even with a flexible sheet-like substrate, each of the embodiments is used. The flat (planar) substrate P can be similarly exposed by the exposure apparatus.

  For example, the substrate P may be a rigid substrate that does not substantially deform, and the exposure apparatus may expose the substrate P. Further, the substrate P may be transported so that the projection region PR on the substrate P is planar, and the exposure apparatus may expose such a substrate P.

  In each of the above-described embodiments, an example of a single lens type exposure apparatus in which the number of illumination optical systems is one and the number of projection optical systems is one has been described. A so-called multi-lens type exposure apparatus may be used in which a plurality of sets of illumination optical systems and projection optical systems are arranged in the direction in which the rotation center axes AX2 and AX1 of the drum mask DM and the rotary drum DP extend.

  In the first embodiment and the third embodiment, the passing range of the illumination light L1 is defined by using the reflecting unit 16 of the light separating unit 10, but the light shielding provided separately from the reflecting unit 16. You may prescribe | regulate a passage range by a part. For example, the light shielding portion may absorb light incident on the outside of the passage portion 15 to shield the light from passing through the light separation portion 10. The passage 15 may be, for example, a gap (opening) disposed so as to pass the illumination light L1.

[Device manufacturing method]
Next, the device manufacturing method of the above embodiment will be described. FIG. 34 is a flowchart showing the device manufacturing method of the above embodiment. Some steps in this flowchart are performed by the device manufacturing systems SYS and SYS2 (flexible display manufacturing lines) shown in FIGS. However, in order to carry out all the steps of the flowchart of FIG. 34, it is necessary to prepare a plurality of manufacturing processing apparatuses.

  In the device manufacturing method shown in FIG. 34, first, function / performance design of a device such as an organic EL display panel is performed (step 201). Next, a mask pattern M is manufactured based on the device design (step 202). In addition, a transparent film or sheet as a substrate of the device, or a substrate such as an ultrathin metal foil is prepared by purchase or manufacture (step 203).

  Next, the prepared substrate is put into a roll type or patch type production line, and TFT backplane layers such as electrodes, wiring, insulating film, semiconductor film, etc. constituting the device on the substrate, and organic EL light emission that becomes a pixel portion A layer is formed (step 204). Step 204 typically includes a step of forming a resist pattern on a film on the substrate and a step of etching the film using the resist pattern as a mask. For forming the resist pattern, a step of uniformly forming a resist film on the substrate surface, a step of exposing the resist film of the substrate with exposure light patterned through the mask pattern M according to each of the above embodiments, A step of developing the resist film on which the latent image of the mask pattern is formed by the exposure is performed.

  As a typical additive process that does not use the conventional resist process to save resources, in the case of flexible device manufacturing that also uses printing technology, a functional photosensitive layer (function) is formed on the surface of a flexible substrate. A photosensitive layer, a photosensitive silane coupling material, etc.) by a coating method, using the exposure apparatus shown in each of the above embodiments, flexible exposure light patterned through the drum mask DM The process of irradiating the functional photosensitive layer (functional sensitive layer) on the substrate to form a hydrophilic portion and a water-repellent portion according to the pattern shape on the functional photosensitive layer, the hydrophilicity of the functional photosensitive layer A step of applying a plating base solution or the like to a high portion and depositing and forming a metallic pattern by electroless plating, a so-called low-temperature wet process at 120 ° C. or lower is performed.

  Next, depending on the device to be manufactured, for example, the substrate is diced or cut, or another substrate manufactured in a separate process, such as a sheet-like color filter having a sealing function or a thin glass substrate is attached. The combining process is performed, and a device (display panel) is assembled (step 205). Next, post-processing such as inspection is performed on the device (step 206). A device can be manufactured as described above. In the device manufacturing method in the above embodiment, the processing apparatus (substrate processing apparatus) conveys the sensitive substrate in a predetermined direction while rotating the drum mask (mask holding member), and continuously applies the mask pattern to the sensitive substrate. And performing a subsequent process using a change in the sensitive layer of the exposed sensitive substrate.

