JPS56147452A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS56147452A
JPS56147452A JP5082980A JP5082980A JPS56147452A JP S56147452 A JPS56147452 A JP S56147452A JP 5082980 A JP5082980 A JP 5082980A JP 5082980 A JP5082980 A JP 5082980A JP S56147452 A JPS56147452 A JP S56147452A
Authority
JP
Japan
Prior art keywords
sealing material
case
deformed
metal plate
stress resulting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5082980A
Other languages
Japanese (ja)
Other versions
JPS6014509B2 (en
Inventor
Kazuo Usada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP5082980A priority Critical patent/JPS6014509B2/en
Publication of JPS56147452A publication Critical patent/JPS56147452A/en
Publication of JPS6014509B2 publication Critical patent/JPS6014509B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To absorb the stress resulting from the cure shrinkage of a sealing material by providing a thin plate between a case and the sealing material. CONSTITUTION:For example, a thin metal plate 5 (approximately 0.1mm.) is fitted into a case 1. Subsequently, a sealing material 2 such as epoxy resin and an IC- mounting substrate 3 are piled thereon and heated to melt the sealing material. When the heating is stopped, the sealing material starts curing, so that the substrate 3 is sealed. At this time, absorbing the stress resulting from the shrinkage of the sealing material 2, the thin metal plate 5 is deformed. Because the thin plate 5 is not secured to the inside of the case 1, the case bottom is not cracked or deformed at all.
JP5082980A 1980-04-16 1980-04-16 semiconductor equipment Expired JPS6014509B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5082980A JPS6014509B2 (en) 1980-04-16 1980-04-16 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5082980A JPS6014509B2 (en) 1980-04-16 1980-04-16 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS56147452A true JPS56147452A (en) 1981-11-16
JPS6014509B2 JPS6014509B2 (en) 1985-04-13

Family

ID=12869647

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5082980A Expired JPS6014509B2 (en) 1980-04-16 1980-04-16 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6014509B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4894414A (en) * 1987-07-30 1990-01-16 The Dow Chemical Company Rubber-modified cyanate ester resins and polytriazines derived therefrom
US5079294A (en) * 1987-07-30 1992-01-07 The Dow Chemical Company Rubber-modified cyanate ester resins and polytriazines derived therefrom

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4894414A (en) * 1987-07-30 1990-01-16 The Dow Chemical Company Rubber-modified cyanate ester resins and polytriazines derived therefrom
US5079294A (en) * 1987-07-30 1992-01-07 The Dow Chemical Company Rubber-modified cyanate ester resins and polytriazines derived therefrom

Also Published As

Publication number Publication date
JPS6014509B2 (en) 1985-04-13

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