DE3137480C2 - - Google Patents

Info

Publication number
DE3137480C2
DE3137480C2 DE3137480A DE3137480A DE3137480C2 DE 3137480 C2 DE3137480 C2 DE 3137480C2 DE 3137480 A DE3137480 A DE 3137480A DE 3137480 A DE3137480 A DE 3137480A DE 3137480 C2 DE3137480 C2 DE 3137480C2
Authority
DE
Germany
Prior art keywords
resin
resins
rubber
particles
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3137480A
Other languages
German (de)
English (en)
Other versions
DE3137480A1 (de
Inventor
Tadanori Segawa
Hiroshi Suzuki
Masahiro Hitachi Jp Kitamura
Shunichi Hitashi Jp Numata
Kunihiko Higashikurume Jp Nishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE3137480A1 publication Critical patent/DE3137480A1/de
Application granted granted Critical
Publication of DE3137480C2 publication Critical patent/DE3137480C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/12—Protection against corrosion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Details Of Resistors (AREA)
DE19813137480 1980-09-22 1981-09-21 In harz eingekapselte elektronische vorrichtung Granted DE3137480A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55130682A JPS6018145B2 (ja) 1980-09-22 1980-09-22 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
DE3137480A1 DE3137480A1 (de) 1982-04-15
DE3137480C2 true DE3137480C2 (enExample) 1993-02-04

Family

ID=15040087

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19813137480 Granted DE3137480A1 (de) 1980-09-22 1981-09-21 In harz eingekapselte elektronische vorrichtung

Country Status (4)

Country Link
US (1) US4933744A (enExample)
JP (1) JPS6018145B2 (enExample)
DE (1) DE3137480A1 (enExample)
GB (1) GB2086134B (enExample)

Families Citing this family (70)

