KR20190091574A - Device manufacturing method - Google Patents

Abstract

The substrate processing apparatus EX projects the reflected light beam L2 generated from the illumination region IR toward the substrate, and the projection optical system PL which forms an image of the mask pattern on the substrate, illumination light and illumination directed toward the illumination region. Of the imaging luminous fluxes generated from the region, an optical separation section 10 through which one passes and reflects the other, a primary light source image is formed, and the illumination light from the primary light source image is irradiated to the illumination region. The illumination optical system IL is formed between the center line and the cylindrical surface to form a first conjugate plane that is optically conjugate with the primary light source image.

Description

Device manufacturing method {DEVICE MANUFACTURING METHOD}

The present invention relates to a substrate processing apparatus and a device manufacturing method.

This application claims priority based on Japanese Patent Application No. 2012-157810 for which it applied on July 13, 2012, and Japanese Patent Application No. 2012-157811 for which it applied on July 13, 2012, and uses the content here. .

As a substrate processing apparatus for patterning electronic circuits, such as a semiconductor integrated device and a display panel, the precision exposure apparatus is widely used. Generally, the exposure apparatus optically transfers the pattern of the electronic circuit formed in the mask onto a photosensitive substrate such as a semiconductor wafer or a glass substrate through a projection optical system. The mask used here is a circuit pattern formed with a light shielding material, such as chromium, on a flat quartz plate normally, and in a scanning type projection exposure apparatus, the photosensitive board | substrate is carried out reciprocally moving the mask in one dimension. Is moved by a step & scan method, and the circuit pattern of a mask is transferred so that it may be aligned in matrix form (two-dimensional) on a board | substrate.

In a projection exposure apparatus of such a step-and-scan method, it is known to improve throughput (productivity) by reducing the number of steps (number of accelerations and decelerations of the movable stage moving the substrate). Here, an exposure apparatus for achieving high throughput by preparing a reflective cylindrical mask and repeatedly arranging a plurality of circuit patterns in the circumferential direction of the cylindrical surface is described in, for example, Patent Document 1 below. have.

On the other hand, in the field of producing a large display panel, a scanning exposure apparatus having a movable stage on which a large glass substrate (2 m × m or more) is mounted, and a large glass substrate holding, developing, etching, deposition, etc. Various process apparatuses and conveying apparatuses to be used are used. These exposure apparatuses, process apparatuses, and conveying apparatuses are not only very large and expensive, but also the total cost of manufacturing the display panel (materials such as expenses of various powers according to the operation of the apparatus, maintenance expenses of a large clean room, etching, etc.). It is difficult to suppress the waste due to the disposal process.

Here, what is attracting attention as a manufacturing method which saved more resources is the printed electronics technique which forms an electronic circuit directly on a flexible resin board | substrate or a plastic board | substrate using a high precision printing technique. Using this technique, the method of manufacturing the display panel by organic EL by a roll-to-roll system is described, for example in following patent document 2. The roll-to-roll method draws a flexible (flexible) long substrate (film) from a supply roll and performs various treatments on the substrate in the middle of a conveyance path that is wound around a recovery roll. To add.

Moreover, as substrate processing apparatuses, such as an exposure apparatus, for example, as described in following patent document 1, for the improvement of the throughput at the time of continuously projecting and exposing several chip devices on a semiconductor wafer by a scanning system, a cylinder A device using a rotating mask of the shape has been proposed. Moreover, as one of the methods of manufacturing electronic devices, such as a display panel and a solar cell, the roll-to-roll system as described, for example in following patent document 2 is known. A roll-to-roll system is a system which performs various processes to a board | substrate on a conveyance path, conveying a flexible board | substrate, such as a film, from a roll for delivery to a roll for collection | recovery.

Patent Document 1: International Publication No. 2008/029917 Patent Document 2: International Publication No. 2008/129819

In the exposure apparatus disclosed in Patent Document 1, for example, a plurality of shot regions lined up in a row in the direction of scanning exposure on a substrate (wafer) can be integrated and scanned, while rotating a cylindrical mask, so that the number of stepping is greatly reduced. In this way, high throughput processing can be performed. However, in the projection optical system of the exposure apparatus disclosed in Patent Document 1, since the pattern formed on the outer circumferential surface of the cylindrical mask is cylindrical, the quality (image quality) of the pattern image projected on the substrate deteriorates. It is possible that the minimum line width that can be projected or becomes large, whereby high-precision (faithful) transfer cannot be expected.

Moreover, also in the manufacturing method of the display panel by the roll-to-roll system disclosed by patent document 2, when high resolution patterning is not possible only by a printing method or an inkjet (droplet) method, let an exposure apparatus be introduced. do. In that case, it is necessary to convey the flexible sheet substrate stably under the projection system. A viable method for this is to wind the sheet substrate around a part of the surface of the rotating drum, for example, while tensioning the sheet substrate in the long direction. Also in this system, since the pattern image of the mask by the projection system is projected onto the sheet substrate curved in the shape of a cylindrical surface, similarly, the quality (quality) of the pattern image on the substrate is deteriorated or the minimum line width that can be projected is There is a possibility that it becomes thick and cannot expect high precision (faithful) transcription.

Aspects of the present invention can be used to accurately project a projected image onto a substrate in projection of a pattern on a cylindrical curved surface or on a pattern onto a substrate curved in a cylindrical shape. It is an object to provide a substrate processing apparatus and a device manufacturing method.

In addition, the exposure apparatus as described above can perform a highly efficient exposure process by scanning a substrate (wafer) in synchronism with the rotation while continuously rotating a mask pattern curved in a roll shape, for example. However, since the mask pattern is curved in a cylindrical shape, when a part of the mask pattern is projected onto a planar semiconductor wafer through a normal projection optical system, the quality of the projection image (distortion error, anisotropic magnification error, focus) Error, etc.) may be reduced.

Another aspect of the present invention is to provide a substrate processing apparatus and a device manufacturing method capable of accurately projecting exposure using a curved mask pattern (cylindrical mask) without degrading the quality of the projected image. do.

According to the first aspect of the present invention, there is provided a substrate processing apparatus for projecting and exposing an image of a reflective mask pattern disposed on a sensitive substrate along a cylindrical surface curved at a predetermined radius around a predetermined center line. A mask holding member rotatably holding the mask pattern along the cylindrical surface and rotating around the center line, and projecting the reflected light beam generated from an illumination region set on a portion on the mask pattern toward the sensitive substrate; A projection optical system that forms an image of a portion of the mask pattern on the sensitive substrate, and is disposed in an optical path of the projection optical system to illuminate the illumination area. And passing one of the illumination light toward the illumination region and the reflected light beam generated from the illumination region and reflecting the other. An optical splitter and a primary light source image serving as a source of the illumination light, and the illumination light from the primary light source image through the optical splitter and an optical path of a part of the projection optical system. The substrate processing apparatus provided with the illumination optical system which irradiates an illumination area | region, and forms the 1st conjugate plane optically conjugate with the said primary light source image between the centerline and the cylindrical surface.

According to the 2nd aspect of this invention, exposing the said mask pattern to the said sensitive substrate, conveying the said sensitive substrate in a predetermined direction, rotating the said mask holding member by the substrate processing apparatus of a 1st aspect, and the exposure A device manufacturing method is provided that includes performing subsequent processing using a change in the sensitive layer of a sensitive substrate.

According to the third aspect of the present invention, there is provided a substrate processing apparatus for projecting and exposing an image of a reflective mask pattern disposed on a circumferential surface curved at a predetermined radius around a predetermined center line on a sensitive substrate, wherein the cylindrical surface is provided. A portion of the mask pattern by projecting the mask pattern along the mask pattern, and projecting the mask holding member rotatable around the center line and the reflected light beam generated from an illumination region set at a portion on the mask pattern toward the sensitive substrate. One of a projection optical system for forming an image of the image on the sensitive substrate, and a light beam disposed in an optical path of the projection optical system to illuminate the illumination region, and the illumination light directed toward the illumination region and the reflected light beam generated from the illumination region. An optical splitter that passes through and reflects the other side, Illuminating inclined with respect to the circumferential direction of the cylindrical surface so as to irradiate the illumination light to the illumination region through the light separation unit, and to direct the main light ray of the illumination light to a predetermined position between the center line and the cylindrical surface. A substrate processing apparatus having an optical system is provided.

According to the fourth aspect of the present invention, a substrate processing apparatus for projecting and exposing an image of a reflective mask pattern disposed along a cylindrical surface curved at a predetermined radius around a predetermined center line on a sensitive substrate, wherein the cylindrical surface is provided. A mask holding member rotatably holding the mask pattern along the center line, and a primary light source image serving as a source of illumination light directed toward an illumination region set on a portion of the mask pattern, wherein the primary light source The illumination optical system which irradiates the said illumination area from an image to the said illumination area | region, and forms the 1st conjugate plane which is optically conjugate with the said primary light source image between the said center line and the said cylindrical surface, and the said illumination light The reflected light beam generated from the illumination region being guided is guided to an intermediate image surface, and a part of the mask pattern is provided. The first projection optical system for forming an image on the intermediate image surface, a concave mirror disposed at or near the intermediate image surface, and the reflected light beam reflected from the concave mirror toward the sensitive substrate, thereby forming the first projection optical system. The substrate processing apparatus provided with the 2nd projection optical system which projects the image formed on the said intermediate image surface by 1st projection optical system on the said sensitive substrate is provided.

According to the fifth aspect of the present invention, the substrate processing apparatus of the third aspect conveys the sensitive substrate in a predetermined direction while rotating the mask holding member, thereby continuously exposing the mask pattern to the sensitive substrate; There is provided a device manufacturing method comprising performing subsequent processing using a change in the sensitive layer of the exposed sensitive substrate.

According to a sixth aspect of the present invention, an exposure apparatus for projecting and exposing an image of a reflective mask pattern disposed on a circumferential surface curved at a predetermined radius around a predetermined center line on a sensitive substrate, wherein the cylindrical surface is exposed. Therefore, while maintaining the mask pattern, and irradiating the illumination light from the light source toward the mask holding member that is rotatable around the center line and the illumination region set on a portion of the mask pattern, the main ray of the illumination light, The illumination optical system inclined with respect to the circumferential direction of the cylindrical surface so as to face a specific position between the center line and the cylindrical surface, and the reflected light flux generated from the illumination region by the irradiation of the illumination light to the intermediate image plane, A first projection optical system for forming an image of a portion of the mask pattern on the intermediate image surface, and the intermediate image And a second projection optical system in which the concave mirror disposed at or near and the reflected light beam reflected by the concave mirror are incident to project an image formed on the intermediate image surface by the first projection optical system onto the sensitive substrate. An exposure apparatus provided is provided.

According to the aspect of this invention, while being able to expose a projection image on a board | substrate with high precision, it can provide the substrate processing apparatus which can expose efficiently, and a device manufacturing method.

According to another aspect of the present invention, a substrate processing apparatus capable of projecting an image of a curved mask pattern with high quality, and capable of projecting exposure with high accuracy during patterning of a high resolution, miniaturized display device, and the like, and A device manufacturing method can be provided.

1 is a diagram illustrating a device manufacturing system according to a first embodiment.
It is a schematic diagram for demonstrating the outline of the optical system of an exposure apparatus.
3 is a diagram illustrating a light beam incident on an illumination region and a light flux emitted from the illumination region.
4 is a diagram illustrating a configuration of a substrate processing apparatus (exposure apparatus).
5 is a diagram illustrating a configuration from a light source to a second aperture member of the illumination optical system.
6 is a diagram illustrating a configuration of a first diaphragm member of the illumination optical system.
7A is a diagram illustrating a configuration from the first aperture member to the light separation unit of the illumination optical system.
FIG. 7B is a diagram illustrating a configuration from the first aperture member to the light separation unit of the illumination optical system.
8 is a diagram illustrating a configuration from an optical separation unit of the illumination optical system to an image plane of the projection optical system.
9 is a view showing an optical separation unit according to the first embodiment.
FIG. 10 is a view illustrating a light beam incident on an illumination region and a light flux emitted from the illumination region.
11 is a top view illustrating the luminous flux emitted from the illumination region.
12 is a diagram illustrating a representative position of an illumination region referred to in the description of the spot.
FIG. 13 is a diagram showing a spot in a first conjugate plane that is conjugate with the light source image.
It is a figure which shows the structure of the substrate processing apparatus which concerns on 2nd Embodiment.
15 is an enlarged view of a part of the optical system of the exposure apparatus.
It is a figure which shows the device manufacturing system which concerns on 3rd embodiment.
It is a schematic diagram for demonstrating the optical system of the exposure apparatus which concerns on 3rd Embodiment.
18 is a diagram illustrating a light beam incident on the illumination region and a light flux emitted from the illumination region.
It is a figure which shows the structure of the substrate processing apparatus (exposure apparatus) which concerns on 3rd Embodiment.
20 is a diagram illustrating a configuration of a uniform optical system.
21 is a diagram illustrating a configuration of the first aperture member.
FIG. 22A is a diagram illustrating a configuration from the first aperture member to the light separation unit. FIG.
FIG. 22B is a diagram illustrating a configuration from the first aperture member to the light separation unit. FIG.
FIG. 23 is a diagram illustrating a configuration of an optical splitter.
FIG. 24 is a diagram illustrating a light beam incident on an illumination region and a light flux emitted from the illumination region.
25 is a diagram illustrating a light beam emitted from an illumination region.
It is a figure which shows the representative position of the illumination area referred to in description of a spot.
FIG. 27 is a diagram showing spots in a first conjugate plane in conjugate with the light source image.
FIG. 28 is a diagram showing an optical path in a first projection optical system. FIG.
29 is a diagram illustrating an optical path in a second projection optical system.
It is a figure which shows the structure of the substrate processing apparatus (exposure apparatus) which concerns on 4th Embodiment.
31 is a diagram illustrating an optical path in the illumination optical system.
32 is a diagram illustrating an optical path in a first projection optical system.
33 is a diagram illustrating an optical path in a second projection optical system.
34 is a flowchart illustrating a device manufacturing method.

[First embodiment]

FIG. 1: is a figure which shows the structure by an example of the device manufacturing system SYS (flexible display manufacturing line) of this embodiment. Here, the flexible board P (sheet | sheet, film, etc.) withdraw | derived from the supply roll FR1 passes through n processing apparatuses U1, U2, U3, U4, U5, ... Un in order to collect | recover a roll The example until it winds up to FR2 is shown.

In the following description, the XYZ rectangular coordinate system is set so that the surface (or back surface) of the substrate P is perpendicular to the XZ plane, and the width direction perpendicular to the conveying direction (long direction) of the substrate P is Y-axis direction. Shall be set to. In the following description, the rotational direction of the circumference of the X-axis direction is called the θX-axis direction, and similarly, the rotational direction of the circumference of the Y-axis direction and the Z-axis direction is called the θY-axis direction and the θZ-axis direction, respectively.

The board | substrate P wound around the supply roll FR1 is taken out by the nip drive roller DR1, and is conveyed to the processing apparatus U1. The center of the Y-axis direction (width direction) of the board | substrate P is servo-controlled by the edge position controller EPC1 so that it may fall in the range of +/- 10 micrometers to about 10 micrometers with respect to a target position.

The processing apparatus U1 transfers the photosensitive functional liquid (photoresist, photosensitive coupling material, photosensitive plating reducing agent, UV curing resin liquid, etc.) to the surface of the board | substrate P by the printing system, and conveyance direction (long direction) of the board | substrate P. It is a coating apparatus which apply | coats continuously or selectively to the. In the processing apparatus U1, the cylinder roller DR2 to which the board | substrate P is wound, and on this cylinder roller DR2, the photosensitive functional liquid (sensitive functional liquid) is equally or partially to the surface of the board | substrate P. The coating device Gp1 containing the coating roller etc. for apply | coating, the drying device Gp2 for rapidly removing the solvent or water contained in the photosensitive functional liquid apply | coated to the board | substrate P, etc. are provided.

The processing apparatus U2 heats the board | substrate P conveyed from the processing apparatus U1 to predetermined temperature (for example, about several tens degreeC-about 120 degreeC), and the photosensitive functional layer (sensitive functional layer) apply | coated to the surface. It is a heating device for fixing the stably. In the processing apparatus U2, the several chambers for folding | folding the board | substrate P, air turn bar, the heating chamber part HA1 for heating the board | substrate P carried in, and the heated board | substrate ( The cooling chamber part HA2, the nip drive roller DR3, etc. are provided in order to lower | hang the temperature of P to match the environmental temperature of a subsequent process (processing apparatus U3, substrate processing apparatus).

