HK1029401A1 - Ultraviolet curable resin composition and photo solder resist ink using the same - Google Patents

Ultraviolet curable resin composition and photo solder resist ink using the same

Info

Publication number
HK1029401A1
HK1029401A1 HK01100122A HK01100122A HK1029401A1 HK 1029401 A1 HK1029401 A1 HK 1029401A1 HK 01100122 A HK01100122 A HK 01100122A HK 01100122 A HK01100122 A HK 01100122A HK 1029401 A1 HK1029401 A1 HK 1029401A1
Authority
HK
Hong Kong
Prior art keywords
ultraviolet curable
curable resin
resin composition
ethylenically unsaturated
solder resist
Prior art date
Application number
HK01100122A
Other languages
English (en)
Inventor
Tatsuya Kubo
Masatoshi Fujimoto
Soichi Hashimoto
Original Assignee
Goo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goo Chemical Co Ltd filed Critical Goo Chemical Co Ltd
Publication of HK1029401A1 publication Critical patent/HK1029401A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09D133/062—Copolymers with monomers not covered by C09D133/06
    • C09D133/068—Copolymers with monomers not covered by C09D133/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/08—Anti-corrosive paints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
HK01100122A 1999-03-17 2001-01-05 Ultraviolet curable resin composition and photo solder resist ink using the same HK1029401A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7280999 1999-03-17
JP2000055760A JP4081217B2 (ja) 1999-03-17 2000-03-01 紫外線硬化性樹脂組成物、フォトソルダーレジストインク、予備乾燥被膜、基板及びプリント配線板

Publications (1)

Publication Number Publication Date
HK1029401A1 true HK1029401A1 (en) 2001-08-03

Family

ID=26413945

Family Applications (1)

Application Number Title Priority Date Filing Date
HK01100122A HK1029401A1 (en) 1999-03-17 2001-01-05 Ultraviolet curable resin composition and photo solder resist ink using the same

Country Status (10)

