SG11201502567TA - Sintering powder - Google Patents
Sintering powderInfo
- Publication number
- SG11201502567TA SG11201502567TA SG11201502567TA SG11201502567TA SG11201502567TA SG 11201502567T A SG11201502567T A SG 11201502567TA SG 11201502567T A SG11201502567T A SG 11201502567TA SG 11201502567T A SG11201502567T A SG 11201502567TA SG 11201502567T A SG11201502567T A SG 11201502567TA
- Authority
- SG
- Singapore
- Prior art keywords
- sintering powder
- sintering
- powder
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G5/00—Compounds of silver
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/103—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing an organic binding agent comprising a mixture of, or obtained by reaction of, two or more components other than a solvent or a lubricating agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/62—Metallic pigments or fillers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
- C09C3/08—Treatment with low-molecular-weight non-polymer organic compounds
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0466—Alloys based on noble metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
- C01P2002/72—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by d-values or two theta-values, e.g. as X-ray diagram
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/80—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70
- C01P2002/88—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70 by thermal analysis data, e.g. TGA, DTA, DSC
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/01—Particle morphology depicted by an image
- C01P2004/04—Particle morphology depicted by an image obtained by TEM, STEM, STM or AFM
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/51—Particles with a specific particle size distribution
- C01P2004/53—Particles with a specific particle size distribution bimodal size distribution
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/22—Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/32—Thermal properties
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/40—Electric properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261719700P | 2012-10-29 | 2012-10-29 | |
US201361772343P | 2013-03-04 | 2013-03-04 | |
US201361781338P | 2013-03-14 | 2013-03-14 | |
PCT/GB2013/052817 WO2014068299A1 (en) | 2012-10-29 | 2013-10-29 | Sintering powder |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201502567TA true SG11201502567TA (en) | 2015-05-28 |
Family
ID=49551701
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201502567TA SG11201502567TA (en) | 2012-10-29 | 2013-10-29 | Sintering powder |
Country Status (9)
Country | Link |
---|---|
US (3) | US10259980B2 (en) |
EP (2) | EP3659971A1 (en) |
JP (1) | JP6293767B2 (en) |
KR (3) | KR20220130266A (en) |
CN (2) | CN108907178B (en) |
MY (1) | MY173832A (en) |
SG (1) | SG11201502567TA (en) |
TW (1) | TWI666656B (en) |
WO (1) | WO2014068299A1 (en) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013208387A1 (en) * | 2013-05-07 | 2014-11-13 | Robert Bosch Gmbh | Silver composite sintered pastes for low temperature sintered joints |
JP2017504468A (en) * | 2013-10-17 | 2017-02-09 | エックスジェット・リミテッドXjet Ltd. | Method and system for printing 3D objects by inkjet |
TW201611198A (en) * | 2014-04-11 | 2016-03-16 | 阿爾發金屬公司 | Low pressure sintering powder |