The processing apparatus U3 (substrate processing apparatus) includes an exposure apparatus, and a circuit pattern for a display and a wiring pattern with respect to the photosensitive functional layer (sensitive functional layer) of the substrate P conveyed from the processing apparatus U2. Patterned light of the corresponding ultraviolet rays is irradiated. In the processing apparatus U3, the edge position controller EPC2, the nip drive roller DR4, and the patterning light which control the center of the Y-axis direction (width direction) of the board | substrate P to a fixed position are carried out of the board | substrate P. Substrate support roll DR5 (substrate support member) which supports the board | substrate P in the position to be irradiated, and two sets of drive rollers DR6 which give predetermined slack (free) DL to the board | substrate P, DR7) and the like.

In the processing apparatus U3, the reflective mask pattern M is formed in the cylindrical outer peripheral surface, the drum mask DM which rotates the periphery of the center line parallel to a Y-axis direction, and the mask of the drum mask DM Mask of drum mask DM to illumination unit IU which irradiates slit-shaped exposure illumination light extended to pattern M in the Y-axis direction, and a part of board | substrate P supported by board | substrate support roll DR5. The projection optical system PL for projecting an image of a part of the circumferential direction of the pattern M, and the substrate P in advance to relatively align (align) the image of the part of the pattern to be projected with the substrate P. The alignment microscope AM which detects the formed alignment mark etc. is provided.

The processing apparatus U4 performs wet to at least one of various wet treatments such as wet development, electroless plating, and the like on the photosensitive functional layer of the substrate P conveyed from the processing apparatus U3. wet) processing device. In the processing apparatus U4, three processing tanks BT1, BT2, and BT3 layered in the Z-axis direction, a plurality of rollers which bend and convey the substrate P, a nip drive roller DR8, and the like are provided. have.

Although the processing apparatus U5 heats the board | substrate P conveyed from the processing apparatus U4, and heat-drying apparatus which adjusts the moisture content of the board | substrate P which was wet by the wet process to predetermined value, the detail is abbreviate | omitted. Then, the board | substrate P which passed through the last processing apparatus Un of a series of processes through several processing apparatuses is wound up by the collection roll FR2 through the nip drive roller DR9. Even when winding up, the edge position controller EPC3 prevents the center of the Y-axis direction (width direction) of the substrate P or the substrate end in the Y-axis direction from being scattered in the Y-axis direction. The relative position of the drive roller DR9 and the collection roll FR2 in the Y-axis direction is controlled in turn.

The host controller CONT collectively controls the operation of each of the processing apparatuses U1 to Un that constitute the production line. The host controller CONT is based on the monitoring of the processing status and processing status in each processing apparatus U1 to Un, the monitoring of the transfer status of the substrate P between the processing apparatuses, and the preliminary / post inspection / measurement results. Feedback correction and feed forward correction are also performed.

The board | substrate P used by this embodiment is a flexible board | substrate, such as foil (foil) which consists of metals or alloys, such as a resin film and stainless steel, for example. The material of the resin film is, for example, polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, Polystyrene resins and vinyl acetate resins;

It is preferable that the substrate P is selected so that the thermal expansion coefficient is not significantly large so that the amount of deformation due to heat received in various processing steps can be substantially ignored. The thermal expansion coefficient may be set smaller than the threshold value according to the process temperature, for example, by mixing the inorganic filler into the resin film. The inorganic filler may be titanium oxide, zinc oxide, alumina, silicon oxide, or the like, for example. Moreover, the board | substrate P may be the monolayer of the ultra-thin glass about 100 micrometers thick manufactured by the float method, etc., and bonding said resin film, foil, etc. to this ultra-thin glass. The laminated body may be combined. In addition, the substrate P is imprinted with a fine partition structure (concave-convex structure) for modifying the surface thereof by a predetermined pretreatment in advance and activating the surface or for fine patterning on the surface. It may be formed by.

The device manufacturing system SYS of this embodiment repeats various processes for device (display panel etc.) manufacture with respect to the board | substrate P, or performs it continuously. The board | substrate P to which various processes were applied is divided | divided (dicing) for every device, and it becomes several devices. As for the dimension of the board | substrate P, the dimension of the width direction (the Y-axis direction used as short length) is about 10 cm-2m, and the dimension of the long direction (the X-axis direction used as long length) is 10 m or more. The dimension of the width direction (Y-axis direction used as short length) of the board | substrate P may be 10 cm or less, and may be 2 m or more. The dimension of the long direction (X-axis direction used as long length) of the board | substrate P may be 10 m or less.

Next, the principle of exposure by processing apparatus U3 (exposure apparatus EX, substrate processing apparatus) is demonstrated. FIG. 2: is a schematic diagram for demonstrating schematic structure of the optical system of exposure apparatus EX. FIG. 3: is explanatory drawing which shows the state of the light beam which injects into illumination region IR, and the light beam radiate | emitted from illumination region IR.

The exposure apparatus EX shown in FIG. 2 includes a drum mask DM, an illumination optical system IL, a projection optical system PL, an optical separation unit 10, and a deflection member 11. The drum mask DM has a cylindrical outer circumferential surface (hereinafter referred to as a cylindrical surface 12) and is formed by bending the reflective mask pattern M along the cylindrical surface 12. The cylindrical surface 12 is a surface which curved the circumference | surroundings of a predetermined center line to a predetermined radius, and is at least one part of the outer peripheral surface of a cylindrical column or a cylinder, for example. The drum mask DM is rotatable around the rotation center axis AX1 (center line).

The illumination optical system IL performs a laca illumination of the illumination area | region IR on the mask pattern M hold | maintained by the drum mask DM with illumination light L1 through a part of projection optical system PL. The illumination optical system IL has the 1st optical system 13 which forms the light source image L0 which becomes the source of illumination light L1, and the 2nd optical system 14 which served as a part of projection optical system PL (The optical axis is 14a. It includes). Illumination light L1 from light source image L0 passes through the optical separation part 10 comprised from the base material used as the base material of the concave mirror arrange | positioned at the pupil plane of the projection optical system PL. After passing through the part 15 and entering the second optical system 14, and after passing through the second optical system 14 and being deflected in the reflection plane on the upper side of the deflection member 11, the illumination region IR is irradiated. The projection optical system PL includes an optical separation unit 10, an optical separation unit 10, and a second optical system (optical system) 14 disposed in an optical path between the illumination region IR.

Although the detail is mentioned later, the optical separation part 10 is the passage part (transmission part) 15 from the optical axis 14a in FIG. 2, and the light source image L0 (for example, a ply) is located there. A plurality of point light source images made of eye lenses are formed. Or in FIG. 2, the lower half part from the optical axis 14a of the optical separation part 10 becomes the concave reflection part 16. As shown in FIG.

The projection optical system PL (including the second optical system 14) projects the reflected light beam generated in the illumination region IR toward the substrate P, thereby preventing the mask pattern M appearing in the illumination region IR. A part of the image is projected onto the substrate P. In the following description, the luminous flux generated from the mask pattern M and projected onto the substrate by irradiation of the illumination light L1 is referred to as appropriate and imaging luminous flux L2.

The imaging light beam L2 generated in the illumination region IR is deflected from the reflection plane above the deflection member 11 to be incident on the second optical system 14, passes through the second optical system 14, and passes through the optical separation unit 10. After being reflected by the reflecting portion 16, the second optical system 14 again reaches the reflecting plane below the deflection member 11. The imaging light beam L2 reflected by the reflecting plane below the deflection member 11 forms an intermediate image Im corresponding to a part of the mask pattern M appearing in the illumination region IR at a position conjugate with the illumination region IR. do. This intermediate image Im is re-imaged on the board | substrate P by the projection optical system (shown with the code | symbol PL2 in FIG. 4) arrange | positioned after that.

By the way, since the illumination area | region IR is curved in the cylindrical surface shape as shown in FIG. 3, the incidence angle with respect to the illumination area | region IR of the chief ray L1a of illumination light L1 is the chief ray in the circumferential direction of the cylindrical surface 12. As shown in FIG. It depends on the incident position of L1a. This is for making each main ray L2a of the imaging light beam L2 which arises from illumination region IR be parallel to each other in the surface perpendicular | vertical to the rotation center axis AX1.

In the present embodiment, the illumination optical system IL has the main light beam L1a in a plane perpendicular to the rotational center axis AX1 such that the main light beam L2a of the imaging light beam L2 is in a state close to each other (telecentric state). It is comprised so that illumination light L1 which made N = parallel to irradiate illumination area | region IR. That is, the illumination optical system IL is comprised so that the illumination light L1 which injects into the illumination area | region IR may be non-telecentric in order to make the incident side to the projection optical system PL of the imaging light beam L2 telecentric. .

In order to make such an illumination state, each principal ray L1a of illumination light L1 is set so that it may converge at the intermediate position (near half of the radius of the cylindrical surface 12) of the cylindrical surface 12 and the rotation center axis AX1. do. Therefore, the intermediate position is a position which is conjugate with the pupil plane of the illumination optical system IL (passing part 15 of the optical separation part 10 of FIG. 2).

Moreover, the advancing direction of each main beam L2a of the imaging light beam L2 in the surface perpendicular | vertical to the rotation center axis AX1 is the generation | occurrence | production position on the illumination area | region IR of each main beam L2a, and the rotation center axis AX1, for example. It is set to incline with respect to the line (diameter direction) which connects. This is because, as shown in FIG. 2, the illumination light L1 and the imaging light beam L2 need to be separated up and down with the optical axis 14a interposed at the position of the optical separation unit 10. Therefore, as shown in FIG. 2, the advancing direction of each principal ray L2a of the imaging light beam L2 in the surface perpendicular | vertical to the rotation center axis AX1 is the surface perpendicular to the optical axis 14a of the 2nd optical system 14. With respect to (perpendicular to the ground), it is inclined by a certain angle within this surface (ground).

Next, the structure of the processing apparatus U3 (exposure apparatus EX) is demonstrated in detail. 4 is a diagram illustrating a configuration of the exposure apparatus EX. The exposure apparatus EX supports the drum mask DM (mask holding member) rotatable around the rotation center axis AX1 while holding the mask pattern M, and the substrate P, while supporting the rotation center axis AX2. It is provided with the rotating drum DP (substrate support member) which can be rotated around. The illumination optical system IL illuminates the illumination area IR on the mask pattern M hold | maintained by the drum mask DM with uniform brightness by Koehler illumination.

The projection optical system PL projects a portion of the mask pattern M by projecting the imaging light beam L2 generated from the illumination region IR toward the projection region PR on the substrate P supported by the rotating drum DP. The image in the illumination region IR is imaged on the substrate P. FIG.

The projection optical system PL shown in FIG. 4 is the first projection optical system PL1 which forms the intermediate image Im of the mask pattern M in the illumination area IR, and the agent which projects the intermediate image Im on the board | substrate P. FIG. 2 projection optical system PL2 is provided. The first projection optical system PL1 and the second projection optical system PL2 shown in FIG. 4 are, for example, a half obtained by dividing a circular image field in a reflection plane above and below the prism mirrors (deflection members 11 and 35). It is constructed telecentric as a reflection-curved projection optical system of an image field type.

The exposure apparatus EX is what is called a scanning exposure apparatus, and the image of the mask pattern M hold | maintained by the drum mask DM by synchronously rotating the drum mask DM and the rotating drum DP by a predetermined rotational speed ratio, Projection exposure is continuously repeated on the surface (surface curved along the cylindrical surface) of the board | substrate P supported by the rotating drum DP.

The drum mask DM is a circular columnar or cylindrical member, and what is necessary is just to form the reflective mask pattern M along the outer peripheral surface (cylindrical surface 12).

The mask pattern M is made as a sheet-shaped mask which patterned the highly reflective metal film deposited on the flexible glass sheet of thickness about 100 micrometers, for example, wound it on the outer peripheral surface of the drum mask DM, The structure which can be mounted so that exchange with respect to the drum mask DM may be sufficient.

The rotating drum DP (substrate support roll DR5 of FIG. 1) is a circular columnar or cylindrical member, and its outer peripheral surface is cylindrical. The board | substrate P is supported by the rotating drum DP, for example by winding around a part of outer peripheral surface of the rotating drum DP. Projection area PR on which the image of mask pattern M is projected is arrange | positioned in the vicinity of the outer peripheral surface of rotating drum DP.

The board | substrate P may be supported by suspension by the some conveyance roller, and in this case, the projection area | region PR may be arrange | positioned between the some conveyance roller.

The exposure apparatus EX includes, for example, a driving unit for rotationally driving the drum mask DM and the rotating drum DP, and a detection unit detecting respective positions of the drum mask DM and the rotating drum DP. And a moving part for adjusting respective positions of the drum mask DM and the rotating drum DP, and a control part for controlling each part of the exposure apparatus EX.

The control unit of the exposure apparatus EX synchronously rotates the drum mask DM and the rotating drum DP at a predetermined rotational speed ratio by controlling the drive unit based on the detection result of the detection unit. Moreover, this control part adjusts the relative position of the drum mask DM and the rotating drum DP by controlling a moving part based on the detection result of a detection part.

The illumination unit IU shown in FIG. 1 contains the light source 20 shown in FIG. 4, and the 1st optical system 13 of illumination optical system IL. The first optical system 13 of the illumination optical system IL forms a light source image L0 serving as a source of the illumination light L1 by the light emitted from the light source 20, and makes the light intensity distribution of the illumination light L1 uniform. .

The light source 20 includes, for example, a lamp light source such as a mercury lamp, or a solid light source such as a laser diode or a light emitting diode (LED). The illumination light L1 emitted from the light source 20 is, for example, ultraviolet light (DUV light) such as bright line (g line, h line, i line), KrF excimer laser light (wavelength 248 nm), ArF excimer laser. Light (wavelength 193 nm) and the like.

FIG. 5 is a diagram illustrating a configuration from the light source 20 shown in FIG. 4 to the second diaphragm member 26 of the illumination optical system IL. The first optical system 13 illustrated in FIG. 5 includes an input lens 21, a fly-eye lens 22, a first diaphragm member 23, a relay lens 24, and a cylindrical lens 25. ) And a second aperture member 26.

The input lens 21 is disposed at a position at which the illumination light L1 emitted from the light source 20 is incident. The input lens 21 condenses the illumination light L1 to enter the incident end surface 22a of the fly-eye lens 22. The fly-eye lens 22 has a plurality of lens elements 22b arranged two-dimensionally on a plane orthogonal to the optical axis of the input lens 21.

The fly-eye lens 22 spatially divides the illumination light L1 emitted from the input lens 21 for each lens element 22b. In the emission end surface 22c from which light is emitted from the fly-eye lens 22, a primary light source image (a converged point light source, etc.) is formed for each lens element 22b. The surface on which the primary light source image is formed is the optical separation section 10 in the vicinity of the pupil plane of the first projection optical system PL1 in FIG. 4 (which is also the pupil plane of the illumination optical system IL), and the conjugate plane described later ( 40) (first conjugate plane, shown in FIG. 10, etc.) and optically conjugate.

The first diaphragm member 23 is a so-called aperture diaphragm (light sigma diaphragm), and is disposed at or near the exit end face 22c of the fly-eye lens 22.

FIG. 6: is a figure which shows the structure of the 1st stop member 23 of illumination optical system IL. As shown in FIG. 6, the first aperture member 23 has an elongated circular or elliptic opening 23a through which at least a portion of the illumination light L1 from the fly-eye lens 22 passes.

5 and 6, the first diaphragm member 23 is disposed on a surface (parallel to the XY plane) perpendicular to the optical axis of the relay lens 24. The opening 23a has an inner dimension (dimension) in the second direction (Y-axis direction) in which the inner dimension (dimension) D1 in the first direction (X-axis direction) corresponds to the direction parallel to the rotation center axis AX1. ) Is smaller than D2. The first direction of the inner dimension (dimension) D1 coincides with the circumferential direction of the cylindrical surface 12 in the illumination region IR on the drum mask DM in FIG. 2 or FIG. 4.

The first direction is a direction projected in the circumferential direction on the cylindrical surface 12, and the second direction is a direction projected in a direction parallel to the rotation center axis AX1 of the cylindrical surface 12. That is, the first diaphragm member 23 has a diffusion angle NA of the illumination light L1 in the circumferential direction of the cylindrical surface 12 in a direction parallel to the rotational center axis AX1 of the cylindrical surface 12. Is provided so as to be smaller than the diffusion angle NA of the illumination light L1.

7A and 7B are views showing an example of a specific optical system (lens arrangement) from the first aperture member 23 to the optical separation unit 10 of the illumination optical system IL shown in FIGS. 4 and 5. . FIG. 7A is a plan view in a plane perpendicular to the rotation center axis AX1. FIG. 7B shows a plan view in a plane parallel to the rotation center axis AX1.

