JPS551116A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS551116A
JPS551116A JP7338378A JP7338378A JPS551116A JP S551116 A JPS551116 A JP S551116A JP 7338378 A JP7338378 A JP 7338378A JP 7338378 A JP7338378 A JP 7338378A JP S551116 A JPS551116 A JP S551116A
Authority
JP
Japan
Prior art keywords
container
sensor
filter
bonded
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7338378A
Other languages
Japanese (ja)
Inventor
Isamu Kitahiro
Yasuaki Terui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP7338378A priority Critical patent/JPS551116A/en
Publication of JPS551116A publication Critical patent/JPS551116A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Light Receiving Elements (AREA)

Abstract

PURPOSE: To easily make a color image pickup solid plate, by fixing a semiconductor element on the bottom of a container, connecting wires to the semiconductor element, sealing up the container with a transparent lid and filling a transparent liquid substance in the container.
CONSTITUTION: An image sensor 3 is bonded at 4 to the bottom of a ceramic container 1 and connected at 5 to lead wires. A color mosaic filter 11 is positioned and bonded at 12 to the container at a distance of about 10 to 100 μ from the surface of the image sensor 3 and has a hole 13. The pressure in the container is reduced through the hole 13. Silicone oil 14 of refractive index almost equal to those of an insulating film on the surface of the sensor 3 and the galss of the filter 11 is introduced into the container. The container is then sealed up with a resin 15. Because no bonding agent is coated on the sensor, a quickly-set material can be used. Since the filter serves also as a cap, the cost is reduced and a positioning jig is simplified.
COPYRIGHT: (C)1980,JPO&Japio
JP7338378A 1978-06-16 1978-06-16 Manufacture of semiconductor device Pending JPS551116A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7338378A JPS551116A (en) 1978-06-16 1978-06-16 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7338378A JPS551116A (en) 1978-06-16 1978-06-16 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS551116A true JPS551116A (en) 1980-01-07

Family

ID=13516606

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7338378A Pending JPS551116A (en) 1978-06-16 1978-06-16 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS551116A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5840870A (en) * 1981-09-03 1983-03-09 Sanyo Electric Co Ltd Light receiving device
JPS5857871A (en) * 1981-10-02 1983-04-06 Hitachi Ltd Solid-state image pickup device
JPS5873153A (en) * 1981-10-26 1983-05-02 Fujitsu Ltd Semicondutor integrated circuit device
JPS58170052A (en) * 1982-03-31 1983-10-06 Sony Corp Manufacture of solid state image pickup device
JPS6464254A (en) * 1987-09-03 1989-03-10 Toshiba Corp Solid-state image sensor and manufacture thereof
US5070571A (en) * 1988-03-24 1991-12-10 Nippon Wiperblade Co., Ltd. Windshield wiper

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5840870A (en) * 1981-09-03 1983-03-09 Sanyo Electric Co Ltd Light receiving device
JPS6355789B2 (en) * 1981-09-03 1988-11-04 Sanyo Electric Co
JPS5857871A (en) * 1981-10-02 1983-04-06 Hitachi Ltd Solid-state image pickup device
JPS5873153A (en) * 1981-10-26 1983-05-02 Fujitsu Ltd Semicondutor integrated circuit device
JPS58170052A (en) * 1982-03-31 1983-10-06 Sony Corp Manufacture of solid state image pickup device
JPS6464254A (en) * 1987-09-03 1989-03-10 Toshiba Corp Solid-state image sensor and manufacture thereof
US5070571A (en) * 1988-03-24 1991-12-10 Nippon Wiperblade Co., Ltd. Windshield wiper

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