BR112016024827A2 (en) * | 2014-04-23 | 2017-08-15 | Alpha Metals | method for making metal powder |
EP3154729A4 (en) * | 2014-06-12 | 2018-02-28 | Alpha Metals, Inc. | Sintering materials and attachment methods using same |
EP3157695B1 (en) * | 2014-06-23 | 2024-01-31 | Alpha Assembly Solutions Inc. | Multilayered metal nanoparticles |
KR102360575B1 (en) | 2015-05-08 | 2022-02-09 | 헨켈 아이피 앤드 홀딩 게엠베하 | Sinterable films and pastes, and methods of use thereof |
WO2017003980A1 (en) * | 2015-06-29 | 2017-01-05 | Corning Incorporated | Manufacturing line, process, and sintered article |
JP6704322B2 (en) | 2015-09-30 | 2020-06-03 | 日東電工株式会社 | Sheets and composite sheets |
JP2017066485A (en) * | 2015-09-30 | 2017-04-06 | 日東電工株式会社 | Sheet and composite sheet |
RU2623251C2 (en) * | 2015-10-28 | 2017-06-23 | Олег Ювенальевич Кузнецов | Method of producing a colloidal water solution of silver |
JP6812768B2 (en) * | 2015-12-11 | 2021-01-13 | Dic株式会社 | Conductive paste |
JP6920029B2 (en) * | 2016-04-04 | 2021-08-18 | 日亜化学工業株式会社 | Metal powder sintered paste and its manufacturing method, conductive material manufacturing method |
JP7017562B2 (en) * | 2016-05-13 | 2022-02-08 | マントル インク | Sinterable metal paste for use in additive manufacturing |
WO2018008270A1 (en) * | 2016-07-04 | 2018-01-11 | バンドー化学株式会社 | Conductive paste and method for forming conductive pattern |
EP3333230A1 (en) * | 2016-12-08 | 2018-06-13 | Henkel AG & Co. KGaA | A composition suitable for application with laser induced forward transfer (lift) |
TW201842086A (en) * | 2017-02-08 | 2018-12-01 | 加拿大國家研究委員會 | Method of finishing a metallic conductive layer |
JP7031678B2 (en) * | 2017-09-20 | 2022-03-08 | 株式会社村田製作所 | Ceramic substrate manufacturing method, ceramic substrate, and module |
WO2019092960A1 (en) | 2017-11-13 | 2019-05-16 | 日東電工株式会社 | Composition for sinter bonding, sheet for sinter bonding, and dicing tape having sheet for sinter bonding |
WO2019163568A1 (en) * | 2018-02-22 | 2019-08-29 | リンテック株式会社 | Film-like firing material and film-like firing material with support sheet |
KR102486410B1 (en) * | 2018-06-26 | 2023-01-09 | 알파 어셈블리 솔루션스 인크. | Nanocopper pastes and films for sintered die attach and similar applications |
DE102018128748A1 (en) | 2018-11-15 | 2020-05-20 | Infineon Technologies Ag | METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE WITH A PASTE LAYER AND SEMICONDUCTOR DEVICE |
TWI784320B (en) | 2019-09-24 | 2022-11-21 | 美商阿爾發金屬化工公司 | Sintering composition, methods of manufacturing and using the same, and uses thereof |
CN114845827B (en) * | 2019-12-20 | 2023-09-15 | 三菱综合材料株式会社 | Silver paste, method for producing same, and method for producing joined body |
US11938543B2 (en) * | 2021-04-09 | 2024-03-26 | Heraeus Deutschland GmbH & Co. KG | Silver sintering preparation and the use thereof for the connecting of electronic components |
WO2023224555A2 (en) * | 2022-05-17 | 2023-11-23 | National University Of Singapore | A composition and a composite material |
GR1010610B (en) * | 2022-12-16 | 2024-01-23 | Εθνικο Μετσοβιο Πολυτεχνειο, | Hybrid thermosetting microbeads having deposited silver nanoparticles |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4463030A (en) * | 1979-07-30 | 1984-07-31 | Graham Magnetics Incorporated | Process for forming novel silver powder composition |
CN1062486A (en) * | 1990-12-20 | 1992-07-08 | 吉林工业大学 | Technology for sintering powder metallurgical product by laser radiation |