DESCRIPTION OF SYMBOLS 10 ... Light separation part, 12 ... Cylindrical surface, 15 ... Passing part, 16 ... Reflection part, 18 ... Concave mirror, 19 ... Uniformation optical system, 23 ... 1st Diaphragm member, 25 ... Cylindrical lens, 26 ... Second diaphragm member, 28 ... Pupil plane, 40 ... Conjugate plane, 41 ... Extension line, 42 ... Intermediate image plane, ... Light separating section, 57... Reflecting section, 60... Concave mirror, IL .. illumination optical system, IR... Illumination area, Im .. intermediate image, L0. ..Illumination light, L2 ... imaging light beam, L2a ... chief ray, M ... mask pattern, P ... substrate, PL ... projection optical system, PR ... projection area, PL1 ..First projection optical system, PL2 ... second projection optical system U3 ... processing device

Claims (38)

A substrate processing apparatus for projecting and exposing an image of a reflective mask pattern arranged along a cylindrical surface curved with a predetermined radius around a predetermined center line on a sensitive substrate,
A mask holding member that holds the mask pattern along the cylindrical surface and is rotatable about the center line;
A projection optical system that forms an image of a part of the mask pattern on the sensitive substrate by projecting a reflected light beam generated from an illumination area set in a part of the mask pattern toward the sensitive substrate; ,
In order to illuminate the illumination area by epi-illumination, one of the illumination light directed to the illumination area and the reflected light beam generated from the illumination area is allowed to pass through the other while being arranged in the optical path of the projection optical system. A light separating part to be reflected;
Forming a primary light source image as a source of the illumination light, irradiating the illumination area with the illumination light from the primary light source image via the light separation unit and a part of the optical path of the projection optical system; An illumination optical system that forms a first conjugate surface optically conjugate with the primary light source image between the center line and the cylindrical surface;
A substrate processing apparatus comprising: Of the chief rays of the illumination light reaching the illumination area, an extension line of each chief ray distributed in the circumferential direction of the cylindrical surface is set to intersect with a line on the first conjugate plane parallel to the center line. The substrate processing apparatus according to claim 1. The substrate processing apparatus according to claim 1, wherein the first conjugate plane is disposed at a central position between the center line and the illumination area or in the vicinity thereof. The projection optical system has a pupil plane on which a secondary light source image formed by the illumination optical system is formed,
The substrate processing apparatus according to claim 1, wherein the light separation unit is disposed at or near the position of the pupil plane. The light separation unit includes a passing unit that passes the illumination light toward the illumination region, and a reflection unit that reflects a reflected light beam generated from the illumination region,
The projection optical system includes an optical system disposed in an optical path between the light separation unit and the illumination area,
The substrate processing apparatus according to claim 4, wherein at least a part of the reflection portion of the light separation portion is disposed at a position symmetrical to the passage portion with respect to an intersection between the optical axis of the optical system and the light separation portion. The secondary light source image formed on the pupil plane of the projection optical system is set such that a dimension along the circumferential direction of the cylindrical surface is larger than a dimension along the direction of the center line. The substrate processing apparatus as described. The substrate processing apparatus according to claim 6, wherein the light separation unit further includes a defining unit that defines a passing range of the illumination light toward the illumination region via the passage unit. The substrate processing apparatus according to claim 7, wherein the defining unit uses at least a part of the reflecting unit. The illumination optical system includes a diaphragm member disposed at or near a position optically conjugate with the illumination area,
An optical member that is disposed in an optical path from the primary light source image to the aperture member, and whose power along the circumferential direction of the cylindrical surface is larger than the power along the direction of the center line;
A substrate processing apparatus according to any one of claims 6 to 8. The optical member is configured such that, among the principal rays of the illumination light reaching the illumination area, the principal rays arranged in the direction of the center line are parallel to each other, and the principal rays arranged in the circumferential direction of the cylindrical surface are extended lines thereof. The substrate processing apparatus according to claim 9, wherein the substrate processing apparatus is deflected so as to intersect a line on the first conjugate plane parallel to the center line. The illumination optical system is disposed in at least a part of an optical path from the primary light source image to the diaphragm member, and the light intensity distribution of the illumination light using the primary light source image as a source is at or near the position of the diaphragm member. The substrate processing apparatus according to claim 9, further comprising: a uniformizing optical system that makes uniform. The homogenizing optical system includes a second conjugate surface that is optically conjugate with the first conjugate surface and on which the secondary light source image is formed,
The distribution range of the secondary light source image formed on the second conjugate plane is set so that the dimension along the direction of the center line is smaller than the dimension along the circumferential direction of the cylindrical surface. The substrate processing apparatus according to claim 11. The illumination optical system includes a diaphragm member disposed at or near a position optically conjugate with the illumination area,
