JPS6169256A - Image sensor - Google Patents

Image sensor

Info

Publication number
JPS6169256A
JPS6169256A JP59190693A JP19069384A JPS6169256A JP S6169256 A JPS6169256 A JP S6169256A JP 59190693 A JP59190693 A JP 59190693A JP 19069384 A JP19069384 A JP 19069384A JP S6169256 A JPS6169256 A JP S6169256A
Authority
JP
Japan
Prior art keywords
image sensor
substrate
adhesive
state image
curing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59190693A
Other languages
Japanese (ja)
Other versions
JPH0693504B2 (en
Inventor
Keisuke Maemura
敬介 前村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59190693A priority Critical patent/JPH0693504B2/en
Publication of JPS6169256A publication Critical patent/JPS6169256A/en
Publication of JPH0693504B2 publication Critical patent/JPH0693504B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Solid State Image Pick-Up Elements (AREA)
  • Facsimile Heads (AREA)

Abstract

PURPOSE:To obtain the high-quality picture information which is free from distortions and at the same time ensure easy control of an optical system, by fixing at least a solid state image pickup element on a substrate of high resistance by means of a high-speed curing adhesive and a heat-curing adhesive. CONSTITUTION:The center part of solid state image pickup elements CCD1a...1n is fixed on an alumina substrate 5 by means of an epoxy acrylic ultraviolet curing resin 12, i.e., a high-speed curing adhesive. While other areas of said solid state image pickup elements are fixed on the substrate 5 via an epoxy heat curing conductive adhesive 11. In such constitution, the elements CCD1a...1n can be set on the substrate 5 with high accuracy to obtain an adhesion type image sensor which secures high picture quality. In addition, the control of an optical system is facilitated together with improvement of the picture quality since the elements CCD1a...1n can be fixed on the substrate 5 with high accuracy owing to the external form of the substrate 5.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明はイメージセンサに係り、特にCCD等の固体撮
像素子を高抵抗基材上に載置する手段に関〔発明の技術
的背景とその問題点〕 近年、ファクシミリなどに用いられる画像読み取り装置
を小型化するために、イメージセンサ特に密着型イメー
ジセンサの開発が盛んである。この密着型イメージセン
サの多くは、レンズ系にロッドレンズアレイを用いて原
稿と同一寸法に設けた7オトセルアレイ上に原稿の王立
等倍像を結像させ、7オトセルアレイから原稿の画情報
を得る構造をとる。したがって、この構造によれば、ロ
ッドレンズアレイの物像間距離が略17朋と短いため装
置の大幅な小型化を図る利点がある。
[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to an image sensor, and particularly to a means for mounting a solid-state image sensor such as a CCD on a high-resistance base material [Technical background of the invention and its problems] [Points] In recent years, image sensors, particularly contact type image sensors, have been actively developed in order to miniaturize image reading devices used in facsimiles and the like. Most of these contact-type image sensors use a rod lens array in the lens system to form a royal life-size image of the original onto a 7-otocell array that has the same dimensions as the original, and then collect the image information of the original from the 7-otocell array. Take the structure you get. Therefore, according to this structure, since the object-to-image distance of the rod lens array is as short as approximately 17 mm, there is an advantage that the apparatus can be significantly downsized.

守等の絶縁基板上に原稿と同一寸法のCdF3eやCd
8等の光導を膜を設けたもの、あるいはアモルファスシ
リコン膜を設けたものである。しかしながら、第一の密
着型イメージセンサは、応答性・解像度等の緒特性に問
題がある。この問題を回避したものが、CCD等の固体
撮像素子を用いた第二/f’s  ljK  珀蓼 ?
FII  j   J  ++  x3  J−リ 祷
し −噂 4L  テ     ト Δ1 め − Δ
1 作力 凸ε型イメージセンサは高速・高解像度であ
るが、次のような欠点がある。すなわち、固体撮像素子
は小型であり、センナ部の幅が最大のものでも約60翼
冨である。、このため、原稿と同寸法の等倍像を読み取
るため、%關昭57−129065号公報に開示されて
いるように7オトセルアレイの中心からずらせて配置し
た固体撮像素子を複数個千鳥状に、かつそれぞれのチッ
プの7オトセルアレイが互いに接近する方向に並べる構
造を取る必要がある。
CdF3e or Cd of the same size as the original on the insulation board of the protector etc.
A light guide such as No. 8 is provided with a film, or an amorphous silicon film is provided. However, the first contact type image sensor has problems in its characteristics such as responsiveness and resolution. Is there a way to avoid this problem by using a solid-state image sensor such as a CCD?
FII j J ++ x3 J-li prayer - rumor 4L Tet Δ1 me - Δ
1. Production power Although the convex ε-type image sensor has high speed and high resolution, it has the following drawbacks. That is, the solid-state image sensing device is small, and even the maximum width of the senna portion is approximately 60 mm. Therefore, in order to read a same-size image with the same size as the original, multiple solid-state image sensors are arranged in a staggered manner, offset from the center of the 7-otocell array, as disclosed in Japanese Patent No. 57-129065. , and it is necessary to adopt a structure in which the seven cell arrays of each chip are arranged in a direction in which they approach each other.

