JPS56116649A - Manufacturing of semiconductor device - Google Patents

Manufacturing of semiconductor device

Info

Publication number
JPS56116649A
JPS56116649A JP2025580A JP2025580A JPS56116649A JP S56116649 A JPS56116649 A JP S56116649A JP 2025580 A JP2025580 A JP 2025580A JP 2025580 A JP2025580 A JP 2025580A JP S56116649 A JPS56116649 A JP S56116649A
Authority
JP
Japan
Prior art keywords
semiconductor device
resin
container
hardening type
ultraviolet rays
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2025580A
Other languages
Japanese (ja)
Other versions
JPS6122865B2 (en
Inventor
Isamu Kitahiro
Kazufumi Ogawa
Yoshiko Yasuda
Taketoshi Yonezawa
Shigeru Kondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2025580A priority Critical patent/JPS56116649A/en
Publication of JPS56116649A publication Critical patent/JPS56116649A/en
Publication of JPS6122865B2 publication Critical patent/JPS6122865B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Light Receiving Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

PURPOSE:To make it possible to seal a container, which contains a semiconductor device, easily and surely, by performing the sealing work through ultraviolet radiation hardening type resin. CONSTITUTION:A semiconductor device, which is composed of a solid image- taking element 22, a filter 24 and a small-diameter metallic wire 26, etc. and secured in a container 21 by adhesives 23 and 25, etc., is filled with ultraviolet radiation hardening type resin 27, and when a glass cover 28 is placed on this resin 27 and ultraviolet rays are applied thereon, the resin 27 is hardened. It is possible, by using this process, to easily provide the semiconductor device with a sure and satisfactory sealing of a good water-and-humidity-resisting capability simply by applying ultraviolet rays without allowing the element 22 to rise in temperature above 80 deg.C which causes a disturbance to characteristics of the element.
JP2025580A 1980-02-19 1980-02-19 Manufacturing of semiconductor device Granted JPS56116649A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025580A JPS56116649A (en) 1980-02-19 1980-02-19 Manufacturing of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2025580A JPS56116649A (en) 1980-02-19 1980-02-19 Manufacturing of semiconductor device

Publications (2)

Publication Number Publication Date
JPS56116649A true JPS56116649A (en) 1981-09-12
JPS6122865B2 JPS6122865B2 (en) 1986-06-03

Family

ID=12022082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025580A Granted JPS56116649A (en) 1980-02-19 1980-02-19 Manufacturing of semiconductor device

Country Status (1)

Country Link
JP (1) JPS56116649A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834681A (en) * 1981-08-26 1983-03-01 Hitachi Ltd Solid-state image sensor
JPS5857871A (en) * 1981-10-02 1983-04-06 Hitachi Ltd Solid-state image pickup device
JPS5869174A (en) * 1981-10-21 1983-04-25 Hitachi Ltd Solid-state image pickup device
JPS5869962U (en) * 1981-11-06 1983-05-12 松下電器産業株式会社 Seam-sealed semiconductor device for solid-state imaging
JPS58170052A (en) * 1982-03-31 1983-10-06 Sony Corp Manufacture of solid state image pickup device
JPS5918438U (en) * 1982-07-27 1984-02-04 シチズン時計株式会社 IC sealing structure of electronic clock
JPS62273768A (en) * 1986-05-21 1987-11-27 Toshiba Corp Solid-state image sensing device
JPS63168041A (en) * 1987-01-05 1988-07-12 Hitachi Maxell Ltd Semiconductor device and manufacture thereof
JPS6457661A (en) * 1987-08-27 1989-03-03 Toshiba Corp Solid-state image sensing device and manufacture thereof
JPS6464254A (en) * 1987-09-03 1989-03-10 Toshiba Corp Solid-state image sensor and manufacture thereof
US6531334B2 (en) * 1997-07-10 2003-03-11 Sony Corporation Method for fabricating hollow package with a solid-state image device
JP2006005029A (en) * 2004-06-15 2006-01-05 Fujitsu Ltd Imaging device and its manufacturing method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5222036B2 (en) * 2008-06-17 2013-06-26 日東電工株式会社 Manufacturing method of optical components

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834681A (en) * 1981-08-26 1983-03-01 Hitachi Ltd Solid-state image sensor
JPS5857871A (en) * 1981-10-02 1983-04-06 Hitachi Ltd Solid-state image pickup device
JPS5869174A (en) * 1981-10-21 1983-04-25 Hitachi Ltd Solid-state image pickup device
JPS5869962U (en) * 1981-11-06 1983-05-12 松下電器産業株式会社 Seam-sealed semiconductor device for solid-state imaging
JPS58170052A (en) * 1982-03-31 1983-10-06 Sony Corp Manufacture of solid state image pickup device
JPS5918438U (en) * 1982-07-27 1984-02-04 シチズン時計株式会社 IC sealing structure of electronic clock
JPS62273768A (en) * 1986-05-21 1987-11-27 Toshiba Corp Solid-state image sensing device
JPS63168041A (en) * 1987-01-05 1988-07-12 Hitachi Maxell Ltd Semiconductor device and manufacture thereof
JPS6457661A (en) * 1987-08-27 1989-03-03 Toshiba Corp Solid-state image sensing device and manufacture thereof
JPS6464254A (en) * 1987-09-03 1989-03-10 Toshiba Corp Solid-state image sensor and manufacture thereof
US6531334B2 (en) * 1997-07-10 2003-03-11 Sony Corporation Method for fabricating hollow package with a solid-state image device
JP2006005029A (en) * 2004-06-15 2006-01-05 Fujitsu Ltd Imaging device and its manufacturing method
US8411197B2 (en) 2004-06-15 2013-04-02 Fujitsu Semiconductor Limited Image pickup device and production method thereof

Also Published As

Publication number Publication date
JPS6122865B2 (en) 1986-06-03

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