HK1163598A1 - 粒子和使用粒子的墨和薄膜 - Google Patents

粒子和使用粒子的墨和薄膜

Info

Publication number
HK1163598A1
HK1163598A1 HK12104052.3A HK12104052A HK1163598A1 HK 1163598 A1 HK1163598 A1 HK 1163598A1 HK 12104052 A HK12104052 A HK 12104052A HK 1163598 A1 HK1163598 A1 HK 1163598A1
Authority
HK
Hong Kong
Prior art keywords
inks
films
particles
Prior art date
Application number
HK12104052.3A
Other languages
English (en)
Inventor
Sachin Parashar
Siuli Sarkar
Oscar Khaselev
Brian Lewis
Michael Marczi
Bawa Singh
Nitin Desai
Michael Liberatore
Original Assignee
Alpha Metals
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alpha Metals filed Critical Alpha Metals
Publication of HK1163598A1 publication Critical patent/HK1163598A1/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00Making metallic powder or suspensions thereof
    • B22F9/16Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/03Printing inks characterised by features other than the chemical nature of the binder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05Metallic powder characterised by the size or surface area of the particles
    • B22F1/054Nanosized particles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05Metallic powder characterised by the size or surface area of the particles
    • B22F1/054Nanosized particles
    • B22F1/0545Dispersions or suspensions of nanosized particles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102Metallic powder coated with organic material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/30Inkjet printing inks
    • C09D11/38Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/60Additives non-macromolecular
    • C09D7/61Additives non-macromolecular inorganic
    • C09D7/62Additives non-macromolecular inorganic modified by treatment with other compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/66Additives characterised by particle size
    • C09D7/67Particle size smaller than 100 nm
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00Coating starting from inorganic powder
    • C23C24/08Coating starting from inorganic powder by application of heat or pressure and heat
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00Coating not provided for in groups C23C2/00 - C23C24/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60Forming conductive regions or layers, e.g. electrodes
    • H10K71/611Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K99/00Subject matter not provided for in other groups of this subclass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00Crystal-structural characteristics
    • C01P2002/80Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70
    • C01P2002/84Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70 by UV- or VIS- data
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/62Submicrometer sized, i.e. from 0.1-1 micrometer
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/64Nanometer sized, i.e. from 1-100 nanometer
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/04Ingredients treated with organic substances
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0224Conductive particles having an insulating coating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982Particulate matter [e.g., sphere, flake, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991Coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Composite Materials (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Powder Metallurgy (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
HK12104052.3A 2006-08-03 2012-04-24 粒子和使用粒子的墨和薄膜 HK1163598A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/462,089 US7968008B2 (en) 2006-08-03 2006-08-03 Particles and inks and films using them

Publications (1)

Publication Number Publication Date
HK1163598A1 true HK1163598A1 (zh) 2012-09-14

Family

ID=38728951

Family Applications (1)

Application Number Title Priority Date Filing Date
HK12104052.3A HK1163598A1 (zh) 2006-08-03 2012-04-24 粒子和使用粒子的墨和薄膜

Country Status (7)

