JPS61222358A - Semiconductor device - Google Patents

Abstract

PURPOSE:To decrease the manufacture cost and to improve the reliability by providing a circuit substrate around the semiconductor element and bonding the electrodes of the semiconductor element and a wiring pattern on the circuit substrate. CONSTITUTION:The semiconductor element 1 having a connection lead 12 to a major face side of a glass made transparent substrate 11 and a circuit substrate 13 provided around the element are mounted. The connection lead 12 prolonged from the electrode of the element 1 is bonded to the wiring pattern 14 of the circuit substrate 13. Then the element 1 and circuit substrate 13 are all covered by a protection resin layer 15. Through the constitution above, the semiconductor element group provided in parallel with the transparent glass plate is closed together and the components are the semiconductor element, the transparent glass plate and the circuit substrate only, then the manufacture cost is decreased. Since the semiconductor element including the transparent glass is protected directly by a resin, the reliability is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a semiconductor device, for example, a so-called read sensor using a semiconductor element, which has a significantly simple structure.
This provides a sensor that is inexpensive to manufacture.

With the development of new media such as conventional technology 0m, hm, fm, etc.
A reading sensor for electrically reading a character image is being developed. Generally, a reading sensor has a structure in which the number of elements to be read is the same as the width of the paper to be read, or a structure in which the reading elements are formed in a high density and are magnified with a lens to be read. However, while the former configuration can be made thin, the latter does not use a large number of semiconductor elements, but instead requires a certain distance between the lens system and the semiconductor element, which results in a large configuration. there were. FIG. 3 shows a cross section of the former configuration, which can be constructed thin. Semiconductor element 1 is COD, BBD MO
It is a type 5 structure, a bipolar structure having a PM junction, or a structure that emits light, in which at least a circuit for driving the element group that senses light or emits light is integrally formed.

The light-sensing or light-emitting elements formed on the semiconductor element 1 are arranged in a row at intervals of 50 μm to SOO μm. The semiconductor element 1 is placed on a wiring board 3 made of ceramic or glass-containing epoxy without any gaps, and is connected to the wiring pattern 4 of the wiring board 3 from the input and output electrodes 2 of the semiconductor element 1 with wires 6 by wire bonding. be done. The wiring board 3 is placed on the base 6,
Further, the frame 8 is fixed with an adhesive 9, and the semiconductor element is covered with a transparent glass plate 7 to protect it from damage caused by mechanical shock, atmospheric gas, moisture contamination, etc. It was fixed to the body 8 with adhesive 9. Further, the optical signal 1° is transmitted to the semiconductor element 1 through the entire transparent glass plate 7.

Problems to be Solved by the Invention In such a conventional configuration, atmospheric gas and moisture can enter through the transparent glass plate or the adhesive surface between the base and the frame, contaminating and damaging the semiconductor elements. In addition, the adhesive surface may peel off due to warping due to thermal expansion between the transparent glass plate and the base. In addition, the distance between the light-sensing element or light-emitting element of the semiconductor element and the paper surface on which the character 9 image is read is too large, making the image unclear and not only unable to obtain the desired resolution, but also due to the large number of components and mounting Not only is the cost significantly higher, but because the wire bonding method uses wires to connect the electrodes of the semiconductor element and the wiring pattern of the circuit board, the wires can break due to vibrations or shocks, reducing reliability. It also lowered the

Means for Solving the Problems In order to solve these conventional problems, the present invention has a structure in which a semiconductor element and a circuit board are provided on one main surface of a transparent glass plate, and the circuit board is placed around the periphery of the semiconductor element. The electrodes of the semiconductor element and the wiring pattern on the circuit board are connected to each other.The present invention has the above-described structure, so that the semiconductor elements arranged in parallel on the transparent glass plate are brought into close contact with each other, and the component parts are connected to the semiconductor element. Since it only requires a transparent glass plate and a circuit board, the manufacturing cost is low, and since it includes a transparent glass plate and the semiconductor element can be directly protected with resin, reliability is significantly improved.

Example An embodiment of the present invention will be described with reference to FIG.

A semiconductor element 1 having connection leads 12 and a circuit board 13 disposed around the periphery of the semiconductor element 1 are placed on the main surface side of a transparent substrate 11 made of a glass plate such as Pyrex or quartz. Connection leads 12 extending from the electrodes of the element 1 are joined to the wiring pattern 14 of the circuit board 13.

