HK1121180A1 - Conductive pressure sensitive adhesive tape - Google Patents

Conductive pressure sensitive adhesive tape

Info

Publication number
HK1121180A1
HK1121180A1 HK09100685.1A HK09100685A HK1121180A1 HK 1121180 A1 HK1121180 A1 HK 1121180A1 HK 09100685 A HK09100685 A HK 09100685A HK 1121180 A1 HK1121180 A1 HK 1121180A1
Authority
HK
Hong Kong
Prior art keywords
sensitive adhesive
adhesive tape
pressure sensitive
conductive pressure
conductive
Prior art date
Application number
HK09100685.1A
Other languages
English (en)
Inventor
Kim Sun Ki
Original Assignee
Joinset Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Joinset Co Ltd filed Critical Joinset Co Ltd
Publication of HK1121180A1 publication Critical patent/HK1121180A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/18—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet characterized by perforations in the adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/163—Metal in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/006—Presence of polyolefin in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/21—Circular sheet or circular blank
    • Y10T428/218—Aperture containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2804—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
HK09100685.1A 2007-01-17 2009-01-22 Conductive pressure sensitive adhesive tape HK1121180A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20070005256 2007-01-17
KR1020070018924A KR100774440B1 (ko) 2007-01-17 2007-02-26 전도성 점착테이프

Publications (1)

Publication Number Publication Date
HK1121180A1 true HK1121180A1 (en) 2009-04-17

Family

ID=39061256

Family Applications (1)

Application Number Title Priority Date Filing Date
HK09100685.1A HK1121180A1 (en) 2007-01-17 2009-01-22 Conductive pressure sensitive adhesive tape

Country Status (8)