ところで、千鳥状に配列された固体撮像素子の位置精度
が悪い場合には、□固体撮像素子と固体撮像素子との隣
接部す々わち画情報のつなぎ部で画情報が不連続となシ
読取画像に歪みが生じる危険がある。したがって固体撮
像素子を複数個千鳥状に並べたイメージセンサにおいて
は画質に影響を?    与えることなく、固体撮像素
子を精度良く並べることが要求されている。その上、こ
の様な密着型イメージセンサばかシでなく、従来より球
面レンズと組み合せて用いられているCCD −? M
OS型のIC’センサにおいても光学系の調整を容易に
するために、固体撮像素子を絶縁基板の外形に対して精
度良く配置することが必要となる。
By the way, if the positional accuracy of solid-state image sensors arranged in a staggered manner is poor, □ Image information may become discontinuous at adjacent areas between solid-state image sensors, that is, at joints of image information. There is a risk that the read image will be distorted. Therefore, does an image sensor with multiple solid-state image sensors arranged in a staggered arrangement affect image quality? It is required to arrange the solid-state image sensors with high accuracy without causing any damage. Moreover, instead of using a contact image sensor like this, a CCD-? M
In the OS-type IC' sensor as well, in order to facilitate adjustment of the optical system, it is necessary to accurately arrange the solid-state image sensor with respect to the outer shape of the insulating substrate.

一般に固体撮像素子は+−紋l¥塁而面り電気的接31
されるように加熱硬化型である。この加熱硬化型の接着
剤を用いた場合、接着剤を硬化させる前に固体撮像素子
を基板上に精度良く並べても、硬化中に接着型からガス
が発生し、このガスの発生により固体撮像素子が動いて
しまう危険や、硬化前に粘度が低下し接着剤が流れだし
たりして接着剤の硬化中に固体撮像素子が動いてし一!
う危険等がある。したがって、接着剤の硬化後もその位
置精度を保持することは極めて困難である。
In general, solid-state image sensors have +- and --printed electrical connections.
It is a heat curing type. When this heat-curing adhesive is used, even if the solid-state image sensors are precisely arranged on the substrate before the adhesive is cured, gas is generated from the adhesive mold during curing, and this gas generation causes the solid-state image sensors to There is a risk that the solid-state image sensor may move while the adhesive is curing, or the viscosity may decrease and the adhesive may flow out before curing.
There is a danger of Therefore, it is extremely difficult to maintain the positional accuracy even after the adhesive has hardened.

みがなく良質な画情報を得、その上光学系の調整が容易
なイメージセンサを提供することを目的とする。
It is an object of the present invention to provide an image sensor which obtains clear and high-quality image information and whose optical system can be easily adjusted.