As shown in FIG. 7A, the opening 23a of the first diaphragm member 23 is disposed to be biased toward one side (+ X axis side) with respect to the optical axis 13a parallel to the Z axis of the first optical system 13. . In addition, as shown in FIG. 7B, the opening 23a of the first diaphragm member 23 is disposed symmetrically with respect to the optical axis 13a of the first optical system 13 in the Y-axis direction. That is, the 1st stop member 23 is arrange | positioned so that the optical axis 13a of the 1st optical system 13 may pass through the center of the opening 23a when it sees from an X-axis direction.

The relay lens 24 is disposed at a position at which light passing through the first aperture member 23 is incident. The relay lens 24 is provided so as to overlap the light beams from the plurality of primary light sources formed on the fly-eye lens 22. Light from the plurality of primary light sources formed on the exit side of the fly-eye lens 22 is uniform in the light intensity distribution at the overlapping position.

The cylindrical lens 25 is disposed in the optical path from the position where the primary light source image is formed in the fly-eye lens 22 to the second diaphragm member 26.

Similarly to the cylindrical lens 25 in FIGS. 4 and 5, the cylindrical lens 25 in FIGS. 7A and 7B has a power (refractive power) in the XZ plane having a rotational center axis AX1. It is an optical member larger than the power (refractive force) in the YZ surface parallel to and. The direction where the power (refractive force) of the cylindrical lens 25 is large coincides with the circumferential direction of the cylindrical surface 12 in the illumination region IR on the drum mask DM in FIG. 2 or FIG. 4.

The second aperture member 26 is a so-called visual aperture and defines the position and shape of the illumination region IR. The second aperture member 26 is disposed at or near the illumination region IR. The light from the plurality of primary light sources formed on the fly-eye lens 22 is superimposed on the position of the second aperture member 26 by the relay lens 24 and the cylindrical lens 25, and the second The light intensity distribution in the diaphragm 26 is equalized. In other words, the input lens 21, the fly-eye lens 22, the relay lens 24, and the cylindrical lens 25 constitute a homogenizing optical system 19 for uniformizing the light intensity distribution of the illumination light L1.

Moreover, the illumination optical system IL is arrange | positioned in at least one part of the optical path from the primary light source image to the 2nd aperture member 26, and the light intensity distribution of illumination light L1 which originates in a primary light source image is based on a 2nd aperture member ( And a homogenizing optical system 19 to be made uniform at or near the position 26. In addition, the illumination optical system IL does not need to be equipped with the 2nd aperture member 26. As shown in FIG. In addition, the homogenizing optical system 19 may be configured using a rod lens instead of the fly-eye lens 22. In this case, the structure of the illumination optical system IL is suitably changed so that the emission cross section from which light may be emitted from the rod lens may be optically conjugate with the illumination region IR.

As shown in FIGS. 7A and 7B, the first optical system 13 includes a lens group 27 disposed in an optical path between the second aperture member 26 and the optical separation unit 10. The lens group 27 is composed of, for example, a plurality of lenses that are axisymmetric with the optical axis 13a of the first optical system 13 as the rotation center. As shown in FIG. 7B, the lens group 27 forms a pupil plane 28 (second conjugate plane) that is optically conjugate with the first aperture member 23 when viewed in the X-axis direction. On the copper surface 28, as shown in FIG. 2 (or FIG. 4), the light source image L0 (secondary light source image) which becomes a source of illumination light L1 irradiated to illumination region IR is formed.

As for the secondary light source image L0 formed in the pupil plane 28 of the projection optical system PL, the dimension of an X-axis direction is a rotation center axis (center line) in FIG. 2 (or FIG. 4), FIG. 7A, FIG. ) Is set to be larger than the dimension in the Y-axis direction parallel to (AX1). The X-axis direction in which the dimension of the secondary light source image L0 becomes large coincides with the circumferential direction of the cylindrical surface 12 in the illumination region IR on the drum mask DM in FIG. 2 or FIG. 4.

In addition, in FIG. 7A and FIG. 7B, the distribution range of the secondary light source image L0 formed in the 2nd conjugate plane (cavity 28) is Y-axis direction parallel to the rotation center axis (center line) AX1. The dimension of is set so that it may become smaller than the dimension of an X-axis direction. The X axis direction in which the dimension of the distribution range of the secondary light source image L0 becomes relatively large is the circumferential direction of the cylindrical surface 12 in the illumination region IR on the drum mask DM in FIG. 2 or FIG. 4. Is consistent with

By the way, the lens group 27 is comprised so that the component disperse | distributed to the Y-axis direction among the light beams from the primary light source image formed in the 1st aperture member 23 may converge on the coplanar surface 28. As shown in FIG. Here, since the power of the cylindrical lens 25 is different in the X-axis direction and the Y-axis direction, the component diffused in the X-axis direction from each point of the primary light source image (the opening of the first aperture member 23) is , As shown in FIG. 7A, it does not converge to one point on the hibernate surface 28. In other words, the hibernation surface 28 is not optically conjugate with the first aperture member 23 when viewed from the Y-axis direction.

The optical separation unit 10 is disposed at or near the position of the pupil surface 28 such that at least a portion thereof is disposed on the pupil surface 28. Here, the position of the copper surface 28 or its vicinity is a surface corresponded substantially to a Fourier transform surface with respect to illumination region IR. Therefore, by defining the range (passing part 15 in FIG. 2) through which the illumination light L1 passes among the optical separation parts 10, the main ray L1a of the illumination light L1 incident on the illumination region IR on the drum mask DM is defined. Direction (orientation characteristic) can be defined. As described with reference to FIG. 3, the optical separation unit 10 (regulator) enters the illumination light L1 into the illumination region IR in order to make the incident side of the imaging light beam L2 into the projection optical system PL telecentric. The pass range (distribution range) of the illumination light L1 in the optical separation part 10 is defined so that the side becomes non-telecentric. The light splitter 10 is disposed in the optical path of the projection optical system PL to illuminate the illumination area IR.

FIG. 8 is a diagram illustrating a configuration from the optical separation unit 10 of the illumination optical system IL to the intermediate image surface 32 (Im) of the projection optical system PL. 9 is a plan view showing the optical separation unit 10 according to the present embodiment.

The optical separation unit 10 shown in FIG. 8 includes a lens member 30 of a material through which light is transmitted and a reflective film 31 (corresponding to the reflection unit 16 in FIG. 2) formed on the surface of the lens member 30. It includes. The lens member 30 has a shape similar to a meniscus lens, for example, and the side surface 30a on which the illumination light L1 is incident from the first optical system 13 is a convex surface, and the surface 30a is provided. The surface 30b side facing away from the side is a concave surface. The reflective film 31 is provided on the surface 30b of the lens member 30.

As shown in FIG. 9, the optical separation unit 10 is generated in the passage 15 through which at least a part of the illumination light L1 from the first optical system 13 passes, and in the illumination region IR on the mask pattern M. FIG. The reflecting part 16 which the imaging light beam L2 (refer FIG. 2) reflects is provided. In the optical separation unit 10, the reflective film 31 is formed except a part of the surface 30b of the lens member 30, and the passage 15 is in the Z-axis direction of the optical separation unit 10. As seen from the above, the reflective film 31 is disposed in an area where the reflective film 31 is not formed.

The passage part 15 is arrange | positioned with respect to the intersection 13b of the optical axis 13a of the 1st optical system 13, and the surface 30b on the -X-axis side. The passage part 15 is arrange | positioned in the area | region which does not overlap with the intersection 13b among the surfaces 30b. In FIG. 8, the passage part 15 (light passing window) is made into the elongate direction which makes the X-axis direction long, and makes the Y-axis direction parallel to the rotation center axis AX1 of the drum mask DM short. It is formed in a circular shape. Therefore, the long direction of the elongate circular part 15 corresponds to the circumferential direction of the cylindrical surface 12 in the illumination area IR on the drum mask DM in FIG. 2 (or FIG. 4) or FIG. Doing.

The region where the reflective film 31 is formed in the optical separation section 10 as viewed in the Z-axis direction is used for the reflecting section 16 on which the imaging light beam L2 is reflected and is illuminated through the passage section 15. It is also used as a prescribed part which defines the passage range of illumination light L1 toward (IR). In other words, the reflecting film 31 is provided so that the illumination light L1 does not pass through the area | region other than the passage part 15 among the optical separation parts 10. As shown in FIG. In addition, the reflecting film 31 is disposed so as to include at least a region existing at a position substantially symmetrical with the passage 15 with respect to the intersection 13b of the optical separation section 10 so as to reflect the imaging light beam L2. .

Returning to the description of FIG. 8, the second optical system 14 is disposed at a position at which the illumination light L1 passing through the passage 15 of the optical separation unit 10 is incident. The second optical system 14 condenses the illumination light L1 such that the illumination region IR is optically conjugate with the first aperture member 23. That is, the 2nd optical system 14 and the lens group 27 shown to FIG. 7A and 7B form the surface which is optically conjugate with the 2nd aperture member 26 in illumination region IR.

The second optical system 14 is configured by, for example, a plurality of lenses that are axisymmetrically around a predetermined central axis (optical axis 14a). The optical axis 14a of the second optical system 14 is set coaxially with the optical axis 13a of the first optical system 13, for example. The illumination light L1 incident on the second optical system 14 passes through one side with respect to the surface (YZ plane) including the optical axis 14a of the second optical system 14 and is emitted from the second optical system 14.

The deflection member 11 is disposed at the position where the illumination light L1 emitted from the second optical system 14 is incident. The deflection member 11 is, for example, a triangular prism-shaped member, and has a first reflection surface 11a and a second reflection surface 11b orthogonal to each other. The 1st reflecting surface 11a and the 2nd reflecting surface 11b are arrange | positioned so that it may become an angle of almost 45 degreeC, respectively, with the optical axis 14a of the 2nd optical system 14, respectively.

The illumination light L1 emitted from the second optical system 14 is reflected and deflected on the first reflection surface 11a and is incident on the illumination region IR on the mask pattern M held by the drum mask DM. This illumination light L1 reflects diffraction by the mask pattern M, and produces | generates the imaging light beam L2. The illumination light L1 incident on the illumination region IR and the imaging light beam L2 emitted from the illumination region IR will be described later in detail with reference to FIGS. 9 to 14.

The imaging light beam L2 emitted from the illumination region IR is incident on the first reflective surface 11a of the deflection member 11. The imaging light beam L2 is deflected by being reflected by the first reflecting surface 11a and is incident on the second optical system 14. The imaging light beam L2 incident on the second optical system 14 passes through an optical path different from the illumination light L1 toward the illumination region IR, as described above with reference to FIGS. 2 and 3. The optical path of the imaging light beam L2 in the second optical system 14 is substantially opposite to the optical path of the illumination light L1 (+ X axis side) with respect to the surface (YZ plane) including the optical axis 14a of the second optical system 14. Is placed.

The imaging light beam L2 which has passed through the second optical system 14 is incident on the optical separation unit 10. As shown in FIG. 9, the range R1 in which the imaging light beam L2 is incident in the optical separation unit 10 is the range R2 in which the illumination light L1 is incident on the optical separation unit 10 from the first optical system 13. 15)), so as not to overlap. The range R1 in which the imaging light beam L2 is incident is set on the side opposite to the passage 15 with respect to the YZ plane, for example, and becomes the reflecting portion 16 of the optical separation section 10. The reflecting portion 16 is disposed in the pupil plane 28 or its vicinity, and as shown in FIG. 3, since the chief ray L2a emitted from each point of the illumination region IR is substantially parallel to each other, the illumination region The light beam generated at each point (IR) is incident on the reflector 16 so that the spots overlap in the range R2.

As shown in FIG. 8, the imaging light beam L2 incident on the reflector 16 is reflected by the reflector 16 and is incident again on the second optical system 14. The imaging light beam L2 which has passed through the second optical system 14 is incident on the second reflective surface 11b of the deflection member 11, and is reflected and deflected on the second reflective surface 11b. The advancing direction of the chief ray of the imaging light beam L2 reflected by the 2nd reflecting surface 11b is a direction substantially parallel to the advancing direction of the chief ray when it exits from illumination region IR, and the optical axis of the 2nd optical system 14 ( 14a) is a non-vertical cross direction.

The luminous flux emitted from each point of the illumination region IR among the imaging beams L2 passes through the second optical system 14 twice to almost one point on the intermediate image 32 optically conjugate with the illumination region IR. Converge. Thus, the 1st projection optical system PL1 shown in FIG. 4 among the projection optical systems PL is the intermediate image 32 (Im) of the intermediate image of a part (lighting area IR) of the mask pattern M. As shown in FIG. To form. The intermediate image surface 32 is a surface which is also optically conjugate with the projection area PR, and a field stop (third aperture member) for defining the position and shape of the projection area PR may be disposed.

The second projection optical system PL2 shown in FIG. 4 is optically conjugate with the optical separation unit 10 instead of the optical separation unit 10 in the optical path of the first projection optical system PL1, for example. It is comprised by arrange | positioning the concave mirror 33 in a position. That is, the 2nd projection optical system PL2 contains the 3rd optical system 34 similar to the 2nd optical system 14 of the 1st projection optical system PL1. The imaging light beam L2 which has passed through the intermediate image surface 32 is reflected and deflected by the first reflection surface 35a of the deflection member 35, passes through the third optical system 34 and enters the concave mirror 33. The imaging light beam L2 incident on the concave mirror 33 is reflected by the concave mirror 33 and passes again through the third optical system 34, and then reflected on the second reflecting surface 35b of the deflection member 35 and deflected. And is incident on the projection area PR on the substrate P supported by the rotating drum DP. The luminous flux emitted from each point of the intermediate image 32 among the imaging beams L2 passes through the third optical system 34 twice so that each corresponding point in the projection region PR is optically conjugate with the intermediate image 32. Converge to In this way, the second projection optical system PL2 projects the intermediate image Im formed by the first projection optical system PL1 onto the projection area PR.

Next, the state of illumination light L1 and incident light L2 radiate | emitted from illumination area | region IR when it injects into illumination area | region IR is demonstrated in detail.

10 is perpendicular to the direction (Y axis) of the rotational axis AX1 of the drum mask DM to the luminous flux incident to the illumination region IR (illumination light L1) and the imaging luminous flux L2 emitted from the illumination region IR. It is a side view seen from inside XZ plane. FIG. 11: is a top view which looked at the imaging light beam L2 radiate | emitted from illumination region IR from the direction orthogonal to FIG. 10 (Z-axis direction).

As shown in FIG. 10 (refer FIG. 3), the main light ray L1a of illumination light L1 is a cylinder with the rotation center axis AX1 when it sees from the direction (Y-axis direction) of the rotation center axis AX1 of the drum mask DM. A conjugate plane 40 which is conjugate with the primary light source image (first aperture member 23) between the planes 12 (also conjugate with the pupil plane 28 of the first projection optical system PL1 on which the secondary light source image is formed) It is incident on the illumination region IR so that it is formed. The conjugate surface 40 (first conjugate surface) is disposed at or near the central position of the rotation center axis AX1 and the illumination region IR, for example. That is, the positional relationship between the passage part 15 and the reflecting part 16 of the optical separation part 10 is the conjugate plane 40 from the rotation center axis AX1 when the radius of the mask pattern M is r. It is set such that the distance to D3 is about half of the radius r.

Here, the extension line 41 of the chief ray L1a of the illumination light L1 is arrange | positioned so that it may cross | intersect on the conjugate plane 40 in the cross section orthogonal to the rotation center axis AX1 of the drum mask DM. The intersection point 142 of the extension line 41 of the chief ray L1a is arranged in a row on a line parallel to the rotation center axis AX1 of the drum mask DM. That is, the positional relationship between the passage part 15 and the reflecting part 16 of the optical separation part 10 is that the extension line 41 of the main beam L1a distributed in the circumferential direction of the cylindrical surface 12 among the illumination light L1 is the central axis of rotation. It is set to intersect the line on the conjugate plane 40 parallel to (AX1). That is, the illumination optical system IL irradiates the illumination region IR with the illumination light L1 generated from the light source 20 through the optical separation part 10, and illuminates the chief ray L1a of the illumination light L1 with the rotation center axis AX1. ) And the cylindrical surface 12 inclined with respect to the circumferential direction of the cylindrical surface 12.