The substrate according to claim 6, further comprising: a defining unit that is disposed in an optical path from the light source that emits the illumination light to the optical system and that defines a distribution range of the illumination light toward the illumination region in the light separation unit. Processing equipment. The substrate processing apparatus according to claim 1, wherein the mask pattern is exposed to the sensitive substrate while the sensitive substrate is conveyed in a predetermined direction while rotating the mask holding member. When,
Performing a subsequent process using a change in the sensitive layer of the exposed sensitive substrate. A substrate processing apparatus for projecting and exposing an image of a reflective mask pattern arranged along a cylindrical surface curved with a predetermined radius around a predetermined center line on a sensitive substrate,
A mask holding member that holds the mask pattern along the cylindrical surface and is rotatable about the center line;
A projection optical system that forms an image of a part of the mask pattern on the sensitive substrate by projecting a reflected light beam generated from an illumination area set in a part of the mask pattern toward the sensitive substrate; ,
In order to illuminate the illumination area by epi-illumination, one of the illumination light directed to the illumination area and the reflected light beam generated from the illumination area is allowed to pass through the other while being arranged in the optical path of the projection optical system. A light separating part to be reflected;
The illumination light generated from a light source is applied to the illumination region via the light separation unit, and the principal ray of the illumination light is directed to a predetermined position between the center line and the cylindrical surface. An illumination optical system that is inclined with respect to the circumferential direction of the cylindrical surface;
A substrate processing apparatus comprising: A substrate processing apparatus for projecting and exposing an image of a reflective mask pattern arranged along a cylindrical surface curved with a predetermined radius around a predetermined center line on a sensitive substrate,
A mask holding member that holds the mask pattern along the cylindrical surface and is rotatable about the center line;
Forming a primary light source image serving as a source of illumination light directed to an illumination area set in a part of the mask pattern, irradiating the illumination area with the illumination light from the primary light source image, and the primary light source image An illumination optical system that forms an optically conjugate first conjugate surface between the center line and the cylindrical surface;
A first projection optical system that guides a reflected light beam generated from the illumination area irradiated with the illumination light to an intermediate image plane, and forms an image of a part of the mask pattern on the intermediate image plane;
A concave mirror disposed at or near the intermediate image plane;
A second projection optical system that projects the image formed on the intermediate image plane by the first projection optical system onto the sensitive substrate by projecting the reflected light beam reflected by the concave mirror toward the sensitive substrate; ,
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 16, wherein the concave mirror is provided so that principal rays of the reflected light beam reaching the pupil plane of the second projection optical system are parallel to each other. The substrate processing according to claim 16 or 17, wherein the concave mirror is arranged so as to be shifted from the intermediate image plane in a range where a distance between an image plane of the second projection optical system and the projection area is equal to or less than a focal depth. apparatus. The substrate processing according to any one of claims 16 to 18, further comprising a deflecting member that is disposed in an optical path from the concave mirror to the pupil plane of the second projection optical system and deflects the reflected light beam reflected by the concave mirror. apparatus. The substrate processing apparatus according to claim 19, wherein the deflecting member is provided so that principal rays of the reflected light beams reaching the pupil plane of the second projection optical system are parallel to each other. 21. The substrate processing apparatus according to claim 16, wherein the first projection optical system forms an image of a part of the mask pattern at a reduction magnification on the intermediate image plane. The substrate processing apparatus according to claim 21, wherein a projection optical system including the first projection optical system and the second projection optical system forms an image of a part of the mask pattern in the projection region at an equal magnification. Of the chief rays of the illumination light reaching the illumination area, an extension line of each chief ray distributed in the circumferential direction of the cylindrical surface is set to intersect with a line on the first conjugate plane parallel to the center line. The substrate processing apparatus according to any one of claims 16 to 22. The substrate processing apparatus according to any one of claims 16 to 23, wherein the first conjugate plane is disposed at or near the center of the center line and the illumination area. An optical path from the primary light source image to the illumination area and an optical path from the illumination area to the intermediate image plane, and the illumination light going to the illumination area and the reflected light beam going to the intermediate image plane Among them, it further comprises a light separation part that allows one to pass and reflects the other,
The illumination optical system irradiates the illumination area with the illumination light via the light separation unit,