〔発明の概要〕[Summary of the invention]

本発明のイメージセンサは、少なくとも1個の固体撮像
素子を速硬化型接着剤と1熱硬化型導電性接着剤とによ
り高抵抗基板上に配置したことを特徴とする。よυ詳し
く説明するならば、アルミナ基板上に配設されたグイパ
ッド上の少なくとも一点にエポキシ・アクリル系紫外線
硬化型接着剤を取着し、残りの部分をエポキシ系加熱硬
化型導電性接着剤を取着し、この接2着剤上に固体撮像
素子を載置したものである。したがって、まずエポキシ
・アクリル系紫外線硬化型接着剤に紫外線を照射し、固
体撮像素子をアルミナ基板上に仮止めした後(、加熱し
エポキシ系加熱硬化型導電性接着剤を硬化させ固体撮像
素子をアルミナ基板に強固に固定する。したがって、固
体撮像素子をアルミナ基板忙強固に精度良く固定するこ
とができる。
The image sensor of the present invention is characterized in that at least one solid-state image sensor is disposed on a high-resistance substrate using a quick-curing adhesive and a thermosetting conductive adhesive. To explain in detail, an epoxy/acrylic ultraviolet curable adhesive is attached to at least one point on the Guipad placed on the alumina substrate, and an epoxy heat curable conductive adhesive is attached to the remaining part. The solid-state image sensor is mounted on the adhesive. Therefore, first, the epoxy/acrylic ultraviolet curable adhesive is irradiated with ultraviolet rays, and the solid-state image sensor is temporarily fixed on the alumina substrate. It is firmly fixed to the alumina substrate.Therefore, the solid-state image sensor can be firmly and accurately fixed to the alumina substrate.

〔発明の実施例〕[Embodiments of the invention]

次に第1図および第2図(al 、 (b)を参照して
本発日日 σzA   +I−Xン 、し ソ →← 
yz  cm  *c alI  ズ−eM  nR−
J−1第2図(al 、 (blにおいて、本発明のイ
メージセンサの概略は、アルミナ基板(5)上に配置し
たCCDに電圧をかけるダイパッド(図示せず)上にエ
ポキシ・アクリル系紫外線硬化型接着剤(図示せず)と
エポキシ系加熱硬化型接着剤(図示せず)とを介してc
cD(1a)、(1b)、−(1n)が固着され構成さ
れている。このcaD(1a)、(xb)、・(In−
t)はフォトセルアレイ(2)が平行な2本の直線(3
1、(4J上に位置するように千鳥状に配列されている
。この直線(3)。
Next, referring to Figures 1 and 2 (al, (b)), determine the effective date σzA +I−X →←
yz cm *c alI zu-eM nR-
In Figure 2 (al and bl) of J-1, an outline of the image sensor of the present invention is shown in Fig. c through a mold adhesive (not shown) and an epoxy heat-curable adhesive (not shown).
It is composed of cD(1a), (1b), and -(1n) fixed together. This caD (1a), (xb), (In-
t), the photocell array (2) is connected to two parallel straight lines (3
1. (Arranged in a staggered manner so as to be located on 4J. This straight line (3).

(4)上のCCD(Ia)、(IC)e−(In−、+
)および(lb)、(ld)。
(4) Upper CCD (Ia), (IC)e-(In-, +
) and (lb), (ld).

・(in)の7オトセルアレイ(2)上にはロッドレン
ズアレイ(6)によりそれぞれ原稿面(7)の走査線(
8)および走査線(9)上の画像が等倍結像される。こ
れKよシ、直線(3)上のCOD (la)、(lb)
、−(In−t)からは原稿面(7)の走査線(8)上
の画情報が得られる。同様に直線(4)上の固体撮像素
子(Ib)、(lc)、−=(In)からは走査線(9
)上の画情報が得られる。また、本発明のイメージセン
サのCCD (la)、(lb)、 −・(In) カ
精度良くアルミナ基板(5)上に並べられているため、
原CCD (lb)、(ld)、 −(In)からの画
情報を走査線(8)と走査線(9)との間隔にはいる画
情報の分だけメモリ等で遅延させ、UCD(1a)、(
IC)、 l (In−t)からの画情報と電気的に接
続して、走査線(8)上の画情報を1つの時系列信号と
して得られる。
・On the (in) 7 otocell array (2), a rod lens array (6) is used to scan the scanning line (7) of the original surface (7).
8) and the images on the scanning line (9) are formed at the same magnification. This is K, COD on straight line (3) (la), (lb)
, -(In-t) provides image information on the scanning line (8) on the document surface (7). Similarly, from the solid-state image sensors (Ib), (lc), -=(In) on the straight line (4), the scanning line (9
) above image information can be obtained. Furthermore, since the CCDs (la), (lb), -.(In) of the image sensor of the present invention are arranged on the alumina substrate (5) with high precision,
The image information from the original CCDs (lb), (ld), -(In) is delayed by the amount of image information that enters the interval between scanning lines (8) and (9) in a memory, etc. ), (
By electrically connecting the image information from IC) and l (In-t), image information on the scanning line (8) can be obtained as one time-series signal.

