JPH02105458A - Solid-state image sensing device and its manufacture - Google Patents

Abstract

PURPOSE:To eliminate a mutual dislocation of chips by using an ultraviolet- curing type resin in order to fix a plurality of solid-state image sensing elements to a substrate. CONSTITUTION:Electrodes 4 are formed on a substrate 1 made of an alumina ceramic; they are connected individually to external leads 6. A position where a first chip is to be mounted is coated with an ultraviolet-curing type resin 7 of only a required amount. Then, the first chip 3 is pressed onto the ultraviolet-curing type adhesive 7; it is aligned; after that, ultraviolet rays are radiated; the first chip is fixed. In this case, it is better to align the chip 3 by using a suction collet 8 and to radiate the ultraviolet rays 9 in a state that the suction collet 8 is not detached from the chip 3. In this manner, after the first chip has been fixed, a second and subsequent chips are fixed one after another in the same way. After that, electrodes on the side of chips and the electrodes 4 on the side of the substrate are connected by wires; this assembly is sealed with a cap.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a solid-state imaging device and a manufacturing method thereof.

[Conventional technology]

Conventionally, this type of solid-state imaging device has been equipped with silver at a predetermined position on an insulating substrate 1 (hereinafter referred to as a substrate) such as an alumina ceramic or glass epoxy board, as shown in FIG. 3(a). A thermosetting adhesive such as epoxy is applied on top of it as shown in Figure 3(b).

As shown in (C), the solid-state image sensing devices 3 (hereinafter referred to as chips) are adhered one after another, and once all have been adhered, heat is applied to harden the chips 3 to completely adhere to the substrate 1, and then ,
As shown in FIG. 4, an electrode (not shown) on the chip and an electrode 4 on the substrate side are connected by a wire 5 made of Au or Aρ,
Finally, a box-shaped cap 11 made of transparent glass is bonded with resin to cover the chip 3 and the wires 5 to complete the process. Solid-state imaging devices in which a plurality of chips are arranged in a linear manner are used in devices such as facsimiles that convert images into electrical signals and transmit the information. That is, the surface of the chip with a length of 70 to 80 mm is covered with photo
5,000 to 10,000 diodes are arranged in a row, and by arranging multiple chips in a straight line, it is possible to convert, for example, characters or images written on an A4 board into electrical signals. can. Therefore, multiple chips on the board are
If the mutual positions are not fixed with high precision, the image will be distorted. Normally, positional accuracy between chips is required to be ±10 microns.

[Problem to be solved by the invention]

In the conventional solid-state imaging device described above, the adhesive for the chips is thermosetting, so even if they are aligned by -degrees, the chips will shift before they are cured by heat, making it difficult to maintain sufficient positional accuracy between the chips. There were some drawbacks that made it difficult to improve.

The present invention aims to solve the above-mentioned problems and to obtain a solid-state imaging device with good positional accuracy between chips.

[Means to solve the problem]

The solid-state imaging device and its manufacturing method of the present invention are characterized in that an ultraviolet curable adhesive is used as the adhesive for fixing the chip to the substrate. After the first chip is placed and aligned, the first chip is fixed by irradiation with ultraviolet rays, and the second and subsequent chips are sequentially fixed in the same manner. Also, after applying an ultraviolet curable resin and a thermosetting resin to predetermined positions on the substrate, placing the first chip on top of the resin and aligning the first chip, the first chip is irradiated with ultraviolet rays. Another feature of the present invention is a method in which the second and subsequent chips are fixed one after another in the same manner, and when all the chips are fixed, they are completely fixed by heating.

[Example 1] Next, the present invention will be explained with reference to the drawings.

FIGS. 1(a) to 1(e) are plan views showing one embodiment of the present invention. FIG. 1(a) shows the state of the substrate before a chip is fixed on it. On the substrate 1 made of alumina ceramic, there is an electric 8i! 4 are formed and each is connected to an external lead 6. As shown in FIG. 1(b), a required amount of ultraviolet curable resin 7 is applied to the position where the first chip is to be mounted. In the case of this example, five drops of ultraviolet curable resin 7 were dropped at approximately equal intervals. This can be easily done by attaching five nozzles to the tip of the syringe and feeding pressurized air into the syringe. The amount of resin dripped depends on the nozzle diameter, pressure,
It can be controlled to the optimum value by adjusting the pressurization time, etc. Further, instead of using such a dot method, it is also possible to apply the material in a linear manner by pulling one nozzle while pressurizing it, as shown in the example shown in FIG.

