JPS5869174A - Solid-state image pickup device - Google Patents
Solid-state image pickup deviceInfo
- Publication number
- JPS5869174A JPS5869174A JP56167234A JP16723481A JPS5869174A JP S5869174 A JPS5869174 A JP S5869174A JP 56167234 A JP56167234 A JP 56167234A JP 16723481 A JP16723481 A JP 16723481A JP S5869174 A JPS5869174 A JP S5869174A
- Authority
- JP
- Japan
- Prior art keywords
- solid
- hollow part
- glass plate
- image pickup
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Abstract
Description
【発明の詳細な説明】
本発明は固体撮像装置、特に固体撮像索子に好適なパッ
ケージング構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a packaging structure suitable for solid-state imaging devices, particularly solid-state imaging cables.
第１図は従来の固体撮像装置の一例を示す要部断面構成
図である。同図において、１はセラミック材を成形して
形成された平板および枠寸法の異々る枠体を接着して積
層させて構成されたパッケージであシ、このパッケージ
１の中央部には段部１凰と底部１ｂとからなる凹部１Ｃ
が形成されている。この場合、このパッケージ１を構成
する中央部のセラミック枠体上面には、段部１８から端
部方向に向って多数本の導電性金属ノくターフ２がほぼ
放射状に延在して被着形成されている。そして、この導
電性金属パターン２０段部１ａ側上面にはポンディング
パッド３が被着形成され、さらにこの導電性金属パター
ン２の端部側はノくツケージ１の側面に固着配置された
外部接続用端子４にそれぞれ電気的に接続されている。FIG. 1 is a cross-sectional configuration diagram of main parts showing an example of a conventional solid-state imaging device. In the figure, 1 is a package constructed by bonding and stacking a flat plate formed by molding a ceramic material and frames of different frame sizes. A recess 1C consisting of a bottom part 1b and a bottom part 1b.
is formed. In this case, on the upper surface of the central ceramic frame constituting this package 1, a large number of conductive metal turfs 2 extend almost radially from the stepped portion 18 toward the end portions to form an adhesion. has been done. A bonding pad 3 is formed on the upper surface of the conductive metal pattern 20 on the side of the stepped portion 1a, and the end side of the conductive metal pattern 2 has an external connection fixedly arranged on the side surface of the socket cage 1. The terminals 4 are electrically connected to each other.
また、とのノくツケージ１の凹部１Ｃ内には光電変換機
能を備えた固体撮像素子５がその底部１ｂに接着して配
置され、この固体撮像索子５の周縁上面に設けられた多
数個のポンディングパッド６はボンディングワイヤ１を
介して上記パッケージ段部１ａの導電性金属パターン２
上に形成されたポンプイングツ（ラド３にそれぞれ接続
されている。また、この）（ツケージ１はその開口端側
、つまり前面側には底部１ｂに固着配置された固体撮像
素子５の劣化および外部から保饅するための透光性ガラ
ス板８が例えば有機性接着剤９によシ接着固定して配置
されている。In addition, a solid-state imaging device 5 having a photoelectric conversion function is arranged in the recessed portion 1C of the door cage 1, and is adhered to the bottom portion 1b thereof. The bonding pad 6 is connected to the conductive metal pattern 2 of the package step portion 1a via the bonding wire 1.
The pump cages 1 are connected to the RADs 3 formed on the top, and the pump cages 1 have an open end side, that is, a front side, to protect against deterioration of the solid-state image sensor 5 fixedly arranged on the bottom part 1b and from the outside. A translucent glass plate 8 for preserving the rice cake is fixed and fixed with, for example, an organic adhesive 9.
しかしながら上記構成による固体撮像装置においては、
セラミックパッケージ１と透光性ガラス板８とで形成さ
れる中空部を有し、かつ透光性ガラス板８とセラミック
パッケージ１とを有機性接着剤９で封止された構造を有
しているため、高温高湿状態に放置された場合、有機シ
ール部分から水分の透過が起シ、透光性ガラス板８およ
びセラミックパッケージ１の内面に結露を発生させて固
体撮像素子５への正確な光情報の伝達を妨げたシ、ボン
ディングワイヤ７を腐蝕させたシするなど固体撮像装置
の信頼性を低下させるという致命的な問題があった。However, in the solid-state imaging device with the above configuration,
It has a hollow part formed by a ceramic package 1 and a translucent glass plate 8, and has a structure in which the translucent glass plate 8 and the ceramic package 1 are sealed with an organic adhesive 9. Therefore, if left in high temperature and high humidity conditions, moisture will permeate through the organic seal, causing dew condensation on the inner surfaces of the translucent glass plate 8 and the ceramic package 1, which will prevent accurate light from reaching the solid-state image sensor 5. There were fatal problems such as interfering with information transmission and corroding the bonding wire 7, reducing the reliability of the solid-state imaging device.
