JPH02260658A - Solid-state image sensing component - Google Patents
Solid-state image sensing componentInfo
- Publication number
- JPH02260658A JPH02260658A JP1083413A JP8341389A JPH02260658A JP H02260658 A JPH02260658 A JP H02260658A JP 1083413 A JP1083413 A JP 1083413A JP 8341389 A JP8341389 A JP 8341389A JP H02260658 A JPH02260658 A JP H02260658A
- Authority
- JP
- Japan
- Prior art keywords
- solid
- state imaging
- package
- image sensor
- state image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims abstract description 31
- 230000001681 protective effect Effects 0.000 claims abstract description 26
- 239000004840 adhesive resin Substances 0.000 claims abstract description 5
- 229920006223 adhesive resin Polymers 0.000 claims abstract description 5
- 238000003384 imaging method Methods 0.000 claims description 33
- 230000017525 heat dissipation Effects 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 9
- 239000005357 flat glass Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 abstract description 17
- 238000000034 method Methods 0.000 abstract description 5
- 230000004907 flux Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 4
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はＣＯＤ等の固体撮像素子を用いて撮像する固体
撮像部品に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a solid-state imaging component that captures an image using a solid-state imaging device such as a COD.
従来、の技術
従来の固体撮像部品は、セラミックパッケージに固体撮
像素子を実装したものが一般的である。2. Description of the Related Art Conventional solid-state imaging components generally include a solid-state imaging device mounted in a ceramic package.
これは第４図、第５図に示すようにセラミックパッケー
ジ１の中に固体撮像素子２を導電性接着樹脂３等で固着
し、保護ガラス４により密閉構造としたものである。As shown in FIGS. 4 and 5, a solid-state image pickup device 2 is fixed in a ceramic package 1 with a conductive adhesive resin 3, etc., and the structure is sealed with a protective glass 4.
発明が解決しようとする課題 しかし、前述の従来技術には以下の問題がある。Problems that the invention aims to solve However, the above-mentioned conventional technology has the following problems.
セラミックパッケージ１は焼成部品であるので、固体撮
像素子２を固着する面に対して保護ガラス４の固着する
面が平行でない。従って固体撮像素子２の受光面２ａと
保護ガラス４が平行にならない。この為、第６図に示す
ようにプリズム部材７ａｌ ７ｂ、 ７ｃへの取り
付けに、固体撮像部品６ａ、 Ｅｔｂ、 ６ｃの相
対的な位置合わせの他に光束８、 ９． １０に対して
固体撮像部品６ａ、６ｂ。Since the ceramic package 1 is a fired component, the surface to which the protective glass 4 is fixed is not parallel to the surface to which the solid-state image sensor 2 is fixed. Therefore, the light receiving surface 2a of the solid-state image sensor 2 and the protective glass 4 are not parallel to each other. For this reason, as shown in FIG. 6, in addition to the relative positioning of the solid-state imaging components 6a, Etb, 6c, the luminous fluxes 8, 9. 10, solid-state imaging components 6a and 6b.
６ｃの固体撮像素子を垂直とする複雑な調整を行なう必
要がある。It is necessary to make a complicated adjustment to make the solid-state image sensor 6c vertical.
又セラミックパッケージ１は熱伝導率の低いアルミナで
できているため、固体撮像素子２より発生する熱の放熱
性が悪い。Furthermore, since the ceramic package 1 is made of alumina, which has a low thermal conductivity, the heat dissipation property of the solid-state image sensor 2 is poor.
本発明は上記問題に鑑み、固体撮像素子の受光面に対し
て保護ガラスのプリズム部材への取付は面が平行で放熱
性の良い固体撮像部品を提供することを目的とする。SUMMARY OF THE INVENTION In view of the above problems, it is an object of the present invention to provide a solid-state imaging component in which the surface of the protective glass attached to the prism member is parallel to the light-receiving surface of the solid-state imaging device and has good heat dissipation.