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DE3029667A1 (de) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
JPS58219218A (ja) * 1982-06-15 1983-12-20 Toray Silicone Co Ltd 熱硬化性エポキシ樹脂組成物
DE3222791A1 (de) * 1982-06-18 1983-12-22 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von halbleiter-bauelementen
JPS58225120A (ja) * 1982-06-25 1983-12-27 Mitsubishi Gas Chem Co Inc 半導体封止用エポキシ樹脂組成物
JPS5996122A (ja) * 1982-11-22 1984-06-02 Toray Silicone Co Ltd 熱硬化性エポキシ樹脂組成物
JPS6063951A (ja) * 1983-09-16 1985-04-12 Hitachi Ltd 半導体装置
US4616406A (en) * 1984-09-27 1986-10-14 Advanced Micro Devices, Inc. Process of making a semiconductor device having parallel leads directly connected perpendicular to integrated circuit layers therein
DE3442131A1 (de) * 1984-11-17 1986-05-22 Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn Verfahren zum einkapseln von mikroelektronischen halbleiter- und schichtschaltungen
JPH0682764B2 (ja) * 1985-11-28 1994-10-19 日東電工株式会社 半導体装置
US4720741A (en) * 1986-06-26 1988-01-19 American Telephone And Telegraph Company, At&T Technologies, Inc. Antistatic and antitack coating for circuit devices
GB8622807D0 (en) * 1986-09-23 1987-02-04 Royal Ordnance Plc Semiconductor chip constructions
JPH0689224B2 (ja) * 1987-09-11 1994-11-09 ポリプラスチックス株式会社 低応力封止材
US5031017A (en) * 1988-01-29 1991-07-09 Hewlett-Packard Company Composite optical shielding
JPH0289854U (enExample) * 1988-12-27 1990-07-17
JP2907914B2 (ja) * 1989-01-16 1999-06-21 シーメンス、アクチエンゲゼルシヤフト 電気又は電子デバイス又はモジユールの封止方法とパツケージ
EP0386473B1 (de) * 1989-03-08 1996-12-11 Siemens Aktiengesellschaft Tropfenabdeckmassen für elektrische und elektronische Bauelemente
US4946518A (en) * 1989-03-14 1990-08-07 Motorola, Inc. Method for improving the adhesion of a plastic encapsulant to copper containing leadframes
FR2645680B1 (fr) * 1989-04-07 1994-04-29 Thomson Microelectronics Sa Sg Encapsulation de modules electroniques et procede de fabrication
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US5187558A (en) * 1989-05-08 1993-02-16 Mitsubishi Denki Kabushiki Kaisha Stress reduction structure for a resin sealed semiconductor device
US5349136A (en) * 1989-08-02 1994-09-20 Matsushita Electric Industrial Co., Ltd. Mold tool assembly
JPH0639563B2 (ja) * 1989-12-15 1994-05-25 株式会社日立製作所 半導体装置の製法
JPH03259914A (ja) * 1990-03-09 1991-11-20 Hitachi Ltd 半導体封止用樹脂組成物および該組成物を用いた半導体装置
US5281846A (en) * 1990-05-29 1994-01-25 Texas Instruments Deutschland Gmbh Electronic device having a discrete capacitor adherently mounted to a lead frame
JPH03245558A (ja) * 1990-09-17 1991-11-01 Hitachi Ltd 半導体装置
US5194933A (en) * 1990-10-05 1993-03-16 Fuji Electric Co., Ltd. Semiconductor device using insulation coated metal substrate
FR2668651A1 (fr) * 1990-10-29 1992-04-30 Sgs Thomson Microelectronics Circuit integre a boitier moule comprenant un dispositif de reduction de l'impedance dynamique.
CA2083868A1 (en) * 1990-11-14 1993-06-12 Chong Soo Lee Coated abrasive having a coating of an epoxy resin coatable from water
CA2054554A1 (en) * 1990-11-14 1992-05-15 Chong Soo Lee Coated abrasive having an overcoating of an epoxy resin coatable from water and a grinding aid
DE69225337T2 (de) * 1991-03-08 1998-08-27 Japan Gore Tex Inc In Harz versiegelte Halbleitervorrichtung bestehend aus porösem Fluorkohlenstoffharz
US5218759A (en) * 1991-03-18 1993-06-15 Motorola, Inc. Method of making a transfer molded semiconductor device
US5134094A (en) * 1991-07-22 1992-07-28 Silicon Power Corporation Single inline packaged solid state relay with high current density capability
US5252783A (en) * 1992-02-10 1993-10-12 Motorola, Inc. Semiconductor package
DE4211250A1 (de) * 1992-04-03 1993-10-07 Siemens Ag Reaktionsharze zum Vergießen von druckempfindlichen elektronischen Bauelementen
US5390082A (en) * 1992-07-06 1995-02-14 International Business Machines, Corp. Chip carrier with protective coating for circuitized surface
US5381304A (en) * 1993-06-11 1995-01-10 Honeywell Inc. Reworkable encapsulated electronic assembly and method of making same
JPH0722722A (ja) * 1993-07-05 1995-01-24 Mitsubishi Electric Corp 樹脂成形タイプの電子回路装置
US5585600A (en) * 1993-09-02 1996-12-17 International Business Machines Corporation Encapsulated semiconductor chip module and method of forming the same