Country Link
US (1) US8465834B2 (ko)
EP (1) EP2121862B1 (ko)
JP (1) JP5081924B2 (ko)
KR (2) KR100774440B1 (ko)
CN (1) CN101225284B (ko)
HK (1) HK1121180A1 (ko)
TW (1) TWI361213B (ko)
WO (1) WO2008088107A1 (ko)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM344984U (en) * 2008-05-28 2008-11-21 jian-hong Li Writing board
JP5295943B2 (ja) * 2008-12-26 2013-09-18 花王株式会社 ナノファイバシート
CN101712217B (zh) * 2009-05-12 2013-07-31 大连丽昌新材料有限公司 一种石墨导热界面材料的制造工艺
KR101088891B1 (ko) * 2009-10-09 2011-12-07 조인셋 주식회사 전기전도성 시트
CN102241950A (zh) * 2010-05-14 2011-11-16 3M创新有限公司 电磁屏蔽胶带
JP2012131921A (ja) * 2010-12-22 2012-07-12 Nitto Denko Corp 導電性接着テープ
CN103563505B (zh) * 2011-04-28 2017-03-08 索略得 水平热电胶带及其制备方法
JP2014056967A (ja) * 2012-09-13 2014-03-27 Dic Corp 導電性薄型粘着シート
JP5942725B2 (ja) * 2012-09-18 2016-06-29 デクセリアルズ株式会社 導電性シート
US8968853B2 (en) * 2012-11-07 2015-03-03 Firestone Building Products Company, Llc Pressure-sensitive adhesives including expandable graphite
CN103059757B (zh) * 2012-12-18 2014-06-04 苏州斯迪克新材料科技股份有限公司 用于散热的压敏胶带及其制备方法
CN103059760B (zh) * 2012-12-18 2014-10-15 斯迪克新型材料（江苏）有限公司 具有散热功能的导热贴膜及其制造方法
CN104152073B (zh) * 2012-12-18 2016-01-13 苏州斯迪克新材料科技股份有限公司 用于电子产品贴膜的制备方法
CN104263267B (zh) * 2012-12-28 2016-04-27 斯迪克新型材料（江苏）有限公司 多用途导电导热复合胶带
CN105008475B (zh) * 2013-03-05 2017-07-07 住友电气工业株式会社 粘接片及粘接片的制造方法
CN103254830B (zh) * 2013-05-13 2015-07-29 3M创新有限公司 均热胶带
JP6168348B2 (ja) * 2013-06-05 2017-07-26 Dic株式会社 粘着シート及び電子機器
KR101321063B1 (ko) 2013-07-09 2013-10-29 (주)세경하이테크 전사식 그라파이트 복합 필름 가공 방법
WO2015008671A1 (ja) * 2013-07-16 2015-01-22 住友電気工業株式会社 電子部品及び電子部品の製造方法
JP2015030238A (ja) * 2013-08-06 2015-02-16 Dic株式会社 積層基材、粘着シート及び電子機器
KR102040150B1 (ko) * 2013-09-02 2019-11-04 삼성전자주식회사 전계 방출 소자 및 전계 방출 소자의 에미터의 제조 방법
JP5952369B2 (ja) * 2013-10-23 2016-07-13 福岡丸本株式会社 粘着テープ及び粘着テープ巻回体並びにテープディスペンサー
KR101557890B1 (ko) 2013-11-11 2015-10-12 주식회사 이에스디웍 열전도성 테이프 및 열전도성 테이프 제조 방법
KR101466589B1 (ko) * 2014-01-24 2014-12-01 조인셋 주식회사 전도성 탄성부재
JP2017534721A (ja) 2014-10-13 2017-11-24 アベリー・デニソン・コーポレイションＡｖｅｒｙ Ｄｅｎｎｉｓｏｎ Ｃｏｒｐｏｒａｔｉｏｎ 溶接性且つ振動減衰性を備えたシリコン接着剤
CN104494234B (zh) * 2014-12-18 2018-03-06 杭州临安天宏电讯材料有限公司 一种单面热熔铝塑复合箔及其制备方法
CN104789147A (zh) * 2015-04-20 2015-07-22 江苏伊诺尔新材料科技有限公司 电磁波屏蔽用亮面铝箔mylar导电胶带及制备方法
WO2017175753A1 (ja) 2016-04-08 2017-10-12 サンスター技研株式会社 滑り止め施工用粘着シート
CN106047204A (zh) * 2016-07-18 2016-10-26 江苏亚龙数码科技有限公司 一种绝热抗氧化性铝箔胶带
KR101728671B1 (ko) * 2017-01-05 2017-04-20 마진규 멀티 마킹 테이프
KR102007915B1 (ko) 2017-09-26 2019-08-06 주식회사 영우 금속섬유를 이용한 전도성 테이프
US20190190214A1 (en) * 2017-12-20 2019-06-20 North Inc. Electronic device including a connector receptacle having a rotationally symmetric contact plane
JP6617768B2 (ja) * 2017-12-26 2019-12-11 デクセリアルズ株式会社 導電性シート
CN108864972A (zh) * 2018-04-16 2018-11-23 南通康尔乐复合材料有限公司 一种双层铝塑复合膜导电胶带
CN108882664B (zh) * 2018-07-24 2020-04-21 厦门比肯精密工业有限公司 一种适用于电磁屏蔽的导电泡棉
CN110358461A (zh) * 2019-07-26 2019-10-22 新纶科技（常州）有限公司 一种耐高温电磁波屏蔽导电硅胶双面胶带及其制备方法
US11502450B2 (en) 2020-10-09 2022-11-15 Dell Products L.P. Systems for dynamically adjustable grounding connections
CN114132023A (zh) * 2021-11-12 2022-03-04 凯仁精密材料(江苏)有限公司 一种导电性薄片
CN114058275B (zh) * 2021-11-16 2023-05-30 江西鸿美新能源科技有限公司 一种导电布胶带及其制备方法
