HK1221778A1 - Exposure device and exposure method - Google Patents

Exposure device and exposure method

Info

Publication number
HK1221778A1
HK1221778A1 HK16109756.7A HK16109756A HK1221778A1 HK 1221778 A1 HK1221778 A1 HK 1221778A1 HK 16109756 A HK16109756 A HK 16109756A HK 1221778 A1 HK1221778 A1 HK 1221778A1
Authority
HK
Hong Kong
Prior art keywords
exposure
exposure device
exposure method
Prior art date
Application number
HK16109756.7A
Other languages
Chinese (zh)
Inventor
熊澤雅人
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of HK1221778A1 publication Critical patent/HK1221778A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/24—Optical objectives specially designed for the purposes specified below for reproducing or copying at short object distances
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B17/00—Systems with reflecting surfaces, with or without refracting elements
    • G02B17/08—Catadioptric systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/7015—Details of optical elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70316—Details of optical elements, e.g. of Bragg reflectors, extreme ultraviolet [EUV] multilayer or bilayer mirrors or diffractive optical elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Lenses (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Microscoopes, Condenser (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
HK16109756.7A 2012-07-13 2015-08-08 Exposure device and exposure method HK1221778A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012157811 2012-07-13
JP2012157810 2012-07-13

Publications (1)

Publication Number Publication Date
HK1221778A1 true HK1221778A1 (en) 2017-06-09

Family

ID=49915752

Family Applications (2)

Application Number Title Priority Date Filing Date
HK16109756.7A HK1221778A1 (en) 2012-07-13 2015-08-08 Exposure device and exposure method
HK15107656.3A HK1207161A1 (en) 2012-07-13 2015-08-08 Substrate treatment device and device manufacturing method

Family Applications After (1)

Application Number Title Priority Date Filing Date
HK15107656.3A HK1207161A1 (en) 2012-07-13 2015-08-08 Substrate treatment device and device manufacturing method

Country Status (5)

Country Link
JP (6) JP6137182B2 (en)
KR (4) KR102096891B1 (en)
CN (4) CN105652609B (en)
HK (2) HK1221778A1 (en)
WO (1) WO2014010274A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105652609B (en) * 2012-07-13 2018-12-04 株式会社尼康 Exposure device and exposure method
CN103984209B (en) * 2014-04-04 2016-08-17 中国科学院上海光学精密机械研究所 Refraction-reflection lithographic illumination relay lens group
KR102075755B1 (en) * 2017-06-19 2020-02-10 에스케이텔레콤 주식회사 Illumination optical system for projector and method for constructing same
KR102439935B1 (en) * 2018-02-27 2022-09-02 가부시키가이샤 오크세이사쿠쇼 Projection exposure apparatus
JP7145620B2 (en) * 2018-02-27 2022-10-03 株式会社オーク製作所 projection exposure equipment
CN114070971A (en) * 2020-07-27 2022-02-18 奥林巴斯株式会社 Observation device, light deflection unit, and image forming method
CN112013954B (en) * 2020-09-08 2024-08-02 中国科学院西安光学精密机械研究所 Curved prism-based offner hyperspectral imaging system