したがって本発明は、上記の欠点に鑑みてなされたもの
でＳ１シ、その目的とするととろけ、結露の発生および
ボンディングワイヤの腐蝕の発生を防止させて信頼性を
向上させた固体撮像装置を提供することにある。Therefore, the present invention has been made in view of the above-mentioned drawbacks, and its purpose is to provide a solid-state imaging device that improves reliability by preventing melting, dew condensation, and corrosion of bonding wires. There is a particular thing.
本発明の第２の目的は、固体撮像素子を低価格でかつ生
産性良く封止可能にした固体撮像装置を提供することに
ある。A second object of the present invention is to provide a solid-state imaging device in which a solid-state imaging device can be sealed at low cost and with high productivity.
このような目的を達成するために本発明は、高分子材料
の透湿現象によシ、シール材に水蒸気圧差が生じた場合
、水分が透過する。したがって固体撮像装置に有機性接
着剤を用いて封止した場合、パッケージ内部を中空にし
ておくと、周囲の湿度。In order to achieve this object, the present invention utilizes the moisture permeation phenomenon of polymeric materials, and when a water vapor pressure difference occurs in the sealing material, moisture permeates through the sealing material. Therefore, when a solid-state imaging device is sealed using an organic adhesive, if the inside of the package is left hollow, it will absorb the ambient humidity.
温度上昇に伴ないパッケージ内部のｆ７Ｉ！第１水蒸気
圧も増加するため、外部と平衡状態まで水分が入シ込ん
でし１うことから、中空部分に透光性樹脂を光横するこ
とによって、透湿現象を阻止させたものである。f7I inside the package as the temperature rises! Since the first water vapor pressure also increases, moisture will enter until it reaches a state of equilibrium with the outside, so by placing translucent resin in the hollow part, the moisture permeation phenomenon is prevented. .
以下図面を用いて本発明の実施例を詳細に説明する。Embodiments of the present invention will be described in detail below using the drawings.
第２図は本発明によ２）固体撮像装置の一例を示す第１
図に相当する要部断面構成図であシ、第１図と同記号は
同一要素となるのでその説明は省′略する。第２図にお
いて、セラミックパッケージ１の凹部ＩＣと透光性ガラ
ス板８とで形成される中空部１０には、例えば透光率が
８０％以上を有するエポキシ系またげシリコン系の透光
性樹脂１１が充填され、かつセラミックパッケージ１と
透光性ガラス板８とが樹脂１１で接着固化されている、
１この↓うな構成によれば、中空部１０が樹脂１１でモ
ールドされかつ透光性ガラス板８とセラミックパッケー
ジ１とが接着固化されたことによって、外部から中空部
１０への透湿現象による水分の透過をほぼ完全にかつ確
実に阻止することができるので、結露の発生およびボン
ディングワイヤ１の腐蝕の発汗を確実に防止することが
できる。また、セラミックパッケージ１の凹部１ｃと透
光性ガラス板８とから々る中空部１０に透光性樹脂１１
を充填する封止構造であるため、低コストで生産性良く
透湿現象が全く発生し表い高品質の固体撮像装置が得ら
れる。FIG. 2 is a first diagram showing an example of 2) a solid-state imaging device according to the present invention.
This is a cross-sectional configuration diagram of a main part corresponding to the figure, and since the same symbols as in FIG. 1 represent the same elements, the explanation thereof will be omitted. In FIG. 2, the hollow part 10 formed by the recess IC of the ceramic package 1 and the translucent glass plate 8 is filled with, for example, an epoxy-based straddle silicone-based translucent resin having a light transmittance of 80% or more. 11, and the ceramic package 1 and the transparent glass plate 8 are bonded and solidified with the resin 11.
1 According to this configuration, since the hollow part 10 is molded with the resin 11 and the translucent glass plate 8 and the ceramic package 1 are bonded and solidified, moisture is absorbed from the outside into the hollow part 10 due to moisture permeation phenomenon. Since the permeation of the bonding wire 1 can be almost completely and reliably blocked, generation of dew condensation and sweating due to corrosion of the bonding wire 1 can be reliably prevented. Further, a translucent resin 11 is placed in the hollow portion 10 formed by the concave portion 1c of the ceramic package 1 and the translucent glass plate 8.
Since the sealing structure is filled with the liquid, a high-quality solid-state imaging device can be obtained at low cost, with good productivity, and with no moisture permeation phenomenon.
以上説明したように本発明によれば、中空部を透光性樹
脂でシール封止したことによって、中空部内面での結露
の発生およびボンディングワイヤの腐蝕を確実に防＋）
−できるので、信頼性の高い固体撮像装置が得られる。As explained above, according to the present invention, by sealing the hollow part with a transparent resin, the occurrence of dew condensation on the inner surface of the hollow part and corrosion of the bonding wire are reliably prevented.
- A highly reliable solid-state imaging device can be obtained.