Moreover, the chief ray L1a distributed in the direction parallel to the rotation center axis AX1 of the drum mask DM among illumination light L1 is incident in illumination region IR in a substantially parallel relationship with each other. As shown in FIG. 11, the main light beam L2a of the imaging light beam L2 has an illumination region (in a substantially parallel relationship with each other when viewed in a direction orthogonal to the rotation center axis AX1 of the drum mask DM (Z-axis direction)). IR). Here, the chief ray L1a of the illumination light L1 is incident on the illumination region IR from an almost normal direction (X-axis direction) of the cylindrical surface 12 of the drum mask DM when viewed from the Z-axis direction, and thus, of the imaging light beam L2. The chief ray L2a is emitted from the illumination region IR toward the substantially normal direction (X-axis direction) of the cylindrical surface 12 of the drum mask DM when viewed in the Z-axis direction.

Next, with reference to FIG. 9, FIG. 12, and FIG. 13, the shape of the pupil in the plane conjugated with the light source image is demonstrated. 12 is a diagram showing a representative position of the illumination region IR referred to in the description of the pupil. FIG. 13 is a view showing a spot in the conjugate plane 40 which is conjugate with the light source image. Here, for convenience of explanation, the luminous flux (illumination light L1 and the imaging luminous flux L2) passing through each point of the illumination region IR is spot on the plane (cooperative surface 28 and conjugate surface 40) which is conjugate with the light source image. It is assumed that the shape is the cause.

In FIG. 12, the code | symbol P1-P9 represents the point on illumination area | region IR seen from the plane in the X-axis direction. The point P1, the point P2, and the point P3 are group of points (referred to as a 1st group) which line in the circumferential direction of the cylindrical surface 12 shown in FIG. The point P1 is located at the + Z axis side of the illumination region IR, the point P3 is located at the −Z axis side of the illumination region IR, and the point P2 is disposed at the center of the points P1 and P3. Similarly, the second group of points P4, point P5 and point P6, and the third group of points P7, point P8 and point P9 are groups of points lined in the circumferential direction of the cylindrical surface 12, respectively. Moreover, the 1st group of points P1-P3 is arrange | positioned at the edge of the -Y axis side of illumination area | region IR, and the 3rd group of points P7-point P9 is arrange | positioned at the + Y-axis side edge of illumination area | region IR, , The second group of points P4 to P6 is disposed between the first group and the third group.

First, the passing range of the illumination light L1 in the pupil plane 28 is demonstrated, referring FIG. 9 and FIG. In the illumination region IR shown in FIG. 12, the main rays of the illumination light L1 incident on the points P1, P4, and P7 extending in a direction parallel to the rotation center axis AX1 are in the circumferential direction of the illumination region IR. The incidence position in is almost the same, and the incidence angle with respect to the illumination area IR is substantially the same.

Therefore, the light beams incident on the points P1, P4 and P7 are almost the same in the X-axis direction when the positions of the passing range on the pupil plane 28 are also referred to in FIG. 8 above. Therefore, the light beam which injects into the point P1, the point P4, and the point P7 in the illumination area | region IR on the drum mask DM becomes a light beam which advances from substantially the same direction as seen from the illumination area | region IR side. Here, the light beams incident on the points P1, P4 and P7 all pass through substantially the same range R3 on the pupil plane 28 shown in FIG. 9. Similarly, the light beams incident on the points P3, P6, and P9 lined in the direction parallel to the rotation center axis AX1 all pass through substantially the same range R4 on the coplanar surface 28.

Moreover, the chief ray of illumination light L1 incident on the point P1 and the chief ray of illumination light L1 incident on the point P3 have different incidence positions in the circumferential direction of the illumination region IR, and the incident angle to the illumination region IR is different.

Therefore, the position of the passing range (range R3) through which the light beam incident on the point P1 in the illumination region IR passes through the copper plane 28, and the light flux incident on the point P3 in the illumination region IR are the copper surface 28 The passing range (range R4) passing through is shifted in the X-axis direction.

9, the position of the range R3 in the Y-axis direction is substantially the same as that of the range R4. The position in the X-axis direction of the range R3 is farther from the intersection 13b of the optical axis 13a of the first optical system 13 and the optical separation unit 10 than the position in the X-axis direction of the range R4.

In addition, the passage range of the light beam which injects into the point P2, the point P5, and the point P8 which run in parallel with the rotation center axis AX1 in the illumination area | region IR shown in FIG. 12 is not shown in FIG. However, it is disposed between the range R3 and the range R4. Similarly, the light beam passing through any point on the line connecting the point P1 and the point P3 passes through the range shifted from the range R3 to the range R4 in accordance with the shift amount from the point P1 of this arbitrary point. Therefore, the passage range on the pupil plane 28 of illumination light L1 incident on illumination region IR becomes the elongate circular range R2 which connects range R3 and range R4, for example.

Thus, when the range R2 of the passage part 15 is made into the elongate circular shape, the principal light ray L2a of the imaging light beam L2 distributed in the circumferential direction of the rotation center axis AX1 will make an illumination light into a illumination area by making it into a parallel light beam. Rather, it is closer to a parallel relationship (telecentric state). This is achieved in addition to setting the light separation section 10 or the illumination system before it so that the air plane 40 is disposed at or near the central position of the rotational center axis AX1 and the illumination region IR.

Next, the shape of the pupil in the conjugate plane 40 will be described with reference to FIGS. 10, 12, and 13. The shape of the pupil in the conjugate surface 40 is on the secondary light source formed in the conjugate surface 40 when the illumination light L1 incident on the illumination region IR is virtually propagated inside the drum mask DM. It corresponds to the shape.

Illumination light L1 at point P1, point P2, and point P3 lined in the circumferential direction in illumination area IR on cylindrical surface 12 so that the extension line 41 of chief ray L1a may overlap with one point on the conjugate surface 40 at almost one point. The chief ray L1a of is incident. Therefore, if the light beams incident on the points P1, P2, and P3 are propagated to the inside of the cylindrical surface 12, the positions of the passing range on the airspace 40 will coincide. It passes through the range R5 shown in FIG. For the same reason, the light beams incident on the points P4, P5 and P6 lined in the circumferential direction in the illumination region IR on the cylindrical surface 12 all pass through the same range R6, and the cylindrical surface 12 The light beams incident on the points P7, P8, and P9 lined in the circumferential direction in the illumination region IR of the image pass through the same range R7.

Moreover, the main beam L1a of the illumination light L1 enters into the point P1, the point P4, and the point P7 parallel to the rotation center axis AX1 parallel to each other in substantially parallel relationship. Therefore, if the light beams incident on the points P1, P4, P7 are propagated to the inner side of the cylindrical surface 12, the conjugate plane 40 is in the Y-axis direction parallel to the rotation center axis AX1. The position of the pass range on 된다 is shifted. That is, the range R5 is disposed at the end on the -Y axis side on the conjugate plane 40, the range R7 is disposed at the end on the + Y axis side on the conjugate plane 40, and the range R6 is disposed at the center of the range R5 and the range R7. do. As a result, the illumination light L1 incident on the illumination region IR becomes the elongated circular range R8 in which the shape of the pupil in the conjugate surface 40 connects the range R5 and the range R7.

As mentioned above, the chief ray L2a which arises in each position of illumination region IR among the imaging beams L2 is the circumferential direction of the cylindrical surface 12, and the direction (Y-axis direction) parallel to the rotation center axis AX1. In each direction, they are almost parallel to each other. Therefore, the projection optical system PL can comprise the entrance side (the exit side of the illumination area | region IR) telecentrically.

In the processing apparatus U3 (exposure apparatus EX) of the present embodiment as described above, since the illumination optical system IL is configured such that the imaging light beam L2 incident on the projection optical system PL is closer to the parallel light beam, the projection optical system Even if PL is not complicated, the image of the curved mast pattern M can be accurately projected and exposed. Therefore, the processing apparatus U3 can expose the board | substrate P efficiently by performing an exposure process, rotating the mask pattern M. FIG.

Moreover, since the processing apparatus U3 arrange | positioned the optical separation part 10 in the copper surface 28 of the projection optical system PL, it can isolate | separate the optical path of illumination light L1, and the optical path of imaging beam L2. Therefore, the processing apparatus U3 can reduce the loss of the amount of light and the generation of stray light in the PBS, as compared with the configuration of dividing the optical path using, for example, a polarization splitting splitter (PBS). . The optical separation unit 10 may be made of PBS or the like.

In addition, since the light separation part 10 defines a passing range of the illumination light L1 toward the illumination region IR through the passage 15, the direction of the chief ray L1a of the illumination light L1 when incident on the illumination region IR is adjusted. It can be specified with high precision. In addition, since the light separation unit 10 defines the passing range of the illumination light L1 using the reflecting unit 16, the configuration can be simplified.

By the way, the relationship (for example, parallel to each other) of the principal rays L1a distributed in the direction parallel to the rotation center axis AX1 among illumination light L1, the principal rays distributed in the direction parallel to the rotation center axis AX1 among the imaging beams L2. It is also maintained in the L2a relationship (e.g., parallel to each other). Moreover, the relationship (for example, parallel) of the main beams L2a distributed in the circumferential direction of the cylindrical surface 12 in the imaging beam L2 is the relationship between the main beams L1a distributed in the circumferential direction of the cylindrical surface 12 among the illumination lights L1. (For example, non-parallel to each other). Therefore, for example, in the imaging light beam L2, the diffusing angle NA of the illumination light L1 is an optical member having isotropic power so that the chief rays L2a distributed in the circumferential direction of the cylindrical surface 12 are in parallel with each other. When adjusted, the chief ray L2a relationship distributed in the direction parallel to rotation center axis AX1 among imaging beams L2 will not become mutually parallel.

In this embodiment, the cylindrical lens 25 corresponds to the rotation center axis AX1 to diffuse angle of the illumination light L1 reaching the illumination region IR on the cylindrical surface 12 of the drum mask DM. The direction (Y-axis direction) and the circumferential direction of the cylindrical surface 12 in illumination region IR are different.

That is, the cylindrical lens 25 has the cylindrical surface 12 in which the principal rays L1a lined up in the direction parallel to the rotation center axis AX1 among the principal rays L1a of the illumination light L1 reaching the illumination region IR are parallel to each other. The chief ray L1a, which is arranged in the circumferential direction, has a deflection such that the extension line 41 intersects the line on the conjugate plane 40 parallel to the rotation center axis AX1. Therefore, while the main beam L2a of the imaging beam L2 distributed in the direction parallel to the rotation center axis AX1 is made substantially parallel to each other, the main beam L2a of the imaging beam L2 distributed in the circumferential direction of the cylindrical surface 12 also mutually exists. It can be nearly parallel. In addition, as a method of giving anisotropy to the diffusion angle of illumination light L1, the shape of the light exit side of this light guide member is used, for example using the light guide member which bundled the optical fiber, for example, the 1st aperture member in FIG. The elongated circle or ellipse like the opening part 23a of 23 may be made, and the light output side may be arrange | positioned in the position of the 1st stop member 23 in FIG.

[Second embodiment]

Next, 2nd Embodiment is described. In this embodiment, the same code | symbol is attached | subjected about the component similar to said embodiment, and the description is simplified or abbreviate | omitted.

FIG. 14 is a diagram showing the configuration of the processing apparatus (exposure apparatus EX2) according to the present embodiment. The exposure apparatus EX2 shown in FIG. 14 differs from the first embodiment in that the projection optical system PL is composed of an optical system such as an opener optical system.

The projection optical system PL includes a first projection optical system PL1 forming an intermediate image Im of a part of the mask pattern M (lighting area IR), and an intermediate image formed by the first projection optical system PL1. 2nd projection optical system PL2 is projected on projection area PR on (). Here, each of the first projection optical system PL1 and the second projection optical system PL2 is composed of an optical system such as an opener optical system.

The illumination optical system IL can be comprised similarly to 1st Embodiment about the element arrange | positioned from the light source 20 to the optical separation part 50. FIG. The illumination light L1 emitted from the light source 20 passes through the homogenizing optical system 19 to make the light intensity distribution in the second stop member 26 uniform. The illumination light L1 passing through the second aperture member 26 is incident on the optical separation unit 50 through the lens group 27.

FIG. 15 is an enlarged view of a part of the illumination optical system IL and the first projection optical system PL1 in FIG. 14. The optical separation section 50 includes a passing section 15 and a reflecting section 16 as described in the first embodiment. The optical separation unit 50 is disposed at or near the coplanar surface where the light source image serving as the source of the illumination light L1 is formed. Arrangement of the passage part 15 and the reflecting part 16 is the same as that of 1st Embodiment.

The light splitter 50 has a surface 50a through which the illumination light L1 is incident and a surface 50b facing the surface 50a. The surface 50b is a surface on which the imaging light beam L2 is incident in the optical path of the first projection optical system PL1, and is convex toward the outside (incident side of the imaging light beam L2).

The illumination light L1 which has passed through the passage part 15 of the optical separation part 50 passes through the lens group 51 used for correction of aberration and is incident on the reflecting surface 53a of the concave mirror 53. The reflective surface 53a is disposed to face the surface 50b of the optical separation unit 50. The reflecting surface 53a of the concave mirror 53 and the surface 50b of the optical separation unit 50 are curved surfaces which are arranged at approximately the same center of curvature.

The illumination light L1 incident on the reflecting surface 53a is collected by being reflected by the reflecting surface 53a, and is incident on the reflecting surface 54a of the deflection member (planar reflecting mirror) 54 while converging. The illumination light L1 incident on the reflection surface 54a of the deflection member 54 is deflected by being reflected by the reflection surface 54a and is incident on the illumination region IR through the phase adjusting member 55. The image adjusting member 55 is an optical member (a lens element having power) used for adjusting the light intensity distribution, adjusting the diffusion angle, correcting the aberration, and the like.

As described above with reference to FIG. 3, the illumination optical system IL as described above, in order to make the chief rays of the imaging light beam L2 generated in the illumination region IR parallel to each other, the chief rays of the illumination light L1 incident on the illumination region IR. It is comprised so that the extension line may cross | intersect inside drum mask DM.

The imaging light beam L2 generated in the illumination region IR is incident on the reflecting surface 54a of the deflection member 54 through the image adjusting member 55, and is reflected by the reflecting surface 54a to be half of the concave mirror 53. Incident on the slope 53a. The imaging light beam L2 incident on the reflecting surface 53a is collected by being reflected by the reflecting surface 53a, and is incident on the reflecting portion 16 of the light separation section 50 through the lens group 51 while converging. The imaging light beam L2 incident on the reflecting unit 16 is reflected by the reflecting unit 16 and passes through the lens group 51 to enter the reflecting surface 53a of the concave mirror 53. The imaging light beam L2 incident on the reflecting surface 53a is collected by being reflected by the reflecting surface 53a, and is incident on the reflecting surface 56a of the deflection member (planar reflecting mirror) 56 while converging.

Here, the deflection member 54 and the deflection member 56 are provided so that the imaging beam L2 can pass between the deflection member 54 and the deflection member 56. The imaging light beam L2 incident on the reflecting surface 56a of the biasing member 56 is deflected by reflecting off the reflecting surface 56a, and enters the intermediate upper surface 32 through the image adjusting member 57. The image adjusting member 57 is an optical member having the same function as the image adjusting member 55. In this manner, the first projection optical system PL1 forms the intermediate image Im of a part of the mask pattern M (lighting region IR) on the intermediate image surface 32.

Returning to the description of FIG. 14, the second projection optical system PL2 is configured by disposing the convex mirror 60 instead of the optical separation unit 50, for example. The imaging light beam L2 passing through the intermediate upper surface 32 is reflected by the first reflecting surface 61a of the deflection member 61 and is incident on the concave mirror 62, and is reflected by the concave mirror 62 to reflect the convex mirror 60. ) Is incident. The imaging light beam L2 incident on the convex mirror 60 is reflected by the convex mirror 60 and is incident on the concave mirror 62, and after being reflected by the concave mirror 62, the second reflecting surface of the deflection member 61 ( Reflected by 61b), it is incident on the projection area PR on the substrate P supported by the rotating drum DP. In this manner, the second projection optical system PL2 projects the intermediate image Im of the illumination region IR of the mask pattern M onto the projection region PR on the substrate P. As shown in FIG.

[Third embodiment]

Next, 3rd Embodiment is described. In this embodiment, the same code | symbol is attached | subjected about the component similar to said embodiment, and the description is simplified or abbreviate | omitted.

FIG. 16: is a figure which shows the structure of the device manufacturing system SYS2 (flexible display manufacturing line) of this embodiment. Here, the flexible substrate P (sheet, film, etc.) drawn out from the supply roll FR1 passes through n processing apparatuses U1, U2, U3, U4, U5, ... Un in order to collect | recover the roll. The example until it winds around (FR2) is shown.