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6018383A (en) * 1997-08-20 2000-01-25 Anvik Corporation Very large area patterning system for flexible substrates
JP2001085314A (en) * 1999-09-13 2001-03-30 Nikon Corp Exposure method and aligner for exposure and method for manufacturing device
JP2004061584A (en) * 2002-07-25 2004-02-26 Fuji Photo Film Co Ltd Method for making planographic printing plate
JP2003295062A (en) * 2003-03-10 2003-10-15 Nikon Corp Catadioptic imaging optical system
CN100508119C (en) * 2003-07-09 2009-07-01 株式会社尼康 Linking unit, exposure apparatus and method for manufacturing device
KR100550560B1 (en) * 2003-12-16 2006-02-10 전자부품연구원 Pattern manufacturing device and manufacture method for the same
US7102733B2 (en) * 2004-08-13 2006-09-05 Asml Holding N.V. System and method to compensate for static and dynamic misalignments and deformations in a maskless lithography tool
JP2006098719A (en) * 2004-09-29 2006-04-13 Fuji Photo Film Co Ltd Exposure apparatus
JP4893310B2 (en) * 2004-10-26 2012-03-07 株式会社ニコン Optical apparatus, lens barrel, exposure apparatus, and device manufacturing method
JP4251158B2 (en) * 2005-06-24 2009-04-08 パナソニック電工株式会社 Charger and electric tool set using the same
JP2007227438A (en) * 2006-02-21 2007-09-06 Nikon Corp Exposure apparatus and exposure method, and mask for light exposure
US7936445B2 (en) * 2006-06-19 2011-05-03 Asml Netherlands B.V. Altering pattern data based on measured optical element characteristics
KR101422298B1 (en) * 2006-09-08 2014-08-13 가부시키가이샤 니콘 Mask, exposure apparatus and device manufacturing method
JP5181451B2 (en) * 2006-09-20 2013-04-10 株式会社ニコン Mask, exposure apparatus, exposure method, and device manufacturing method
WO2008129819A1 (en) 2007-04-13 2008-10-30 Nikon Corporation Display element manufacturing method, display element manufacturing apparatus and display element
JP5272348B2 (en) * 2007-08-14 2013-08-28 株式会社ニコン Wafer bonding equipment
NL1036558A1 (en) * 2008-03-25 2009-09-28 Asml Netherlands Bv Method and lithographic apparatus for acquiring height data related to a substrate surface.
JP5282895B2 (en) * 2009-03-06 2013-09-04 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
US8264666B2 (en) * 2009-03-13 2012-09-11 Nikon Corporation Exposure apparatus, exposure method, and method of manufacturing device
JP2011221536A (en) * 2010-04-13 2011-11-04 Nikon Corp Mask moving device, exposure device, substrate processor and device manufacturing method
JP5724564B2 (en) 2010-04-13 2015-05-27 株式会社ニコン Mask case, mask unit, exposure apparatus, substrate processing apparatus, and device manufacturing method
WO2013094286A1 (en) * 2011-12-20 2013-06-27 株式会社ニコン Substrate processing device, device manufacturing system and device manufacturing method
CN105652609B (en) * 2012-07-13 2018-12-04 株式会社尼康 Exposure device and exposure method

Also Published As

Publication number Publication date
WO2014010274A1 (en) 2014-01-16
CN107229190B (en) 2020-03-20
JP2017037347A (en) 2017-02-16
JP6137356B2 (en) 2017-05-31
JP6137182B2 (en) 2017-05-31
KR101914895B1 (en) 2018-11-02
CN107229190A (en) 2017-10-03
CN107272348B (en) 2020-04-07
JP2017068289A (en) 2017-04-06
KR102096891B1 (en) 2020-04-03
JP2016085475A (en) 2016-05-19
JP2018136577A (en) 2018-08-30
KR20180120800A (en) 2018-11-06
KR102007616B1 (en) 2019-08-05
JP6350687B2 (en) 2018-07-04
KR20190091574A (en) 2019-08-06
JP6245342B2 (en) 2017-12-13
HK1207161A1 (en) 2016-01-22
CN104428715B (en) 2017-06-30
JP2016122202A (en) 2016-07-07
JP6128240B2 (en) 2017-05-17
CN104428715A (en) 2015-03-18
KR20150035991A (en) 2015-04-07
JPWO2014010274A1 (en) 2016-06-20
CN105652609B (en) 2018-12-04
CN105652609A (en) 2016-06-08
KR20170130628A (en) 2017-11-28
JP6519694B2 (en) 2019-05-29
KR101880792B1 (en) 2018-07-20
CN107272348A (en) 2017-10-20

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20230325