HK1056040A1 - Thin film piezoelectric element and its manufacturing method, and actuator unit using same - Google Patents

Thin film piezoelectric element and its manufacturing method, and actuator unit using same

Info

Publication number
HK1056040A1
HK1056040A1 HK03107973A HK03107973A HK1056040A1 HK 1056040 A1 HK1056040 A1 HK 1056040A1 HK 03107973 A HK03107973 A HK 03107973A HK 03107973 A HK03107973 A HK 03107973A HK 1056040 A1 HK1056040 A1 HK 1056040A1
Authority
HK
Hong Kong
Prior art keywords
manufacturing
thin film
same
piezoelectric element
actuator unit
Prior art date
Application number
HK03107973A
Other languages
English (en)
Inventor
Hirokazu Uchiyama
Hideki Kuwajima
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of HK1056040A1 publication Critical patent/HK1056040A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
    • H02N2/10—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing rotary motion, e.g. rotary motors
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/54—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head into or out of its operative position or across tracks
    • G11B5/55—Track change, selection or acquisition by displacement of the head
    • G11B5/5521—Track change, selection or acquisition by displacement of the head across disk tracks
    • G11B5/5552—Track change, selection or acquisition by displacement of the head across disk tracks using fine positioning means for track acquisition separate from the coarse (e.g. track changing) positioning means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/076—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/206—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using only longitudinal or thickness displacement, e.g. d33 or d31 type devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Moving Of The Head To Find And Align With The Track (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Moving Of Heads (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
HK03107973A 2001-09-27 2003-11-05 Thin film piezoelectric element and its manufacturing method, and actuator unit using same HK1056040A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001296829A JP4904656B2 (ja) 2001-09-27 2001-09-27 薄膜圧電体素子およびその製造方法

Publications (1)

Publication Number Publication Date
HK1056040A1 true HK1056040A1 (en) 2004-01-30

Family

ID=19117999

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03107973A HK1056040A1 (en) 2001-09-27 2003-11-05 Thin film piezoelectric element and its manufacturing method, and actuator unit using same

Country Status (6)

Country Link
US (1) US6912760B2 (de)
EP (1) EP1298735B1 (de)
JP (1) JP4904656B2 (de)
CN (1) CN1251228C (de)
DE (1) DE60224148T2 (de)
HK (1) HK1056040A1 (de)

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JP3503386B2 (ja) * 1996-01-26 2004-03-02 セイコーエプソン株式会社 インクジェット式記録ヘッド及びその製造方法
US20030048041A1 (en) * 2001-09-07 2003-03-13 Hiroyuki Kita Piezoelectric thin-film element and a manufacturing method thereof
US7000459B2 (en) * 2002-07-10 2006-02-21 Seagate Technology Llc Strain sensor patterned on MEMS flex arms
AU2003301713A1 (en) * 2002-10-29 2004-05-25 Matsushita Electric Industrial Co., Ltd. Switching apparatus, electric field applying method and switching system
CN100399597C (zh) * 2002-12-03 2008-07-02 松下电器产业株式会社 薄膜压电体元件和其制造方法以及使用其的驱动器
JP4806896B2 (ja) * 2003-03-06 2011-11-02 パナソニック株式会社 薄膜圧電体素子、アクチュエータおよびディスク装置
WO2004100187A1 (ja) * 2003-05-08 2004-11-18 Matsushita Electric Industrial Co., Ltd. 電子部品及びその製造方法
US7456932B2 (en) * 2003-07-25 2008-11-25 Asml Netherlands B.V. Filter window, lithographic projection apparatus, filter window manufacturing method, device manufacturing method and device manufactured thereby
JP4433727B2 (ja) * 2003-09-02 2010-03-17 Ｔｄｋ株式会社 フレクシャ、サスペンションおよびヘッドジンバルアセンブリ
CN100411015C (zh) * 2004-09-28 2008-08-13 新科实业有限公司 微驱动器、设有该微驱动器的磁头折片组合以及磁盘驱动器
JP4997716B2 (ja) * 2005-06-21 2012-08-08 Ｔｄｋ株式会社 電子デバイスの製造方法
JP2007019290A (ja) * 2005-07-08 2007-01-25 Tdk Corp 圧電薄膜振動子およびその製造方法、並びにそれを用いた駆動装置および圧電モータ
JP5032949B2 (ja) * 2007-11-14 2012-09-26 エイチジーエスティーネザーランドビーブイ マイクロアクチュエータ、ヘッド・ジンバル・アセンブリ及びディスク・ドライブ装置
CN101983438B (zh) * 2008-02-05 2014-10-29 摩根先进陶瓷有限公司 用于减少颗粒脱落的封装涂层
JP4897767B2 (ja) 2008-10-21 2012-03-14 Ｔｄｋ株式会社 薄膜圧電体素子及びその製造方法並びにそれを用いたヘッドジンバルアセンブリ、及びそのヘッドジンバルアセンブリを用いたハードディスクドライブ
JP5741983B2 (ja) * 2012-09-27 2015-07-01 株式会社村田製作所 圧電アクチュエータの製造方法
US9401469B2 (en) 2014-09-29 2016-07-26 Sae Magnetics (H.K.) Ltd. Thin-film piezoelectric material element, method of manufacturing the same, head gimbal assembly, hard disk drive, ink jet head, variable focus lens and sensor
JP6601174B2 (ja) * 2015-11-13 2019-11-06 セイコーエプソン株式会社 圧電アクチュエーター、積層アクチュエーター、圧電モーター、ロボット、ハンド及び送液ポンプ
JP6944768B2 (ja) * 2016-08-29 2021-10-06 エア・ウォーター株式会社 ペリクルの製造方法
US10679679B1 (en) 2018-12-21 2020-06-09 Seagate Technology Llc Slider test socket with clamp, and related assemblies and methods of use
US11387402B2 (en) * 2019-08-28 2022-07-12 Signal Solutions, Llc Piezoelectric sensor assembly
JP7446964B2 (ja) * 2020-09-29 2024-03-11 日本発條株式会社 ディスク装置用サスペンションの製造方法と、製造装置

