HK1147782A1 - Method of obtaining a yellow gold alloy coating by electroplating without the use of toxic metals or metalloids - Google Patents

Method of obtaining a yellow gold alloy coating by electroplating without the use of toxic metals or metalloids

Info

Publication number
HK1147782A1
HK1147782A1 HK11101836.3A HK11101836A HK1147782A1 HK 1147782 A1 HK1147782 A1 HK 1147782A1 HK 11101836 A HK11101836 A HK 11101836A HK 1147782 A1 HK1147782 A1 HK 1147782A1
Authority
HK
Hong Kong
Prior art keywords
metalloids
electroplating
obtaining
gold alloy
alloy coating
Prior art date
Application number
HK11101836.3A
Other languages
English (en)
Inventor
Giuseppe Aliprandini
Michel Caillaud
Original Assignee
Aliprandini G
Swatch Group Res & Dev Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39967872&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1147782(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Aliprandini G, Swatch Group Res & Dev Ltd filed Critical Aliprandini G
Publication of HK1147782A1 publication Critical patent/HK1147782A1/xx

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/62Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/48Electroplating: Baths therefor from solutions of gold
HK11101836.3A 2007-09-21 2011-02-24 Method of obtaining a yellow gold alloy coating by electroplating without the use of toxic metals or metalloids HK1147782A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH01494/07A CH710184B1 (fr) 2007-09-21 2007-09-21 Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques.
PCT/EP2008/062042 WO2009037180A1 (fr) 2007-09-21 2008-09-11 Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques

Publications (1)

Publication Number Publication Date
HK1147782A1 true HK1147782A1 (en) 2011-08-19

Family

ID=39967872

Family Applications (1)

Application Number Title Priority Date Filing Date
HK11101836.3A HK1147782A1 (en) 2007-09-21 2011-02-24 Method of obtaining a yellow gold alloy coating by electroplating without the use of toxic metals or metalloids

Country Status (12)

Country Link
US (3) US10233555B2 (xx)
EP (1) EP2205778B1 (xx)
JP (2) JP5563462B2 (xx)
KR (1) KR101280675B1 (xx)
CN (1) CN101815814B (xx)
AT (1) ATE499461T1 (xx)
CH (1) CH710184B1 (xx)
DE (1) DE602008005184D1 (xx)
HK (1) HK1147782A1 (xx)
IN (1) IN2014CN02464A (xx)
TW (2) TWI441959B (xx)
WO (1) WO2009037180A1 (xx)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH714243B1 (fr) * 2006-10-03 2019-04-15 Swatch Group Res & Dev Ltd Procédé d'électroformage et pièce ou couche obtenue par ce procédé.
CH710184B1 (fr) 2007-09-21 2016-03-31 Aliprandini Laboratoires G Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques.
EP2312021B1 (fr) * 2009-10-15 2020-03-18 The Swatch Group Research and Development Ltd. Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux toxiques
EP2505691B1 (fr) * 2011-03-31 2014-03-12 The Swatch Group Research and Development Ltd. Procédé d'obtention d'un dépôt d'alliage d'or 18 carats 3N
ITFI20120103A1 (it) * 2012-06-01 2013-12-02 Bluclad Srl Bagni galvanici per l'ottenimento di una lega di oro a bassa caratura e processo galvanico che utilizza detti bagni.
WO2016020812A1 (en) * 2014-08-04 2016-02-11 Nutec International Srl Electrolytic bath, electrolytic deposition method and item obtained with said method
CN109504991B (zh) * 2019-01-21 2020-08-07 南京市产品质量监督检验院 一种无氰18k金电铸液、其制备方法及其应用