また、中空部を透光性樹脂でシール封止したことによっ
て、パッケージとギャップとしての透光性ガラス板との
封止構造が従来の封止構造に比較して簡単となるので、
作業工数が大幅に低減して生産性が向上できるとともに
、封止コストを従来の約穐程度に低減てきるなどの極め
て優れた効果が得られる。In addition, by sealing the hollow part with a translucent resin, the sealing structure between the package and the translucent glass plate as a gap becomes simpler than the conventional sealing structure.
Extremely excellent effects can be obtained, such as significantly reducing the number of work steps and improving productivity, as well as reducing sealing costs to about the same level as conventional methods.
第１図は従来の固体撮像装置の一例を示す要部断面構成
図、第２図は本発明による固体撮像装置の一例を示す要
部断面構成図である。
１拳・・・セラミックパッケージ、１ｂ・・・・段部、
ｌｃ ・・・・凹部、２・・・・導電性金属パターン、
３・・・・ボンディングパット、４・・・・外部接続用
端子、５・・・・固体撮像素子、６・・・・ポンディン
グパッド、７・・・・ボンディングワイヤ、８−φ・拳
透光性ガラス板、９・ｏｓｓ接着剤、１０１１・晧・中
空部、１１・・・・透光性樹脂。FIG. 1 is a sectional view of a main part of an example of a conventional solid-state imaging device, and FIG. 2 is a sectional view of a main part of an example of a solid-state imaging device according to the present invention. 1 fist...ceramic package, 1b...stepped section,
lc...concavity, 2...conductive metal pattern,
3... Bonding pad, 4... External connection terminal, 5... Solid-state image sensor, 6... Bonding pad, 7... Bonding wire, 8-φ fist through Optical glass plate, 9. oss adhesive, 1011. Akira, hollow part, 11... translucent resin.
Claims (1)
、前記セラミックパッケージの前面側に接着配置されか
つ前記固体撮像索子を外界写囲気から保護する透光性ガ
ラス板とを少なくとも備えた固体撮像装置において、前
記セラミックパッケージと前記透光性ガラス板とで形成
される中空部分に接着性を有する透光性樹脂を充填しか
つ前記透光性ガラス板と前記セラζツクパッケージとを
接着させたことを特徴とする固体撮像装置。A solid-state imaging device comprising at least a ceramic package in which a solid-state imaging device is housed, and a translucent glass plate that is adhesively arranged on the front side of the ceramic package and protects the solid-state imaging device from outside air. A hollow portion formed by the ceramic package and the translucent glass plate is filled with a translucent resin having adhesive properties, and the translucent glass plate and the ceramic package are bonded together. A solid-state imaging device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56167234A JPS5869174A (en) | 1981-10-21 | 1981-10-21 | Solid-state image pickup device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56167234A JPS5869174A (en) | 1981-10-21 | 1981-10-21 | Solid-state image pickup device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5869174A true JPS5869174A (en) | 1983-04-25 |
Family
ID=15845933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56167234A Pending JPS5869174A (en) | 1981-10-21 | 1981-10-21 | Solid-state image pickup device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5869174A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS604254A (en) * | 1983-06-22 | 1985-01-10 | Toshiba Corp | Image sensor |
| JPS61256667A (en) * | 1985-05-09 | 1986-11-14 | Matsushita Electric Ind Co Ltd | Close contact type image sensor |
| EP0468379A2 (en) * | 1990-07-21 | 1992-01-29 | Mitsui Petrochemical Industries, Ltd. | Semiconductor device having a package |
| US7748684B2 (en) | 2005-06-24 | 2010-07-06 | Ckd Corporation | Flow control valve |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5478026A (en) * | 1977-12-05 | 1979-06-21 | Hitachi Ltd | Production of solid color image pickup unit |
| JPS56116649A (en) * | 1980-02-19 | 1981-09-12 | Matsushita Electric Ind Co Ltd | Manufacturing of semiconductor device |
-
1981
- 1981-10-21 JP JP56167234A patent/JPS5869174A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5478026A (en) * | 1977-12-05 | 1979-06-21 | Hitachi Ltd | Production of solid color image pickup unit |
| JPS56116649A (en) * | 1980-02-19 | 1981-09-12 | Matsushita Electric Ind Co Ltd | Manufacturing of semiconductor device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS604254A (en) * | 1983-06-22 | 1985-01-10 | Toshiba Corp | Image sensor |
| JPS61256667A (en) * | 1985-05-09 | 1986-11-14 | Matsushita Electric Ind Co Ltd | Close contact type image sensor |
| EP0468379A2 (en) * | 1990-07-21 | 1992-01-29 | Mitsui Petrochemical Industries, Ltd. | Semiconductor device having a package |
| US5343076A (en) * | 1990-07-21 | 1994-08-30 | Mitsui Petrochemical Industries, Ltd. | Semiconductor device with an airtight space formed internally within a hollow package |
| US6048754A (en) * | 1990-07-21 | 2000-04-11 | Mitsui Chemicals, Inc. | Method of manufacturing a semiconductor device with an airtight space formed internally within a hollow package |
| US7748684B2 (en) | 2005-06-24 | 2010-07-06 | Ckd Corporation | Flow control valve |
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