JP2569400B2 (ja) * 1994-06-23 1997-01-08 九州日本電気株式会社 樹脂封止型半導体装置の製造方法
DE4423575A1 (de) 1994-07-05 1996-01-11 Giesecke & Devrient Gmbh Datenträger mit einem Modul mit integriertem Schaltkreis
JP3401107B2 (ja) * 1995-01-23 2003-04-28 松下電器産業株式会社 パッケージｉｃのモジュール
DE19638669A1 (de) * 1996-09-20 1998-04-02 Siemens Components A T Herstellungsverfahren von Kunststoffgehäusen für auf Trägerrahmen befestigten Chips
US6079332A (en) * 1996-11-01 2000-06-27 The Ensign-Bickford Company Shock-resistant electronic circuit assembly
US6311621B1 (en) 1996-11-01 2001-11-06 The Ensign-Bickford Company Shock-resistant electronic circuit assembly
JP3125137B2 (ja) * 1996-11-18 2001-01-15 株式会社日立製作所 半導体装置
TW378345B (en) * 1997-01-22 2000-01-01 Hitachi Ltd Resin package type semiconductor device and manufacturing method thereof
US6621173B1 (en) * 1998-07-23 2003-09-16 Dow Corning Toray Silicone Co., Ltd. Semiconductor device having an adhesive and a sealant
US6087200A (en) * 1998-08-13 2000-07-11 Clear Logic, Inc. Using microspheres as a stress buffer for integrated circuit prototypes
JP3736349B2 (ja) 1998-08-21 2006-01-18 日立化成工業株式会社 ペースト組成物並びにこれを用いた保護膜及び半導体装置
JP2000114204A (ja) * 1998-10-01 2000-04-21 Mitsubishi Electric Corp ウエハシート及びこれを用いた半導体装置の製造方法並びに半導体製造装置
JP2000228467A (ja) * 1998-12-02 2000-08-15 Toshiba Corp 半導体封止用樹脂組成物及び半導体装置とその製造方法
JP2001044358A (ja) * 1999-07-28 2001-02-16 Mitsubishi Electric Corp 半導体装置およびその製造方法
CN101037581A (zh) * 1999-08-25 2007-09-19 日立化成工业株式会社 粘合剂,配线端子的连接方法和配线结构体
US6534707B1 (en) 2000-10-11 2003-03-18 Visteon Global Technologies, Inc. Method for absorbing active, external and dynamic magnetic fields using a ferrite encapsulated coating
US6748650B2 (en) * 2001-06-27 2004-06-15 Visteon Global Technologies, Inc. Method for making a circuit assembly having an integral frame
FR2848667B1 (fr) * 2002-12-11 2005-01-14 Valeo Electronique Sys Liaison Capteur de temperature
JP3938067B2 (ja) * 2003-02-18 2007-06-27 株式会社日立製作所 電子回路装置
JP4277079B2 (ja) * 2004-06-18 2009-06-10 Ｏｋｉセミコンダクタ株式会社 半導体加速度センサ装置及びその製造方法
DE102004031889B4 (de) * 2004-06-30 2012-07-12 Infineon Technologies Ag Halbleiterbauteil mit einem Gehäuse und einem teilweise in eine Kunststoffgehäusemasse eingebetteten Halbleiterchip und Verfahren zur Herstellung desselben
DE102005027551A1 (de) 2005-06-14 2006-12-21 Basf Ag Verfahren zur Herstellung eines Verbundstoffes aus Steinen und einem Kunststoff
WO2007029504A1 (ja) * 2005-09-02 2007-03-15 Shin-Etsu Chemical Co., Ltd. エポキシ樹脂組成物及び該組成物を含むダイボンド剤
US20070090545A1 (en) * 2005-10-24 2007-04-26 Condie Brian W Semiconductor device with improved encapsulation
EP2097241B1 (en) 2006-12-29 2015-02-11 Montanuniversität Leoben Device for and method of determining residence time distributions
US7659141B2 (en) * 2007-09-25 2010-02-09 Silverbrook Research Pty Ltd Wire bond encapsulant application control
US8063318B2 (en) * 2007-09-25 2011-11-22 Silverbrook Research Pty Ltd Electronic component with wire bonds in low modulus fill encapsulant
US7741720B2 (en) * 2007-09-25 2010-06-22 Silverbrook Research Pty Ltd Electronic device with wire bonds adhered between integrated circuits dies and printed circuit boards
JP2011100718A (ja) * 2009-10-05 2011-05-19 Yazaki Corp コネクタ
US9349927B2 (en) * 2011-10-18 2016-05-24 Nitto Denko Corporation Encapsulating sheet and optical semiconductor element device
DE102020127830A1 (de) * 2020-10-22 2022-04-28 Infineon Technologies Ag Moldverbindungen und Packages zum Verkapseln elektronischer Komponenten
JP7528042B2 (ja) * 2021-09-17 2024-08-05 株式会社東芝 半導体装置

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US4529755A (en) * 1982-10-23 1985-07-16 Denki Kagaku Kogyo Kabushiki Kaisha Epoxy resin composition for encapsulating semiconductor

Also Published As

Publication number Publication date
GB2086134B (en) 1984-09-05
DE3137480A1 (de) 1982-04-15
US4933744A (en) 1990-06-12
JPS6018145B2 (ja) 1985-05-09
GB2086134A (en) 1982-05-06
JPS5756954A (en) 1982-04-05

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8128 New person/name/address of the agent

Representative=s name: VON FUENER, A., DIPL.-CHEM. DR.RER.NAT. EBBINGHAUS

D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee