JPS6169256A - Image sensor - Google Patents

Abstract

PURPOSE:To obtain the high-quality picture information which is free from distortions and at the same time ensure easy control of an optical system, by fixing at least a solid state image pickup element on a substrate of high resistance by means of a high-speed curing adhesive and a heat-curing adhesive. CONSTITUTION:The center part of solid state image pickup elements CCD1a...1n is fixed on an alumina substrate 5 by means of an epoxy acrylic ultraviolet curing resin 12, i.e., a high-speed curing adhesive. While other areas of said solid state image pickup elements are fixed on the substrate 5 via an epoxy heat curing conductive adhesive 11. In such constitution, the elements CCD1a...1n can be set on the substrate 5 with high accuracy to obtain an adhesion type image sensor which secures high picture quality. In addition, the control of an optical system is facilitated together with improvement of the picture quality since the elements CCD1a...1n can be fixed on the substrate 5 with high accuracy owing to the external form of the substrate 5.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to an image sensor, and particularly to a means for mounting a solid-state image sensor such as a CCD on a high-resistance base material [Technical background of the invention and its problems] [Points] In recent years, image sensors, particularly contact type image sensors, have been actively developed in order to miniaturize image reading devices used in facsimiles and the like. Most of these contact-type image sensors use a rod lens array in the lens system to form a royal life-size image of the original onto a 7-otocell array that has the same dimensions as the original, and then collect the image information of the original from the 7-otocell array. Take the structure you get. Therefore, according to this structure, since the object-to-image distance of the rod lens array is as short as approximately 17 mm, there is an advantage that the apparatus can be significantly downsized.

CdF3e or Cd of the same size as the original on the insulation board of the protector etc.
A light guide such as No. 8 is provided with a film, or an amorphous silicon film is provided. However, the first contact type image sensor has problems in its characteristics such as responsiveness and resolution. Is there a way to avoid this problem by using a solid-state image sensor such as a CCD?
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1. Production power Although the convex ε-type image sensor has high speed and high resolution, it has the following drawbacks. That is, the solid-state image sensing device is small, and even the maximum width of the senna portion is approximately 60 mm. Therefore, in order to read a same-size image with the same size as the original, multiple solid-state image sensors are arranged in a staggered manner, offset from the center of the 7-otocell array, as disclosed in Japanese Patent No. 57-129065. , and it is necessary to adopt a structure in which the seven cell arrays of each chip are arranged in a direction in which they approach each other.

By the way, if the positional accuracy of solid-state image sensors arranged in a staggered manner is poor, □ Image information may become discontinuous at adjacent areas between solid-state image sensors, that is, at joints of image information. There is a risk that the read image will be distorted. Therefore, does an image sensor with multiple solid-state image sensors arranged in a staggered arrangement affect image quality? It is required to arrange the solid-state image sensors with high accuracy without causing any damage. Moreover, instead of using a contact image sensor like this, a CCD-? M
In the OS-type IC' sensor as well, in order to facilitate adjustment of the optical system, it is necessary to accurately arrange the solid-state image sensor with respect to the outer shape of the insulating substrate.

In general, solid-state image sensors have +- and --printed electrical connections.
It is a heat curing type. When this heat-curing adhesive is used, even if the solid-state image sensors are precisely arranged on the substrate before the adhesive is cured, gas is generated from the adhesive mold during curing, and this gas generation causes the solid-state image sensors to There is a risk that the solid-state image sensor may move while the adhesive is curing, or the viscosity may decrease and the adhesive may flow out before curing.
There is a danger of Therefore, it is extremely difficult to maintain the positional accuracy even after the adhesive has hardened.

It is an object of the present invention to provide an image sensor which obtains clear and high-quality image information and whose optical system can be easily adjusted.

[Summary of the invention]

The image sensor of the present invention is characterized in that at least one solid-state image sensor is disposed on a high-resistance substrate using a quick-curing adhesive and a thermosetting conductive adhesive. To explain in detail, an epoxy/acrylic ultraviolet curable adhesive is attached to at least one point on the Guipad placed on the alumina substrate, and an epoxy heat curable conductive adhesive is attached to the remaining part. The solid-state image sensor is mounted on the adhesive. Therefore, first, the epoxy/acrylic ultraviolet curable adhesive is irradiated with ultraviolet rays, and the solid-state image sensor is temporarily fixed on the alumina substrate. It is firmly fixed to the alumina substrate.Therefore, the solid-state image sensor can be firmly and accurately fixed to the alumina substrate.

[Embodiments of the invention]

Next, referring to Figures 1 and 2 (al, (b)), determine the effective date σzA +I−X →←
yz cm *c alI zu-eM nR-
In Figure 2 (al and bl) of J-1, an outline of the image sensor of the present invention is shown in Fig. c through a mold adhesive (not shown) and an epoxy heat-curable adhesive (not shown).
It is composed of cD(1a), (1b), and -(1n) fixed together. This caD (1a), (xb), (In-
t), the photocell array (2) is connected to two parallel straight lines (3
1. (Arranged in a staggered manner so as to be located on 4J. This straight line (3).

(4) Upper CCD (Ia), (IC)e-(In-, +
) and (lb), (ld).

