JPS61123288A - Solid-state pick up device - Google Patents

Abstract

PURPOSE:To obtain a solid-state image pick up device of extremely compact in size and having no failure due to light reflection flare and the like by laminat ing a transparent member on a photosensitive surface of a solid-state image pick up element chip and sealing hermetically the chip. CONSTITUTION:A solid-state image pick up element chip 11 bonded and fixed to an inner bottom surface 14A of a ceramic substrate 14 of a package structure by a bonding agent 15. On a photo-sensitive surface side of the chip 11, a trans parent glass base plate 19 is laminated through a transparent bonding agent 18 by a direct bonding and fixed to have a transparent body. Thereby, the solid state image pick up element chip 11 prevents its surface from contacting an external atmosphere. Under such a condition, further between the solidstate image pick up element chip 11, the circumference of the glass substrate 19 and the ceramic substrate 14, for protection of a bonding wire 17, an hermetic sealing of the chip 11 and a strong fixing, a resin 20 is filled.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a solid-state imaging device, and particularly to an improved structure on a photosensitive surface thereof.

[Technical background of the invention and its problems]

Traditionally, photodiode arrays and charge-coupled devices (CODs)
) formed on a single semiconductor substrate is adhesively fixed on a ceramic substrate. This ceramic substrate has a package structure and has pads for leading out electrodes of the charge coupled device and the like. Here, an edge of a transparent glass substrate is disposed around the ceramic substrate of the package structure, and the structure is such that the solid-state image sensor chip is hermetically sealed.

However, in the conventional solid-state imaging device, there is a certain distance between the solid-state imaging element chip and the transparent glass substrate, which causes the following problems. That is, since the optical path length is long due to the above-mentioned spacing, flare is likely to occur because incident light is reflected by the glass substrate, and light reflected from the chip surface is reflected back from the back surface of the glass substrate. Furthermore, the external dimensions of the solid-state imaging device are large, making it unsuitable for realizing an ultra-small imaging device.

[Purpose of the invention]

The present invention has been made to address the above-mentioned circumstances, and an object of the present invention is to provide a solid-state imaging device that can eliminate obstacles caused by light reflection such as flare and is effective in making an ultra-small device.

[Summary of the invention]

In the present invention, as shown in FIG. 1, the above object is achieved by laminating transparent bodies 18 and 19 directly on the photosensitive surface of the solid-state image sensor chip 11, and by sealing the chip. be.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view of a solid-state imaging device according to an embodiment of the present invention. 11 is a solid-state image sensor chip;
For example, a 7-otodiode array and a charge-coupled device (COD)
) is formed on a semiconductor substrate. This solid-state image sensor chip 11 is, in plan view, a second
As shown in the figure, it has a photosensitive surface area 11k, around which a large number of bonding pads 13 serving as electrodes for external connection are arranged.

The solid-state image sensor chip 11 is adhesively fixed to the inner bottom surface Z4A of the ceramic substrate 14 having a package structure using an adhesive 15. The ceramic substrate 14 has a bonding pad 16 corresponding to the bonding pad 13 on its periphery. And ceramic substrate 14@
bonding pad 16 and solid-state image sensor chip 11
The corresponding bonding pads 13 on the sides are connected by bonding wires 11, such as aluminum or gold.

Next, in the present invention, a transparent glass substrate 19 is directly adhesively and fixedly laminated on the photosensitive surface side of the solid-state image sensor chip 11 via a transparent adhesive z8 to form a transparent body. As a result, the surface of the solid-state image element chip 11 is cut off from being exposed to the outside air. In this state, K.

Solid-state image sensor chip 11. A resin 20 is filled between the periphery of the glass substrate 19 and the ceramic substrate 110 in order to protect the bonding wires 11 and to hermetically seal and strengthen the fixation of the solid-state imaging probe chip 11.

In the above description, the glass substrate 19 was shown as a representative example of the transparent body, but this glass substrate may be a glass substrate having a filter effect. Furthermore, in solid-state imaging devices, an infrared light cut filter is usually provided separately in the optical system, but the transparent body may also have this effect, and in this case, it is more advantageous to realize an ultra-compact camera. It is. Furthermore, the transparent body may be a crystal plate having an optical low-pass filter effect.

〔Effect of the invention〕

As described above, according to the present invention, the surface of the solid-state image sensor chip does not come into direct contact with the outside air, and can be prevented from being soaked with moisture or the like from the outside air. As a result, it is possible to provide an ultra-small device with no change in characteristics. conventionally,
The solid-state image sensor chip and the glass substrate were placed apart and sealed at the outer edge of the entire package, resulting in a large package size.In addition, multiple reflections occurred between the chip surface and the back surface of the glass substrate, which was a major cause of flare. However, these problems can be resolved and ultra-compact, high-performance devices can be realized. Furthermore, with this configuration, the transparent substrate does not have to worry about flare generation, so in addition to protecting the chip surface, it can also have color filter characteristics, optical four-pass filter characteristics, etc. Optical components that were conventionally provided separately can be integrated. This eliminates the need for extra space and is effective in making the entire camera ultra-small.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view showing one embodiment of the present invention, and FIG. 2 is a plan view of the solid-state image sensor chip shown in FIG. 11... Solid-state image sensor chip, 18... Adhesive, 1
9...Glass substrate, 20...Resin. Applicant's representative Patent attorney Takehiko Suzue Figure 1 Figure 2

Claims (4)

[Claims] (1) A transparent body having at least the function of protecting the photosensitive surface is directly laminated on the photosensitive surface side of the solid-state image sensor chip,
A solid-state imaging device characterized in that the periphery of the solid-state imaging element chip is covered with a resin layer. (2) The solid-state imaging device according to claim 1, wherein the transparent body is a transparent adhesive applied to the photosensitive surface and a glass substrate bonded with the adhesive. (3) The solid-state imaging device according to claim 2, wherein the glass substrate has a color filter characteristic that cuts light of a specific color. (4) The solid-state imaging device according to claim 1, wherein the transparent body is made of a transparent adhesive and a crystal plate having an optical low-pass filter effect.