GB2414954B - Process and apparatus for ablation - Google Patents

Process and apparatus for ablation

Info

Publication number
GB2414954B
GB2414954B GB0413029A GB0413029A GB2414954B GB 2414954 B GB2414954 B GB 2414954B GB 0413029 A GB0413029 A GB 0413029A GB 0413029 A GB0413029 A GB 0413029A GB 2414954 B GB2414954 B GB 2414954B
Authority
GB
United Kingdom
Prior art keywords
ablation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0413029A
Other languages
English (en)
Other versions
GB2414954A (en
GB0413029D0 (en
Inventor
Neil Sykes
Yoshinari Sasaki
Hidehisa Murase
Naoki Yamada
Kousei Aso
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Exitech Ltd
Sony Corp
Original Assignee
Exitech Ltd
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Exitech Ltd, Sony Corp filed Critical Exitech Ltd
Priority to GB0413029A priority Critical patent/GB2414954B/en
Publication of GB0413029D0 publication Critical patent/GB0413029D0/en
Priority to PCT/GB2005/002326 priority patent/WO2005120763A2/en
Priority to US11/628,911 priority patent/US8344285B2/en
Priority to CN2005800265196A priority patent/CN101018639B/zh
Priority to JP2007520873A priority patent/JP2008501531A/ja
Priority to KR1020067026294A priority patent/KR100890295B1/ko
Publication of GB2414954A publication Critical patent/GB2414954A/en
Application granted granted Critical
Publication of GB2414954B publication Critical patent/GB2414954B/en
Priority to JP2012180204A priority patent/JP5389236B2/ja
Priority to US13/720,009 priority patent/US8809732B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
GB0413029A 2004-06-11 2004-06-11 Process and apparatus for ablation Expired - Fee Related GB2414954B (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
GB0413029A GB2414954B (en) 2004-06-11 2004-06-11 Process and apparatus for ablation
JP2007520873A JP2008501531A (ja) 2004-06-11 2005-06-13 アブレーション方法及び装置
US11/628,911 US8344285B2 (en) 2004-06-11 2005-06-13 Process and apparatus for ablation
CN2005800265196A CN101018639B (zh) 2004-06-11 2005-06-13 烧蚀工艺及其装置
PCT/GB2005/002326 WO2005120763A2 (en) 2004-06-11 2005-06-13 Process and apparatus for ablation
KR1020067026294A KR100890295B1 (ko) 2004-06-11 2005-06-13 애블레이션을 위한 방법 및 장치
JP2012180204A JP5389236B2 (ja) 2004-06-11 2012-08-15 アブレーション方法及び装置
US13/720,009 US8809732B2 (en) 2004-06-11 2012-12-19 Process and apparatus for ablation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0413029A GB2414954B (en) 2004-06-11 2004-06-11 Process and apparatus for ablation

Publications (3)

Publication Number Publication Date
GB0413029D0 GB0413029D0 (en) 2004-07-14
GB2414954A GB2414954A (en) 2005-12-14
GB2414954B true GB2414954B (en) 2008-02-06

Family

ID=32732303

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0413029A Expired - Fee Related GB2414954B (en) 2004-06-11 2004-06-11 Process and apparatus for ablation

Country Status (6)

Country Link
US (2) US8344285B2 (ja)
JP (2) JP2008501531A (ja)
KR (1) KR100890295B1 (ja)
CN (1) CN101018639B (ja)
GB (1) GB2414954B (ja)
WO (1) WO2005120763A2 (ja)