Country Link
US (1) US6465540B1 (es)
EP (1) EP1037111B1 (es)
JP (1) JP4081217B2 (es)
KR (1) KR100344933B1 (es)
CN (1) CN1202180C (es)
AT (1) ATE252739T1 (es)
DE (1) DE60006016T2 (es)
ES (1) ES2209706T3 (es)
HK (1) HK1029401A1 (es)
TW (1) TW538309B (es)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000336298A (ja) * 1999-05-28 2000-12-05 Mitsubishi Pencil Co Ltd 焼成色鉛筆芯の製造方法
KR100634341B1 (ko) * 2000-02-14 2006-10-16 타이요 잉크 메뉴펙츄어링 컴퍼니, 리미티드 윤기를 없앤 피막 형성용 광경화성·열경화성 조성물
US6485306B1 (en) * 2001-07-10 2002-11-26 Aiptek International Inc. Locus-recordable portable handwriting device
AU2001286239A1 (en) * 2000-09-16 2002-04-02 Goo Chemical Co., Ltd. Ultraviolet-curable resin composition and photosolder resist ink containing the composition
JP4558178B2 (ja) * 2000-11-30 2010-10-06 新日鐵化学株式会社 光又は熱硬化性樹脂組成物及びプリント配線基板
AU2002221064A1 (en) * 2000-12-14 2002-06-24 Goo Chemical Co., Ltd. Ultraviolet-curable resin composition and photosolder resist ink containing the composition
AU2002246458A1 (en) * 2001-03-30 2002-10-15 Dsm Ip Assets B.V. Curable composition, cured product thereof, and laminated material
JP5027357B2 (ja) * 2001-03-30 2012-09-19 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物及びプリント配線板
JP2003005365A (ja) * 2001-06-25 2003-01-08 Goo Chemical Co Ltd 紫外線硬化性樹脂組成物及びドライフィルム
JP3425139B2 (ja) * 2001-07-27 2003-07-07 實密科技股▲フン▼有限公司 選択的金属メッキ方法
JP3673967B2 (ja) * 2001-09-21 2005-07-20 タムラ化研株式会社 感光性樹脂組成物及びプリント配線板
US7399574B2 (en) * 2001-09-28 2008-07-15 Dai Nippon Printing Co., Ltd. Curable resin for photo-patterning, process for producing the same, curable resin composition, color filter, liquid crystal panel substrate, and liquid crystal panel
CN1267478C (zh) * 2001-12-06 2006-08-02 范蒂科股份公司 热固化树脂组合物
KR20030067168A (ko) * 2002-02-07 2003-08-14 이승구 솔더 레지스트 잉크 조성물
JP2004066017A (ja) * 2002-08-01 2004-03-04 Nippon Paint Co Ltd ソルダーレジスト膜の形成方法
EP1455227A3 (en) * 2002-09-30 2004-10-27 Tamura Kaken Corporation Photosensitive resin composition and printed wiring board
EP1413926A3 (en) * 2002-09-30 2004-10-27 Tamura Kaken Corporation Photosensitive resin composition and printing wiring board
TWI288142B (en) * 2003-05-09 2007-10-11 Taiyo Ink Mfg Co Ltd Photocuring/thermosetting ink jet composition and printed wiring board using same
KR100571366B1 (ko) * 2004-01-27 2006-04-14 주식회사 코오롱 액상 포토 솔더 레지스트 조성물
KR100776721B1 (ko) * 2005-10-05 2007-11-28 주식회사 두산 액정표시소자용 실란트 조성물 및 이를 이용한 씰제
CN101371195A (zh) * 2006-01-12 2009-02-18 东丽株式会社 感光性组合物、显示器构件及其制造方法
US8211222B2 (en) * 2007-12-21 2012-07-03 Lg Chem, Ltd. Ink composition roll for printing
JP5788646B2 (ja) * 2009-06-25 2015-10-07 住友化学株式会社 偏光板、複合偏光板および液晶表示装置
TW201113303A (en) * 2009-10-07 2011-04-16 Sumitomo Chemical Co Colored photosensitive resin compositions
CN101797552A (zh) * 2010-03-26 2010-08-11 四川长虹电器股份有限公司 在非金属材料表面实现选择性导电的处理方法
US20120194622A1 (en) * 2011-01-31 2012-08-02 Camtek Ltd. Ultra violet light emitting diode curing of uv reactive ink
CN102827513B (zh) * 2012-09-04 2015-04-22 上海蓝沛新材料科技股份有限公司 一种可光聚合的催化油墨及其应用
JP5775239B1 (ja) 2014-12-10 2015-09-09 互応化学工業株式会社 液状ソルダーレジスト組成物及び被覆プリント配線板
JP6740603B2 (ja) * 2014-12-25 2020-08-19 東洋インキＳｃホールディングス株式会社 活性エネルギー線硬化型平版印刷インキ、および印刷物
CN105086602B (zh) * 2015-07-02 2017-06-16 深圳市容大感光科技股份有限公司 光固化热固化树脂组合物油墨、用途及使用其的线路板
CN105086605B (zh) * 2015-07-13 2018-07-27 深圳市容大感光科技股份有限公司 一种光固化热固化组合物油墨、用途及含有其的线路板
CN105086604A (zh) * 2015-07-13 2015-11-25 深圳市容大感光科技股份有限公司 一种油墨组合物、其应用及印刷电路板
CN108027675B (zh) * 2015-09-30 2021-10-08 富士胶片株式会社 静电电容型输入装置及其电极保护膜及其膜用组合物、转印薄膜、层叠体、图像显示装置
KR101819110B1 (ko) * 2016-05-17 2018-01-16 마이크로크래프트코리아 주식회사 잉크젯용 수지 조성물 및 이를 이용한 인쇄 배선판

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61243869A (ja) 1985-04-19 1986-10-30 Taiyo Ink Seizo Kk レジストインキ組成物
DE3588111T2 (de) * 1985-06-29 1996-10-31 Dainippon Ink & Chemicals Kunststoffzusammensetzung für Lötschutztinte
JP3329877B2 (ja) 1993-03-02 2002-09-30 互応化学工業株式会社 プリント回路基板製造用レジストインク組成物、それを用いたレジスト膜及びプリント回路基板
JPH0720631A (ja) 1993-06-30 1995-01-24 Taiyo Ink Mfg Ltd 感光性・熱硬化性樹脂組成物及びソルダーマスク形成方法
WO1996028764A1 (fr) 1993-09-02 1996-09-19 Goo Chemical Industries Co., Ltd. Composition de resine photosensible et couche mince de revetement, encre resist, resist de soudure et plaquette a circuits imprimes realises avec cette composition
JP3503910B2 (ja) 1994-08-17 2004-03-08 互応化学工業株式会社 フォトソルダーレジストインク、プリント回路基板及びその製造方法
US5821031A (en) 1994-10-05 1998-10-13 Goo Chemical Co., Ltd. Photosensitive solder resist ink, printed circuit board and production thereof
JPH08335768A (ja) 1995-06-06 1996-12-17 Taiyo Ink Mfg Ltd アルカリ現像可能な一液型ソルダーレジスト組成物及びそれから得られるソルダーレジスト皮膜
JPH09185166A (ja) 1995-12-28 1997-07-15 Taiyo Ink Mfg Ltd 感光性プレポリマー及びそれを用いた光硬化性・熱硬化性ソルダーレジストインキ組成物
JP3405632B2 (ja) 1996-02-28 2003-05-12 互応化学工業株式会社 エポキシ樹脂、エポキシ樹脂組成物及びフォトソルダーレジストインク並びにプリント配線板及びその製造方法
JP3405631B2 (ja) 1996-02-28 2003-05-12 互応化学工業株式会社 エポキシ樹脂組成物及びフォトソルダーレジストインク並びにプリント配線板及びその製造方法
JP3662690B2 (ja) 1996-11-13 2005-06-22 互応化学工業株式会社 紫外線硬化性樹脂組成物及びフォトソルダーレジストインク
JP4060962B2 (ja) 1998-02-25 2008-03-12 互応化学工業株式会社 アルカリ現像型フォトソルダーレジストインク