次に第1図を参照してCCD(1a)、(1b)、(1
n)とアルミナ基板、(5)との固定状態を説明する。
Next, referring to FIG. 1, CCDs (1a), (1b), (1
The fixing state between n), the alumina substrate, and (5) will be explained.

第1図において、CCD (la) 、(lb)+ =
・(In)の中央部には速硬化型接着剤としてのエポキ
シ・アクリル系紫外線硬化型接着剤α2によりアルミナ
基板(5)上に固定され、CCD (la)、(Ib)
、  (In)のその他の部分はエポキシ系加熱硬化型
の導電性接着剤αのにより固定されている。
In FIG. 1, CCD (la), (lb)+ =
・The central part of (In) is fixed on the alumina substrate (5) with a fast-curing epoxy/acrylic ultraviolet curing adhesive α2, and the CCDs (la) and (Ib) are fixed on the alumina substrate (5).
, (In) is fixed with an epoxy heat-curable conductive adhesive α.

上述の構成により、CCD (la)、(lb)、−(
In)は精度よくアルミナ基板(5)上に配置されるの
で、画質の良い密着型イメージセンサが得られる。その
〆 上アルミナ基板(5)外形から精度よ(CCD (
la)。
With the above configuration, CCD (la), (lb), -(
Since In) is placed on the alumina substrate (5) with high precision, a contact type image sensor with good image quality can be obtained. The final step is to determine the accuracy from the outer shape of the upper alumina substrate (5) (CCD (
la).

(lb)、・・・(1n)を固定することができること
により、光学系の調整が容易なイメージセンサを得られ
る。
By fixing (lb), . . . (1n), an image sensor whose optical system can be easily adjusted can be obtained.

さらに、CCD (la)、(lb)、 −(In)と
アルミナ基板(5)のダイパッドはエポキシ系加熱硬化
型の導電性接着剤αυを主に用いていることにより、C
CD(la)。
Furthermore, the die pads of CCD (la), (lb), -(In) and alumina substrate (5) mainly use epoxy-based heat-curable conductive adhesive αυ.
CD(la).

(lb)、・・(1n)はダイパッドと充分に電気的接
続をとることができる。
(lb), . . . (1n) can be sufficiently electrically connected to the die pad.

次に第3図を参照して第1図に示すCCD’(la)。Next, referring to FIG. 3, the CCD'(la) shown in FIG.

(lb)、・・(1n)のマウント方法を説明する。第
3図において、CCD (1b)はコレラ) (131
によって固定された状態でエポキシ系加熱硬化型の導電
性接着剤αυとエポキシ・アクリル系紫外線硬化型接着
剤αのとが配置されたアルミナ基板(5)上に精度良く
配置されている。この後、 CCD (lb)の中央部
のエポキシ・アクリル系紫外線硬化型接着剤(12に紫
外線α4を照射し、エポキシ・アクリル系紫外線硬化型
接着剤(12がCCD (1t、)の載置面よりはみ出
ている部分を硬化させ、CCI) (lb) をその位
置精度を保ったままアルミナ基板(5)上に仮に固定さ
せる。この後、コレットα3を取シはずし、さらに全体
をW熱してエポキシ系加熱硬化型の導電性接着剤(11
1を硬化させる。この際、CCD(lb)はエポキシ・
アクリル系紫外線硬化型接着剤(lzのはみ出し部分で
固定されており、CCD (lb)には%に過大な力が
加わらないため接着剤の加熱硬化中も動くことはない。
A method for mounting (lb), . . . (1n) will be explained. In Figure 3, CCD (1b) is cholera) (131
An epoxy thermosetting conductive adhesive αυ and an epoxy/acrylic ultraviolet curable adhesive α are precisely placed on the alumina substrate (5) while being fixed thereon. After this, the epoxy/acrylic ultraviolet curable adhesive (12) in the center of the CCD (lb) is irradiated with ultraviolet ray α4, and the epoxy/acrylic ultraviolet curable adhesive (12 is the mounting surface of the CCD (1t,) The protruding parts are hardened and the CCI) (lb) is temporarily fixed on the alumina substrate (5) while maintaining its positional accuracy.After this, the collet α3 is removed, and the whole is further heated with epoxy. Heat-curable conductive adhesive (11
1 is cured. At this time, the CCD (lb) is made of epoxy
It is fixed by the protruding part of the acrylic ultraviolet curable adhesive (lz), and no excessive force is applied to the CCD (lb), so it does not move during the heating and curing of the adhesive.