・On the (in) 7 otocell array (2), a rod lens array (6) is used to scan the scanning line (7) of the original surface (7).
8) and the images on the scanning line (9) are formed at the same magnification. This is K, COD on straight line (3) (la), (lb)
, -(In-t) provides image information on the scanning line (8) on the document surface (7). Similarly, from the solid-state image sensors (Ib), (lc), -=(In) on the straight line (4), the scanning line (9
) above image information can be obtained. Furthermore, since the CCDs (la), (lb), -.(In) of the image sensor of the present invention are arranged on the alumina substrate (5) with high precision,
The image information from the original CCDs (lb), (ld), -(In) is delayed by the amount of image information that enters the interval between scanning lines (8) and (9) in a memory, etc. ), (
By electrically connecting the image information from IC) and l (In-t), image information on the scanning line (8) can be obtained as one time-series signal.

Next, referring to FIG. 1, CCDs (1a), (1b), (1
The fixing state between n), the alumina substrate, and (5) will be explained.

In FIG. 1, CCD (la), (lb)+ =
・The central part of (In) is fixed on the alumina substrate (5) with a fast-curing epoxy/acrylic ultraviolet curing adhesive α2, and the CCDs (la) and (Ib) are fixed on the alumina substrate (5).
, (In) is fixed with an epoxy heat-curable conductive adhesive α.

With the above configuration, CCD (la), (lb), -(
Since In) is placed on the alumina substrate (5) with high precision, a contact type image sensor with good image quality can be obtained. The final step is to determine the accuracy from the outer shape of the upper alumina substrate (5) (CCD (
la).

By fixing (lb), . . . (1n), an image sensor whose optical system can be easily adjusted can be obtained.

Furthermore, the die pads of CCD (la), (lb), -(In) and alumina substrate (5) mainly use epoxy-based heat-curable conductive adhesive αυ.
CD(la).

(lb), . . . (1n) can be sufficiently electrically connected to the die pad.

Next, referring to FIG. 3, the CCD'(la) shown in FIG.

A method for mounting (lb), . . . (1n) will be explained. In Figure 3, CCD (1b) is cholera) (131
An epoxy thermosetting conductive adhesive αυ and an epoxy/acrylic ultraviolet curable adhesive α are precisely placed on the alumina substrate (5) while being fixed thereon. After this, the epoxy/acrylic ultraviolet curable adhesive (12) in the center of the CCD (lb) is irradiated with ultraviolet ray α4, and the epoxy/acrylic ultraviolet curable adhesive (12 is the mounting surface of the CCD (1t,) The protruding parts are hardened and the CCI) (lb) is temporarily fixed on the alumina substrate (5) while maintaining its positional accuracy.After this, the collet α3 is removed, and the whole is further heated with epoxy. Heat-curable conductive adhesive (11
1 is cured. At this time, the CCD (lb) is made of epoxy
It is fixed by the protruding part of the acrylic ultraviolet curable adhesive (lz), and no excessive force is applied to the CCD (lb), so it does not move during the heating and curing of the adhesive.

In this case, it goes without saying that if an epoxy/acrylic ultraviolet curable adhesive (I'J that is cured by heating) is used, it will be more effective.

By the above manufacturing method, the CCU (lb) maintains sufficient positional accuracy even after the epoxy heat-curing conductive adhesive αυ is cured, and the entire back side of the COD (lb) is fixed to the alumina substrate (5). It is possible to make electrical connections from the back side of the CCD (lb). Also, CCD
(la) , (1') , (ld), ... (In-t
) + (lft) is similarly fixed on the alumina substrate (5).

Also, the method of applying adhesive (111, a'a) is not limited to the above method, but it is also possible to apply adhesive αυ, (Ia) alternately or apply adhesive α0 to the back side of CCD (lb). , it is also possible to apply adhesive α to the periphery of the CCD (lb).In the latter method, the adhesive (I2) is completely irradiated with ultraviolet rays, so it has the property of heat curing. There is also the effect that there is no need to use adhesive az at all.

Note that the image sensor of the present invention is not limited to the above-described embodiments, and may be, for example, one in which solid-state imaging devices are arranged in a straight line, one in which there is one solid-state imaging device, or a conventionally used CCD-? It can also be used in an MO8 type XC sensor in which a solid-state image sensor is mounted based on the board outline. In other words, the present invention can be modified in various ways without departing from the spirit thereof.

〔Effect of the invention〕

Since the image sensor of the present invention has at least one solid-state image sensor disposed on a high-resistance substrate using a quick-curing adhesive and a heat-curing adhesive, it is possible to create an image using a plurality of solid-state image sensors. The positional accuracy of the solid-state image sensor required in the sensor can be easily achieved, and an image sensor with good image quality can be obtained.

Main part enlarged schematic cross section, k! , 2 (al to 2nd (8)
(bl is a schematic diagram for explaining an embodiment of the image sensor of the present invention, and FIG. 3 is a simplified cross-sectional view for explaining a mounting method of the image sensor shown in FIG. 1.

(Ia), (Ib), -, (in) ・-CCD (2
)...7 Otocell Array (5)...Alumina substrate αD-epoxy heat curing adhesive (12+...Epoxy/acrylic ultraviolet curing adhesive Representative Patent Attorney Noriyuki Chika (and 1 other person) No.
1 Figure 3

Claims (3)

[Claims] (1) In an image sensor in which at least one solid-state image sensor is mounted on a high-resistance base material, the solid-state image sensor is attached to the high-resistance base material via a fast-curing adhesive and a heat-curing conductive adhesive. An image sensor characterized by being placed on a material. (2) The image sensor according to claim 1, wherein the fast-curing adhesive is cured by irradiation with ultraviolet rays. (3) The fast-curing adhesive is cured by irradiation with ultraviolet rays or heating.
Image sensor described in section.