CN114058275B - 一种导电布胶带及其制备方法 - Google Patents
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Abstract
本发明公开了一种导电布胶带的制备方法，包括步骤：(1)提供基材层，且基材层具有凸出的毛刺，(2)对含毛刺的基材层进行处理，使得基材层和毛刺表面均包覆导电的金属层；(3)进行涂胶处理，然后采用磁力取向装置使得毛刺沿基材层的厚度方向直立，再干燥挥发胶层中溶剂，毛刺露出胶层，制得导电布胶带。通过该导电布胶带的制备方法，能够制得垂直方向(即Z轴方向)导电性能优良的导电布胶带，同时不会降低或影响水平方向(即X轴和Y轴方向)的导电性能，同时该方法操作简单、成本低。本申请还提供一种上述方法制得的导电布胶带。
Description
技术领域
本发明涉及导电布技术领域，更具体地涉及一种导电布胶带及其制备方法。
背景技术
导电布胶带也就是用导电布做成的胶带，其特性是在导电布的基础上增加了“胶”特性，根据实际使用的需求，胶可采用导电胶，即在胶中含有“镍”成分，从而起到磁屏蔽的效果，也可采用普通的亚克力胶或者热融胶，目的是让导电布有良好的粘性。
当前，导电布胶带的制备工艺为：在聚酯纤维上，先镀上一层金属镍，然后再镀一层铜，再镀上一层镍，然后涂覆一层含镍的胶水。由于很难均匀的将镍粉分散在胶水中，工艺控制较难，成本较高，且镍粉分散，导致在垂直方向(即Z轴方向)的导电性能比较低下。
因此，提高该导电布胶带在垂直方向(即Z轴方向)的导电性能势在必行。
发明内容
为了克服现有技术的缺陷，本发明的目的是提供一种导电布胶带的制备方法，能够制得垂直方向(即Z轴方向)导电性能优良的导电布胶带，同时不会降低或影响水平方向(即X轴和Y轴方向)的导电性能，同时该方法操作简单、成本低。
为了实现上述目的，本发明公开了一种导电布胶带的制备方法，包括步骤：
(1)提供基材层，且基材层具有凸出的毛刺，
(2)对含毛刺的基材层进行处理，使得基材层和毛刺表面均包覆导电的金属层；
(3)进行涂胶处理，然后采用磁力取向装置使得毛刺沿基材层的厚度方向直立，再干燥挥发胶层中溶剂，毛刺露出胶层，制得导电布胶带。
与现有技术相比，本发明导电布胶带的制备方法中，基材层具有凸出的毛刺，在对含毛刺的基材层进行处理后，使得基材层和毛刺表面均包覆导电的金属层，进行涂胶处理后，然后采用磁力取向装置进行磁力取向，由于金属层属于磁性材料，能够使得毛刺的磁极方向沿基材层的厚度方向直立，即毛刺垂直于基材层，再干燥挥发胶层中溶剂，使得毛刺部分露出胶层，制得导电布胶带，将该导电布胶带与导电体接触时，露出胶层的毛刺部分抵接导电体从而实现电连接，且含铜层，故而其垂直方向(即Z轴方向)导电性能优良，同时不会降低或影响水平方向(即X轴和Y轴方向)的导电性能，尤其是不需要在胶水中加入镍粉，工艺成本低，操作方便。
相应地，本发明还提供一种导电布胶带，通过上述制备方法制得。
具体实施方式
为详细说明本发明的技术内容、构造特征、所实现目的及效果，以下结合实施方式详予说明。
本发明提供的导电布胶带的制备方法，包括步骤：
(1)提供基材层，且基材层具有凸出的毛刺，
(2)对含毛刺的基材层进行处理，使得基材层和毛刺表面均包覆导电的金属层；
(3)进行涂胶处理，然后采用磁力取向装置使得毛刺沿基材层的厚度方向直立，再干燥挥发胶层中溶剂，毛刺露出胶层，制得导电布胶带。
本发明导电布胶带的制备方法中，基材层具有凸出的毛刺，在对含毛刺的基材层进行处理后，使得基材层和毛刺表面均包覆导电的金属层，进行涂胶处理后，然后采用磁力取向装置进行磁力取向，由于金属层属于磁性材料，能够使得毛刺的磁极方向沿基材层的厚度方向直立，即毛刺垂直于基材层，再干燥挥发胶层中溶剂，使得毛刺部分露出胶层，制得导电布胶带，将该导电布胶带与导电体接触时，露出胶层的毛刺部分抵接导电体从而实现电连接，且毛刺含铜层，故而其垂直方向(即Z轴方向)导电性能优良，同时不会降低或影响水平方向(即X轴和Y轴方向)的导电性能，尤其是不需要在胶水中加入镍粉，工艺成本低，操作方便。
在一个优选地技术方案中，采用若干短纤维线材编织得到基材层，且露出基材层表面的短纤维线材形成毛刺。也就是说，通过短纤维线材编织基材层时，有目的的将短纤维线材的线头露出，以便形成毛刺。当然，可以是将毛刺均保留在基材层的同一侧，也可以是基材层两侧均具有毛刺。基材层一侧具有毛刺，能够制得单面的导电布胶带，基材层两侧均具有毛刺，能够制得双面的导电布胶带。其中，短纤维线材选自涤纶、锦纶、玻纤、化纤中的至少一种。
在一个优选地技术方案中，毛刺的长度为10-100μm，比如毛刺的厚度为10μm、20μm、30μm、40μm、50μm、60μm、70μm、80μm、90μm、100μm。毛刺的形状可以为但不限于针状、条状、片状、柱状。