Also in FIG. 16, the XYZ rectangular coordinate system is set so that the surface (or back surface) of the board | substrate P may become perpendicular to an XZ plane, and the direction (width direction) orthogonal to the conveyance direction (long direction) of the board | substrate P is It is assumed that it is set in the Y-axis direction.

Next, the principle of exposure by the processing apparatus U3 (exposure apparatus EX, the substrate processing apparatus) of the device manufacturing system SYS2 of this embodiment is demonstrated. FIG. 17 is a diagram showing a schematic diagram for explaining the optical system of the exposure apparatus EX3. FIG. 18 is a diagram showing illumination light L1 incident on illumination region IR and the imaging light beam L2 emitted from illumination region IR.

The exposure apparatus EX3 illustrated in FIG. 17 includes a drum mask DM holding the mask pattern M, an illumination optical system IL, a projection optical system PL, and a rotating drum DP supporting the substrate P. FIG. ) (Substrate support roll DR5 shown in FIG. 16).

The drum mask DM has a cylindrical outer circumferential surface (hereinafter also referred to as a cylindrical surface 12), and keeps the reflective mask pattern M in a cylindrical shape so as to follow the cylindrical surface 12. . The cylindrical surface is a surface curved at a predetermined radius around a predetermined center line (rotational center axis AX1), and is, for example, at least a part of the outer circumferential surface of the cylindrical column or cylinder.

The illumination optical system IL performs a laca illumination of the illumination area | region IR on the mask pattern M hold | maintained by the drum mask DM with illumination light L1 through a part of projection optical system PL. The illumination optical system IL includes the first optical system 13 which forms the light source image L0 which becomes the source of illumination light L1, and the 2nd optical system 14 which also served as a part of projection optical system PL. The light source image L0 formed by the first optical system 13 is formed in the vicinity of the passage 15 (transmitting portion) of the optical separation unit 10, and the illumination light L1 traveling from the light source image L0 is The light is incident on the second optical system 14 through the passage 15, and is incident on the illumination region IR through the second optical system 14.

The projection optical system PL projects the image of the illumination region IR on the mask pattern M by projecting the reflected light beam generated in the illumination region IR onto the substrate P supported by the rotating drum DP. Project onto P). The projection optical system PL is a first projection optical system PL1 that forms the intermediate image Im of the illumination region IR, and a second projection that projects the intermediate image Im formed by the first projection optical system PL1 onto the substrate P. FIG. The optical system PL2 is provided. The first projection optical system PL includes an optical separation unit 10 and a second optical system 14 (optical system) 14 disposed in an optical path between the optical separation unit 10 and the illumination region IR. In the following description, the luminous flux generated by the mask pattern M illuminated by the illumination light L1 and projected onto the substrate is referred to as appropriate and imaging luminous flux L2.

The imaging light beam L2 generated in the illumination region IR passes through the second optical system 14 of the first projection optical system PL1 and is reflected by the reflector 16 of the optical separation unit 10, and then the second optical system ( It passes through 14 again and is incident on the biasing member 17. The imaging light beam L2 incident on the deflection member 17 is deflected by the deflection member 17 and is incident on the concave mirror 18.

The luminous flux (imaging luminous flux L2) generated from any point in the illumination region IR passes through the second optical system 14 twice so that the corresponding point on the intermediate image surface 42 which is optically conjugate with the illumination region IR ( Convergence). Thus, 1st projection optical system PL1 forms the intermediate image Im of the part (lighting area IR) of the mask pattern M illuminated by illumination light L1 in the intermediate image surface 42. Since the illumination area | region IR is a cylindrical surface shape which convex toward the light output side, the intermediate | middle upper surface 42 becomes a cylindrical surface shape which concave toward the light incident side (deflection member 17 side).

The concave cylindrical mirror (hereinafter simply referred to as a concave mirror) 18 is disposed at or near the intermediate upper surface 42. The concave mirror 18 is curved in the shape of a cylindrical surface concave toward the light incidence side along the middle upper surface 42. The imaging light beam L2 reflected by the concave mirror 18 is projected to the projection area PR via the optical member (lens, mirror, etc.) of the 2nd projection optical system PL2. In this way, the image of the illumination region IR of the mask pattern M is projected onto the projection region PR on the substrate P supported by the rotating drum DP.

Here, the structure (when it is a simple planar mirror) in which the concave mirror 18 is not provided is assumed. In this configuration, the image plane of the second projection optical system PL2 has a cylindrical surface shape concave toward the light incidence side, similarly to the image surface (middle image plane) of the first projection optical system PL1, and the projection area. With respect to the tangent plane of, it is bent on the side opposite to the projection area (the direction of the projection area and the unevenness is reversed). Therefore, as it moves away from the tangent with the tangent plane in the circumferential direction of the curved projection area, the defocus increases.

In the exposure apparatus EX3 shown in FIG. 17, the concave mirror 18 converts the image surface such that the image surface of the second projection optical system PL2 becomes convex toward the light incident side. In other words, the concave mirror 18 has the second projection optical system PL2 such that the center of curvature of the image plane of the second projection optical system PL2 is disposed on the same side as the center of curvature of the projection region PR with respect to the projection region PR. Change the top of). Therefore, the upper surface of the 2nd projection optical system PL2 becomes the shape which follows the projection area | region PR on the board | substrate P curved in the cylindrical surface shape, As a result, the exposure apparatus EX3 accurately corrects a desired pattern. It can transfer faithfully well, and high-precision pattern exposure is attained.

By the way, since the illumination area | region IR is curved in the cylindrical surface shape as shown in FIG. 18, in this embodiment, the incident angle with respect to the illumination area | region IR of the chief ray L1a of illumination light L1 is made into the circumference | surroundings of the cylindrical surface 12. As shown in FIG. It changes with the incidence position of the chief ray L1a in the direction. In other words, the main rays of illumination light incident on the water surface are not parallel to each other, as in the normal illumination method using a conventional illumination system, and the main rays of light appear to converge at almost half of the radius of the cylindrical surface 12. By doing in this way, the chief ray L2a of the reflected light beam (imaging light beam L2) which generate | occur | produces in each point in illumination area | region IR will be in the state (telecentric) parallel to each other with respect to the circumferential direction of the cylindrical surface 12. As shown in FIG.

In the present embodiment, the illumination optical system IL is configured as a non-telecentric system in which the main light rays of the illumination light L1 are non-parallel with respect to the circumferential direction of the cylindrical surface 12, and the main light beam of the imaging beam L2 in the circumferential direction. To be parallel. Therefore, as shown in FIG. 18, it is comprised so that the extension line 41 which may extend the main line L1a of illumination light L1 may cross | intersect at the position of about half of the radius inside the cylindrical surface 12. As shown in FIG.

In such an imaging light beam L2, the main light ray L2a which generate | occur | produced in each point on illumination area | region IR is radiate | emitted from illumination area | region IR, for example in parallel relationship with each other. The advancing direction of each chief ray L2a when it sees from the direction of the center line (rotation center axis AX1) of the drum mask DM, For example, the generating position on the illumination area | region IR of each chief ray L2a, and the rotation center axis ( It is a direction intersecting with the line (diameter direction) which connects AX1). In addition, as shown in FIG. 17, the advancing direction of each principal ray L2a when it sees from the direction of the rotation center axis AX1 crosses non-vertically with the optical axis 14a of the 2nd optical system 14, for example. Direction.

As described above, the illumination optical system IL is configured such that the incidence side of the first projection optical system PL1 is telecentric, but the imaging light beam L2 passing through the projection optical system PL is, for example, the first projection optical system. In PL1, the telecentric relationship may collapse due to aberration generated. The concave mirror 18 is provided to adjust the characteristic of the image projected on the board | substrate P, for example, taking into account the aberration generate | occur | produced in the 1st projection optical system PL1. Therefore, even when using the curved mast pattern M, the exposure apparatus EX3 can expose with high precision.

In addition, the 1st projection optical system PL1 is comprised as a reduction optical system whose magnification is N times (but N <1), for example. That is, the first projection optical system PL1 forms an image of a part of the mask pattern M on the intermediate image 42 at a reduced magnification. By setting it as such a structure, the shift amount from the telecentric relationship of the chief ray L2a in the imaging light beam L2 can be made small. The projection optical system PL is, for example, an equal magnification optical system which forms an image of a part of the projection area PR of the mask pattern M in the projection area PR at the same magnification, and the second projection optical system PL2 is The magnification is configured as a magnification optical system of 1 / N times.

In addition, when projection optical system PL as a whole is an equal magnification optical system, both 1st projection optical system PL1 and 2nd projection optical system PL2 may be equal magnification optical systems, one may be a reduction optical system, and the other may be an magnification optical system. . In addition, the projection optical system PL may be a reduction optical system as a whole, or may be a magnification optical system as a whole.

Next, the structure of the processing apparatus U3 (exposure apparatus EX3) is demonstrated in detail.

19 is a diagram illustrating the configuration of the exposure apparatus EX3. The exposure apparatus EX3 holds the mask pattern M and is rotatable around the rotation center axis AX1, supporting the drum mask DM (mask holding member) and the substrate P, and rotating center axis AX2. It is provided with the rotating drum DP (substrate support member) which can be rotated around. The rotation center axis AX2 of the rotary drum DP is set substantially parallel to the rotation center axis AX1 of the drum mask DM, for example.

The drum mask DM is a circular columnar or cylindrical member having a constant radius, and its outer circumferential surface is the cylindrical surface 12. The mask pattern M is wound around the outer peripheral surface of the drum mask DM, for example, and is mounted so that release is possible with respect to the drum mask DM. The mask pattern M may be formed, for example on the surface of the drum mask DM using a vapor deposition method, or may be impossible to release from the drum mask DM. As the mask pattern M which can be released, the patterned chromium layer deposited by the ultra-thin glass sheet (about 100 micrometers in thickness), and the thing patterned by the light shielding layer on the sheet of transparent resin or plastic are used. The cylindrical surface also in any of the cases where the sheet-shaped mask pattern M is wound on the drum mask DM or when the mask pattern M is drawn directly on the surface of the drum mask DM. It is important to accurately grasp the radius (diameter) of the mask pattern M curved into a shape.

The rotating drum DP is a circular columnar or cylindrical member having a constant radius, and its outer circumferential surface is cylindrical. The board | substrate P is supported by the rotating drum DP, for example by winding around a part of outer peripheral surface of the rotating drum DP. Projection area PR on which the image of mask pattern M is projected is arrange | positioned in the vicinity of the outer peripheral surface of rotating drum DP. The structure of the board | substrate support member which supports the board | substrate P can be changed suitably. For example, the board | substrate P may be supported by being suspended by the some conveyance roller, and in this case, the projection area | region PR may be arrange | positioned in planar shape between the some conveyance roller.

As shown in FIG. 19, the illumination optical system IL illuminates the illumination region IR on the mask pattern M held by the drum mask DM with uniform brightness by an illumination method such as quality illumination. The projection optical system PL projects a portion of the mask pattern M by projecting the imaging light beam L2 generated in the illumination region IR toward the projection region PR on the substrate P supported by the rotating drum DP. The image of the illumination area IR) is imaged in the projection area PR on the substrate P. FIG.

The exposure apparatus EX3 is a so-called scanning exposure apparatus, and synchronously rotates the drum mask DM and the rotating drum DP at a predetermined rotational speed ratio, thereby allowing the image of the mask pattern M held by the drum mask DM to be rotated. The projection exposure is successively repeated on the surface (surface curved along the cylindrical surface) of the substrate P supported by the rotating drum DP.

The exposure apparatus EX3 includes, for example, a rotation driving unit for rotationally driving the drum mask DM and the rotating drum DP, and detecting respective positions of the drum mask DM and the rotating drum DP. A position detection unit (rotary encoder or the like), a moving unit for adjusting respective positions of the drum mask DM and the rotating drum DP, and a control unit for controlling each unit of the exposure apparatus EX3 are provided.

The control unit of the exposure apparatus EX3 controls the rotation driving unit based on the rotation positions of the drum mask DM and the rotating drum DP detected by the position detecting unit, thereby determining the drum mask DM and the rotating drum DP. Rotate synchronously with the rotation speed ratio. Moreover, this control part can adjust the relative position of the drum mask DM and the rotating drum DP by controlling a moving part based on the detection result of a position detection part.

Next, illumination optical system IL is demonstrated in detail. The first optical system 13 of the illumination optical system IL is a uniform optical system 19 arranged in an optical path from the light source 20 to the optical separation unit 10 and the optical separation unit 10 from the m uniform optical system 19. It has a lens group 27 disposed in the light path leading to.

The equalizing optical system 19 forms a plurality of primary light source images by the light emitted from the light source 20, and makes the light intensity distribution uniform by superimposing the light beams from the plurality of primary light source images. The illumination light L1 emitted from the homogenizing optical system 19 advances in a direction parallel to the optical axis 27a of the lens group 27 and enters the lens group 27. The lens group 27 forms a secondary light source image that is conjugate with the primary light source image formed by the homogenizing optical system 19. Here, the lens group 27 is an optical system which is axisymmetric, and the optical axis 27a of the lens group 27 is called the optical axis 13a of the first optical system 13.

The light source 20 of this embodiment can be configured similarly to the first embodiment, for example. In addition, in this embodiment, the illumination unit IU shown in FIG. 16 contains the light source 20 and the 1st optical system 13, for example.

20 is a diagram illustrating the configuration of the homogenized optical system 19. The homogenizing optical system 19 shown in FIG. 20 includes an input lens 21, a fly-eye lens 22, a first diaphragm member 23, a relay lens (condensing lens) 24, and a cylindrical lens 25. ) And a second aperture member 26.

The input lens 21 of this embodiment can be configured similarly to the first embodiment, for example. In addition, the optical axis 21a of the input lens 21 of this embodiment is substantially parallel to the optical axis 27a of the lens group 27 (refer FIG. 19), and is an optical axis in the X-axis direction orthogonal to the optical axis 27a. It shifts from (27a) to the + X axis side.

The fly-eye lens 22 of the present embodiment can be configured similarly to the first embodiment, for example. In addition, the fly-eye lens 22 of this embodiment spatially divides the illumination light L1 radiate | emitted from the input lens 21 for every lens element 22b. In the emission end surface 22c from which light exits the fly-eye lens 22, a primary light source image (condensing point) is formed for each lens element 22b. The surface on which this primary light source image is formed is optically conjugate with the conjugate surface (first conjugate surface) 40 (shown in FIG. 24) described later.

The 1st stop member 23 is what is called an aperture stop, and is arrange | positioned in the exit end surface 22c of the fly-eye lens 22 (refer FIG. 20), or its vicinity. FIG. 21: is a figure which shows the structure of the 1st aperture member 23. As shown in FIG. The first aperture member 23 has an elongated circular or elliptic opening 23a through which at least a portion of the illumination light L1 from the fly-eye lens 22 passes, and the center of the opening 23a is, for example, It is set substantially coaxial with the optical axis 21a of the input lens 21 (refer FIG. 20).

As shown in FIG. 20, the first aperture member 23 is disposed on a surface (parallel to the XY plane) orthogonal to the optical axis 21a of the input lens 21. The opening 23a has an inner dimension (dimension) in the second direction (Y-axis direction) in which the inner dimension (dimension) D1 in the first direction (X-axis direction) corresponds to the direction parallel to the rotation center axis AX1. ) Is smaller than D2. The first direction of the inner dimension (dimension) D1 coincides with the circumferential direction of the cylindrical surface 12 in the illumination region IR on the drum mask DM in FIG. 17 or FIG. 19.

In the present embodiment, the first direction and the second direction can be defined similarly to the first embodiment.

22A and 22B are views showing the configuration from the first aperture member 23 to the optical separation unit 10. FIG. 22A is a plan view in a plane perpendicular to the rotation center axis AX1. 22B is a plan view in a plane parallel to the rotation center axis AX1.

As shown in FIG. 22A, the opening 23a of the first aperture member 23 is disposed to be biased toward one side (+ X axis side) with respect to the optical axis 13a of the first optical system 13. In addition, as shown in FIG. 22B, the opening 23a of the first aperture member 23 is disposed symmetrically with respect to the optical axis 13a of the first optical system 13 in the Y-axis direction. That is, the 1st stop member 23 is arrange | positioned so that the optical axis 13a of the 1st optical system 13 may pass through the center of the opening 23a when it sees from an X-axis direction.

The relay lens (condensing lens) 24 is disposed at a position at which light passing through the first aperture member 23 is incident. The relay lens 24 is provided so as to overlap light beams from a plurality of primary light source images (condensing points) formed on the fly-eye lens 22. The illumination light L1 from the plurality of primary light sources formed on the fly-eye lens 22 has a uniform light intensity distribution at the overlapping position.