Country Link
US (2) US7968008B2 (zh)
EP (2) EP2380688B1 (zh)
JP (1) JP5556176B2 (zh)
KR (1) KR101431570B1 (zh)
CA (1) CA2659028C (zh)
HK (1) HK1163598A1 (zh)
WO (1) WO2008017062A1 (zh)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7968008B2 (en) * 2006-08-03 2011-06-28 Fry's Metals, Inc. Particles and inks and films using them
US9615463B2 (en) * 2006-09-22 2017-04-04 Oscar Khaselev Method for producing a high-aspect ratio conductive pattern on a substrate
JP5219296B2 (ja) * 2006-09-22 2013-06-26 フライズ・メタルズ・インコーポレイテッド 金属およびインクのための溶剤系
US9580810B2 (en) * 2007-02-27 2017-02-28 Mitsubishi Materials Corporation Dispersion of metal nanoparticles, method for producing the same, and method for synthesizing metal nanoparticles
US8312623B2 (en) 2007-03-29 2012-11-20 Fry's Metals, Inc. Methods for producing electrical conductors
US9362424B2 (en) 2007-03-29 2016-06-07 Oscar Khaselev Electrical contacts
KR20080106102A (ko) * 2007-05-30 2008-12-04 주식회사 엘지화학 금속 착화합물을 포함하는 탄소 나노튜브 분산제
US8555491B2 (en) * 2007-07-19 2013-10-15 Alpha Metals, Inc. Methods of attaching a die to a substrate
US8304062B2 (en) * 2007-07-20 2012-11-06 Fry's Metals, Inc. Electrical conductors and methods of making and using them
CA2717665C (en) * 2008-04-28 2013-03-12 Tata Chemicals Limited A process for the preparation of silver nano particles
EP2157067B1 (de) * 2008-07-30 2012-09-12 Ivoclar Vivadent AG Mit einer farbgebenden Komponente beschichtete Primärpartikel
US9095898B2 (en) * 2008-09-15 2015-08-04 Lockheed Martin Corporation Stabilized metal nanoparticles and methods for production thereof
WO2010036953A2 (en) 2008-09-26 2010-04-01 Fry's Metals, Inc. Conductive compositions and methods of using them
KR101038784B1 (ko) * 2009-02-03 2011-06-03 삼성전기주식회사 금속 배선의 형성방법 및 이를 이용하여 형성된 금속 배선
KR101105348B1 (ko) * 2009-05-13 2012-01-16 주식회사 유월드테크 잉크젯 프린터용 전도성 잉크 조성물 및 그 제조 방법
US8277894B2 (en) * 2009-07-16 2012-10-02 Rohm And Haas Electronic Materials Llc Selenium ink and methods of making and using same
JP2011042758A (ja) * 2009-08-24 2011-03-03 Yokohama Rubber Co Ltd:The インクジェットプリンタ用インク、導電性配線の形成方法および導電性配線
US8894760B2 (en) * 2009-11-20 2014-11-25 Rohm And Haas Electronic Materials Llc Group 3a ink and methods of making and using same
US8765025B2 (en) * 2010-06-09 2014-07-01 Xerox Corporation Silver nanoparticle composition comprising solvents with specific hansen solubility parameters
US8871370B2 (en) * 2010-09-24 2014-10-28 Jian Zhang Water based biological and photochemical batteries
WO2012061511A2 (en) 2010-11-03 2012-05-10 Fry's Metals, Inc. Sintering materials and attachment methods using same
KR101287938B1 (ko) * 2011-01-17 2013-07-22 한국화학연구원 나노 결정 실리콘의 제조방법
KR101273694B1 (ko) * 2011-02-25 2013-06-12 삼성전기주식회사 구리 나노 페이스트 및 그 형성 방법, 그리고 상기 구리 나노 페이스트를 이용한 전극 형성 방법
US9272334B2 (en) * 2011-04-12 2016-03-01 GM Global Technology Operations LLC Synthesis of platinum-alloy nanoparticles and supported catalysts including the same
