JPS5227273A - Resin seal type semiconductor unit - Google Patents
Resin seal type semiconductor unitInfo
- Publication number
- JPS5227273A JPS5227273A JP50102198A JP10219875A JPS5227273A JP S5227273 A JPS5227273 A JP S5227273A JP 50102198 A JP50102198 A JP 50102198A JP 10219875 A JP10219875 A JP 10219875A JP S5227273 A JPS5227273 A JP S5227273A
- Authority
- JP
- Japan
- Prior art keywords
- type semiconductor
- seal type
- semiconductor unit
- resin seal
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50102198A JPS5227273A (en) | 1975-08-25 | 1975-08-25 | Resin seal type semiconductor unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50102198A JPS5227273A (en) | 1975-08-25 | 1975-08-25 | Resin seal type semiconductor unit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5227273A true JPS5227273A (en) | 1977-03-01 |
Family
ID=14320952
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50102198A Pending JPS5227273A (en) | 1975-08-25 | 1975-08-25 | Resin seal type semiconductor unit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5227273A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5519711U (en) * | 1978-07-22 | 1980-02-07 |
-
1975
- 1975-08-25 JP JP50102198A patent/JPS5227273A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5519711U (en) * | 1978-07-22 | 1980-02-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Effective date: 20040406 Free format text: JAPANESE INTERMEDIATE CODE: A621 |
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A711 | Notification of change in applicant |
Effective date: 20041119 Free format text: JAPANESE INTERMEDIATE CODE: A711 |
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A131 | Notification of reasons for refusal |
Effective date: 20070515 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
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A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20070815 |
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A602 | Written permission of extension of time |
Effective date: 20070921 Free format text: JAPANESE INTERMEDIATE CODE: A602 |
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A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070914 |
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TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Effective date: 20080318 Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Effective date: 20080327 Free format text: JAPANESE INTERMEDIATE CODE: A61 |
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FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110425 Year of fee payment: 3 |
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R150 | Certificate of patent (=grant) or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
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FPAY | Renewal fee payment (prs date is renewal date of database) |
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LAPS | Cancellation because of no payment of annual fees |