The cylindrical lens 25 is disposed in the optical path from the position where the primary light source image is formed in the fly-eye lens 22 to the second diaphragm member 26. The cylindrical lens 25 is a surface including an arc in the circumferential direction of the cylindrical surface 12 (mask pattern surface) of the drum mask DM (see FIG. 17), that is, the rotational axis AX1. The refractive power (power) with respect to the XZ plane perpendicular to) is configured as an optical member (lens group) larger than the refractive power (power) with respect to the YZ plane in the direction parallel to the rotational center axis AX1.

The second aperture member 26 is a so-called visual aperture and defines the position and shape of the illumination region IR. The second diaphragm member 26 is disposed at or near the illumination region IR. As shown to FIG. 22A, the center position of the opening through which illumination light L1 passes in the 2nd aperture member 26 is also shifted to the + X-axis side also by the optical axis 13a of the 1st optical system 13. As shown to FIG. In addition, as shown in FIG. 22B, the center position of the opening through which the illumination light L1 passes in the second aperture member 26 is disposed at a position substantially equal to the optical axis 13a of the first optical system 13.

The light from the plurality of primary light sources formed on the fly-eye lens 22 is superimposed on the position of the second aperture member 26 by the relay lens 24 and the cylindrical lens 25, and the second The light intensity distribution in the diaphragm 26 is equalized. That is, the input lens 21, the fly-eye lens 22, the relay lens 24, and the cylindrical lens 25 make the light intensity distribution of illumination light L1 uniform.

Moreover, the illumination optical system IL is arrange | positioned in at least one part of the optical path from the primary light source image to the 2nd aperture member 26, and the light intensity distribution of illumination light L1 which originates in a primary light source image is based on a 2nd aperture member ( And a homogenizing optical system 19 to be made uniform at or near the position 26. In addition, the illumination optical system IL does not need to be equipped with the 2nd aperture member 26, for example, when the projection optical system PL is equipped with the field stop. In addition, the homogenizing optical system 19 may be configured using a rod lens instead of the fly-eye lens 22. In this case, the structure of the illumination optical system IL is suitably changed so that the emission cross section which may emit light in a rod lens may be optically conjugate with illumination region IR.

The lens group 27 is composed of, for example, a plurality of lenses that are axisymmetric with a predetermined axis as the rotation center. As shown in FIG. 22B, the lens group 27 forms a pupil plane 28 optically conjugate with the first aperture member 23 when viewed in the X-axis direction. On the copper surface 28, as shown in FIG. 17, the light source image L0 (secondary light source image) which becomes a source of illumination light L1 irradiated to illumination area | region IR is formed.

When the secondary light source image L0 formed on the copper surface 28 of the first projection optical system PL1 is projected onto the cylindrical surface 12 of the drum mask DM along the illumination light path, the cylindrical surface 12 The dimension of the circumferential direction of is set larger than the dimension of the direction of the rotation center axis (center line) AX1.

Moreover, the distribution range of the secondary light source image L0 formed in the 2nd conjugate plane (coil 28) is the cylinder of the drum mask DM along the illumination light path in the distribution range of the secondary light source image L0. When projecting on the surface 12, the dimension of the direction of the rotation center axis (center line) AX1 is set so that it may become smaller than the dimension of the circumferential direction of the cylindrical surface 12. As shown in FIG.

By the way, the lens group 27 is comprised so that the component disperse | distributed to the Y-axis direction among the light beams from the primary light source image formed in the 1st aperture member 23 may converge on the copper surface 28. As shown in FIG. Here, since the power of the cylindrical lens 25 is different in the X-axis direction and the Y-axis direction, it diffuses in the X-axis direction from each point of the primary light source image (the opening 23a of the first aperture member 23). The component to be converged does not converge on each corresponding point on the pupil plane 28 as shown in FIG. 22A. In other words, the hibernation surface 28 is optically conjugate with the first aperture member 23 when viewed from the X-axis direction, and may not be optically conjugate with the first aperture member 23 when viewed from the Y-axis direction. .

The optical separation unit 10 of the present embodiment can be configured similarly to the first embodiment, for example. In addition, the optical separation part 10 of this embodiment includes the lens member 30 of the material which light transmits, and the reflecting film 31 formed in the surface of the lens member 30. As shown in FIG. The lens member 30 is, for example, shaped like a meniscus lens, and the side of the surface 30a on which the illumination light L1 is incident from the first optical system 13 is a convex surface, and faces the surface 30a. The surface 30b side is a concave surface. The surface 30b is a curved surface including a part of a spherical surface, for example. The reflective film 31 is provided on the surface 30b of the lens member 30.

FIG. 23 is a plan view illustrating the configuration of the optical separation unit 10. As shown in FIG. 23, the optical splitter 10 includes a passer 15 through which at least a part of the illumination light L1 from the first optical system 13 passes, and an illumination region IR on the mask pattern M. FIG. The reflection part 16 which reflects the generated imaging beam L2 (refer FIG. 17) is provided. The light splitter 10 is disposed over the optical path from the primary light source to the illumination region IR and the optical path from the illumination region IR to the intermediate image 42. The reflection part 16 of the optical separation part 10 of this embodiment includes the reflection surface (reflective film 31) curved, for example in the shape of a concave surface containing a part of spherical surface.

As shown in FIG. 19, the 2nd optical system 14 is arrange | positioned in the position where illumination light L1 which passed through the passage part 15 of the optical separation part 10 is incident. The second optical system 14 condenses the illumination light L1 such that the illumination region IR is optically conjugate with the first aperture member 23. That is, the lens group 27 and the second optical system 14 form a surface optically conjugate with the second aperture member 26 in the illumination region IR.

The second optical system 14 is configured of, for example, a plurality of lenses that are axisymmetric around a predetermined central axis. In this embodiment, this predetermined center axis is called the optical axis 14a of the second optical system 14. The optical axis 14a of the second optical system 14 is set coaxially with the optical axis 13a of the first optical system 13, for example. The illumination light L1 incident on the second optical system 14 passes through one side with respect to the surface (YZ plane) including the optical axis 14a of the second optical system 14 and exits from the second optical system 14. The illumination light L1 emitted from the second optical system 14 is incident on the illumination region IR on the mask pattern M held by the drum mask DM. This illumination light L1 is diffracted by the mask pattern M, and the imaging light beam L2 generate | occur | produces.

Here, the illumination light L1 when incident on the illumination region IR and the imaging light beam L2 emitted from the illumination region IR will be described in more detail.

FIG. 24 shows the light beam incident on the illumination region IR (illumination light L1) and the imaging light beam L2 emitted from the illumination region IR in the direction (Y-axis direction) of the rotation center axis AX1 of the drum mask DM. This is a side view. FIG. 25: is a top view which looked at the imaging light beam L2 radiate | emitted from illumination region IR from the direction orthogonal to FIG. 24 (Z-axis direction). In this embodiment, since description in FIG. 24 and FIG. 25 about illumination light L1 and the imaging light beam L2 is the same content as description in FIG. 10 and FIG. 11 of 1st Embodiment, it demonstrates here. Omit.

Next, the shape of the pupil in the plane (the pupil plane 28 and the conjugate plane 40) which is conjugate with the light source image will be described. It is a figure which shows the representative position of illumination area | region IR referred to in description of a pupil. FIG. 27 is a view showing the shape of the pupil in the conjugate plane 40 which is conjugate with the light source image. Here, for convenience of explanation, the luminous flux (illumination light L1 and the imaging luminous flux L2) passing through each point of the illumination region IR is spot on the plane (cooperative surface 28 and conjugate surface 40) which is conjugate with the light source image. It is assumed that the shape is the cause.

In FIG. 26, code | symbol P1-P9 shows the point on illumination area | region IR seen from the plane in the X-axis direction. The point P1, the point P2, and the point P3 are group of points (referred to as 1st group) which line in the circumferential direction (X direction of planar view) of the cylindrical surface 12 of the drum mask DM. The point P1 is located at the + X axis side of the illumination area IR, the point P3 is located at the -X axis side of the illumination area IR, and the point P2 is disposed at the center of the points P1 and P3. Similarly, the second group of points P4, point P5 and point P6, and the third group of points P7, point P8 and point P9 are groups of points lined in the circumferential direction of the cylindrical surface 12, respectively. Moreover, the 1st group of points P1-P3 is arrange | positioned at the edge of the -Y axis side of illumination area | region IR, and the 3rd group of points P7-point P9 is arrange | positioned at the + Y-axis side edge of illumination area | region IR, , The second group of points P4 to P6 is disposed between the first group and the third group.

First, the passing range of the illumination light L1 in the pupil plane 28 (light separation part 10) is demonstrated. The principal rays of the illumination light L1 incident on the points P1, P4 and P7 in a line parallel to the rotational center axis AX1 (Y-axis direction) on the periphery of the illumination region IR shown in FIG. The incidence position in the circumferential direction of the illumination region IR is almost the same, and the incidence angle with respect to the illumination region IR is almost the same. Therefore, the light beams incident on the points P1, P4, and P7 have the positions of the passing range on the optical separation section 10 (the pupil plane 28), respectively, in FIG. 22A in the X-axis direction. do. Therefore, as shown in FIG. 23, the light beam which injects into the point P1, the point P4, and the point P7 all pass the range R3 on the optical separation part 10 (copper surface 28). Similarly, the light beams incident on the points P3, P6, and P9 in the illumination region IR lined up in the direction parallel to the rotation center axis AX1 all pass through the range R4 on the coplanar surface 28.

Moreover, the main light beam of the illumination light L1 incident on the point P1 and the main light beam of the illumination light L1 incident on the point P3 have different incidence positions in the circumferential direction of the illumination region IR (cylindrical surface 12), and thus the illumination region IR The angle of incidence relative to) is different.

Therefore, the pass range (range R3) on the optical separation part 10 (copper surface 28) through which the light flux incident on the point P1 passes, and the optical separation unit 10 (the copper surface) through which the light flux incident on the point P3 passes. The passing range (range R4) on (28) is shifted in the X-axis direction on the pupil plane 28, and shifted in the circumferential direction of the cylindrical surface 12 in the illumination region IR.

In FIG. 23, the position in the Y-axis direction of the range R3 on the pupil plane 28 is substantially the same as the range R4. The position in the X-axis direction of the range R3 is farther from the intersection 13b of the optical axis 13a of the first optical system 13 and the optical separation unit 10 than the position in the X-axis direction of the range R4.

In addition, in the illumination region IR shown in FIG. 26, the passing range of the light beam incident on the point P2, the point P5, and the point P8 lined in the Y-axis direction parallel to the rotation center axis AX1 is shown in FIG. Although not, it is arranged between the range R3 and the range R4. Similarly, the light beam passing through any point on the line connecting the point P1 and the point P3 passes through the range shifted from the range R3 to the range R4 in accordance with the shift amount from the point P1 of this arbitrary point. Therefore, the passing range on the pupil plane 28 of the illumination light L1 incident on the illumination region IR becomes, for example, an elongated circular range R2 connecting the range R3 and the range R4.

Thus, when the range R2 of the passage part 15 is made into an elongate circle shape, the principal light ray L2a of the imaging beam L2 distributed in the circumferential direction of the rotation center axis AX1 will make illumination light into parallel illumination beam, and will make it enter into an illumination area | region. Rather, it is closer to a parallel relationship (telecentric state). This is achieved in addition to setting the light separation section 10 or the illumination system before it so that the air plane 40 is disposed at or near the central position of the rotational center axis AX1 and the illumination region IR.

Next, the shape of the pupil in the conjugate surface 40 will be described. The shape of the pupil in the conjugate surface 40 is the shape of the spot formed in the conjugate surface 40 when the illumination light L1 incident on the illumination region IR is virtually propagated inside the drum mask DM. Almost the same.

An extension line 41 (see FIG. 24) of the chief ray L1a is almost one point on the conjugate surface 40 at points P1, P2, and P3 in the illumination region IR arranged in the circumferential direction of the cylindrical surface 12. In order to overlap, the chief ray L1a of illumination light L1 is incident. Therefore, if the light beams incident on the points P1, P2, and P3 each propagate to the inside of the cylindrical surface 12, the positions of the passing range on the airspace 40 will coincide. It passes through the range R5 shown in FIG. For the same reason, the light beams incident on the points P4, P5 and P6 in the illumination region IR lined in the circumferential direction of the cylindrical surface 12 all pass through the range R6, and the The light beams incident on the points P7, P8, and P9 arranged in the circumferential direction all pass through the range R7.

Further, the main rays L1a of the illumination light L1 are incident in a substantially parallel relationship to the points P1, P4, and P7 of the illumination region IR lining in the direction parallel to the rotation center axis AX1 (Y-axis direction). come. Therefore, if the light beams incident on the points P1, P4, P7 are propagated to the inner side of the cylindrical surface 12, the conjugate plane 40 is in the Y-axis direction parallel to the rotation center axis AX1. The position of the pass range on 된다 is shifted. That is, the range R5 is disposed at the end on the -Y axis side on the conjugate plane 40, the range R7 is disposed at the end on the + Y axis side on the conjugate plane 40, and the range R6 is disposed at the center of the range R5 and the range R7. do. As a result, as shown in FIG. 27, the illumination light L1 incident on the illumination region IR becomes an elongated circular range R8 in which the shape of the pupil in the conjugate surface 40 connects the range R5 and the range R7. .

As mentioned above, the chief ray L2a which arises in each position of illumination region IR among the imaging beams L2 is the circumferential direction of the cylindrical surface 12, and the direction (Y-axis direction) parallel to the rotation center axis AX1. In each direction, they are almost parallel to each other. Therefore, the projection optical system PL can be configured so that its incidence side (illumination region IR side) is telecentric. In addition, as shown in FIG. 19 etc., the advancing direction of the main light ray L2a of the imaging light beam L2 at the time of exiting from the illumination area | region IR is an optical axis of the 2nd optical system 14 when seen from the direction of the rotation center axis AX1. It is the direction which intersects (14a) non-vertically.

Next, the projection optical system PL will be described in more detail. A circular columnar shape is a figure which shows the optical path which functions as a 1st projection optical system. 29 is a diagram showing an optical path functioning as a second projection optical system.

The projection optical system PL is a first projection optical system PL1 for forming the intermediate image Im as shown in a circular columnar shape, and a second projection optical system for projecting the intermediate image Im as shown in FIG. 29 onto the substrate P. FIG. PL2 is provided. The 1st projection optical system PL1 and the 2nd projection optical system PL2 are telecentrically comprised, for example as a reflection-molding projection optical system of the half image field type which divided | segmented the circular image field.

The first projection optical system PL1 illustrated in FIG. 28 includes a second optical system 14, an optical separation unit 10, a deflection member 17, a lens group 43, and a deflection member 44.

The second optical system 14 also serves as part of the illumination optical system IL as described above, and includes a lens group 45 and a lens group 46. The lens group 45 and the lens group 46 form a plane (the pupil plane 28 of the first projection optical system PL1) that is conjugate with the light source image formed by the illumination optical system IL.

The lens group 45 includes the optical axis PL2a of the second projection optical system PL2 and the illumination region IR (drum) with respect to the plane XY plane parallel to the rotation center axis AX1 (see FIG. 19). It is arranged on the same side as the mask DM). The lens group 46 includes the optical axis PL2a of the second projection optical system PL2 and is illuminated with the illumination region IR (drum) with respect to the plane XY plane parallel to the rotational center axis AX1 (see FIG. 19). It is arrange | positioned on the opposite side to mask DM).

The imaging light beam L2 incident on the second optical system 14 passes through an optical path different from the illumination light L1 (see FIG. 19) facing the illumination region IR. The optical path of the imaging light beam L2 in the second optical system 14 is substantially opposite to the optical path of the illumination light L1 (+ X axis side) with respect to the surface (YZ plane) including the optical axis 14a of the second optical system 14. Is placed.

The imaging light beam L2 which has passed through the second optical system 14 is incident on the optical separation unit 10. The range R1 in which the imaging light beam L2 is incident in the optical separation unit 10 (see FIG. 23) is the range R2 in which the illumination light L1 is incident on the optical separation unit 10 from the first optical system 13 (passing unit 15). Are set so that they do not overlap. The range R1 in which the imaging light beam L2 is incident is set on the side opposite to the passage 15 with respect to the YZ plane, for example, and serves as the reflecting portion 16 of the optical separation section 10. The reflecting portion 16 is disposed on the copper surface 28 or its vicinity, and as shown in FIG. 18, since the chief ray L2a emitted from each point of the illumination region IR is almost parallel to each other, the illumination region The light beam generated at each point (IR) is incident on the reflector 16 so that the spots overlap in the range R2.