WO2013147535A1 (en) * 2012-03-30 2013-10-03 Korea Research Institute Of Chemical Technology Synthetic method of suppressing metal nano-particle from having oxidized film and method of manufacturing conductive metal thin film via solution-processed
KR101418276B1 (ko) * 2012-03-30 2014-07-15 한국화학연구원 표면 산화막 형성이 제어된 금속 나노 입자 합성 방법 및 용액 공정을 통한 금속 전도성 박막의 제조방법
US9872916B2 (en) 2012-04-06 2018-01-23 University of North Texas Office of Economic Development and Technology Transfer Facile method for making non-toxic biomedical compositions comprising hybrid metal-polymer microparticles
US9034075B2 (en) 2012-04-30 2015-05-19 Dow Global Technologies Llc Methods of manufacturing high aspect ratio silver nanowires
SG11201502567TA (en) * 2012-10-29 2015-05-28 Alpha Metals Sintering powder
KR101346240B1 (ko) * 2013-03-15 2014-01-02 한국화학연구원 나노 결정 실리콘의 제조방법
WO2014172252A1 (en) * 2013-04-15 2014-10-23 Kent State University Patterned liquid crystal alignment using ink-jet printed nanoparticles and use thereof to produce patterned, electro-optically addressable devices; ink-jet printable compositions
SG11201510700VA (en) * 2013-06-26 2016-01-28 Agency Science Tech & Res Metal-containing particles, processes for their preparation, and uses thereof
US10000652B2 (en) 2013-07-24 2018-06-19 National Research Council Of Canada Process for depositing metal on a substrate
TW201611198A (zh) * 2014-04-11 2016-03-16 阿爾發金屬公司 低壓燒結粉末
US10465295B2 (en) * 2014-05-20 2019-11-05 Alpha Assembly Solutions Inc. Jettable inks for solar cell and semiconductor fabrication
CN106660120A (zh) * 2014-06-12 2017-05-10 阿尔法金属公司 烧结材料和使用其的固定方法
EP3157695B1 (en) * 2014-06-23 2024-01-31 Alpha Assembly Solutions Inc. Multilayered metal nanoparticles
DE102015013238A1 (de) 2014-10-28 2016-04-28 Dow Global Technologies Llc Verfahren mit niedriger Sauerstoffkonzentration zur Herstellung von Silber-Nanodrähten
DE102015013220A1 (de) 2014-10-28 2016-04-28 Dow Global Technologies Llc Verfahren zur Herstellung von Silber-Nanodrähten
DE102015013239A1 (de) 2014-10-28 2016-04-28 Dow Global Technologies Llc Hydrothermalverfahren zur Herstellung von Silber-Nanodrähten
DE102015013219A1 (de) 2014-10-28 2016-04-28 Dow Global Technologies Llc Verfahren zur Herstellung von Silber-Nanodrähten
KR102052326B1 (ko) * 2014-12-17 2019-12-05 알파 어셈블리 솔루션스 인크. 다이 및 클립 부착 방법
US10376898B2 (en) 2015-06-12 2019-08-13 Dow Global Technologies Llc Method for manufacturing high aspect ratio silver nanowires
US10081020B2 (en) 2015-06-12 2018-09-25 Dow Global Technologies Llc Hydrothermal method for manufacturing filtered silver nanowires
JP2017171974A (ja) * 2016-03-23 2017-09-28 株式会社豊田中央研究所 ポリマー被覆鉄ニッケル合金微粒子、その製造方法、及びそれを用いた印刷用組成物及び磁性体膜
US10982107B2 (en) * 2018-07-24 2021-04-20 Xerox Corporation Metal nanoparticle ink composition