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050064137A1 (en) * 2003-01-29 2005-03-24 Hunt Alan J. Method for forming nanoscale features and structures produced thereby
EP1657020A1 (de) * 2004-11-10 2006-05-17 Synova S.A. Verfahren und Vorrichtung zur Optimierung der Kohärenz eines Flüssigkeitsstrahls für eine Materialbearbeitung und Flüssigkeitsdüse für eine solche Vorrichtung
CN100536046C (zh) * 2005-02-25 2009-09-02 京瓷株式会社 复合生片的加工方法
US7863542B2 (en) 2005-12-22 2011-01-04 Sony Corporation Laser processing apparatus and laser processing method as well as debris extraction mechanism and debris extraction method
GB2438527B (en) * 2006-03-07 2008-04-23 Sony Corp Laser processing apparatus, laser processing head and laser processing method
JP5165203B2 (ja) 2006-03-07 2013-03-21 ソニー株式会社 レーザ加工装置及びレーザ加工方法
SE530592C2 (sv) * 2007-01-16 2008-07-15 Tetra Laval Holdings & Finance Anordning för laserbearbetning av en förpackningsmaterialbana
CN101518854B (zh) * 2008-02-29 2011-08-31 深圳市大族激光科技股份有限公司 透镜的吸尘保护装置
JP5094535B2 (ja) * 2008-05-07 2012-12-12 富士フイルム株式会社 凹部形成方法、凹凸製品の製造方法、発光素子の製造方法および光学素子の製造方法
US8207472B2 (en) 2008-06-18 2012-06-26 Electro Scientific Industries, Inc. Debris capture and removal for laser micromachining
FR2932899B1 (fr) * 2008-06-23 2010-07-30 Commissariat Energie Atomique Procede d'elimination de defaut de gravure d'une couche metallique deposee sur un support souple.
US8288678B2 (en) * 2008-12-18 2012-10-16 Ppg Industries Ohio, Inc. Device for and method of maintaining a constant distance between a cutting edge and a reference surface
FR2940154B1 (fr) * 2008-12-23 2011-02-25 Commissariat Energie Atomique Avaloir d'aspiration de particules fines et dispositif d'ablation laser d'une couche superficielle d'une paroi comprenant un tel avaloir
JP2011125871A (ja) * 2009-12-15 2011-06-30 Disco Abrasive Syst Ltd レーザ加工装置
KR101135499B1 (ko) * 2010-05-28 2012-04-13 삼성에스디아이 주식회사 전지용 전극 탭의 레이저 세정 장치 및 이를 이용한 레이저 세정 방법
JP5501099B2 (ja) * 2010-06-03 2014-05-21 株式会社ディスコ レーザ加工装置
GB2481190B (en) * 2010-06-04 2015-01-14 Plastic Logic Ltd Laser ablation
JP5610991B2 (ja) * 2010-11-08 2014-10-22 株式会社ディスコ レーザ加工装置
KR101256430B1 (ko) * 2011-03-15 2013-04-18 삼성에스디아이 주식회사 레이저 용접 장치
DE102011001322A1 (de) * 2011-03-16 2012-09-20 Ipg Laser Gmbh Maschine und Verfahren zur Materialbearbeitung von Werkstücken mit einem Laserstrahl
DE102011107982A1 (de) * 2011-07-20 2013-01-24 Rena Gmbh Werkzeugkopf (LCP-Kopf)
WO2013029038A2 (en) 2011-08-25 2013-02-28 Preco, Inc. Method and apparatus for making a clean cut with a laser
DE102012202330B4 (de) * 2012-02-16 2017-08-17 Trumpf Laser Gmbh Laserbearbeitungsvorrichtung mit einem relativ zu einer Spannpratze beweglichen Laserbearbeitungskopf
CN102642085A (zh) * 2012-04-01 2012-08-22 上海交通大学 激光焊接等离子体侧吸负压装置
JP5943720B2 (ja) * 2012-06-06 2016-07-05 株式会社ディスコ レーザー加工装置
CN102692447B (zh) * 2012-06-11 2014-04-02 燕山大学 小型化强脉冲单轨放电烧蚀装置
US9259802B2 (en) * 2012-07-26 2016-02-16 Electro Scientific Industries, Inc. Method and apparatus for collecting material produced by processing workpieces
JP2015134364A (ja) * 2014-01-16 2015-07-27 株式会社デンソー レーザ加工装置およびレーザ加工方法
JP5663776B1 (ja) * 2014-03-27 2015-02-04 福井県 吸引方法及び吸引装置並びにレーザ加工方法及びレーザ加工装置
