HK1086020A1 - Capsule type hardener and composition - Google Patents

Capsule type hardener and composition

Info

Publication number
HK1086020A1
HK1086020A1 HK06106016A HK06106016A HK1086020A1 HK 1086020 A1 HK1086020 A1 HK 1086020A1 HK 06106016 A HK06106016 A HK 06106016A HK 06106016 A HK06106016 A HK 06106016A HK 1086020 A1 HK1086020 A1 HK 1086020A1
Authority
HK
Hong Kong
Prior art keywords
composition
capsule type
type hardener
hardener
capsule
Prior art date
Application number
HK06106016A
Other languages
English (en)
Inventor
Taketoshi Usui
Yoshimitsu Ohyama
Original Assignee
Asahi Kasei Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Chemicals Corp filed Critical Asahi Kasei Chemicals Corp
Publication of HK1086020A1 publication Critical patent/HK1086020A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/08—Ingredients agglomerated by treatment with a binding agent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/188—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using encapsulated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/002—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor using materials containing microcapsules; Preparing or processing such materials, e.g. by pressure; Devices or apparatus specially designed therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Organic Insulating Materials (AREA)
  • Sealing Material Composition (AREA)
HK06106016A 2002-10-25 2006-05-25 Capsule type hardener and composition HK1086020A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002311114 2002-10-25
JP2003079836 2003-03-24
PCT/JP2003/013571 WO2004037885A1 (ja) 2002-10-25 2003-10-23 カプセル型硬化剤及び組成物

Publications (1)

Publication Number Publication Date
HK1086020A1 true HK1086020A1 (en) 2006-09-08

Family

ID=32179100

Family Applications (1)

Application Number Title Priority Date Filing Date
HK06106016A HK1086020A1 (en) 2002-10-25 2006-05-25 Capsule type hardener and composition

Country Status (9)

Country Link
US (1) US20060128835A1 (xx)
EP (1) EP1557438A4 (xx)
JP (2) JP4326524B2 (xx)
KR (1) KR100809799B1 (xx)
CN (1) CN100357336C (xx)
AU (1) AU2003275620A1 (xx)
HK (1) HK1086020A1 (xx)
TW (1) TWI247764B (xx)
WO (1) WO2004037885A1 (xx)