As shown in FIG. 28, the imaging light beam L2 incident on the reflector 16 of the optical separation unit 10 is reflected by the reflector 16 and passes through the lens group 46 of the second optical system 14. Incident on the deflection member 17. The deflection member 17 is, for example, a prism mirror, and the plane on which the imaging light beam L2 is incident from the light separation unit 10 is a plane reflective surface.

The deflection member 17 is disposed at a position deviating from the optical path of the illumination light L1 so as not to block the illumination light L1 (see FIG. 19) passing through the second optical system 14 toward the illumination region IR. Here, the deflection member 17 shields the imaging light beam L2 reflected by the optical separation unit 10 so as not to face the drum mask DM. The imaging light beam L2 incident on the deflection member 17 is deflected by reflecting on the deflection member 17 and is incident on the lens group 43.

The lens group 43 condenses the imaging light beam L2 reflected by the deflection member 17 so that the intermediate image surface 42 which is conjugate with the illumination region IR is formed. The lens group 43 is, for example, a projection area PR (for the surface YZ plane) including the optical axis 14a of the second optical system 14 and the rotational center axis AX1 (see FIG. 19). It is arranged on the same side as the rotating drum DP). The lens group 43 is configured to be optically equivalent to the lens group 45 of the second optical system 14, for example. The lens group 43 is composed of, for example, an optical member such as a lens which is rotationally symmetric about a predetermined axis (optical axis PL2a of the second projection optical system PL2). The optical axis PL2a of the second projection optical system PL2 is set to be orthogonal to the optical axis 14a of the second optical system 14, for example.

The imaging light beam L2 reflected by the deflecting member 17 and passing through the lens group 43 is incident on the reflecting surface 44a of the deflecting member 44 and is deflected by being reflected by the reflecting surface 44a to concave mirror 18. ) Is incident. The deflection member 17 is, for example, a prism mirror, and the reflecting surface 44a is almost planar.

The second projection optical system PL2 shown in FIG. 29 includes a concave mirror 18, a deflection member 44, a lens group 43, a lens group 47, and a concave mirror 48.

The concave mirror 18 shown to FIG. 28, FIG. 29 is arrange | positioned in the vicinity of the position of the intermediate image surface 42 in which the intermediate image Im is formed by 1st projection optical system PL1. That is, the light beam radiate | emitted from each point on illumination area | region IR among the imaging light beams L2 converges to each of the corresponding points (conjugation point) on the concave mirror 18, and is reflected at each point. As for the concave mirror 18, the surface into which the imaging light beam L2 is incident from the deflection member 44 becomes a substantially cylindrical reflective surface. The radius of curvature of the concave mirror 18 is set to be substantially equal to the radius of curvature of the illumination region IR, regardless of the magnification of the first projection optical system PL1.

The imaging light beam L2 reflected by the concave mirror 18 advances in a direction parallel to the advancing direction at the time of incidence into the concave mirror 18, and is incident on the deflection member 44. Therefore, the incident angle with respect to the deflection member 44 of the imaging light beam L2 reflected by the concave mirror 18 becomes different from the incident angle with respect to the deflection member 44 when facing the concave mirror 18. As a result, the imaging light beam L2 reflected by the concave mirror 18 and the deflection member 44 is different from the optical path of the imaging light beam L2 (see FIG. 28) when the deflection member 17 is directed from the deflection member 17. Through the lens group 43 is incident.

The imaging light beam L2 which has passed through the lens group 43 is incident on the lens group 47 without being blocked by the deflection member 17. In other words, the deflection member 17 is a position at which the imaging light beam L2 reflected by the optical separation unit 10 is incident, and the imaging light beam L2 reflected by the deflection member 44 after being reflected by the concave mirror 18 is incident. It is placed in a position where it is not possible.

The lens group 47 collects the imaging light beam L2 reflected from the deflection member 44 and passed through the lens group 43 so that the pupil plane 47a conjoint with the pupil plane 28 of the first projection optical system PL1 is formed. do. The lens group 47 is configured to be optically equivalent to the lens group 46 of the second optical system 14, for example. The lens group 47 is composed of, for example, a lens that is rotationally symmetric around a predetermined axis (optical axis PL2a of the second projection optical system PL2).

The imaging light beam L2 reflected by the deflection member 44 and passing through the lens group 43 and the lens group 47 is incident on the concave mirror 48. The concave mirror 48 is disposed at, for example, the position of the pupil plane 47a in the second projection optical system PL2 or its vicinity. The concave mirror 48 is comprised, for example as a reflecting surface in which the incident cross section of the side into which the imaging light beam L2 is incident is curved in spherical shape. In the concave mirror 48, the reflecting surface is at least the area | region in which the imaging light beam L2 injects in the incident cross section.

In the concave mirror 48, a part of the region where the imaging light beam L2 is incident in the incident cross section may not be a reflecting surface. For example, the concave mirror 48 can function as a diaphragm member by making a part of the area | region in which the imaging light beam L2 injects in the incident cross section into the permeation | transmission part through which the imaging light beam L2 permeate | transmits. In place of at least a part of the transmission part, an absorption part for absorbing the imaging light beam L2 may be provided.

The imaging light beam L2 reflected by the concave mirror 48 is projected to the projection area PR through the lens group 47 and the lens group 43. The luminous flux from each point on the intermediate image surface 42 of the imaging luminous flux L2 passes through the lens group 43 and the lens group 47 twice, thereby being a plane conjugate with the intermediate image surface 42 (second projection optical system ( Converge to each of the corresponding points (conjugate point) on the upper surface of PL2). In this way, the intermediate image Im formed on the intermediate image surface 42 by the first projection optical system PL1 is projected onto the image surface of the second projection optical system PL2.

The image plane of the 2nd projection optical system PL2 is set in substantially the same position as the projection area | region PR on the board | substrate P supported by the outer peripheral surface of the rotating drum DP, and the illumination area | region IR on the mask pattern M ) Is projected and exposed to the projection area PR. In such exposure apparatus EX3, the concave mirror 18 converts the image plane of the second projection optical system PL2 to match the shape of the projection area PR, so that the image of the illumination area IR is faithfully and accurately projected. do.

By the way, as demonstrated using FIG. 25 etc., the illumination optical system IL is comprised so that the chief ray L2a of the imaging light beam L2 at the time of injecting into the projection optical system PL may become substantially parallel to each other. However, the imaging light beam L2 which has passed through at least one part of the projection optical system PL may be sheeted from the relationship in which the principal rays are parallel to each other, for example, by aberration or the like. The accuracy of exposure may fall as much as the relationship of the principal rays of the imaging light beam L2 at the time of injecting into the projection area | region PR mutually paralleled.

Here, the projection optical system PL may be provided with the correction | amendment part which correct | amends so that the direction of the principal light ray of the imaging light beam L2 may become nearly parallel relationship with each other. This correction part may be arrange | positioned in any position of the optical path from illumination area | region IR to projection area | region PR. However, the closer the intermediate image surface 42 is to be disposed, the more effectively the direction of the chief ray L2a of the imaging light beam L2 can be corrected.

For example, the concave mirror 18 is an optical member disposed closest to the intermediate image 42 of the projection optical system PL, and the above-described correction unit can be configured using the concave mirror 18. For example, even if one or both of the shape and the position of the reflecting surface are set so that the concave mirror 18 may parallel the chief rays of the imaging light beam L2 reaching the pupil plane 47a of the second projection optical system PL2 to be parallel to each other. good.

That is, the shape of the concave mirror 18 may be set to an ellipse shape in which the cross-sectional shape orthogonal to the Y-axis direction is different from the circular shape so that the chief rays of the imaging light beam L2 are parallel to each other. Moreover, the position of the concave mirror 18 is intermediate | middle in the range which the distance of the upper surface of the 2nd projection optical system PL2 and projection area | region PR becomes below a depth of focus so that the principal rays of the imaging light beam L2 may become mutually parallel. It may be arranged shifted from the upper surface 42.

In addition, the correction | amendment part mentioned above may contain one or both of the deflection | deviation member 17 and the deflection member 44. As shown in FIG. For example, the reflective surface 44a of the deflection member 44 may be curved such that the chief rays of the imaging light beam L2 reaching the pupil plane 47a of the second projection optical system PL2 are parallel to each other. This also applies to the deflection member 17.

Since the deflection member 44 is disposed closer to the intermediate upper surface 42 than the deflection member 17, the direction of the chief ray can be effectively adjusted by using the correction section described above. Moreover, since the imaging light beam L2 which goes to the intermediate | middle upper surface 42 is incident, and the imaging beam L2 radiate | emitted from the intermediate image surface 42 does not enter, the deflection member 17 adjusts the direction of the chief ray of the imaging light beam L2. High degree of design freedom. In addition, the concave mirror 18, the deflection member 17, and the deflection member 44 may include the other optical member, and may not be provided.

In the processing apparatus U3 (exposure apparatus EX3) of the present embodiment as described above, since the illumination optical system IL is configured such that the imaging light beam L2 incident on the projection optical system PL is closer to the parallel light beam, the projection optical system Even if PL is not complicated, the image of the curved mask pattern M can be accurately projected and exposed. Therefore, the processing apparatus U3 can expose the board | substrate P efficiently and accurately by performing an exposure process, rotating the mask pattern M. As shown in FIG.

Further, in order to project the image of the mask pattern M curved in a cylindrical shape onto the substrate P curved in a cylindrical shape, a concave mirror 18 having a cylindrical reflecting surface is provided at the position of the intermediate upper surface. The image plane of the second projection optical system PL2 is converted to follow the projection area PR, and the processing apparatus U3 is illuminated with respect to the scanning exposure direction (circumferential direction of the mask pattern M). And the width of the projection area PR can be ensured to be wide, and the productivity is high and the exposure processing of high precision can be performed.

In addition, since the processing apparatus U3 has arranged the optical separation part 10 in the copper surface 28 of the 1st projection optical system PL1, the Laksa illumination system which isolate | separated the optical path of illumination light L1 and the optical path of the imaging beam L2 is employable. Can be. Therefore, the processing apparatus U3 can reduce the loss of the amount of light and the generation of stray light in the PBS, as compared with the configuration of dividing the optical path using, for example, a polarization splitting splitter PBS. In addition, when the light source 20 can be used as a laser light source and the like, and the light quantity loss can be reduced by using the polarization characteristic of the illumination light, such an optical separation part 10 may be comprised by PBS.

Moreover, since the light separation part 10 (regulator) defines the passing range of the illumination light L1 toward the illumination area IR through the passage part 15, the chief ray of the illumination light L1 when it enters into the illumination area IR. The direction of L1a can be prescribed | regulated with high precision. In addition, since the light separation unit 10 defines the passing range of the illumination light L1 using the reflecting unit 16, the configuration can be simplified.

By the way, the relationship (for example, parallel to each other) of the principal rays L1a distributed in the direction parallel to the rotation center axis AX1 among illumination light L1, the principal rays distributed in the direction parallel to the rotation center axis AX1 among the imaging beams L2. It is also maintained in the L2a relationship (e.g., parallel to each other). Moreover, the relationship (for example, parallel) of the main beams L2a distributed in the circumferential direction of the cylindrical surface 12 in the imaging beam L2 is the relationship between the main beams L1a distributed in the circumferential direction of the cylindrical surface 12 among the illumination lights L1. (For example, non-parallel to each other). Therefore, for example, in the imaging light beam L2, the diffusing angle NA of the illumination light L1 is an optical member having isotropic power so that the chief rays L2a distributed in the circumferential direction of the cylindrical surface 12 are in parallel with each other. When adjusted, the chief ray L2a relationship distributed in the direction parallel to rotation center axis AX1 among imaging beams L2 will not become mutually parallel.

In the present embodiment, the cylindrical lens 25 causes the illumination light L1 (primary ray) to diffuse, the direction in which the rotational center axis AX1 of the drum mask DM extends, and the circumference of the cylindrical surface 12. Do it differently in the direction. That is, the cylindrical lens 25 has the cylindrical surface 12 in parallel with the chief ray L1a which runs in the direction parallel to the rotation center axis AX1 among the chief ray L1a of illumination light L1 which reaches illumination region IR. Main line L1a, which is lined (distributed) in the circumferential direction, is deflected (set) so that the extension line 41 intersects the line on the plane of plane 40 parallel to the rotation center axis AX1. Therefore, while the main beam L2a of the imaging beam L2 distributed in the direction parallel to the rotation center axis AX1 is made substantially parallel to each other, the main beam L2a of the imaging beam L2 distributed in the circumferential direction of the cylindrical surface 12 also mutually exists. It can be nearly parallel. In addition, as a method of giving anisotropy to the diffusion angle of illumination light L1, the method of adjusting the shape of the light output side of this light guide member can also be used similarly to 1st Embodiment mentioned above using the light guide member which bundled the optical fiber. .

[Fourth embodiment]

Next, 4th Embodiment is described. In this embodiment, the same code | symbol is attached | subjected about the component similar to said embodiment, and the description is simplified or abbreviate | omitted.

30 is a diagram illustrating a configuration of a processing apparatus (exposure apparatus EX4) according to the present embodiment. FIG. 31 is a diagram showing an optical path functioning as the illumination optical system IL in the configuration of FIG. 30. 32 is a diagram illustrating an optical path that functions as the first projection optical system PL1 in the configuration of FIG. 30. FIG. 33 is a diagram showing an optical path functioning as the second projection optical system PL2 in the configuration of FIG. 30.

The projection optical system PL includes a first projection optical system PL1 forming an intermediate image Im of a part of the mask pattern M (lighting area IR), and an intermediate image formed by the first projection optical system PL1. 2nd projection optical system PL2 is projected on projection area PR on (). Here, each of the first projection optical system PL1 and the second projection optical system PL2 is configured by the same optical system as the opener optical system. The illumination optical system IL illuminates the illumination area IR with illumination light L1 through a part of the 1st projection optical system PL1.

The illumination optical system IL can be comprised similarly to 3rd Embodiment about the element (uniformation optical system 19) arrange | positioned from the light source to the 1st aperture member 23, for example. The illumination light L1 emitted from the light source passes through the homogenizing optical system 19 so that the light intensity distribution in the first aperture member 23 is made uniform.

The illumination optical system IL shown in FIG. 31 includes an optical separation unit 50, an image adjustment member 51, a concave mirror 52, a lens group 53, a convex mirror 54, a deflection member 55, and The image adjusting member 56 is provided.

The illumination light L1 which has passed through the first aperture member 23 is incident on the reflecting portion 57 of the light separation section 50 through the image adjusting member 51. The image adjusting member 51 is provided by adding aberration, etc. in order to adjust the image characteristics of the secondary light source image formed on the plane conjugated with the primary light source image. The upper adjustment member 51 can be appropriately omitted.

The reflector 57 of the optical separation unit 50 is a position at which the illumination light L1 is incident from the uniformizing optical system 19, and is positioned at a position where the imaging light beam L2 (see FIG. 30) passing through the projection optical system PL is not incident. It is arranged. The reflecting part 57 of the optical separation part 50 is a prism mirror, for example, and the surface in which illumination light L1 is incident from the equalization optical system 19 is a planar reflection surface.

The illumination light L1 incident on the reflector 57 is deflected by being reflected by the reflector 57 and is incident on the concave mirror 52. The illumination light L1 reflected by the reflector 57 and incident on the concave mirror 52 is reflected by the concave mirror 52 and is incident on the convex mirror 54 through the lens group 53.

The concave mirror 52 has, for example, a reflecting surface including a part of a spherical surface, and is formed on the uniform optical system 19 (primary light source member 23 shown in FIG. 20). The illumination light L1 is collected so as to form the hibernating surface 28 which is conjugated with. That is, the secondary light source image is formed in the copper surface 28.

The lens group 53 is suitably provided to adjust the image characteristic on the secondary light source in the pupil plane 28, and includes a field lens, for example. The convex mirror 54 has a reflecting surface including a part of a spherical surface, for example, and is provided such that the concave mirror 52 and the center of curvature coincide. Here, the axis | shaft which connects the center of the concave mirror 52 and the center of the convex mirror 54 is called optical axis ILa of illumination optical system IL (optical axis PL1a of 1st projection optical system PL1). The convex mirror 54 and the concave mirror 52 are provided so that the light (illumination light L1 and the imaging light beam L2) reflected by the convex mirror 54 is incident again on the concave mirror 52.

The illumination light L1 from the concave mirror 52 is incident on the -X axis side of the convex mirror 54 with respect to the optical axis ILa of the illumination optical system IL, is reflected by the convex mirror 54, and is concave mirror 52. Is incident again. The illumination light L1 reflected by the convex mirror 54 and incident on the concave mirror 52 is reflected by the concave mirror 52 and is incident on the deflection member 55 and is deflected by being reflected by the deflection member 55, thereby adjusting the phase. The light is incident on the illumination region IR through the member 56.