The connection lead 12 may extend from the electrode of the semiconductor element, or may extend from a predetermined position on the circuit board 13 and be bonded to the electrode of the semiconductor element 1. In this case, a part of the wiring pattern 14 formed on the circuit board 13 can be used as a connection lead to extend to the electrodes of the semiconductor element and can be bonded. Further, the semiconductor element 1 is a combination of a light sensing element (for example, CCI), a MOS type element such as a BBD, a bipolar type element having a PH junction, or a light emitting element, and a circuit for driving these elements. The light sensing elements are arranged in at least one row on the semiconductor device 1 at equal intervals.

In addition, a plurality of semiconductor elements 1 are arranged in a line, and the length of the arrangement is at least the length required to read characters or images, and usually they are arranged in a line up to the width of a paper. They are installed in parallel.

FIG. 2 shows an exploded state of the configuration of this embodiment.

There is a transparent substrate 11, and the circuit board 13 may be in the shape of a mouth so as to surround the semiconductor element 1 mounted thereon as shown in the figure, but it may also be simply arranged in parallel with the semiconductor elements 1 and provided on the side edge of the circuit board 13. is a lead 1 extending from the electrode of the semiconductor element 1.
A wiring pattern 14 is formed to which the wires 2 and 2 are connected.

The lead 12 may be formed by ultrasonic pressure bonding of a thick Mu-e wire with a diameter of 100 μm, or by forming a Mu-U protrusion on the electrode of the semiconductor element through a multilayer metal film, and attaching S to the electrode of the semiconductor element.
It is also possible to connect a 7'CCu lead by plating it. Here, the surface of the semiconductor element is placed closely or close to the transparent substrate. When assembling these, the semiconductor element 1 is placed and fixed on the transparent substrate 11 in advance, and then Circuit board 13f: Arranged and fixed, the leads 12 of the semiconductor element 1 and the wiring pattern 17 of the circuit board 13 may be joined, or the electrodes 2 of the semiconductor element 1 may be connected to the wiring pattern 14 of the circuit board 1317 first. It is also possible to place the substrate 1 on the transparent substrate 11 by placing the substrate 1 on the transparent substrate 11. Semiconductor element 1 and circuit board 13
After the electrical charge and the bonding of the leads 12 and the wiring pattern 14 are completed, as shown in FIG.

Cover with a protective resin layer 16 such as silicone resin to obtain high reliability.

The reading semiconductor device thus completed is a device that operates by receiving at least grayscale signals from the direction 10 perpendicular to the main surface 1 of the transparent substrate 11.

The semiconductor devices described so far are devices in which a light-sensing device or a light-emitting device and a circuit for driving them are integrated, but devices in which each device is separate can also be used. In addition, common terminals such as power supplies and signals of the semiconductor element groups arranged vertically and vertically are led out from the end surface area of the circuit board.

Effects of the Invention) As described above, according to the present invention, the following effects can be obtained.

(1) Since the number of constituent materials is significantly reduced and the number of manufacturing steps is reduced, the mounting cost is significantly reduced.

Huge＠）Also, since the semiconductor element is close to or in contact with the protective transparent substrate, the overall thickness of the semiconductor device increases! Not only does it become noticeably thinner and lighter, increasing its commercial value, but it also improves the resolution when reading.

[Brief explanation of the drawing]

〉 Fig. 1 is a sectional view of a semiconductor device according to an embodiment of the present invention, Fig. 2 is an exploded perspective view of essential parts of the same device,
FIG. 3 is a sectional view of a conventional semiconductor device. 1...Semiconductor element, 11...Transparent substrate, 12..."...Lead, 13...Circuit board, 14...Wiring pattern 2 -n, 16...
...Protective resin layer. /-11 Semiconductor Mutsuko Figure 2 /2 /,?

Claims (2)

[Claims] (1) Consisting of a circuit board having a group of semiconductor elements arranged in parallel on one main surface of a transparent substrate and a wiring pattern arranged around the periphery of the semiconductor element, the electrodes of the group of semiconductor elements and the wiring pattern on the circuit board. A semiconductor device characterized in that the transparent substrate is bonded to the transparent substrate, and one main surface of the transparent substrate and an element forming surface of the semiconductor element group are close to or in contact with each other. (2) The semiconductor device according to claim 1, further comprising a resin layer that includes one main surface of a transparent substrate and covers at least a group of semiconductor elements.