KR920702830A - 땜질용 플럭스 - Google Patents

땜질용 플럭스

Info

Publication number
KR920702830A
KR920702830A KR1019910700347A KR910700347A KR920702830A KR 920702830 A KR920702830 A KR 920702830A KR 1019910700347 A KR1019910700347 A KR 1019910700347A KR 910700347 A KR910700347 A KR 910700347A KR 920702830 A KR920702830 A KR 920702830A
Authority
KR
South Korea
Prior art keywords
group
containing compound
soldering flux
resin
active agent
Prior art date
Application number
KR1019910700347A
Other languages
English (en)
Other versions
KR940002047B1 (ko
Inventor
마사노리 다께모도
다쓰시 오오니시
마사미 아이하라
Original Assignee
다나까 다로오
닛뽕덴소오 가부시기가이샤
하세가와 요시히로
하리마 가세이 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다나까 다로오, 닛뽕덴소오 가부시기가이샤, 하세가와 요시히로, 하리마 가세이 가부시기가이샤 filed Critical 다나까 다로오
Publication of KR920702830A publication Critical patent/KR920702830A/ko
Application granted granted Critical
Publication of KR940002047B1 publication Critical patent/KR940002047B1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins

Abstract

내용 없음

Description

땜질용 플럭스
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (9)

  1. (가) 연화점이 적어도 80℃인 열가소성 수지와, (나) 활성제를 적어도 함유함을 특징으로 하는 땜질용 플럭스.
  2. 제1항에 있어서, 열가소성 수지가 중합성 불포화기를 가진 모노머의 중합 또는 공중합에 의해 제조되는 아크릴 수지 및/ 또는 스티렌 말레산 수지인 땜질용 플럭스.
  3. 제1항에 있어서, 열가소성 수지 0.5~80 중량%와 활성제 0.1~20 중량% 함유한 땜질용 플럭스.
  4. (가) 에폭시기 함유 화합물, 라디칼 중합성 불포화 이중결합기 함유 화합물과 블록 이소네이트기 함유 화합물로 된 무리로부터 선택된 적어도 한가지 화합물과, (나) 활성제를 적어도 함유함을 특징으로 하는 땜질용 플럭스.
  5. 제4항에 있어서, 에폭시기 함유 화합물, 라디칼 중합성 불포화 이중결합기 함유 화합물 및 블록 이소시아네이트기 함유 화합물로 된 무리로부터 선택된 적어도 한가지 화합물 1~70 중량%와 활성제 0.1~30 중량%를 함유한 땜질용 플럭스.
  6. (가) 연화점이 80℃이상인 열가소성 수지와, (나) 에폭시기 함유 화합물, 라디칼 중합성 불포화 이중결합기 함유 화합물 및 블록 이소시아네이트기 함유 화합물로 된 무리로부터 선택된 적어도 한가지 화합물과, (다) 활성제를 적어도 함유을 특징으로 하는 땜질용 플럭스.
  7. 제6항에 있어서, 열가소성 수지 0.5~80 중량%와 전기한 적어도 한가지 화합물 1 중량% 이상과 활성제 0.1~30 중량%를 함유한 땜질용 플럭스.
  8. 카르복실기 함유 수지와 에폭시 수지의 두가지 수지를 함유하여 되는 열경화성 수지 또는 카르복실기 및 에폭시기의 두가지 기를 가진 열경화성 수지중 적어도 어느 한가지로 된 열경화성 수지와, 활성제를 함유함을 특징으로 하는 땜질용 플럭스.
  9. 제8항에 있어서, 열경화성 수지 0.5~70 중량%와 활성제 0.1~30 중량%를 함유한 땜질용 플럭스.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910700347A 1989-08-08 1990-08-08 땜질용 플럭스 KR940002047B1 (ko)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
JP1-205093 1989-08-08
JP20509489 1989-08-08
JP1-205094 1989-08-08
JP1-205092 1989-08-08
JP20509189 1989-08-08
JP20509289 1989-08-08
JP20509389 1989-08-08
JP1-205091 1989-08-08
JP2190979A JP2503099B2 (ja) 1989-08-08 1990-07-19 はんだ付け用フラックス
JP2-190979 1990-07-19
PCT/JP1990/001013 WO1991001844A1 (en) 1989-08-08 1990-08-08 Soldering flux

Publications (2)

Publication Number Publication Date
KR920702830A true KR920702830A (ko) 1992-10-28
KR940002047B1 KR940002047B1 (ko) 1994-03-16

