JPS55159677A - Solidstate image sensor - Google Patents

Solidstate image sensor

Info

Publication number
JPS55159677A
JPS55159677A JP6676779A JP6676779A JPS55159677A JP S55159677 A JPS55159677 A JP S55159677A JP 6676779 A JP6676779 A JP 6676779A JP 6676779 A JP6676779 A JP 6676779A JP S55159677 A JPS55159677 A JP S55159677A
Authority
JP
Japan
Prior art keywords
package
ccd
window glass
seal material
adhesives
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6676779A
Other languages
Japanese (ja)
Inventor
Okio Yoshida
Yoshiaki Hayashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP6676779A priority Critical patent/JPS55159677A/en
Publication of JPS55159677A publication Critical patent/JPS55159677A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

PURPOSE:To make longer the life of CCD and to make easy the set of focus of CCD, by sealing the optical window glass after polishing the upper surface of ceramic package mounting CCD. CONSTITUTION:The upper surface of the ceramic package 1 is polished on the line of position X-X', and the surface is polished to be optical flat surface. Next, CCD3 is mounted on the bottom of the package 1 with the adhesives 2. As the adhesives 2, conductive adhesives is used, and lead-in of the electrodes from the CCD3 is made by bonding wires 4, further film organic seal material 5 is framed out and located on the package 1. The optical window glass 6 is located on the seal material 5, and the package 1 and the optical window glass 6 are incorporated by adding required temperature are pressure on the seal material for longer life of solidstate image sensor and making ease of the setting of focus.
JP6676779A 1979-05-31 1979-05-31 Solidstate image sensor Pending JPS55159677A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6676779A JPS55159677A (en) 1979-05-31 1979-05-31 Solidstate image sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6676779A JPS55159677A (en) 1979-05-31 1979-05-31 Solidstate image sensor

Publications (1)

Publication Number Publication Date
JPS55159677A true JPS55159677A (en) 1980-12-11

Family

ID=13325350

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6676779A Pending JPS55159677A (en) 1979-05-31 1979-05-31 Solidstate image sensor

Country Status (1)

Country Link
JP (1) JPS55159677A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4442456A (en) * 1980-06-02 1984-04-10 Hitachi, Ltd. Solid-state imaging device
JPS6169256A (en) * 1984-09-13 1986-04-09 Toshiba Corp Image sensor
US4594613A (en) * 1982-02-16 1986-06-10 Canon Kabushiki Kaisha Solid-state imaging device assembly
JPS63313857A (en) * 1987-06-17 1988-12-21 Hitachi Ltd Solid-state image sensing device
CN107221504A (en) * 2017-05-27 2017-09-29 中国电子科技集团公司第十三研究所 Surface array charge-coupled device encapsulation ceramic package and preparation method thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4442456A (en) * 1980-06-02 1984-04-10 Hitachi, Ltd. Solid-state imaging device
US4594613A (en) * 1982-02-16 1986-06-10 Canon Kabushiki Kaisha Solid-state imaging device assembly
JPS6169256A (en) * 1984-09-13 1986-04-09 Toshiba Corp Image sensor
JPS63313857A (en) * 1987-06-17 1988-12-21 Hitachi Ltd Solid-state image sensing device
CN107221504A (en) * 2017-05-27 2017-09-29 中国电子科技集团公司第十三研究所 Surface array charge-coupled device encapsulation ceramic package and preparation method thereof
CN107221504B (en) * 2017-05-27 2020-08-18 中国电子科技集团公司第十三研究所 Ceramic shell for packaging area array charge coupled device and manufacturing method thereof

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