US6514307B2 (en) * | 2000-08-31 | 2003-02-04 | Kawasaki Steel Corporation | Iron-based sintered powder metal body, manufacturing method thereof and manufacturing method of iron-based sintered component with high strength and high density |
KR100647238B1 (en) * | 2000-10-25 | 2006-11-17 | 하리마카세이 가부시기가이샤 | Electroconductive metal paste and method for production thereof |
DE102006013729A1 (en) * | 2006-03-24 | 2007-10-04 | Esk Ceramics Gmbh & Co. Kg | Sintered material based on transition metal borides cotaining finely divided transition metal diboride, or transition metal diboride mixed crystals useful in cryolite melts and as electrode protective material |
US7968008B2 (en) * | 2006-08-03 | 2011-06-28 | Fry's Metals, Inc. | Particles and inks and films using them |
JP5139659B2 (en) * | 2006-09-27 | 2013-02-06 | Dowaエレクトロニクス株式会社 | Silver particle composite powder and method for producing the same |
JP4872663B2 (en) | 2006-12-28 | 2012-02-08 | 株式会社日立製作所 | Joining material and joining method |
US8555491B2 (en) * | 2007-07-19 | 2013-10-15 | Alpha Metals, Inc. | Methods of attaching a die to a substrate |
JP2009097074A (en) * | 2007-09-27 | 2009-05-07 | Mitsuboshi Belting Ltd | Metal nanoparticle paste, and pattern forming method |
JP5274000B2 (en) * | 2007-12-07 | 2013-08-28 | Dowaエレクトロニクス株式会社 | Low-temperature sinterable silver fine powder and silver paint and method for producing them |
JP5371247B2 (en) * | 2008-01-06 | 2013-12-18 | Dowaエレクトロニクス株式会社 | Silver paint and production method thereof |
WO2009149071A2 (en) * | 2008-06-02 | 2009-12-10 | Tdy Industries, Inc. | Cemented carbide-metallic alloy composites |
CN102076447B (en) * | 2008-06-30 | 2014-12-17 | 同和电子科技有限公司 | Metal microparticle containing composition and process for production of the same |
JP5546551B2 (en) * | 2008-11-21 | 2014-07-09 | ヘンケル コーポレイション | Thermally decomposable polymer-coated metal powder |
DE102009015470A1 (en) * | 2008-12-12 | 2010-06-17 | Byk-Chemie Gmbh | Process for the preparation of metal nanoparticles and metal nanoparticles obtained in this way and their use |
EP2204249A1 (en) * | 2008-12-16 | 2010-07-07 | Akzo Nobel Coatings International B.V. | Aqueous dispersions of metallic particles |
JP5278905B2 (en) | 2009-04-13 | 2013-09-04 | 独立行政法人 国立印刷局 | Quality inspection equipment |
JP5574761B2 (en) * | 2009-04-17 | 2014-08-20 | 国立大学法人山形大学 | Coated silver ultrafine particles and method for producing the same |
US8211205B1 (en) * | 2009-07-28 | 2012-07-03 | Ut Dots, Inc. | Method of controlled synthesis of nanoparticles |
DE102009040076A1 (en) | 2009-09-04 | 2011-03-10 | W.C. Heraeus Gmbh | Metal paste with oxidizing agent |
JP5824201B2 (en) * | 2009-09-11 | 2015-11-25 | Dowaエレクトロニクス株式会社 | Bonding material and bonding method using the same |
US8591624B2 (en) * | 2010-02-25 | 2013-11-26 | National Tsing Hua University | Methods for preparing hydrophobic metal nanoparticles and precursors used therein |
WO2011126706A2 (en) * | 2010-04-09 | 2011-10-13 | Henkel Corporation | Printable materials and methods of manufacture thereof |
DE102010044329A1 (en) * | 2010-09-03 | 2012-03-08 | Heraeus Materials Technology Gmbh & Co. Kg | Contacting agent and method for contacting electrical components |
JP5623861B2 (en) * | 2010-10-14 | 2014-11-12 | 株式会社東芝 | Metal nanoparticle dispersion composition |
