GB2086134B - Resin encapsulated electronic devices - Google Patents

Resin encapsulated electronic devices

Info

Publication number
GB2086134B
GB2086134B GB8127997A GB8127997A GB2086134B GB 2086134 B GB2086134 B GB 2086134B GB 8127997 A GB8127997 A GB 8127997A GB 8127997 A GB8127997 A GB 8127997A GB 2086134 B GB2086134 B GB 2086134B
Authority
GB
United Kingdom
Prior art keywords
electronic devices
resin encapsulated
encapsulated electronic
resin
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8127997A
Other languages
English (en)
Other versions
GB2086134A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of GB2086134A publication Critical patent/GB2086134A/en
Application granted granted Critical
Publication of GB2086134B publication Critical patent/GB2086134B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/12—Protection against corrosion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Details Of Resistors (AREA)
GB8127997A 1980-09-22 1981-09-16 Resin encapsulated electronic devices Expired GB2086134B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55130682A JPS6018145B2 (ja) 1980-09-22 1980-09-22 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
GB2086134A GB2086134A (en) 1982-05-06
GB2086134B true GB2086134B (en) 1984-09-05

Family

ID=15040087

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8127997A Expired GB2086134B (en) 1980-09-22 1981-09-16 Resin encapsulated electronic devices

Country Status (4)

Country Link
US (1) US4933744A (enExample)
JP (1) JPS6018145B2 (enExample)
DE (1) DE3137480A1 (enExample)
GB (1) GB2086134B (enExample)

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US4616406A (en) * 1984-09-27 1986-10-14 Advanced Micro Devices, Inc. Process of making a semiconductor device having parallel leads directly connected perpendicular to integrated circuit layers therein
DE3442131A1 (de) * 1984-11-17 1986-05-22 Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn Verfahren zum einkapseln von mikroelektronischen halbleiter- und schichtschaltungen
JPH0682764B2 (ja) * 1985-11-28 1994-10-19 日東電工株式会社 半導体装置
US4720741A (en) * 1986-06-26 1988-01-19 American Telephone And Telegraph Company, At&T Technologies, Inc. Antistatic and antitack coating for circuit devices
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JPH0689224B2 (ja) * 1987-09-11 1994-11-09 ポリプラスチックス株式会社 低応力封止材
US5031017A (en) * 1988-01-29 1991-07-09 Hewlett-Packard Company Composite optical shielding
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CA2054554A1 (en) * 1990-11-14 1992-05-15 Chong Soo Lee Coated abrasive having an overcoating of an epoxy resin coatable from water and a grinding aid
DE69225337T2 (de) * 1991-03-08 1998-08-27 Japan Gore Tex Inc In Harz versiegelte Halbleitervorrichtung bestehend aus porösem Fluorkohlenstoffharz
US5218759A (en) * 1991-03-18 1993-06-15 Motorola, Inc. Method of making a transfer molded semiconductor device
US5134094A (en) * 1991-07-22 1992-07-28 Silicon Power Corporation Single inline packaged solid state relay with high current density capability
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US5390082A (en) * 1992-07-06 1995-02-14 International Business Machines, Corp. Chip carrier with protective coating for circuitized surface
US5381304A (en) * 1993-06-11 1995-01-10 Honeywell Inc. Reworkable encapsulated electronic assembly and method of making same
JPH0722722A (ja) * 1993-07-05 1995-01-24 Mitsubishi Electric Corp 樹脂成形タイプの電子回路装置
US5585600A (en) * 1993-09-02 1996-12-17 International Business Machines Corporation Encapsulated semiconductor chip module and method of forming the same
JP2569400B2 (ja) * 1994-06-23 1997-01-08 九州日本電気株式会社 樹脂封止型半導体装置の製造方法
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JP3401107B2 (ja) * 1995-01-23 2003-04-28 松下電器産業株式会社 パッケージｉｃのモジュール
DE19638669A1 (de) * 1996-09-20 1998-04-02 Siemens Components A T Herstellungsverfahren von Kunststoffgehäusen für auf Trägerrahmen befestigten Chips
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US6311621B1 (en) 1996-11-01 2001-11-06 The Ensign-Bickford Company Shock-resistant electronic circuit assembly
JP3125137B2 (ja) * 1996-11-18 2001-01-15 株式会社日立製作所 半導体装置
TW378345B (en) * 1997-01-22 2000-01-01 Hitachi Ltd Resin package type semiconductor device and manufacturing method thereof
US6621173B1 (en) * 1998-07-23 2003-09-16 Dow Corning Toray Silicone Co., Ltd. Semiconductor device having an adhesive and a sealant
US6087200A (en) * 1998-08-13 2000-07-11 Clear Logic, Inc. Using microspheres as a stress buffer for integrated circuit prototypes
JP3736349B2 (ja) 1998-08-21 2006-01-18 日立化成工業株式会社 ペースト組成物並びにこれを用いた保護膜及び半導体装置
JP2000114204A (ja) * 1998-10-01 2000-04-21 Mitsubishi Electric Corp ウエハシート及びこれを用いた半導体装置の製造方法並びに半導体製造装置
JP2000228467A (ja) * 1998-12-02 2000-08-15 Toshiba Corp 半導体封止用樹脂組成物及び半導体装置とその製造方法
JP2001044358A (ja) * 1999-07-28 2001-02-16 Mitsubishi Electric Corp 半導体装置およびその製造方法
CN101037581A (zh) * 1999-08-25 2007-09-19 日立化成工业株式会社 粘合剂,配线端子的连接方法和配线结构体
US6534707B1 (en) 2000-10-11 2003-03-18 Visteon Global Technologies, Inc. Method for absorbing active, external and dynamic magnetic fields using a ferrite encapsulated coating
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JP3938067B2 (ja) * 2003-02-18 2007-06-27 株式会社日立製作所 電子回路装置
JP4277079B2 (ja) * 2004-06-18 2009-06-10 Ｏｋｉセミコンダクタ株式会社 半導体加速度センサ装置及びその製造方法
DE102004031889B4 (de) * 2004-06-30 2012-07-12 Infineon Technologies Ag Halbleiterbauteil mit einem Gehäuse und einem teilweise in eine Kunststoffgehäusemasse eingebetteten Halbleiterchip und Verfahren zur Herstellung desselben
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US7659141B2 (en) * 2007-09-25 2010-02-09 Silverbrook Research Pty Ltd Wire bond encapsulant application control
US8063318B2 (en) * 2007-09-25 2011-11-22 Silverbrook Research Pty Ltd Electronic component with wire bonds in low modulus fill encapsulant
US7741720B2 (en) * 2007-09-25 2010-06-22 Silverbrook Research Pty Ltd Electronic device with wire bonds adhered between integrated circuits dies and printed circuit boards
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Also Published As

Publication number Publication date
DE3137480A1 (de) 1982-04-15
US4933744A (en) 1990-06-12
JPS6018145B2 (ja) 1985-05-09
GB2086134A (en) 1982-05-06
JPS5756954A (en) 1982-04-05
DE3137480C2 (enExample) 1993-02-04

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20000916