JPS5216147A - Pacage method for surface elastic wave element - Google Patents

Pacage method for surface elastic wave element

Info

Publication number
JPS5216147A
JPS5216147A JP9186875A JP9186875A JPS5216147A JP S5216147 A JPS5216147 A JP S5216147A JP 9186875 A JP9186875 A JP 9186875A JP 9186875 A JP9186875 A JP 9186875A JP S5216147 A JPS5216147 A JP S5216147A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
element
surface
wave
elastic
method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9186875A
Inventor
Masanori Nakamura
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H03BASIC ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders; Supports
    • H03H9/058Holders; Supports for surface acoustic wave devices
    • H03H9/059Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
    • HELECTRICITY
    • H03BASIC ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders; Supports
    • H03H9/10Mounting in enclosures
    • H03H9/1064Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • HELECTRICITY
    • H03BASIC ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders; Supports
    • H03H9/10Mounting in enclosures
    • H03H9/1064Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1085Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the BAW device

Abstract

PURPOSE:To improve on reliability of a surface elastic wave element by molding both a substrate surface and the element.
JP9186875A 1975-07-30 1975-07-30 Pacage method for surface elastic wave element Pending JPS5216147A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9186875A JPS5216147A (en) 1975-07-30 1975-07-30 Pacage method for surface elastic wave element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9186875A JPS5216147A (en) 1975-07-30 1975-07-30 Pacage method for surface elastic wave element

Publications (1)

Publication Number Publication Date
JPS5216147A true true JPS5216147A (en) 1977-02-07

Family

ID=14038524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9186875A Pending JPS5216147A (en) 1975-07-30 1975-07-30 Pacage method for surface elastic wave element

Country Status (1)

Country Link
JP (1) JPS5216147A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5387031U (en) * 1976-12-17 1978-07-18
JPS5412544A (en) * 1977-06-29 1979-01-30 Toshiba Corp Elastic surface wave unit
JPS5476640U (en) * 1977-11-11 1979-05-31
JPS5492141U (en) * 1977-12-13 1979-06-29
JPS599625U (en) * 1982-07-09 1984-01-21
US4699682A (en) * 1985-10-23 1987-10-13 Clarion Co., Ltd. Surface acoustic wave device sealing method
JPS6437132U (en) * 1987-08-31 1989-03-06
JPH04170811A (en) * 1990-11-05 1992-06-18 Fujitsu Ltd Surface acoustic wave device
US6262513B1 (en) 1995-06-30 2001-07-17 Kabushiki Kaisha Toshiba Electronic component and method of production thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5428935U (en) * 1977-07-29 1979-02-26

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5428935U (en) * 1977-07-29 1979-02-26

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5387031U (en) * 1976-12-17 1978-07-18
JPS5412544A (en) * 1977-06-29 1979-01-30 Toshiba Corp Elastic surface wave unit
JPS5759687B2 (en) * 1977-06-29 1982-12-16 Tokyo Shibaura Electric Co
JPS5476640U (en) * 1977-11-11 1979-05-31
JPS5492141U (en) * 1977-12-13 1979-06-29
JPS5827554Y2 (en) * 1977-12-13 1983-06-15
JPS599625U (en) * 1982-07-09 1984-01-21
US4699682A (en) * 1985-10-23 1987-10-13 Clarion Co., Ltd. Surface acoustic wave device sealing method
JPS6437132U (en) * 1987-08-31 1989-03-06
JPH04170811A (en) * 1990-11-05 1992-06-18 Fujitsu Ltd Surface acoustic wave device
US6262513B1 (en) 1995-06-30 2001-07-17 Kabushiki Kaisha Toshiba Electronic component and method of production thereof
US6628043B2 (en) 1995-06-30 2003-09-30 Kabushiki Kaisha Toshiba Electronic component and method of production thereof
US6754950B2 (en) 1995-06-30 2004-06-29 Kabushiki Kaisha Toshiba Electronic component and method of production thereof

Similar Documents

Publication Publication Date Title
JPS51118728A (en) Process for manufacturing silicone resin
JPS51114439A (en) An adhesive having anisotropic electroconductivity
JPS5240348A (en) Reflecting mirror formed of metallic film
JPS5217031A (en) Thermal fixing device
JPS5380966A (en) Manufacture of electrode fdr semiconductor device
JPS5227157A (en) Arm of industrial robbot
JPS5231424A (en) Moving device for seat
JPS528729A (en) Type-drum
JPS5552602A (en) Waveguide mount
JPS5222196A (en) Hob
JPS5236797A (en) Manufacturing method of ferrite elementary unit junction
JPS5241543A (en) Electrooptical device
JPS5224581A (en) Novel colorrproducing enzymatic substrate
JPS5293285A (en) Structure for semiconductor device
JPS5253665A (en) Semiconductor device
GB1547592A (en) Semiconductor pressure transducers
JPS5214387A (en) Semiconductor device
JPS5321903A (en) Preparation of magnetic disc substrate
JPS52108776A (en) Pattern sticking device
JPS5221390A (en) Enzymatic reacting method utilizing microorganzsm
JPS5323667A (en) Packaging structure of electronic watch
JPS5245550A (en) Etching liquid
JPS5323246A (en) Noise stopper for power supply
JPS5217785A (en) Slip thickness crystal resohator
JPS5240184A (en) Temperature compensation circuit for pressure transducers