JPS55159678A - Solidstate image sensor - Google Patents

Solidstate image sensor

Info

Publication number
JPS55159678A
JPS55159678A JP6676979A JP6676979A JPS55159678A JP S55159678 A JPS55159678 A JP S55159678A JP 6676979 A JP6676979 A JP 6676979A JP 6676979 A JP6676979 A JP 6676979A JP S55159678 A JPS55159678 A JP S55159678A
Authority
JP
Japan
Prior art keywords
glass substrate
ccd3
coupling
sticked
camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6676979A
Other languages
Japanese (ja)
Inventor
Okio Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP6676979A priority Critical patent/JPS55159678A/en
Publication of JPS55159678A publication Critical patent/JPS55159678A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

PURPOSE:To make easy the coupling with the TV camera, by fixing CCD on the reference surface optically polished such as glass substrate, and coupling exposed other surface of glass substrate fixing CCD with the optical system of TV camera. CONSTITUTION:CCD3 is sticked on the surface of a ceramic package 1 with adhesives 2, and the package 1 and CCD3 are electrically connected with the bonding wire 4. Next, the glass substrate 9 is sticked via the transparent adhesives 8 on the CCD3, the both sides of the glass substrate 9 are optically polished to make excellent the parallelism among the surface of glass substrate 9, surface sticking CCD3 and other surface, and the reinforcement of the side surfaces of glass substrate 9 and the protection of the bonding wire 4 are made by filling in the mold material 10. Further, the variation of the optical reference surface due to the bending of the ceramic package 1 is avoided to make easy the optical coupling with TV cameras.
JP6676979A 1979-05-31 1979-05-31 Solidstate image sensor Pending JPS55159678A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6676979A JPS55159678A (en) 1979-05-31 1979-05-31 Solidstate image sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6676979A JPS55159678A (en) 1979-05-31 1979-05-31 Solidstate image sensor

Publications (1)

Publication Number Publication Date
JPS55159678A true JPS55159678A (en) 1980-12-11

Family

ID=13325407

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6676979A Pending JPS55159678A (en) 1979-05-31 1979-05-31 Solidstate image sensor

Country Status (1)

Country Link
JP (1) JPS55159678A (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58174912A (en) * 1982-04-08 1983-10-14 Canon Inc Focusing detector
FR2566962A1 (en) * 1984-06-29 1986-01-03 Thomson Csf Photosensitive integrated circuit including a transparent plate bonded to its photosensitive region
JPS61123288A (en) * 1984-11-20 1986-06-11 Toshiba Corp Solid-state pick up device
JPS61134187A (en) * 1984-12-04 1986-06-21 Toshiba Corp Solid-state image pickup device
JPS61226980A (en) * 1985-03-30 1986-10-08 Sony Corp Sensor device and its manufacture and manufacturing equipment
JPS6251763U (en) * 1985-09-19 1987-03-31
JPS62104075A (en) * 1985-10-30 1987-05-14 Toshiba Corp Solid-state image pickup device
JPS62254579A (en) * 1986-04-28 1987-11-06 Toshiba Corp Solid-state image pickup device
JPS62273768A (en) * 1986-05-21 1987-11-27 Toshiba Corp Solid-state image sensing device
US5098630A (en) * 1985-03-08 1992-03-24 Olympus Optical Co., Ltd. Method of molding a solid state image pickup device
JPH0621415A (en) * 1993-04-12 1994-01-28 Sony Corp Solid-state image sensing device
WO1997010672A1 (en) * 1995-09-11 1997-03-20 Gatan, Inc. Optically coupled large-format solid state imaging device
EP1357605A1 (en) * 2002-04-22 2003-10-29 Scientek Corporation Image sensor semiconductor package with castellation
EP1357606A1 (en) * 2002-04-22 2003-10-29 Scientek Corporation Image sensor semiconductor package
EP1696489A3 (en) * 2005-02-23 2007-01-24 Sharp Kabushiki Kaisha Solid-state imaging device

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0522219B2 (en) * 1982-04-08 1993-03-26 Canon Kk
JPS58174912A (en) * 1982-04-08 1983-10-14 Canon Inc Focusing detector
FR2566962A1 (en) * 1984-06-29 1986-01-03 Thomson Csf Photosensitive integrated circuit including a transparent plate bonded to its photosensitive region
JPS61123288A (en) * 1984-11-20 1986-06-11 Toshiba Corp Solid-state pick up device
JPS61134187A (en) * 1984-12-04 1986-06-21 Toshiba Corp Solid-state image pickup device
US5098630A (en) * 1985-03-08 1992-03-24 Olympus Optical Co., Ltd. Method of molding a solid state image pickup device
JPS61226980A (en) * 1985-03-30 1986-10-08 Sony Corp Sensor device and its manufacture and manufacturing equipment
JPS6251763U (en) * 1985-09-19 1987-03-31
JPS62104075A (en) * 1985-10-30 1987-05-14 Toshiba Corp Solid-state image pickup device
JPS62254579A (en) * 1986-04-28 1987-11-06 Toshiba Corp Solid-state image pickup device
JPS62273768A (en) * 1986-05-21 1987-11-27 Toshiba Corp Solid-state image sensing device
JPH0621415A (en) * 1993-04-12 1994-01-28 Sony Corp Solid-state image sensing device
WO1997010672A1 (en) * 1995-09-11 1997-03-20 Gatan, Inc. Optically coupled large-format solid state imaging device
US5818035A (en) * 1995-09-11 1998-10-06 Gatan, Inc. Optically coupled large-format solid state imaging apparatus having edges of an imaging device
EP1357605A1 (en) * 2002-04-22 2003-10-29 Scientek Corporation Image sensor semiconductor package with castellation
EP1357606A1 (en) * 2002-04-22 2003-10-29 Scientek Corporation Image sensor semiconductor package
EP1696489A3 (en) * 2005-02-23 2007-01-24 Sharp Kabushiki Kaisha Solid-state imaging device
KR100819041B1 (en) * 2005-02-23 2008-04-02 샤프 가부시키가이샤 Solid-state imaging device

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