The substrate processing apparatus according to any one of claims 16 to 24, wherein the first projection optical system guides the reflected light beam to the intermediate image plane through the light separation unit. The first projection optical system has a pupil plane on which a secondary light source image formed by the illumination optical system is formed,
The substrate processing apparatus according to claim 25, wherein the light separation unit is disposed at or near a position of a pupil plane of the first projection optical system. The first projection optical system includes an optical system disposed in an optical path between the light separation unit and the illumination area,
The light separation unit includes a passing member that passes the illumination light toward the illumination area, and a reflection member that reflects the reflected light flux from the illumination area,
27. The substrate processing apparatus according to claim 26, wherein at least a part of the reflection member of the light separation unit is disposed at a position symmetrical to the passage member with respect to an intersection between the optical axis of the optical system and the light separation unit. 27. The secondary light source image formed on the pupil plane of the first projection optical system is set such that a dimension along the circumferential direction of the cylindrical surface is larger than a dimension along the direction of the center line. 27. The substrate processing apparatus according to 27. The substrate processing apparatus according to claim 28, wherein the light separation unit further includes a defining unit that defines a passing range of the illumination light toward the illumination region. The substrate processing apparatus according to claim 29, wherein the defining portion uses at least a part of the reflecting member. The light separation unit further includes a reflecting member disposed in an optical path from the primary light source image to the pupil plane of the first projection optical system,
The substrate processing apparatus according to claim 25, wherein at least a part of the reflecting member is disposed so as not to block the reflected light beam in an optical path from the pupil plane of the first projection optical system to the intermediate image plane. The illumination optical system includes a diaphragm member disposed at or near a position optically conjugate with the illumination area,
An optical member that is disposed in an optical path from the primary light source image to the aperture member, and whose power along the circumferential direction of the cylindrical surface is larger than the power along the direction of the center line;
The substrate processing apparatus according to claim 16, further comprising: The optical member is configured such that, among the principal rays of the illumination light reaching the illumination area, the principal rays arranged in the direction of the center line are parallel to each other, and the principal rays arranged in the circumferential direction of the cylindrical surface are extended lines thereof. The substrate processing apparatus according to claim 32, wherein the substrate processing apparatus is deflected so as to intersect a line on the first conjugate plane parallel to the center line. The illumination optical system is disposed in at least a part of an optical path from the primary light source image to the diaphragm member, and the light intensity distribution of illumination light from the primary light source image is uniform at or near the position of the diaphragm member. The substrate processing apparatus according to claim 32, further comprising a homogenizing optical system. The homogenizing optical system has a second conjugate surface that is optically conjugate with the first conjugate surface and on which the secondary light source image is formed,
The distribution range of the secondary light source image formed on the second conjugate plane is set so that the dimension along the direction of the center line is smaller than the dimension along the circumferential direction of the cylindrical surface. The substrate processing apparatus according to claim 34. The illumination optical system includes a diaphragm member disposed at or near a position optically conjugate with the illumination area,
A defining unit that is disposed in an optical path from a light source that emits the illumination light to an optical system and that defines a distribution range of the illumination light toward the illumination region in the light separation unit;
The substrate processing apparatus according to claim 16, further comprising: The substrate processing apparatus according to any one of claims 16 to 36, wherein the sensitive substrate is transported in a predetermined direction while rotating the mask holding member, and the mask pattern is continuously applied to the sensitive substrate. Exposing,
Performing a subsequent process using a change in the sensitive layer of the exposed sensitive substrate. A substrate processing apparatus for projecting and exposing an image of a reflective mask pattern arranged along a cylindrical surface curved with a predetermined radius around a predetermined center line on a sensitive substrate,
A mask holding member that holds the mask pattern along the cylindrical surface and is rotatable about the center line;
Irradiate illumination light from a light source toward an illumination area set in a part on the mask pattern, and direct the principal ray of the illumination light to a predetermined position between the center line and the cylindrical surface. And an illumination optical system tilted with respect to the circumferential direction of the cylindrical surface,
A first projection optical system that guides a reflected light beam generated from the illumination area by irradiation of the illumination light to an intermediate image plane, and forms an image of a part of the mask pattern on the intermediate image plane;
A concave mirror disposed at or near the intermediate image plane;
A second projection optical system that enters the reflected light beam reflected by the concave mirror and projects an image formed on the intermediate image plane by the first projection optical system onto the sensitive substrate;
A substrate processing apparatus comprising:

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