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2596454A (en) * 1949-09-10 1952-05-13 Metals & Controls Corp Gold alloys
US2660554A (en) * 1950-11-10 1953-11-24 Barnet D Ostrow Bright gold and gold alloy plating baths
CH286123A (fr) 1952-05-08 1952-10-15 Spreter Victor Bain pour le dépôt par voie galvanique d'alliages d'or.
US2976180A (en) 1957-12-17 1961-03-21 Hughes Aircraft Co Method of silver plating by chemical reduction
FR1259407A (fr) 1960-03-10 1961-04-28 Maison Murat Bain électrolytique pour dépôt épais d'alliage or-cuivre
CH455434A (de) * 1963-08-15 1968-07-15 Werner Fluehmann Galvanische A Verfahren zur Herstellung von Weissgoldüberzügen
DE1460993A1 (de) 1965-07-23 1970-07-23 Kieninger & Obergfell Elektrisches Programmsteuergeraet,vorzugsweise fuer elektrische Haushaltsgeraete,insbesondere Waschmaschinen und Geschirrspuelmaschinen
US3475292A (en) * 1966-02-10 1969-10-28 Technic Gold plating bath and process
GB1156186A (en) * 1966-09-26 1969-06-25 Sel Rex Corp Gold Plating
DE1965768A1 (de) * 1969-01-07 1970-07-30 Western Electric Co Elektroniederschlag von Edelmetallen
US3642589A (en) * 1969-09-29 1972-02-15 Fred I Nobel Gold alloy electroplating baths
US3666640A (en) * 1971-04-23 1972-05-30 Sel Rex Corp Gold plating bath and process
DE2121150C3 (de) * 1971-04-24 1980-08-21 Schering Ag, 1000 Berlin Und 4619 Bergkamen Verfahren zur galvanischen Abscheidung von Goldlegierungen
CH529843A (fr) 1971-07-09 1972-10-31 Oxy Metal Finishing Europ S A Bain pour le dépôt électrolytique d'alliages d'or et son utilisation en galvanoplastie
FR2181455B1 (xx) * 1972-04-25 1974-08-30 Parker Ste Continentale
DE2244434C3 (de) * 1972-09-06 1982-02-25 Schering Ag, 1000 Berlin Und 4619 Bergkamen Wäßriges Bad zur galvanischen Abscheidung von Gold und Goldlegierungen
US3902977A (en) * 1973-12-13 1975-09-02 Engelhard Min & Chem Gold plating solutions and method
CH621367A5 (en) 1977-07-08 1981-01-30 Systemes Traitements Surfaces Electrolytic bath for plating gold-copper-cadmium alloys and its use in galvanoplasty
CH622829A5 (xx) * 1977-08-29 1981-04-30 Systemes Traitements Surfaces
FR2405312A1 (fr) * 1977-10-10 1979-05-04 Oxy Metal Industries Corp Bains electrolytiques pour le depot d'alliages d'or
US4168214A (en) * 1978-06-14 1979-09-18 American Chemical And Refining Company, Inc. Gold electroplating bath and method of making the same
DE3020765A1 (de) * 1980-05-31 1981-12-10 Degussa Ag, 6000 Frankfurt Alkalisches bad zum galvanischen abscheiden niederkaraetiger rosa- bis gelbfarbener goldlegierungsschichten
GB8334226D0 (en) * 1983-12-22 1984-02-01 Learonal Uk Ltd Electrodeposition of gold alloys
US4626324A (en) 1984-04-30 1986-12-02 Allied Corporation Baths for the electrolytic deposition of nickel-indium alloys on printed circuit boards
CH662583A5 (fr) 1985-03-01 1987-10-15 Heinz Emmenegger Bain galvanique pour le depot electrolytique d'alliages d'or-cuivre-cadmium-zinc.
