JPS53143656A - Resin seal-forming of electronic parts - Google Patents

Resin seal-forming of electronic parts

Info

Publication number
JPS53143656A
JPS53143656A JP5914177A JP5914177A JPS53143656A JP S53143656 A JPS53143656 A JP S53143656A JP 5914177 A JP5914177 A JP 5914177A JP 5914177 A JP5914177 A JP 5914177A JP S53143656 A JPS53143656 A JP S53143656A
Authority
JP
Japan
Prior art keywords
forming
electronic parts
resin seal
sealing resin
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5914177A
Other languages
Japanese (ja)
Inventor
Takahiro Matsuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP5914177A priority Critical patent/JPS53143656A/en
Publication of JPS53143656A publication Critical patent/JPS53143656A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/462—Injection of preformed charges of material

Abstract

PURPOSE:To reduce sealing resin cost by avoiding leaving an expensive sealing resin in a renner, by feeding said sealing resin for electronic part s such as semiconductor elements, etc. followed by charging another inexpensive resin into the runner.
JP5914177A 1977-05-20 1977-05-20 Resin seal-forming of electronic parts Pending JPS53143656A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5914177A JPS53143656A (en) 1977-05-20 1977-05-20 Resin seal-forming of electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5914177A JPS53143656A (en) 1977-05-20 1977-05-20 Resin seal-forming of electronic parts

Publications (1)

Publication Number Publication Date
JPS53143656A true JPS53143656A (en) 1978-12-14

Family

ID=13104735

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5914177A Pending JPS53143656A (en) 1977-05-20 1977-05-20 Resin seal-forming of electronic parts

Country Status (1)

Country Link
JP (1) JPS53143656A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56137916A (en) * 1980-03-31 1981-10-28 Nec Home Electronics Ltd Molding method for resin of parts
JPS5738125A (en) * 1980-08-20 1982-03-02 Hitachi Ltd Transfer molding process
JPS59151436A (en) * 1983-02-17 1984-08-29 Rohm Co Ltd Resin sealing process of semiconductor device
US4599062A (en) * 1981-01-26 1986-07-08 Dai-Ichi Seiko Co., Ltd. Encapsulation molding apparatus
US4872825A (en) * 1984-05-23 1989-10-10 Ross Milton I Method and apparatus for making encapsulated electronic circuit devices
US4927590A (en) * 1989-05-26 1990-05-22 At&T Bell Laboratories Method for encapsulating integrated circuits
US5204122A (en) * 1990-10-11 1993-04-20 Dai-Ichi Seiko Co., Ltd. Mold for use in resin encapsulation molding
US5409362A (en) * 1992-11-24 1995-04-25 Neu Dynamics Corp. Encapsulation molding equipment
US5429488A (en) * 1992-11-24 1995-07-04 Neu Dynamics Corporation Encapsulating molding equipment and method
US6798078B2 (en) * 2000-12-14 2004-09-28 Yamaha Hatsudoki Kabushiki Kaisha Power control device with semiconductor chips mounted on a substrate

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56137916A (en) * 1980-03-31 1981-10-28 Nec Home Electronics Ltd Molding method for resin of parts
JPS5738125A (en) * 1980-08-20 1982-03-02 Hitachi Ltd Transfer molding process
US4599062A (en) * 1981-01-26 1986-07-08 Dai-Ichi Seiko Co., Ltd. Encapsulation molding apparatus
JPS59151436A (en) * 1983-02-17 1984-08-29 Rohm Co Ltd Resin sealing process of semiconductor device
US4872825A (en) * 1984-05-23 1989-10-10 Ross Milton I Method and apparatus for making encapsulated electronic circuit devices
US4927590A (en) * 1989-05-26 1990-05-22 At&T Bell Laboratories Method for encapsulating integrated circuits
US5204122A (en) * 1990-10-11 1993-04-20 Dai-Ichi Seiko Co., Ltd. Mold for use in resin encapsulation molding
US5409362A (en) * 1992-11-24 1995-04-25 Neu Dynamics Corp. Encapsulation molding equipment
US5429488A (en) * 1992-11-24 1995-07-04 Neu Dynamics Corporation Encapsulating molding equipment and method
US5484274A (en) * 1992-11-24 1996-01-16 Neu Dynamics Corp. Encapsulation molding equipment
US6798078B2 (en) * 2000-12-14 2004-09-28 Yamaha Hatsudoki Kabushiki Kaisha Power control device with semiconductor chips mounted on a substrate

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