EP2944413A1 (de) * 2014-05-12 2015-11-18 Boegli-Gravures S.A. Vorrichtung zur Maskenprojektion von Femtosekunden- und Pikosekunden- Laserstrahlen mit einer Blende, einer Maske und Linsensystemen
KR102410997B1 (ko) * 2014-08-19 2022-06-22 루미리즈 홀딩 비.브이. 다이 레벨 레이저 리프트-오프 동안 기계적 손상을 감소시키기 위한 사파이어 콜렉터
CN105458495B (zh) * 2014-09-11 2017-03-22 大族激光科技产业集团股份有限公司 一种用于激光精密加工的配套系统
GB2530982B (en) * 2014-09-30 2018-10-24 M Solv Ltd Bernoulli process head
US10335899B2 (en) * 2014-10-31 2019-07-02 Prima Power Laserdyne Cross jet laser welding nozzle
CN104625404B (zh) * 2014-12-12 2016-08-17 南通富士通微电子股份有限公司 一种用于激光打标工艺中的清理装置
CN105772942B (zh) * 2014-12-25 2018-07-03 大族激光科技产业集团股份有限公司 一种激光焊缝同轴吹气保护装置及应用方法
CN107924865B (zh) * 2015-05-13 2022-03-11 亮锐控股有限公司 用于减少在管芯水平激光剥离期间机械损伤的蓝宝石收集器
JP6867372B2 (ja) 2015-08-26 2021-04-28 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド レーザスキャン順序及びガス流れに対する方向
EP3167998B1 (en) * 2015-11-16 2021-01-06 Preco, Inc. Galvo cooling air bypass to reduce contamination
CN105499804B (zh) * 2016-01-18 2018-01-02 华中科技大学 一种激光焊接过程中焊缝内部孔洞的控制方法及控制装置
KR101739839B1 (ko) * 2016-02-02 2017-05-25 한동대학교 산학협력단 표면개질용 빔균질기
JP6999264B2 (ja) * 2016-08-04 2022-01-18 株式会社日本製鋼所 レーザ剥離装置、レーザ剥離方法、及び有機ｅｌディスプレイの製造方法
CN108098155B (zh) * 2016-11-17 2020-10-09 宁德新能源科技有限公司 除尘装置
JP6450783B2 (ja) * 2017-01-19 2019-01-09 ファナック株式会社 レーザ加工ヘッド用ノズル
JP6450784B2 (ja) * 2017-01-19 2019-01-09 ファナック株式会社 レーザ加工機
KR101876961B1 (ko) * 2017-03-14 2018-07-10 주식회사 에이치비테크놀러지 박막형성 장치
KR101876963B1 (ko) * 2017-03-14 2018-07-10 주식회사 에이치비테크놀러지 박막형성 장치
JP6508549B2 (ja) * 2017-05-12 2019-05-08 パナソニックＩｐマネジメント株式会社 レーザ加工装置
JP6985642B2 (ja) * 2017-10-20 2021-12-22 株式会社Ihi レーザ溶接装置及びレーザ溶接方法
KR20190110442A (ko) * 2018-03-20 2019-09-30 오르보테크 엘티디. 광학 처리 시스템 내에서 기판으로부터 파편을 제거하기 위한 시스템
JP7114708B2 (ja) 2018-06-27 2022-08-08 ギガフォトン株式会社 レーザ加工装置、レーザ加工システム、及びレーザ加工方法
JP6852031B2 (ja) * 2018-09-26 2021-03-31 株式会社東芝 溶接装置及びノズル装置
KR20200071191A (ko) 2018-12-10 2020-06-19 삼성디스플레이 주식회사 표시 장치의 제조 방법
CN109623140B (zh) * 2018-12-11 2021-07-27 中国科学院宁波材料技术与工程研究所 光纤与水导激光耦合加工装置及系统
KR20200093724A (ko) * 2019-01-28 2020-08-06 삼성디스플레이 주식회사 석션 장치 및 그것을 포함하는 패널 가공 장치
US11273520B2 (en) 2019-01-31 2022-03-15 General Electric Company System and method for automated laser ablation
DE102019103659B4 (de) * 2019-02-13 2023-11-30 Bystronic Laser Ag Gasführung, Laserschneidkopf und Laserschneidmaschine
GB2581378A (en) * 2019-02-15 2020-08-19 Hanbury Robert Laser cutting sheet/material support system
JP7306860B2 (ja) * 2019-04-11 2023-07-11 Ｊｓｗアクティナシステム株式会社 レーザ処理装置
US11267075B2 (en) * 2019-05-16 2022-03-08 Raytheon Technologies Corporation By-product removal device for laser welding
WO2020261537A1 (ja) * 2019-06-28 2020-12-30 三菱重工業株式会社 レーザー加工装置
CN112620255B (zh) * 2020-12-15 2022-05-03 哈尔滨工业大学（深圳） 一种水下激光水流复合清洗系统及方法
CN114378446B (zh) * 2022-03-22 2022-07-29 苏州密尔光子科技有限公司 激光加工辅助装置、方法和具有该装置的激光设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3923829A1 (de) * 1989-07-19 1991-01-31 Fraunhofer Ges Forschung Absauganlage
US5359176A (en) * 1993-04-02 1994-10-25 International Business Machines Corporation Optics and environmental protection device for laser processing applications
EP0695600A2 (en) * 1994-08-02 1996-02-07 McNEIL-PPC, INC. Laser-processing head for laser processing apparatus
