HK1029401A1 - Ultraviolet curable resin composition and photo solder resist ink using the same - Google Patents

Ultraviolet curable resin composition and photo solder resist ink using the same

Info

Publication number
HK1029401A1
HK1029401A1 HK01100122A HK01100122A HK1029401A1 HK 1029401 A1 HK1029401 A1 HK 1029401A1 HK 01100122 A HK01100122 A HK 01100122A HK 01100122 A HK01100122 A HK 01100122A HK 1029401 A1 HK1029401 A1 HK 1029401A1
Authority
HK
Hong Kong
Prior art keywords
ultraviolet curable
curable resin
resin composition
ethylenically unsaturated
solder resist
Prior art date
Application number
HK01100122A
Other languages
English (en)
Inventor
Tatsuya Kubo
Masatoshi Fujimoto
Soichi Hashimoto
Original Assignee
Goo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goo Chemical Co Ltd filed Critical Goo Chemical Co Ltd
Publication of HK1029401A1 publication Critical patent/HK1029401A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09D133/062—Copolymers with monomers not covered by C09D133/06
    • C09D133/068—Copolymers with monomers not covered by C09D133/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/08—Anti-corrosive paints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
HK01100122A 1999-03-17 2001-01-05 Ultraviolet curable resin composition and photo solder resist ink using the same HK1029401A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7280999 1999-03-17
JP2000055760A JP4081217B2 (ja) 1999-03-17 2000-03-01 紫外線硬化性樹脂組成物、フォトソルダーレジストインク、予備乾燥被膜、基板及びプリント配線板

Publications (1)

Publication Number Publication Date
HK1029401A1 true HK1029401A1 (en) 2001-08-03

Family

ID=26413945

Family Applications (1)

Application Number Title Priority Date Filing Date
HK01100122A HK1029401A1 (en) 1999-03-17 2001-01-05 Ultraviolet curable resin composition and photo solder resist ink using the same

Country Status (10)

Country Link
US (1) US6465540B1 (zh)
EP (1) EP1037111B1 (zh)
JP (1) JP4081217B2 (zh)
KR (1) KR100344933B1 (zh)
CN (1) CN1202180C (zh)
AT (1) ATE252739T1 (zh)
DE (1) DE60006016T2 (zh)
ES (1) ES2209706T3 (zh)
HK (1) HK1029401A1 (zh)
TW (1) TW538309B (zh)