KR101310479B1 (en) | 2011-02-28 | 2013-09-24 | 삼성전기주식회사 | Paste composition of conductive metals and method for preparing the same |
JP2012182111A (en) * | 2011-02-28 | 2012-09-20 | Samsung Electro-Mechanics Co Ltd | Conductive metal paste composition and manufacturing method thereof |
JP2012216641A (en) | 2011-03-31 | 2012-11-08 | Fujikura Ltd | Wafer housing cassette and carrying method |
-
2013
- 2013-10-29 CN CN201810841443.1A patent/CN108907178B/en active Active
- 2013-10-29 EP EP19211765.3A patent/EP3659971A1/en active Pending
- 2013-10-29 MY MYPI2015000905A patent/MY173832A/en unknown
- 2013-10-29 JP JP2015538574A patent/JP6293767B2/en active Active
- 2013-10-29 WO PCT/GB2013/052817 patent/WO2014068299A1/en active Application Filing
- 2013-10-29 CN CN201380054460.6A patent/CN104736483A/en active Pending
- 2013-10-29 TW TW102139121A patent/TWI666656B/en active
- 2013-10-29 KR KR1020227032008A patent/KR20220130266A/en active IP Right Grant
- 2013-10-29 KR KR1020157013949A patent/KR102284082B1/en active IP Right Grant
- 2013-10-29 KR KR1020217023591A patent/KR102445401B1/en active IP Right Grant
- 2013-10-29 EP EP13786715.6A patent/EP2911979B1/en active Active
- 2013-10-29 SG SG11201502567TA patent/SG11201502567TA/en unknown
- 2013-10-29 US US14/438,888 patent/US10259980B2/en active Active
-
2019
- 2019-03-01 US US16/289,789 patent/US11162007B2/en active Active
-
2021
- 2021-10-04 US US17/493,247 patent/US20220169905A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
EP2911979A1 (en) | 2015-09-02 |
EP2911979B1 (en) | 2019-12-04 |
TWI666656B (en) | 2019-07-21 |
US20150353804A1 (en) | 2015-12-10 |
EP3659971A1 (en) | 2020-06-03 |
CN108907178B (en) | 2020-12-15 |
KR20150079857A (en) | 2015-07-08 |
US20220169905A1 (en) | 2022-06-02 |
CN108907178A (en) | 2018-11-30 |
MY173832A (en) | 2020-02-24 |
KR102284082B1 (en) | 2021-07-30 |
US20190194517A1 (en) | 2019-06-27 |
KR20220130266A (en) | 2022-09-26 |
CN104736483A (en) | 2015-06-24 |
JP2015536385A (en) | 2015-12-21 |
US11162007B2 (en) | 2021-11-02 |
US10259980B2 (en) | 2019-04-16 |
WO2014068299A1 (en) | 2014-05-08 |
JP6293767B2 (en) | 2018-03-14 |
KR20210095739A (en) | 2021-08-02 |
TW201426765A (en) | 2014-07-01 |
KR102445401B1 (en) | 2022-09-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG11201502567TA (en) | Sintering powder | |
IL291571A (en) | Cx3cr1-binding polypeptides | |
EP2890621A4 (en) | Powder dispenser | |
EP2913546A4 (en) | Sintered bearing | |
EP2829873A4 (en) | Porous silica powder | |
EP2917043A4 (en) | Paintscraper with diamond powder | |
GB201220474D0 (en) | Polypeptides | |
EP2849716A4 (en) | Easily formulated zinc oxide powder | |
EP2772472A4 (en) | Sintered ceramic body | |
ZA201500743B (en) | Sintered alumina particle | |
SG11201504134SA (en) | External preparation | |
EP2912124A4 (en) | Powder coating composition | |
EP2833376A4 (en) | NdFeB-BASED SINTERED MAGNET | |
EP2857421A4 (en) | Cellulose powder | |
EP2878839A4 (en) | Sintered bearing | |
EP2889883A4 (en) | Ndfeb-based sintered magnet | |
EP2680823A4 (en) | Binder powders | |
EP2933042A4 (en) | Starting material powder for powder metallurgy | |
EP2868485A4 (en) | Binder | |
EP2844410A4 (en) | Metal powder casting | |
EP2867303A4 (en) | Silsesquioxane-like particles | |
PL2928936T3 (en) | Binder | |
GB201721211D0 (en) | Improved materials | |
HK1213221A1 (en) | Silver powder | |
GB201218081D0 (en) | Prosthesis |