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JPS60242800A (ja) * 1984-05-17 1985-12-02 Yokogawa Medical Syst Ltd ダイスト・トランスデユ−サの製造方法
JP2642663B2 (ja) * 1988-03-10 1997-08-20 ヤマハ発動機株式会社 めっき型熱電対
JPH01308927A (ja) 1988-06-07 1989-12-13 Matsushita Electric Ind Co Ltd 焦電形赤外検出素子アレイ、焦電形赤外検出器およびその製法
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JP3420915B2 (ja) * 1997-07-10 2003-06-30 富士通株式会社 圧電素子を用いたアクチュエータ及びこのアクチュエータを使用したヘッドの微小移動機構
JPH11142753A (ja) 1997-11-04 1999-05-28 Seiko Epson Corp 変形可能ミラーデバイスの製造方法
JPH11138809A (ja) * 1997-11-13 1999-05-25 Seiko Epson Corp アクチュエータ及びインクジェット式記録ヘッド
JP2000002714A (ja) * 1998-04-13 2000-01-07 Matsushita Electric Ind Co Ltd 圧電型加速度センサ、加速度検出方法、および圧電型加速度センサの製造方法
JPH11345833A (ja) * 1998-06-01 1999-12-14 Matsushita Electric Ind Co Ltd 電子部品の製造方法
JP2000074739A (ja) * 1998-08-31 2000-03-14 Matsushita Electric Ind Co Ltd 電子部品の製造方法
JP3690135B2 (ja) * 1998-09-10 2005-08-31 セイコーエプソン株式会社 デバイスの製造方法
FR2786565B1 (fr) * 1998-11-27 2000-12-22 Commissariat Energie Atomique Structure micro-usinee a membrane deformable et son procede de realisation
JP4000733B2 (ja) * 1999-06-30 2007-10-31 セイコーエプソン株式会社 水晶振動片のエッチング方法とエッチング装置及びエッチング用の水晶片の収容器
JP2001250348A (ja) * 2000-03-03 2001-09-14 Matsushita Electric Ind Co Ltd 圧電素子の固定構造、ヘッドの支持機構および情報記録装置

Also Published As

Publication number Publication date
US6912760B2 (en) 2005-07-05
JP4904656B2 (ja) 2012-03-28
EP1298735B1 (de) 2007-12-19
DE60224148T2 (de) 2008-04-10
CN1251228C (zh) 2006-04-12
JP2003101095A (ja) 2003-04-04
EP1298735A2 (de) 2003-04-02
CN1423276A (zh) 2003-06-11
DE60224148D1 (de) 2008-01-31
US20030057804A1 (en) 2003-03-27
EP1298735A3 (de) 2006-03-15

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20180927