在一个优选地技术方案中，对含毛刺的基材层进行处理，不仅要使其具有导电性，同时需要其满足磁性，导电性的要求是为了实现电连接，而磁性的要求则是为了满足后续的磁力取向。本申请给出了满足该要求的技术方案，金属层由里至外依次包括第一层、第二层、第三层；其中，第一层选自镍层或铜镍层；第二层选自铜层；第三层选自镍层、钴层或铁层，但不限于该技术方案。具体地，先通过真空磁控溅射对含毛刺的基材层溅射一层镍层或铜镍层；再通过电镀的方式电镀一层铜层，然后通过电镀的方式再电镀一层镍层、钴层或铁层，铜层具有导电作用，镍层、钴层或铁层用于磁力取向，其中，钴层成本太高，铁层容易氧化，因此，优先采用镍层。本申请技术方案中，金属层由里至外依次包括镍层、铜层和镍层，但不以此为限。
在一个优选地技术方案中，胶层选自固含量在10-50％的压敏胶树脂。比如丙烯酸酯类压敏胶树脂，但不以此为限。
需要说明的是，在基材层上进行涂胶处理，胶层中含有溶剂，加热挥发溶剂后，胶层固化将毛刺进行固定，毛刺部分露出胶层表面，露出的部分用于与需要电连接的导体抵接，当然，可以根据需要对毛刺露出部分进行裁剪以获得所需长度。还需要说明的是，制备单面导电布胶带时，进行一次涂胶即可。制备双面涂胶，则需要进行两次涂胶，也就是说，先给基材层一侧涂胶以对该侧毛刺进行固定，再给基材层另一侧涂胶以对该侧毛刺进行固定。
下面通过几个具体的实施例来阐述本发明的导电布胶带，但不能以此来限定本发明之权利范围。
实施例1
一种导电布胶带的制备方法，包括步骤：
(1)采用若干短纤维涤纶线材编织得到基材层，且露出基材层表面同一侧的涤纶线头形成毛刺；
(2)对含毛刺的基材层进行以下处理：先通过真空磁控溅射对含毛刺的基材层溅射一层镍层；再通过电镀的方式电镀一层铜层，然后通过电镀的方式再电镀一层镍层；
(3)采用固含量在10-50％的压敏胶树脂进行涂胶处理，然后采用磁力取向装置使得毛刺沿基材层的厚度方向直立，再干燥挥发胶层中溶剂，毛刺露出胶层，制得单面导电布胶带。
实施例2
一种导电布胶带的制备方法，包括步骤：
(1)采用若干短纤维涤纶线材编织得到基材层，且露出基材层表面的涤纶线头形成毛刺，基材层上下两侧均有毛刺；
(2)对含毛刺的基材层进行以下处理：先通过真空磁控溅射对含毛刺的基材层溅射一层镍层；再通过电镀的方式电镀一层铜层，然后通过电镀的方式再电镀一层镍层；
(3)对基材层一侧采用固含量在10-50％的压敏胶树脂进行涂胶处理，然后采用磁力取向装置使得毛刺沿基材层的厚度方向直立，再干燥挥发胶层中溶剂，毛刺露出胶层；
(4)对基材层另一侧采用固含量在10-50％的压敏胶树脂进行涂胶处理，然后采用磁力取向装置使得毛刺沿基材层的厚度方向直立，再干燥挥发胶层中溶剂，毛刺露出胶层，制得双面导电布胶带。
对比例1
对比例1作为对照组，对比例1中基材层没有凸出的毛刺，也没有磁力取向，但胶层中含有镍粉，其余与实施例1相同，在此不进行详细阐述。
性能测试：
对本发明实施例1-2及对比例1制得的导电布胶带进行导电性能测试，结果如表1所示。
表1导电性能测试结果
从表1的数据可知，本发明制备方法制得的导电布胶带，较对比例1而言，其垂直方向(即Z轴方向)导电性能优良，同时不会降低或影响水平方向(即X轴和Y轴方向)的导电性能，尤其是不需要在胶水中加入镍粉，工艺成本低，操作方便。
以上所揭露的仅为本发明的优选实施例而已，当然不能以此来限定本发明之权利范围，因此依本发明申请专利范围所作的等同变化，仍属本发明所涵盖的范围。
Claims (6)
1.一种导电布胶带的制备方法，其特征在于，包括步骤：
(1)采用若干短纤维线材编织得到基材层，且露出基材层表面的短纤维线材形成毛刺，
(2)对含毛刺的基材层进行处理，使得基材层和毛刺表面均包覆导电的金属层，所述金属层由里至外依次包括第一层、第二层、第三层；
其中，第一层选自镍层或铜镍层；
第二层选自铜层；
第三层选自镍层、钴层或铁层；
(3)进行涂胶处理，然后采用磁力取向装置使得毛刺沿基材层的厚度方向直立，再干燥挥发胶层中溶剂，毛刺露出胶层，制得导电布胶带。
2.如权利要求1所述的导电布胶带的制备方法，其特征在于，短纤维线材选自涤纶、锦纶、玻纤、化纤中的至少一种。
3.如权利要求1所述的导电布胶带的制备方法，其特征在于，毛刺的长度为10-100μm。
4.如权利要求1所述的导电布胶带的制备方法，其特征在于，先采用真空磁控溅射使得含毛刺的基材层包覆第一层，再进行电镀形成第二层，然后电镀形成第三层。
5.如权利要求1所述的导电布胶带的制备方法，其特征在于，胶层选自固含量在10-50％的压敏胶树脂。
6.一种导电布胶带，其特征在于，采用如权利要求1-5任一项所述的制备方法制得。
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