Also Published As

Publication number Publication date
EP1037111A1 (en) 2000-09-20
CN1202180C (zh) 2005-05-18
CN1267688A (zh) 2000-09-27
ES2209706T3 (es) 2004-07-01
TW538309B (en) 2003-06-21
JP2000330276A (ja) 2000-11-30
KR100344933B1 (ko) 2002-07-20
EP1037111B1 (en) 2003-10-22
DE60006016T2 (de) 2004-05-19
US6465540B1 (en) 2002-10-15
JP4081217B2 (ja) 2008-04-23
DE60006016D1 (de) 2003-11-27
KR20000062930A (ko) 2000-10-25
ATE252739T1 (de) 2003-11-15

Similar Documents

Publication Publication Date Title
HK1029401A1 (en) Ultraviolet curable resin composition and photo solder resist ink using the same
EP1266922A4 (en) PHOT0- OR THERMOCURING COMPOSITIONS FOR PRODUCING MATTER FILMS
TWI265943B (en) Carboxyl group-containing photosensitive resin, alkali-developable, photocurable and thermosetting composition containing the same, and cured products thereof
DE3789480T2 (de) Durch Wasser entwickelbare, lichtempfindliche Platte und Verfahren zu ihrer Herstellung.
EP1568723A4 (en) PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION AND PRINTED CIRCUIT BOARDS MADE BY MEANS OF SUCH A COMPOSITION
KR940005718A (ko) 에폭시기 함유 수지 조성물
EP1276011A4 (en) RESIN COMPOSITION THAT CAN BE CURED BY LIGHT AND WARMTH, LIGHT-SENSITIVE DRY FILM PRODUCED FROM THIS, AND METHOD FOR MAKING A PATTERN THEREFOR
EP0273729A3 (en) Solder resist ink composition
EP1486521A4 (en) CURABLE RESINS AND CURABLE RESIN COMPOSITIONS CONTAINING SAME
AU2001286239A1 (en) Ultraviolet-curable resin composition and photosolder resist ink containing the composition
EP0280295A3 (en) A heat-resistant photosensitive resin composition
EP0346486A4 (en) Resin composition and solder resist resin composition
DE60032341D1 (de) Wässrige dispersion und verfahren zu deren herstellung
EP1296188A3 (en) Photosensitive resin composition and printed wiring board
EP0419657A4 (en) Resin composition for cement
ES2017615B3 (es) Composicion de foto-resistencia y circuito impreso.
KR900004767A (ko) 변형 라텍스 중합체 라미네이팅 접착 조성물을 이용한 신축성 전자 회로의 제조 공정
EP1296189A3 (en) Photosensitive resin composition and printed wiring board
DK49384D0 (da) Anvendelse af en vandig polymerdispersion som fortykkende bindemiddel til puds
JPS57196230A (en) Photosensitive lithographic plate
JPS57187302A (en) Emulsion resin
JPS57158229A (en) Curable resin composition excellent in heat resistance
ATE241653T1 (de) Verfahren zur herstellung von amphoterischen harzen mit einer dispergierfunktion
WO2003007078A3 (en) Photocurable resist inks
JPS5725311A (en) Unsaturated polyester resin composition

Legal Events

Date Code Title Description
PF Patent in force
PE Patent expired

Effective date: 20200315