The deflection member 55 is, for example, a prism mirror, and a plane on which the illumination light L1 is incident from the concave mirror 52 is a plane reflective surface. The phase adjusting member 56 is appropriately provided with aberration and the like similar to the phase adjusting member 51.

As shown in FIG. 32, the first projection optical system PL1 includes an image adjusting member 56, a biasing member 55, a concave mirror 52, a lens group 53, a convex mirror 54, and an image adjusting member ( 58).

The imaging light beam L2 emitted from the illumination region IR enters the deflection member 55 through the image adjustment member 56 and is deflected by being reflected by the deflection member 55. The imaging light beam L2 deflected by the deflection member 55 is incident on the concave mirror 52 through an optical path different from that of the illumination light L1 directed from the concave mirror 52 shown in FIG. 31 toward the deflection member 55. The imaging light beam L2 incident on the concave mirror 52 passes through an optical path different from the illumination light L1, passes through the lens group 53, and enters the convex mirror 54. The position where the imaging beam L2 is incident in the convex mirror 54 is disposed on the side opposite to the incident position of the illumination light L1 (+ X axis side) with respect to the optical axis PL1a of the first projection optical system PL1.

The imaging light beam L2 reflected by the convex mirror 54 passes through the lens group 53, enters the concave mirror 52, and is reflected by the concave mirror 52. The imaging light beam L2 reflected by the concave mirror 52 is incident on the image adjusting member 58 through the passage part 59 of the optical separation part 50. Here, the passage part 59 of the optical separation part 50 is a region in which the reflection part 57 is not provided. That is, the reflecting part 57 is arrange | positioned in the position which the imaging light beam L2 reflected by the concave mirror 52, after reflecting from the convex mirror 54 does not inject. In this way, the optical separation unit 50 is provided to define the passing range of the illumination light L1.

The light beam emitted from each point on the illumination area | region IR among the imaging light beams L2 converges to almost 1 point on the intermediate | middle upper surface 42 which is conjugate with the illumination area | region IR by passing through the optical path as mentioned above. In other words, the image of the illumination region IR is formed in the intermediate upper surface 42. The image adjusting member 56 and the image adjusting member 58 are appropriately provided with aberrations or the like so as to adjust the image characteristics of the intermediate image Im. One or both of the image adjusting member 56 and the image adjusting member 58 can be appropriately omitted.

As shown in FIG. 33, the second projection optical system PL2 includes the concave mirror 60, the image adjusting member 58, the deflection member 61, the concave mirror 62, the lens group 63, and the convex mirror 64. ), A biasing member 65 and an phase adjusting member 66.

The concave mirror 60 is disposed at or near the middle upper surface 42. It is formed in the shape of a cylindrical surface concave toward the incidence side of the imaging light beam L2 so as to follow the shape of the intermediate image Im formed by the first projection optical system PL1. As described in the third embodiment, the concave mirror 60 converts the shape of the upper surface of the second projection optical system PL2 so as to follow the projection area PR.

The imaging light beam L2 incident on the concave mirror 60 is reflected by the concave mirror 60 and is incident on the deflection member 61 through the image adjusting member 58. The deflection member 61 is, for example, a prism mirror, and the plane on which the imaging light beam L2 is incident from the concave mirror 60 is a planar reflective surface. The deflection member 61 is a position at which the imaging light beam L2 reflected from the concave mirror 60 is incident, and forms an image from the concave mirror 52 (see FIG. 32) of the first projection optical system PL1 toward the concave mirror 60. It is arrange | positioned in the position which does not block luminous flux L2.

The imaging light beam L2 incident on the deflection member 61 is deflected by being reflected by the deflection member 61 and is incident on the concave mirror 62. The imaging light beam L2 incident on the concave mirror 62 is reflected by the concave mirror 62, passes through the lens group 63, and enters the convex mirror 64.

The concave mirror 62 condenses the imaging light beam L2 so as to form the pupil plane 67 in conjugate with the pupil plane 28 of the first projection optical system PL1 shown in FIG. 32. The concave mirror 62 is configured to be optically equivalent to the concave mirror 52 of the first projection optical system PL1, for example. The concave mirror 62 has a curved reflective surface that includes, for example, a portion of the spherical surface.

The lens group 63 is suitably provided by adding aberration etc. to adjust the characteristic of the image formed in the projection area | region PR, for example, and includes a field lens.

The convex mirror 64 is disposed at or near the pupil plane 67. The convex mirror 64 is configured to be optically equivalent to the convex mirror 54 of the first projection optical system PL1, for example. The convex mirror 64 has, for example, a curved reflective surface including a part of a spherical surface, and the center of curvature of the reflective surface is set to a position substantially equal to the center of curvature of the concave mirror 62.

The imaging light beam L2 reflected by the convex mirror 64 passes through the lens group 63 and is incident again on the concave mirror 62, and is reflected by the concave mirror 62 and incident on the deflection member 65. The imaging light beam L2 incident on the deflection member 65 is deflected by being reflected by the deflection member 65, passes through the image adjustment member 66, and enters the projection area PR.

As described above, the second projection optical system PL2 is formed of the second projection optical system PL2 which forms the intermediate image Im of the illumination region IR formed on the intermediate image surface 42 on the image surface of the second projection optical system PL2. The upper surface is set at or near the position of the projection area PR on the substrate P supported by the rotating drum DP, and the image of the illumination area IR is projected onto the projection area PR on the substrate P. Exposed.

Since the processing apparatus U3 (exposure apparatus EX4) of the present embodiment as described above is configured with the illumination optical system IL such that the chief ray of the imaging light beam L2 incident on the projection optical system PL is close to the parallel system, Even if the projection optical system PL is not complicated, the image of the curved mask pattern M can be accurately projected and exposed. Therefore, the processing apparatus U3 can expose the board | substrate P efficiently and accurately by performing an exposure process, rotating the mask pattern M. As shown in FIG.

Moreover, the processing apparatus U3 projects the image of the curved mask pattern M on the curved board | substrate P. FIG. Moreover, in the processing apparatus U3, since the concave mirror 18 converts the upper surface of the 2nd projection optical system PL2 so that along the projection area | region PR, the processing apparatus U3 can expose with high precision. Further, for example, by providing the correction unit so that the imaging light beam L2 is close to the telecentric, the processing apparatus U3 can be exposed with high accuracy. This correction part can be comprised using at least one of the concave mirror 60, the image adjustment member 58, and the deflection member 61, for example.

Moreover, since the processing apparatus U3 arrange | positioned the optical separation part 10 in the pupil plane 28 of 1st projection optical system PL1, the optical path of illumination light L1 and the optical path of imaging beam L2 can be isolate | separated. Therefore, the processing apparatus U3 can reduce the loss of light quantity and the generation of stray light, compared with the structure which divides an optical path using a polarization splitting splitter etc., for example.

In addition, the technical scope of this invention is not limited to each embodiment mentioned above. For example, one or more of the elements described in the above-described embodiments may be omitted. In addition, the element demonstrated in each embodiment mentioned above can be combined suitably.

In addition, in each embodiment mentioned above, although the projection area | region PR on the board | substrate P is curved in cylindrical shape, the projection area | region PR may be planar.

That is, when the substrate P is a rigid substrate that is not substantially deformed, or when a flexible sheet-like substrate can keep a constant range including the projection area PR flat (flat), By the exposure apparatus of each embodiment, such flat (planar) board | substrate P can be exposed similarly.

For example, the exposure apparatus may expose the substrate P as a rigid substrate on which the substrate P is not substantially deformed. Moreover, the board | substrate P may be conveyed so that the projection area | region PR on the board | substrate P may become planar shape, and the exposure apparatus may expose such a board | substrate P. FIG.

In addition, in each embodiment mentioned above, although the example of the exposure apparatus of the single lens system in which the number of illumination optical systems is one and the number of projection optical systems was demonstrated, the exposure apparatus used the several illumination optical system and the set of projection optical systems, The structure which arrange | positioned in multiple in the direction which the rotation center axis | shaft AX2, AX1 of the drum mask DM or the rotating drum DP extends may be sufficient, what is called a multi-lens type exposure apparatus.

In addition, in 1st Embodiment and 3rd Embodiment, although the pass range of illumination light L1 is prescribed | regulated using the reflecting part 16 of the optical separation part 10, the light shielding part provided separately from the reflecting part 16 is provided. You may define a passing range by the. For example, the light shielding part may absorb light incident on the outside of the passage part 15 to shield the light from passing through the optical separation part 10. In addition, the passage part 15 may be a space | gap (opening) arrange | positioned so that it may pass through illumination light L1, for example.

[Device manufacturing method]

Next, the device manufacturing method of said embodiment is demonstrated. 34 is a flowchart showing a device manufacturing method of the above embodiment. Some processes in this flowchart are performed in the device manufacturing systems SYS and SYS2 (flexible display manufacturing line) shown in previous FIG. 1 or FIG. However, in order to perform all the processes of the flowchart of FIG. 34, it is necessary to prepare several manufacturing processing apparatus further.

In the device manufacturing method shown in FIG. 34, first, the function and performance design of devices, such as an organic electroluminescence display, are performed, for example (step 201). Next, based on the design of the device, the mask pattern M is produced (step 202). Moreover, the board | substrate, such as a transparent film, a sheet | seat which is a base material of a device, or ultra-thin metal foil, is prepared by purchase, manufacture, etc. (step 203).

Subsequently, the prepared substrate is put into a roll-type or patch-type manufacturing line to form a TFT backplane layer such as an electrode, a wiring, an insulating film, or a semiconductor film constituting the device, or an organic EL light emitting layer serving as a pixel portion on the substrate. (Step 204). Step 204 typically includes a step of forming a resist pattern on the film on the substrate, and a step of etching the film using the resist pattern as a mask. In the formation of the resist pattern, a step of uniformly forming a resist film on the surface of the substrate, and a step of exposing the resist film of the substrate with patterned exposure light via the mask pattern M according to each of the above embodiments. The process of developing the resist film in which the latent image of a mask pattern was formed by the exposure is performed.

As a typical example of an additive process that does not use a conventional register process for saving resources, in the case of flexible device manufacturing using a printing technique or the like, a functional photosensitive layer (functionality) is formed on the surface of the flexible substrate. The exposure light patterned via the drum mask DM using the exposure apparatus shown in each said embodiment, and the process of forming a sensitive layer, a photosensitive silane coupling material, etc. by application | coating method, on a flexible board | substrate. Irradiating a functional photosensitive layer (functional sensitive layer) to form a hydrophilized part and a water repellent part according to the pattern shape in the functional photosensitive layer, and a high hydrophilicity of the functional photosensitive layer. A plating base liquid etc. are applied to a part, and the process of depositing and forming a metallic pattern by electroless plating, what is called a low temperature wet process below 120 degreeC, etc. are performed.

Next, depending on the device to be manufactured, for example, dicing or cutting a substrate, or another substrate manufactured by a separate process, for example, a sheet-like color filter having a sealing function, The process of bonding together a thin glass substrate etc. is performed, and a device (display panel) is assembled (step 205). Next, the device performs post-processing such as inspection (step 206). In this manner, the device can be manufactured. The device manufacturing method in the above embodiment conveys the sensitive substrate in a predetermined direction while rotating the drum mask (mask holding member) by the processing apparatus (substrate processing apparatus), and continuously exposes the mask pattern to the sensitive substrate. And a step of performing a subsequent process using a change in the sensitive layer of the exposed sensitive substrate.

10: optical separation section, 12: cylindrical surface,
15: through part, 16: reflecting part,
18: concave mirror, 19: uniform optical system,
23: first aperture member, 25: cylindrical lens,
26: second aperture member, 28: hibernation,
40: conjugate plane, 41: extension line,
42: middle top surface, 50: optical separation unit,
57: reflecting portion, 60: concave mirror,
IL: illumination optics, IR: illumination zone,
Im: intermediate phase, L0: light source phase,
L1: illumination light, L2: imaging beam,
L2a: daylight, M: mask pattern,
P: substrate, PL: projection optical system,
PR: projection area, PL1: first projection optical system,
PL2: 2nd projection optical system, U3: processing apparatus.

Claims (14)

A cylindrical drum mask having a reflective mask pattern for an electronic device formed along an outer circumferential surface of a predetermined radius from the first central axis is rotated around the first central axis to be projected onto the photosensitive sheet-like substrate moving in the longitudinal direction. A device manufacturing method using a projection exposure apparatus that exposes an image of the mask pattern through an optical system,
By the illumination optical system of the said projection exposure apparatus, the orientation characteristic of the illumination light irradiated to the illumination area | region on the outer peripheral surface of the said drum mask is made into the non-telecentric state with respect to the circumferential direction of the said outer peripheral surface, and is said 1st central axis By the telecentric state in the extending axial direction, the reflected light beam generated from the illumination region is made telecentric in both the circumferential direction of the outer circumferential surface and the axial direction to the projection optical system. A device manufacturing method comprising incidence. The method according to claim 1,
And the illumination optical system forms a first conjugate plane between the outer circumferential surface of the drum mask and the first central axis that is optically conjugate with the light source image serving as the source of the illumination light. The method according to claim 2,
And a distance from said first central axis to said first conjugate plane is set to half of a radius of said outer circumferential surface. The method according to claim 3,
The projection optical system has a pupil face on which the light source image is formed, and the light source image formed on the pupil face is set so that a dimension corresponding to the circumferential direction of the outer circumferential surface is larger than a dimension corresponding to the axial direction. The method according to any one of claims 1 to 4,
The device for manufacturing a device in which the illumination optical system is provided with an optical member having a different refractive power in the circumferential direction and the axial direction so that the orientation characteristic of the illumination light toward the illumination region on the drum mask is different in the circumferential direction and the axial direction. . The method according to claim 5,
The projection exposure apparatus includes an outer circumferential surface which winds and supports the sheet-shaped substrate so as to have a constant radius from a second central axis arranged in parallel with the first central axis, wherein the sheet is rotated around the second central axis. A device manufacturing method comprising a rotating drum for moving a shaped substrate in a longitudinal direction. The method according to any one of claims 1 to 4,
The projection exposure apparatus includes an outer circumferential surface which winds and supports the sheet-shaped substrate so as to have a constant radius from a second central axis arranged in parallel with the first central axis, wherein the sheet is rotated around the second central axis. A device manufacturing method comprising a rotating drum for moving a shaped substrate in a longitudinal direction. The method according to claim 7,
On the sheet-like substrate before being carried into the rotating drum of the projection exposure apparatus, a photoresist, a photosensitive coupling material, a photosensitive plating reducing agent, or a UV curable resin by any one of the photosensitive functional layers is continuously or in a long direction by a coating apparatus. A device manufacturing method optionally applied. The method according to claim 8,
The sheet-like substrate in which the image of the mask pattern is exposed on the photosensitive functional layer by the projection exposure apparatus is then sent to a wet processing apparatus and subjected to wet processing. A cylindrical drum mask having a reflective mask pattern for an electronic device formed along an outer circumferential surface of a predetermined radius from the first central axis is rotated around the first central axis to be projected onto the photosensitive sheet-like substrate moving in the longitudinal direction. A device manufacturing method using a projection exposure apparatus that exposes an image of the mask pattern through an optical system,
By the illumination optical system of the projection exposure apparatus, the chief ray distributed in the circumferential direction of the outer circumferential surface toward the illumination region set on the outer circumferential surface of the drum mask is in a non-telecentric state, and the first central axis is Irradiating the illumination light of the orientation characteristic that the chief ray extending in the extending axial direction becomes a telecentric state,
And injecting the chief ray of the reflected light beam generated from the illumination region into the projection optical system in a telecentric state in both the circumferential direction and the axial direction of the outer circumferential surface. The method according to claim 10,
And the illumination optical system forms a first conjugate plane between the outer circumferential surface of the drum mask and the first central axis that is optically conjugate with the light source image serving as the source of the illumination light. The method according to claim 11,
And a distance from said first central axis to said first conjugate plane is set to half of a radius of said outer circumferential surface. The method according to claim 12,
The projection optical system has a pupil face on which the light source image is formed, and the light source image formed on the pupil face is set so that a dimension corresponding to the circumferential direction of the outer circumferential surface is larger than a dimension corresponding to the axial direction. The method according to any one of claims 10 to 13,
The device for manufacturing a device in which the illumination optical system is provided with an optical member having a different refractive power in the circumferential direction and the axial direction so that the orientation characteristic of the illumination light toward the illumination region on the drum mask is different in the circumferential direction and the axial direction. .

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