なお、この際、エポキシ・アクリル系紫外線硬化型接着
剤(I′Jが加熱によって硬化するものを用いた場合に
は、一層の効果があるのは言うまでもない。
In this case, it goes without saying that if an epoxy/acrylic ultraviolet curable adhesive (I'J that is cured by heating) is used, it will be more effective.

上述の製造方法により、CCU (lb)はエポキシ系
加熱硬化型の導電性接着剤αυの硬化後も充分な位置精
度を保ち、COD (lb)の裏i全体でアルミナ基板
(5)に固定されており、充分にCCD (lb)の裏
面より電気的接続をとることができる。また、CCD 
(la) 、(1’) 、(ld)、・・・(In−t
 ) + (lft)も同様にアルミナ基板(5)上に
固定される。
By the above manufacturing method, the CCU (lb) maintains sufficient positional accuracy even after the epoxy heat-curing conductive adhesive αυ is cured, and the entire back side of the COD (lb) is fixed to the alumina substrate (5). It is possible to make electrical connections from the back side of the CCD (lb). Also, CCD
(la) , (1') , (ld), ... (In-t
) + (lft) is similarly fixed on the alumina substrate (5).

また接着剤(111、a’aのつけ方は、上記の方法に
限定されるものではなく、接着剤αυ、 (Iaを交互
に並べたものや、接着剤α0をCCD (lb)の裏面
につけ、接着剤αのをCCD (lb)の周辺部につけ
た方法でも良い。%に後者の方法であると、紫外線が接
着剤(I2を完全に照射することになるため、加熱硬化
の性質を有する接着剤azを用いる必要がまったくなく
なる効果もある。
Also, the method of applying adhesive (111, a'a) is not limited to the above method, but it is also possible to apply adhesive αυ, (Ia) alternately or apply adhesive α0 to the back side of CCD (lb). , it is also possible to apply adhesive α to the periphery of the CCD (lb).In the latter method, the adhesive (I2) is completely irradiated with ultraviolet rays, so it has the property of heat curing. There is also the effect that there is no need to use adhesive az at all.

なお、本発明のイメージセンサは上述の実施例に限定さ
れることなく、例えば固体撮像素子を一直線上に並べた
ものや固体撮像素子が1個のものあるいは、従来より用
いられているCCD −? MO8型XCセンサで基板
外形を基準に固体撮像素子を実装したもの等にも用いる
ことができる。換言するならば、本発明はその要旨を逸
脱しない範囲内で種々変形して実施できる。
Note that the image sensor of the present invention is not limited to the above-described embodiments, and may be, for example, one in which solid-state imaging devices are arranged in a straight line, one in which there is one solid-state imaging device, or a conventionally used CCD-? It can also be used in an MO8 type XC sensor in which a solid-state image sensor is mounted based on the board outline. In other words, the present invention can be modified in various ways without departing from the spirit thereof.

〔発明の効果〕〔Effect of the invention〕

本発明のイメージセンサは、少なくとも1個の固体撮像
素子を速硬化型接着剤と加熱硬化型接着剤とにより高抵
抗基板上に配置したものであるため、複数個の固体撮像
素子を用いたイメージセンサにおいて要求される固体撮
像素子の位置精度も容易に実現でき、画質の良いイメー
ジセンサを得ることができる。
Since the image sensor of the present invention has at least one solid-state image sensor disposed on a high-resistance substrate using a quick-curing adhesive and a heat-curing adhesive, it is possible to create an image using a plurality of solid-state image sensors. The positional accuracy of the solid-state image sensor required in the sensor can be easily achieved, and an image sensor with good image quality can be obtained.