CN115093802B (zh) * 2022-03-30 2023-04-18 安徽屹珹新材料科技有限公司 一种电磁屏蔽复合材料及其制备方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB991581A (en) * 1962-03-21 1965-05-12 High Temperature Materials Inc Expanded pyrolytic graphite and process for producing the same
FR1583200A (ko) * 1968-02-09 1969-10-24
US3962508A (en) * 1975-03-26 1976-06-08 Tokumitsu Nakanose Thermoplastic resin tape for packaging
ATE147557T1 (de) * 1991-10-05 1997-01-15 Besma Beschichtungsmassen Gmbh Formbare folie zum befestigen auf einer unterlage und abschirmen von strahlungen oder zum isolieren von elektrisch leitenden teilen
JPH1017832A (ja) * 1996-07-03 1998-01-20 Sumitomo Chem Co Ltd 粘着テープ
KR19980070753A (ko) * 1997-01-28 1998-10-26 모리시타 요이치 반도체 소자 및 그 제조 공정
KR100267814B1 (ko) * 1998-05-06 2001-01-15 이용인 도전성 점착테이프
JP3226889B2 (ja) 1998-05-06 2001-11-05 シンワ プロダクト カンパニー・リミテッド 導電性粘着テープ
TW442554B (en) * 1999-04-05 2001-06-23 Four Pillars Entpr Co Ltd Multi-functional electrically and thermally conductive adhesive tape
JP2000297256A (ja) 1999-04-14 2000-10-24 Mitsui Mining & Smelting Co Ltd 導電性粘着テープ
US6432527B1 (en) * 1999-12-14 2002-08-13 3M Innovative Properties Company Embossed film having controlled tear
DE10007614B4 (de) * 2000-02-18 2004-01-29 Heikaus Unternehmensbeteiligungen Und Verwaltung Gmbh Streckfolie und Verfahren zur Herstellung einer Streckfolie
US20020021997A1 (en) * 2000-06-23 2002-02-21 Akira Taomoto Graphite sheet coated with insulating material and coating method thereof
US7223312B2 (en) * 2000-09-21 2007-05-29 Integument Technologies, Inc. Methods and materials for reducing damage from environmental electromagnetic effects
KR100390164B1 (ko) * 2001-03-29 2003-07-04 신화인터텍 주식회사 도전성 점착테이프
US7033668B2 (en) * 2001-08-23 2006-04-25 Tesa Ag Electrically conductive, preferably unbacked adhesive tape with permanent full-area pressure sensitive adhesion, composed of a film of a pressure sensitive adhesive which is preferably coated onto an antiadhesive medium and has an alkaline surface
JP3999994B2 (ja) * 2002-04-03 2007-10-31 東レ・ダウコーニング株式会社 導電性シリコーンゴム組成物
US6818291B2 (en) * 2002-08-17 2004-11-16 3M Innovative Properties Company Durable transparent EMI shielding film
US20040126597A1 (en) * 2002-12-27 2004-07-01 Cohen Lewis S. Facing for insulation and other applications
US7001662B2 (en) * 2003-03-28 2006-02-21 Matsushita Electric Industrial Co., Ltd. Transfer sheet and wiring board using the same, and method of manufacturing the same
KR20050094516A (ko) * 2004-03-23 2005-09-28 주성숙 필름형 도전성 시트, 그 제조방법 및 이를 이용한 도전성테잎
JP2006117747A (ja) 2004-10-20 2006-05-11 Nitto Shinko Kk 導電性粘着テープ
KR200380753Y1 (ko) 2005-01-03 2005-04-07 조인셋 주식회사 수직 도전성 점착테이프
KR100716582B1 (ko) * 2005-06-03 2007-05-09 (주)에이치제이 도전성 시트 및 그의 제조방법

Also Published As

Publication number Publication date
JP2010515802A (ja) 2010-05-13
CN101225284A (zh) 2008-07-23
CN101225284B (zh) 2012-03-21
EP2121862A4 (en) 2011-10-26
EP2121862A1 (en) 2009-11-25
JP5081924B2 (ja) 2012-11-28
KR100774441B1 (ko) 2007-11-08
TW200831629A (en) 2008-08-01
EP2121862B1 (en) 2014-03-26
KR100774440B1 (ko) 2007-11-08
US20100086777A1 (en) 2010-04-08
WO2008088107A1 (en) 2008-07-24
US8465834B2 (en) 2013-06-18
TWI361213B (en) 2012-04-01

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20170705