Family

ID=27529019

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910700347A KR940002047B1 (ko) 1989-08-08 1990-08-08 땜질용 플럭스

Country Status (6)

Country Link
US (1) US5167729A (ko)
EP (1) EP0443030B1 (ko)
JP (1) JP2503099B2 (ko)
KR (1) KR940002047B1 (ko)
DE (1) DE69030917T2 (ko)
WO (1) WO1991001844A1 (ko)

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JP2725063B2 (ja) * 1989-08-25 1998-03-09 株式会社アサヒ化学研究所 はんだ付け用フラックス組成物
US5177134A (en) * 1990-12-03 1993-01-05 Motorola, Inc. Tacking agent
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JP3146768B2 (ja) * 1993-06-23 2001-03-19 松下電器産業株式会社 電子部品の実装方法
US5417771A (en) * 1994-02-16 1995-05-23 Takeda Chemical Industries, Ltd. Soldering flux
JP3787857B2 (ja) * 1995-03-10 2006-06-21 タムラ化研株式会社 回路基板はんだ付け用フラックス及び回路基板
JP3953514B2 (ja) * 1995-05-24 2007-08-08 フライズ・メタルズ・インコーポレーテッド エポキシ系ｖｏｃ非含有はんだ付け用フラックス
JP3378139B2 (ja) * 1996-03-19 2003-02-17 株式会社デンソー はんだ付け用のフラックス
US5851311A (en) * 1996-03-29 1998-12-22 Sophia Systems Co., Ltd. Polymerizable flux composition for encapsulating the solder in situ
US5985043A (en) * 1997-07-21 1999-11-16 Miguel Albert Capote Polymerizable fluxing agents and fluxing adhesive compositions therefrom
CN1056795C (zh) * 1997-02-21 2000-09-27 清华大学 用于焊锡丝的免清洗固体焊剂及其制备方法
US5985456A (en) * 1997-07-21 1999-11-16 Miguel Albert Capote Carboxyl-containing polyunsaturated fluxing adhesive for attaching integrated circuits
US6017634A (en) * 1997-07-21 2000-01-25 Miguel Albert Capote Carboxyl-containing polyunsaturated fluxing agent and carboxyl-reactive neutralizing agent as adhesive
US6402013B2 (en) 1999-12-03 2002-06-11 Senju Metal Industry Co., Ltd Thermosetting soldering flux and soldering process
JP2002336992A (ja) * 2001-05-14 2002-11-26 Nec Corp 回路基板はんだ付用はんだ加工物及び回路基板
JP3888573B2 (ja) * 2001-06-29 2007-03-07 富士電機ホールディングス株式会社 ハンダ組成物
JP3797990B2 (ja) 2003-08-08 2006-07-19 株式会社東芝 熱硬化性フラックス及びはんだペースト
JP4506550B2 (ja) * 2004-08-04 2010-07-21 株式会社デンソー 金属接続方法
JP2008510620A (ja) * 2004-08-25 2008-04-10 松下電器産業株式会社 半田組成物および半田接合方法ならびに半田接合構造
KR20070049169A (ko) * 2004-08-25 2007-05-10 마츠시타 덴끼 산교 가부시키가이샤 땜납 조성물, 납땜 접합 방법, 및 납땜 접합 구조
JP5289328B2 (ja) * 2007-01-04 2013-09-11 フライズ・メタルズ・インコーポレイテッド フラックス配合物
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JP5152727B2 (ja) * 2007-12-21 2013-02-27 ハリマ化成株式会社 アルミニウムろう付け用ペースト組成物
CN106470794A (zh) * 2014-06-19 2017-03-01 阿尔法金属公司 工程残余物焊料膏工艺
JP2019130585A (ja) * 2018-02-02 2019-08-08 株式会社日本スペリア社 はんだ用フラックス及びはんだ組成物並びにはんだ付け用フラックス
CN114378483B (zh) * 2022-03-23 2022-06-03 广州先艺电子科技有限公司 一种免清洗金锡焊膏用助焊剂及其制备方法和应用

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JPS4911301A (ko) * 1972-05-29 1974-01-31
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Also Published As

Publication number Publication date
EP0443030B1 (en) 1997-06-11
WO1991001844A1 (en) 1991-02-21
EP0443030A4 (en) 1993-07-07
EP0443030A1 (en) 1991-08-28
JP2503099B2 (ja) 1996-06-05
JPH04143093A (ja) 1992-05-18
DE69030917T2 (de) 1997-12-04
US5167729A (en) 1992-12-01
DE69030917D1 (de) 1997-07-17
KR940002047B1 (ko) 1994-03-16

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