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EP1557438A4 (en) * 2002-10-25 2007-05-30 Asahi Kasei Chemicals Corp HARDENER FOR CAPSULE AND COMPOSITION
JP4567377B2 (ja) * 2004-06-04 2010-10-20 旭化成イーマテリアルズ株式会社 潜在性硬化剤および組成物
CA2625794A1 (en) * 2005-09-29 2007-04-05 Asahi Kasei Chemicals Corporation High-stability microencapsulated hardener for epoxy resin and epoxy resin composition
JP4877717B2 (ja) * 2005-09-29 2012-02-15 旭化成イーマテリアルズ株式会社 緩反応性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP2007091899A (ja) * 2005-09-29 2007-04-12 Asahi Kasei Chemicals Corp 高安定性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP4877716B2 (ja) * 2005-09-29 2012-02-15 旭化成イーマテリアルズ株式会社 速硬化性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
EP1980580A1 (en) * 2006-02-03 2008-10-15 Asahi Kasei Chemicals Corporation Microcapsule type hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack type epoxy resin composition, and processed article
KR101211604B1 (ko) * 2006-10-31 2012-12-12 주식회사 엘지화학 표면 개질 아민계 경화제, 이를 이용한 마스킹형 경화제 및일액형 에폭시 수지 조성물
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US8084553B2 (en) * 2008-01-10 2011-12-27 Trillion Science, Inc. Curable adhesive compositions, process, and applications
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CN102414241A (zh) * 2009-04-24 2012-04-11 旭化成电子材料株式会社 含咪唑化合物的微囊化组合物、使用其的固化性组合物及母料型固化剂
US8067484B2 (en) * 2010-03-12 2011-11-29 Trillion Science, Inc. Latent hardener with improved barrier properties and compatibility
US8044154B2 (en) 2009-06-12 2011-10-25 Trillion Science, Inc. Latent hardener for epoxy compositions
JP5558118B2 (ja) * 2009-07-01 2014-07-23 旭化成イーマテリアルズ株式会社 マイクロカプセル型エポキシ樹脂用硬化剤、及びそれを含むマスターバッチ型エポキシ樹脂用硬化剤組成物
JP5253315B2 (ja) * 2009-07-27 2013-07-31 大成プラス株式会社 溶剤型エポキシ接着剤及び接着方法
JP5560014B2 (ja) * 2009-09-30 2014-07-23 太陽ホールディングス株式会社 導電性ペースト
CN101665674B (zh) * 2009-09-30 2012-05-30 烟台德邦科技有限公司 一种单组分螺纹锁固环氧预涂胶及其制备方法
WO2011126702A2 (en) * 2010-03-30 2011-10-13 Henkel Corporation Encapsulated curing agents
JP2011231146A (ja) * 2010-04-23 2011-11-17 Asahi Kasei E-Materials Corp 異方導電性フィルム
JP5717434B2 (ja) * 2010-12-17 2015-05-13 株式会社Adeka マスターバッチ型エポキシ樹脂用潜在性硬化剤及びそれを用いたエポキシ樹脂組成物
JP2013001875A (ja) * 2011-06-20 2013-01-07 Asahi Kasei E-Materials Corp マスターバッチ型硬化剤組成物、それを用いる一液性エポキシ樹脂組成物及び成形品、並びにマスターバッチ型硬化剤組成物の製造方法
JP2013023671A (ja) * 2011-07-26 2013-02-04 Sumitomo Electric Ind Ltd フィルム状異方導電性接着剤及びその検査方法
CN103059348A (zh) * 2011-10-24 2013-04-24 三生医药株式会社 胶囊剂皮膜组合物
DE102012205046A1 (de) * 2012-03-29 2013-10-02 Siemens Aktiengesellschaft Elektroisolationskörper für eine Hochspannungsrotationsmaschine und Verfahren zum Herstellen des Elektroisolationskörpers
CN103146205A (zh) * 2013-03-04 2013-06-12 西北农林科技大学 能快速开放交通的高性能环氧沥青复合材料及其制备方法
JP6331525B2 (ja) * 2014-03-14 2018-05-30 オムロン株式会社 樹脂組成物の硬化方法
US9771449B2 (en) 2014-07-04 2017-09-26 Sepideh Khoee Synthesizing nanocapsules containing reactive amine
WO2016060088A1 (ja) * 2014-10-14 2016-04-21 三菱化学株式会社 半導体デバイス用層間充填剤組成物及び半導体デバイスの製造法
CN105542711A (zh) * 2016-01-08 2016-05-04 东莞市瑞宝机械设备有限公司 新型胶粘剂及其制备方法、固化方法
KR101739872B1 (ko) 2016-05-26 2017-05-25 (주)티엠에스 잠재성 경화제의 제조 방법
KR102237294B1 (ko) * 2019-06-26 2021-04-07 (주)수 캡슐형 소화약제를 이용한 2액형 초기화재진압용 에폭시계 도료 조성물 및 에어로졸형 에폭시계 도료 조성물
US20240270940A1 (en) * 2021-11-12 2024-08-15 Sabanci Universitesi Polyoxazoline based thermal latent curing agents for thermoset resins
TW202330702A (zh) 2021-11-19 2023-08-01 日商納美仕有限公司 硬化性樹脂組成物

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Also Published As

Publication number Publication date
EP1557438A4 (en) 2007-05-30
TWI247764B (en) 2006-01-21
JP2009132931A (ja) 2009-06-18
KR20050057676A (ko) 2005-06-16
CN1729225A (zh) 2006-02-01
CN100357336C (zh) 2007-12-26
TW200410998A (en) 2004-07-01
EP1557438A1 (en) 2005-07-27
WO2004037885A1 (ja) 2004-05-06
KR100809799B1 (ko) 2008-03-04
JPWO2004037885A1 (ja) 2006-02-23
JP4326524B2 (ja) 2009-09-09
US20060128835A1 (en) 2006-06-15
AU2003275620A1 (en) 2004-05-13

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Effective date: 20231022