JPS62164890A (ja) 1986-01-16 1987-07-21 Seiko Instr & Electronics Ltd 金銀銅合金めつき液
ATE86313T1 (de) * 1987-08-21 1993-03-15 Engelhard Ltd Bad fuer das elektroplattieren einer gold-kupfer- zink-legierung.
JPH01247540A (ja) 1988-03-29 1989-10-03 Seiko Instr Inc 硬質金合金外装部品の製造方法
GB8903818D0 (en) * 1989-02-20 1989-04-05 Engelhard Corp Electrolytic deposition of gold-containing alloys
DE3929569C1 (xx) 1989-09-06 1991-04-18 Degussa Ag, 6000 Frankfurt, De
GB2242200B (en) 1990-02-20 1993-11-17 Omi International Plating compositions and processes
CH680927A5 (xx) 1990-10-08 1992-12-15 Metaux Precieux Sa
US5085744A (en) 1990-11-06 1992-02-04 Learonal, Inc. Electroplated gold-copper-zinc alloys
US5244593A (en) 1992-01-10 1993-09-14 The Procter & Gamble Company Colorless detergent compositions with enhanced stability
US5256275A (en) 1992-04-15 1993-10-26 Learonal, Inc. Electroplated gold-copper-silver alloys
US5340529A (en) 1993-07-01 1994-08-23 Dewitt Troy C Gold jewelry alloy
DE69622431T2 (de) 1995-11-03 2003-01-30 Enthone Omi Inc Elektroplattierungsverfahren, zusammensetzungen und überzügen
DE19629658C2 (de) 1996-07-23 1999-01-14 Degussa Cyanidfreies galvanisches Bad zur Abscheidung von Gold und Goldlegierungen
CN1205360C (zh) * 1999-06-17 2005-06-08 德古萨电解技术有限公司 用于电沉积有光泽的金和金合金镀层的酸性浴液及其所用的光泽剂
JP2001198693A (ja) 2000-01-17 2001-07-24 Ishifuku Metal Ind Co Ltd 工業用及び宝飾用金ろう
JP4023138B2 (ja) 2001-02-07 2007-12-19 日立金属株式会社 鉄基希土類合金粉末および鉄基希土類合金粉末を含むコンパウンドならびにそれを用いた永久磁石
FR2828889B1 (fr) * 2001-08-24 2004-05-07 Engelhard Clal Sas Bain electrolytique pour le depot electrochimique de l'or et de ses alliages
EP1548525B2 (fr) 2003-12-23 2017-08-16 Rolex Sa Elément en céramique pour boîte de montre et procédé de fabrication de cet élément
JP4566667B2 (ja) 2004-01-16 2010-10-20 キヤノン株式会社 めっき液、めっき液を用いた構造体の製造方法、めっき液を用いた装置
JP2005214903A (ja) * 2004-01-30 2005-08-11 Kawaguchiko Seimitsu Co Ltd 指標付き文字板の製造方法及びその製造方法を用いて製造した指標付き文字板。
SG127854A1 (en) * 2005-06-02 2006-12-29 Rohm & Haas Elect Mat Improved gold electrolytes
CH710184B1 (fr) 2007-09-21 2016-03-31 Aliprandini Laboratoires G Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques.

Also Published As

Publication number Publication date
JP5563462B2 (ja) 2014-07-30
CN101815814A (zh) 2010-08-25
EP2205778A1 (fr) 2010-07-14
IN2014CN02464A (xx) 2015-08-07
US10619260B2 (en) 2020-04-14
EP2205778B1 (fr) 2011-02-23
TW201428143A (zh) 2014-07-16
CH710184B1 (fr) 2016-03-31
US10233555B2 (en) 2019-03-19
TW200930844A (en) 2009-07-16
US20140299481A1 (en) 2014-10-09
US9683303B2 (en) 2017-06-20
US20190153608A1 (en) 2019-05-23
DE602008005184D1 (de) 2011-04-07
ATE499461T1 (de) 2011-03-15
KR101280675B1 (ko) 2013-07-01
JP2014194087A (ja) 2014-10-09
JP5887381B2 (ja) 2016-03-16
TWI441959B (zh) 2014-06-21
US20100206739A1 (en) 2010-08-19
KR20100075935A (ko) 2010-07-05
JP2010539335A (ja) 2010-12-16
WO2009037180A1 (fr) 2009-03-26
TWI507571B (zh) 2015-11-11
CN101815814B (zh) 2012-05-16

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