EP1149660A1 (en) * 2000-04-03 2001-10-31 Rexam Beverage Packaging AB Method and device for dust protection in a laser processing apparatus
US20030121896A1 (en) * 2002-01-03 2003-07-03 Cheng-Hung Yu Apparatus for on-line cleaning a wafer chuck with laser
US20030127435A1 (en) * 2000-08-31 2003-07-10 Sharp Laboratories Of America, Inc. Laser annealing apparatus to control the amount of oxygen incorporated into polycrystalline silicon films
JP2003245791A (ja) * 2002-02-25 2003-09-02 Sony Corp レーザ加工装置およびレーザ加工方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2627409A1 (fr) * 1988-02-24 1989-08-25 Lectra Systemes Sa Appareil de coupe laser muni d'un dispositif d'evacuation des fumees
JP3203294B2 (ja) * 1994-09-30 2001-08-27 三菱電機株式会社 レーザ加工装置用レンズカバー
GB9507719D0 (en) * 1995-04-13 1995-05-31 Boc Group Plc Machining of materials
JPH09141484A (ja) * 1995-11-22 1997-06-03 Nikon Corp レーザ加工装置
JP3292021B2 (ja) * 1996-01-30 2002-06-17 三菱電機株式会社 レーザ加工方法およびレーザ加工装置
US5922225A (en) * 1996-03-06 1999-07-13 Blake; Ronald J. Apparatus for reducing vaporized material deposits during laser cutting
JP3722902B2 (ja) * 1996-04-18 2005-11-30 日清紡績株式会社 レーザ加工方法及び装置
US6064035A (en) * 1997-12-30 2000-05-16 Lsp Technologies, Inc. Process chamber for laser peening
US6262390B1 (en) * 1998-12-14 2001-07-17 International Business Machines Corporation Repair process for aluminum nitride substrates
US6359257B1 (en) * 1999-02-19 2002-03-19 Lsp Technologies, Inc. Beam path clearing for laser peening
US6342687B1 (en) 2000-02-17 2002-01-29 Universal Laser Systems, Inc. Portable laser system with portable or stationary fume evacuation
JP2001321979A (ja) * 2000-05-12 2001-11-20 Matsushita Electric Ind Co Ltd レーザー穴加工機の加工粉集塵装置
JP3479833B2 (ja) * 2000-08-22 2003-12-15 日本電気株式会社 レーザ修正方法および装置
JP3933398B2 (ja) * 2001-01-19 2007-06-20 リコーマイクロエレクトロニクス株式会社 ビーム加工装置
DE10123097B8 (de) * 2001-05-07 2006-05-04 Jenoptik Automatisierungstechnik Gmbh Werkzeugkopf zur Lasermaterialbearbeitung
JP4459514B2 (ja) 2002-09-05 2010-04-28 株式会社半導体エネルギー研究所 レーザーマーキング装置
JP2004160463A (ja) 2002-11-11 2004-06-10 Hyogo Prefecture レーザ加工装置および該装置を用いた被加工物の加工方法
GB2400063B (en) * 2003-04-03 2006-02-15 Exitech Ltd Positioning method and apparatus and a product thereof
JP4205486B2 (ja) * 2003-05-16 2009-01-07 株式会社ディスコ レーザ加工装置
JP4404085B2 (ja) * 2006-11-02 2010-01-27 ソニー株式会社 レーザ加工装置、レーザ加工ヘッド及びレーザ加工方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3923829A1 (de) * 1989-07-19 1991-01-31 Fraunhofer Ges Forschung Absauganlage
US5359176A (en) * 1993-04-02 1994-10-25 International Business Machines Corporation Optics and environmental protection device for laser processing applications
EP0695600A2 (en) * 1994-08-02 1996-02-07 McNEIL-PPC, INC. Laser-processing head for laser processing apparatus
EP1149660A1 (en) * 2000-04-03 2001-10-31 Rexam Beverage Packaging AB Method and device for dust protection in a laser processing apparatus
US20030127435A1 (en) * 2000-08-31 2003-07-10 Sharp Laboratories Of America, Inc. Laser annealing apparatus to control the amount of oxygen incorporated into polycrystalline silicon films
US20030121896A1 (en) * 2002-01-03 2003-07-03 Cheng-Hung Yu Apparatus for on-line cleaning a wafer chuck with laser
JP2003245791A (ja) * 2002-02-25 2003-09-02 Sony Corp レーザ加工装置およびレーザ加工方法