要部拡大模式断面陥、k!、2図(al乃至第2(8)
(blは本発明のイメージセンサの実施例を説明するだ
めの模式図、第3図は第1図に示すイメージセンサの実
装方法を説明するための断面簡略図である。
Main part enlarged schematic cross section, k! , 2 (al to 2nd (8)
(bl is a schematic diagram for explaining an embodiment of the image sensor of the present invention, and FIG. 3 is a simplified cross-sectional view for explaining a mounting method of the image sensor shown in FIG. 1.

(Ia)、(Ib)、 −、(in) ・−CCD(2
)・・・7オトセルアレイ (5)・・アルミナ基板 αD−エポキシ系加熱硬化型接着剤 (12+・・エポキシ・アクリル系紫外線硬化型接着剤
代理人 弁理士 則 近 憲 佑 (ほか1名)第  
1 図 第  3 図
(Ia), (Ib), -, (in) ・-CCD (2
)...7 Otocell Array (5)...Alumina substrate αD-epoxy heat curing adhesive (12+...Epoxy/acrylic ultraviolet curing adhesive Representative Patent Attorney Noriyuki Chika (and 1 other person) No.
1 Figure 3

Claims (3)

【特許請求の範囲】[Claims] (1)高抵抗基材上に少なくとも1個の固体撮像素子を
載置したイメージセンサにおいて、前記固体撮像素子は
速硬化型接着剤と加熱硬化型導電性接着剤とを介して前
記高抵抗基材上に載置したことを特徴とするイメージセ
ンサ。
(1) In an image sensor in which at least one solid-state image sensor is mounted on a high-resistance base material, the solid-state image sensor is attached to the high-resistance base material via a fast-curing adhesive and a heat-curing conductive adhesive. An image sensor characterized by being placed on a material.
(2)前記速硬化型接着剤は、紫外線の照射によつて硬
化することを特徴とする特許請求の範囲第1項記載のイ
メージセンサ。
(2) The image sensor according to claim 1, wherein the fast-curing adhesive is cured by irradiation with ultraviolet rays.
(3)前記速硬化型接着剤は、紫外線の照射または加熱
によつて硬化することを特徴とする特許請求の範囲第1
項記載のイメージセンサ。
(3) The fast-curing adhesive is cured by irradiation with ultraviolet rays or heating.
Image sensor described in section.
JP59190693A 1984-09-13 1984-09-13 Image sensor manufacturing method Expired - Lifetime JPH0693504B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59190693A JPH0693504B2 (en) 1984-09-13 1984-09-13 Image sensor manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59190693A JPH0693504B2 (en) 1984-09-13 1984-09-13 Image sensor manufacturing method

Publications (2)

Publication Number Publication Date
JPS6169256A true JPS6169256A (en) 1986-04-09
JPH0693504B2 JPH0693504B2 (en) 1994-11-16

Family

ID=16262289

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JPH0693504B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02105458A (en) * 1988-10-13 1990-04-18 Nec Corp Solid-state image sensing device and its manufacture
JPH02294072A (en) * 1989-03-30 1990-12-05 Xerox Corp Method of manufacturing full width scanning array
JP2005297679A (en) * 2004-04-08 2005-10-27 Kasai Kogyo Co Ltd Interior trim structure of automobile

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55159677A (en) * 1979-05-31 1980-12-11 Toshiba Corp Solidstate image sensor
JPS58170052A (en) * 1982-03-31 1983-10-06 Sony Corp Manufacture of solid state image pickup device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55159677A (en) * 1979-05-31 1980-12-11 Toshiba Corp Solidstate image sensor
JPS58170052A (en) * 1982-03-31 1983-10-06 Sony Corp Manufacture of solid state image pickup device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02105458A (en) * 1988-10-13 1990-04-18 Nec Corp Solid-state image sensing device and its manufacture
JPH02294072A (en) * 1989-03-30 1990-12-05 Xerox Corp Method of manufacturing full width scanning array
JP2005297679A (en) * 2004-04-08 2005-10-27 Kasai Kogyo Co Ltd Interior trim structure of automobile

Also Published As

Publication number Publication date
JPH0693504B2 (en) 1994-11-16

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