Next, as shown in FIG. 1(c), the first chip 3 is pressed onto the ultraviolet curing adhesive 7, aligned, and then irradiated with ultraviolet light to fix the first chip. In this case, the first
As shown in the figure, after positioning the chip 3 using the suction collet 8, it is better to irradiate the ultraviolet rays 9 without separating the suction collet 8 from the chip 3. This is because even if the chip 3 is carefully aligned, the chip 3 may move when the suction collet 8 is separated, or the ultraviolet curing resin 7 may not cure uniformly, causing the chip 3 to move.

In this manner, after the first chip is fixed, the second and subsequent chips can be sequentially fixed in the same manner. That is, the application of the ultraviolet curable resin, the mounting of the chip, the positioning of the chip, and the irradiation of ultraviolet rays may be repeated.The ultraviolet curable resin can be completely cured by further applying heat.

FIG. 1(e) shows a state in which all the chips (three in this case) have been fixed in the manner described above. After this, as mentioned above, the electrodes on the chip side and the electrodes 4 on the substrate side are connected as before.
This is completed by connecting them with a wire and sealing them with a cap.

[Embodiment 2] FIG. 2 is a plan view showing a second embodiment of the present invention. Depending on the circuit configuration of the chip, the backside of the chip must be kept at a certain potential. FIG. 2(a) shows an example of a substrate in this case, in which conductive layers called islands 10 are provided where chips are to be mounted, and each is connected to a specific external lead 6.

In the case of the first embodiment, since the ultraviolet curing resin does not have electrical conductivity, it is not possible to provide electrical continuity between the island 10 and the back surface of the chip. In such a case, the second
As shown in Figure (b), ultraviolet curing resin 7 may be applied to both ends of one island, and silver epoxy 2 may be applied to the center.

As in the first embodiment, a chip is mounted on this, aligned, irradiated with ultraviolet rays to the part of the ultraviolet curing resin to produce an effect, and then fixed the second and third chips in the same manner, followed by heating. By doing so, all the chips can be fixed without causing any displacement.

〔Effect of the invention〕

As explained in detail above, by using an ultraviolet curable resin to fix multiple solid-state image sensors to a substrate, it is possible to obtain a solid-state image sensor with high performance by allowing the chips to be fixed without causing any misalignment. Can be done.

[Brief explanation of the drawing]

FIG. 1 is a plan view and a sectional view showing an embodiment of the present invention, FIG. 2 is a plan view showing another embodiment of the invention, FIG. 3 is a plan view showing a conventional method, and FIG. 4 is a plan view showing the present invention. 1 is a plan view showing an example of a solid-state imaging device according to the invention. DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2... Silver epoxy, 3... Solid-state image sensor, 4... Electrode, 5... Wire, 6...
External lead, 7... Ultraviolet curing resin, 8... Adsorption collet, 9... Ultraviolet light, 10... Island, 1
1... Kiya Ygut'' Pu. Agent Patent Attorney Fu Uchihara!

Claims (1)

[Claims] 1. In a solid-state imaging device in which a plurality of solid-state image sensors are fixed on an insulating substrate, the solid-state image sensors are fixed on the substrate with an ultraviolet curing adhesive. A solid-state imaging device characterized by: 2. Applying an ultraviolet curable resin to a predetermined position on the insulating substrate, placing the first solid-state image sensor in the predetermined position,
After positioning, irradiate with ultraviolet rays to harden the ultraviolet curable resin to fix the first solid-state image sensor, and sequentially fix the second and subsequent solid-state image sensors onto the insulating substrate in the same manner as described above. A method for manufacturing a solid-state imaging device, characterized by: 3. Apply ultraviolet curing resin and thermosetting resin to predetermined positions on the insulating substrate, place the first solid-state image sensor at the predetermined positions, and after positioning, irradiate ultraviolet rays. The first solid-state image sensor is fixed by curing the ultraviolet curable resin, and the second and subsequent solid-state image sensors are sequentially fixed on the insulating substrate in the same manner as described above, so that all the solid-state image sensors are fixed. A method for manufacturing a solid-state imaging device, characterized in that the solid-state imaging device is completely fixed by heating after finishing.