Also Published As

Publication number Publication date
US20130140287A1 (en) 2013-06-06
GB2414954A (en) 2005-12-14
JP2012254482A (ja) 2012-12-27
WO2005120763A2 (en) 2005-12-22
US8344285B2 (en) 2013-01-01
GB0413029D0 (en) 2004-07-14
KR20070039493A (ko) 2007-04-12
KR100890295B1 (ko) 2009-03-26
WO2005120763A3 (en) 2006-02-23
US8809732B2 (en) 2014-08-19
CN101018639B (zh) 2010-04-21
JP2008501531A (ja) 2008-01-24
US20080041832A1 (en) 2008-02-21
JP5389236B2 (ja) 2014-01-15
CN101018639A (zh) 2007-08-15

Similar Documents

Publication Publication Date Title
GB2414954B (en) Process and apparatus for ablation
EP1883364A4 (en) DEVICE AND METHOD FOR ABLATION IMPLEMENTATION
SG123759A1 (en) Method and apparatus for placing assist features
EP1871260A4 (en) CAVITY ABLATION DEVICE AND METHOD
GB0406336D0 (en) Apparatus and method
GB0501688D0 (en) Method and apparatus
GB0506186D0 (en) Apparatus and method
GB0621488D0 (en) Apparatus and method
GB0526501D0 (en) Method and Apparatus
GB0611868D0 (en) Method and apparatus
GB0605136D0 (en) Apparatus and method
AP2007003949A0 (en) Apparatus and method
GB2438094B (en) Apparatus and method
GB0513613D0 (en) Apparatus and method
GB0508695D0 (en) Apparatus and method
GB0403238D0 (en) Apparatus and method
GB0402428D0 (en) Apparatus and method
GB0517531D0 (en) Method and apparatus
GB0509526D0 (en) Method and apparatus
GB0504469D0 (en) Method and apparatus
GB0509450D0 (en) Method and apparatus
EP1828440A4 (en) ELECTRODEPOSITION METHOD AND APPARATUS UNDER PULSES
GB0409483D0 (en) Electrosurgical method and apparatus
GB0407659D0 (en) Method and apparatus
GB0408117D0 (en) Apparatus and method

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20140611