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JP2000336298A (ja) * 1999-05-28 2000-12-05 Mitsubishi Pencil Co Ltd 焼成色鉛筆芯の製造方法
WO2001058977A1 (fr) * 2000-02-14 2001-08-16 Taiyo Ink Manufacturing Co., Ltd. Composition photodurcissable/thermodurcissable permettant de produire un film mat
US6485306B1 (en) * 2001-07-10 2002-11-26 Aiptek International Inc. Locus-recordable portable handwriting device
CN1210620C (zh) * 2000-09-16 2005-07-13 互応化学工业株式会社 紫外线固化树脂组合物以及包含该组合物的光防焊油墨
JP4558178B2 (ja) * 2000-11-30 2010-10-06 新日鐵化学株式会社 光又は熱硬化性樹脂組成物及びプリント配線基板
EP1359172B1 (en) * 2000-12-14 2009-05-27 Goo Chemical Co., Ltd. Ultraviolet-curable resin composition and photosolder resist ink containing the composition
US7060737B2 (en) * 2001-03-30 2006-06-13 Dsm Ip Assets B.V. Curable composition, cured product thereof, and laminated material
JP5027357B2 (ja) * 2001-03-30 2012-09-19 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物及びプリント配線板
JP2003005365A (ja) * 2001-06-25 2003-01-08 Goo Chemical Co Ltd 紫外線硬化性樹脂組成物及びドライフィルム
JP3425139B2 (ja) * 2001-07-27 2003-07-07 實密科技股▲フン▼有限公司 選択的金属メッキ方法
JP3673967B2 (ja) * 2001-09-21 2005-07-20 タムラ化研株式会社 感光性樹脂組成物及びプリント配線板
US7399574B2 (en) * 2001-09-28 2008-07-15 Dai Nippon Printing Co., Ltd. Curable resin for photo-patterning, process for producing the same, curable resin composition, color filter, liquid crystal panel substrate, and liquid crystal panel
EP1458794B1 (en) * 2001-12-06 2005-08-17 Huntsman Advanced Materials (Switzerland) GmbH Heat-curable resin composition
KR20030067168A (ko) * 2002-02-07 2003-08-14 이승구 솔더 레지스트 잉크 조성물
JP2004066017A (ja) * 2002-08-01 2004-03-04 Nippon Paint Co Ltd ソルダーレジスト膜の形成方法
EP1413926A3 (en) * 2002-09-30 2004-10-27 Tamura Kaken Corporation Photosensitive resin composition and printing wiring board
EP1455227A3 (en) * 2002-09-30 2004-10-27 Tamura Kaken Corporation Photosensitive resin composition and printed wiring board
TWI288142B (en) 2003-05-09 2007-10-11 Taiyo Ink Mfg Co Ltd Photocuring/thermosetting ink jet composition and printed wiring board using same
KR100571366B1 (ko) * 2004-01-27 2006-04-14 주식회사 코오롱 액상 포토 솔더 레지스트 조성물
KR100776721B1 (ko) * 2005-10-05 2007-11-28 주식회사 두산 액정표시소자용 실란트 조성물 및 이를 이용한 씰제
KR20080081939A (ko) * 2006-01-12 2008-09-10 도레이 가부시끼가이샤 감광성 조성물, 디스플레이 부재 및 그 제조 방법
CN101679792B (zh) * 2007-12-21 2012-09-05 株式会社Lg化学 用于辊式印刷的油墨组合物
JP5788646B2 (ja) * 2009-06-25 2015-10-07 住友化学株式会社 偏光板、複合偏光板および液晶表示装置
TW201113303A (en) * 2009-10-07 2011-04-16 Sumitomo Chemical Co Colored photosensitive resin compositions
CN101797552A (zh) * 2010-03-26 2010-08-11 四川长虹电器股份有限公司 在非金属材料表面实现选择性导电的处理方法
US20120194622A1 (en) * 2011-01-31 2012-08-02 Camtek Ltd. Ultra violet light emitting diode curing of uv reactive ink
CN102827513B (zh) * 2012-09-04 2015-04-22 上海蓝沛新材料科技股份有限公司 一种可光聚合的催化油墨及其应用
US9835944B2 (en) * 2014-12-10 2017-12-05 Goo Chemical Co., Ltd. Liquid solder resist composition and covered-printed wiring board
JP6740603B2 (ja) * 2014-12-25 2020-08-19 東洋インキＳｃホールディングス株式会社 活性エネルギー線硬化型平版印刷インキ、および印刷物
CN105086602B (zh) * 2015-07-02 2017-06-16 深圳市容大感光科技股份有限公司 光固化热固化树脂组合物油墨、用途及使用其的线路板
CN105086604A (zh) * 2015-07-13 2015-11-25 深圳市容大感光科技股份有限公司 一种油墨组合物、其应用及印刷电路板
CN105086605B (zh) * 2015-07-13 2018-07-27 深圳市容大感光科技股份有限公司 一种光固化热固化组合物油墨、用途及含有其的线路板
JP6581200B2 (ja) * 2015-09-30 2019-09-25 富士フイルム株式会社 静電容量型入力装置の電極保護膜用の組成物、静電容量型入力装置の電極保護膜、転写フィルム、積層体、静電容量型入力装置および画像表示装置。
KR101819110B1 (ko) * 2016-05-17 2018-01-16 마이크로크래프트코리아 주식회사 잉크젯용 수지 조성물 및 이를 이용한 인쇄 배선판

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Also Published As

Publication number Publication date
DE60006016T2 (de) 2004-05-19
JP2000330276A (ja) 2000-11-30
KR100344933B1 (ko) 2002-07-20
ES2209706T3 (es) 2004-07-01
US6465540B1 (en) 2002-10-15
CN1267688A (zh) 2000-09-27
EP1037111A1 (en) 2000-09-20
DE60006016D1 (de) 2003-11-27
ATE252739T1 (de) 2003-11-15
KR20000062930A (ko) 2000-10-25
TW538309B (en) 2003-06-21
CN1202180C (zh) 2005-05-18
JP4081217B2 (ja) 2008-04-23
EP1037111B1 (en) 2003-10-22

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Effective date: 20200315