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5413617A (en) 1993-09-13 1995-05-09 National Science Council Process for the preparation of silver powder with a controlled surface area by reduction reaction
JPH0920903A (ja) * 1995-06-30 1997-01-21 Tanaka Kikinzoku Internatl Kk 単分散球状金粒子粉末の製造方法
US5882722A (en) * 1995-07-12 1999-03-16 Partnerships Limited, Inc. Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds
US5922403A (en) * 1996-03-12 1999-07-13 Tecle; Berhan Method for isolating ultrafine and fine particles
US6103868A (en) * 1996-12-27 2000-08-15 The Regents Of The University Of California Organically-functionalized monodisperse nanocrystals of metals
US6780765B2 (en) * 1998-08-14 2004-08-24 Avery N. Goldstein Integrated circuit trenched features and method of producing same
US6660058B1 (en) 2000-08-22 2003-12-09 Nanopros, Inc. Preparation of silver and silver alloyed nanoparticles in surfactant solutions
US7351468B2 (en) * 2000-10-26 2008-04-01 E. I. Du Pont De Nemours And Company Interlayers for laminated safety glass with superior de-airing and laminating properties and process for making the same
JP4183924B2 (ja) * 2001-03-30 2008-11-19 日揮触媒化成株式会社 金属微粒子および該微粒子の製造方法、該微粒子を含む透明導電性被膜形成用塗布液、透明導電性被膜付基材、表示装置
JP2002317215A (ja) * 2001-04-19 2002-10-31 Mitsuboshi Belting Ltd 金属微粒子の製造方法
US6645444B2 (en) * 2001-06-29 2003-11-11 Nanospin Solutions Metal nanocrystals and synthesis thereof
US6951666B2 (en) * 2001-10-05 2005-10-04 Cabot Corporation Precursor compositions for the deposition of electrically conductive features
JP2003253310A (ja) * 2001-12-28 2003-09-10 Mitsuboshi Belting Ltd 金属微粒子の製造方法
JP3796476B2 (ja) 2002-10-25 2006-07-12 バンドー化学株式会社 導電性インク
JP4248857B2 (ja) * 2002-11-29 2009-04-02 三ツ星ベルト株式会社 銀微粒子の製造方法
JP2005060816A (ja) * 2002-11-29 2005-03-10 Mitsuboshi Belting Ltd 合金微粒子の製造方法及び合金薄膜の製造方法
EP1434281A3 (en) 2002-12-26 2007-10-24 Konica Minolta Holdings, Inc. Manufacturing method of thin-film transistor, thin-film transistor sheet, and electric circuit
JP2005060824A (ja) * 2003-07-28 2005-03-10 Mitsuboshi Belting Ltd 合金微粒子の製造方法及び合金薄膜の製造方法
JP4447273B2 (ja) * 2003-09-19 2010-04-07 三井金属鉱業株式会社 銀インク及びその銀インクの製造方法
US7160525B1 (en) * 2003-10-14 2007-01-09 The Board Of Trustees Of The University Of Arkansas Monodisperse noble metal nanocrystals
US20050129843A1 (en) 2003-12-11 2005-06-16 Xerox Corporation Nanoparticle deposition process
WO2005088652A1 (ja) * 2004-03-10 2005-09-22 Asahi Glass Company, Limited 金属含有微粒子、金属含有微粒子分散液および導電性金属含有材料
JP4246104B2 (ja) * 2004-04-26 2009-04-02 田中貴金属工業株式会社 金属コロイド溶液の製造方法及び該金属コロイド溶液の製造方法により得られた金属コロイド溶液を用いた回路形成方法
US7270694B2 (en) * 2004-10-05 2007-09-18 Xerox Corporation Stabilized silver nanoparticles and their use
US8227022B2 (en) 2005-01-10 2012-07-24 Yissum Research Development Company Of The Hebrew University Of Jerusalem Method of forming aqueous-based dispersions of metal nanoparticles
US7345370B2 (en) 2005-01-12 2008-03-18 International Business Machines Corporation Wiring patterns formed by selective metal plating
US20060163744A1 (en) 2005-01-14 2006-07-27 Cabot Corporation Printable electrical conductors
CA2594806C (en) * 2005-01-14 2015-06-02 Cabot Corporation Security features, their use, and processes for making them
JP4635262B2 (ja) * 2005-03-31 2011-02-23 独立行政法人産業技術総合研究所 金属ナノ粒子の製造方法及び金属ナノ粒子
US20060254387A1 (en) * 2005-05-10 2006-11-16 Samsung Electro-Mechanics Co., Ltd. Metal nano particle and method for manufacturing them and conductive ink
KR100690360B1 (ko) 2005-05-23 2007-03-09 삼성전기주식회사 도전성 잉크, 그 제조방법 및 도전성 기판
JP4908002B2 (ja) * 2005-05-31 2012-04-04 三ツ星ベルト株式会社 貴金属微粒子の製造方法および貴金属薄膜の製造方法
KR100711967B1 (ko) 2005-08-08 2007-05-02 삼성전기주식회사 금속 나노 입자의 제조방법 및 도전성 잉크
US7291292B2 (en) * 2005-08-26 2007-11-06 E.I. Du Pont De Nemours And Company Preparation of silver particles using thermomorphic polymers
JP4822783B2 (ja) * 2005-09-22 2011-11-24 株式会社日本触媒 金属ナノ粒子の製法および当該製法により得られた粒子のコロイド
JP2007175619A (ja) * 2005-12-28 2007-07-12 Mitsuboshi Belting Ltd 金属薄膜の製造方法
CN100384572C (zh) 2005-12-29 2008-04-30 黄德欢 一种无机物载纳米银溶胶的制备方法
JP5063003B2 (ja) * 2006-01-25 2012-10-31 株式会社日本触媒 銅ナノ粒子の製造方法、銅ナノ粒子、導電性組成物および電子デバイス
JP4995492B2 (ja) * 2006-06-02 2012-08-08 株式会社日本触媒 銅ナノ粒子の製造方法、銅ナノ粒子、銅ナノ粒子分散体および電子デバイス
US7968008B2 (en) * 2006-08-03 2011-06-28 Fry's Metals, Inc. Particles and inks and films using them
JP5219296B2 (ja) 2006-09-22 2013-06-26 フライズ・メタルズ・インコーポレイテッド 金属およびインクのための溶剤系
US9615463B2 (en) 2006-09-22 2017-04-04 Oscar Khaselev Method for producing a high-aspect ratio conductive pattern on a substrate
US10123430B2 (en) 2006-10-17 2018-11-06 Alpha Assembly Solutions Inc. Materials for use with interconnects of electrical devices and related methods

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CA2659028C (en) 2015-10-20
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WO2008017062A1 (en) 2008-02-07
EP2066470A1 (en) 2009-06-10
US20080032047A1 (en) 2008-02-07
US20110318478A1 (en) 2011-12-29
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US7968008B2 (en) 2011-06-28
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