JPS5227273A - Resin seal type semiconductor unit - Google Patents

Resin seal type semiconductor unit

Info

Publication number
JPS5227273A
JPS5227273A JP50102198A JP10219875A JPS5227273A JP S5227273 A JPS5227273 A JP S5227273A JP 50102198 A JP50102198 A JP 50102198A JP 10219875 A JP10219875 A JP 10219875A JP S5227273 A JPS5227273 A JP S5227273A
Authority
JP
Japan
Prior art keywords
type semiconductor
seal type
semiconductor unit
resin seal
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50102198A
Other languages
Japanese (ja)
Inventor
Toshihiko Ogu
Eiichi Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50102198A priority Critical patent/JPS5227273A/en
Publication of JPS5227273A publication Critical patent/JPS5227273A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To provide a moisture-free resin seal type semiconductor unit by eliminating gaps between the semiconductor and resin mold.
JP50102198A 1975-08-25 1975-08-25 Resin seal type semiconductor unit Pending JPS5227273A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50102198A JPS5227273A (en) 1975-08-25 1975-08-25 Resin seal type semiconductor unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50102198A JPS5227273A (en) 1975-08-25 1975-08-25 Resin seal type semiconductor unit

Publications (1)

Publication Number Publication Date
JPS5227273A true JPS5227273A (en) 1977-03-01

Family

ID=14320952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50102198A Pending JPS5227273A (en) 1975-08-25 1975-08-25 Resin seal type semiconductor unit

Country Status (1)

Country Link
JP (1) JPS5227273A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5519711U (en) * 1978-07-22 1980-02-07

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5519711U (en) * 1978-07-22 1980-02-07

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