課題を解決するための手段
前記課題を解決する本発明の固体撮像部品は、固体撮像
素子と、この固体撮像素子を固着する箇所に孔を設けた
パッケージ又は基板と、固体撮像素子の電極とパッケー
ジ又は基板の電極を導通可能に接続する導電線と、光を
透過する保護ガラスを備え、固体撮像素子の受光面上方
に保護ガラスを設置し、この保護ガラスをパッケージ又
は前期受光面に固着したものである。Means for Solving the Problems A solid-state imaging component of the present invention that solves the above-mentioned problems includes a solid-state imaging device, a package or a substrate having a hole at a location to which the solid-state imaging device is fixed, an electrode of the solid-state imaging device, and a package. Or, it is equipped with a conductive wire that connects the electrodes of the substrate in a conductive manner and a protective glass that transmits light, the protective glass is installed above the light-receiving surface of the solid-state image sensor, and this protective glass is fixed to the package or the previous light-receiving surface. It is.
、更に、パッケージ又は基板の孔から露出する固体撮像
素子の裏面に放熱装置を取り付けたものである。Furthermore, a heat dissipation device is attached to the back surface of the solid-state image sensor exposed through the hole in the package or substrate.
作 用
本発明によれば、先に固体撮像素子が固着されたパッケ
ージ又は基板の孔から露出する固体撮像素子の受光面と
平行な裏面を用いて、プリズム部材への取り付は面であ
る保護ガラスの入射面を受光面と平行を保って保護ガラ
スをパッケージ又は受光面と固着することができるので
、保護ガラスの入射面を光束に対して垂直なプリズム部
材の出射端面に直接貼り付けることにより、必然的に固
体撮像素子の受光面は光束に対して垂直となり、プリズ
ム部材への固体撮像部品の取り付は調整が簡略化できる
。According to the present invention, the solid-state image sensor is attached to the prism member by using the back surface parallel to the light-receiving surface of the solid-state image sensor that is exposed through the hole in the package or substrate to which the solid-state image sensor is fixed. The protective glass can be fixed to the package or the light-receiving surface while keeping the incident surface of the glass parallel to the light-receiving surface, so by attaching the incident surface of the protective glass directly to the output end surface of the prism member perpendicular to the light beam. The light-receiving surface of the solid-state image sensor is necessarily perpendicular to the light beam, and the adjustment of the solid-state image sensor component to the prism member can be simplified.
又固体撮像素子の裏面に放熱装置を取り付けることによ
り放熱効果をより高めることができる。Furthermore, by attaching a heat dissipation device to the back surface of the solid-state image sensor, the heat dissipation effect can be further enhanced.
実施例 本発明の第１実施例を第１図を用いて説明する。Example A first embodiment of the present invention will be described with reference to FIG.
第１図はセラミックパッケージを用いた本実施例にける
固体撮像部品の側断面図である。セラミックパッケージ
１ｏの固体撮像素子１２を固着する部分には孔１１が設
けられており、固体撮像素子１２を導電性接着樹脂１３
等でセラミックパッケージ１０に固着した時、固体撮像
素子１２の受光面１２ａと平行な裏面１２ｂを孔１１よ
り露出させる。この時、セラミックパッケージｌｏ内の
気密を保つ為に導伝性接着樹脂１３を裏面１２ｂの全周
としたり、又孔１１の固体撮像素子１２と接する角に封
止樹脂を設ける等すると良い。そして、固体撮像素子１
２の電極とセラミックパッケージ１０の電極２２を導電
線２３により導通可能とした後、光制御手段としての遮
光板や遮光膜のＯＢフィルター（オプチカルブラックフ
ィルター）５を介在させ、裏面１２ｂを用いて保護ガラ
ス１４の入射面１４ａを前期受光面１２ａと平行を保ち
、保護ガラス１４をセラミックパッケージ１゜に固着す
る。FIG. 1 is a side sectional view of a solid-state imaging component according to this embodiment using a ceramic package. A hole 11 is provided in the portion of the ceramic package 1o to which the solid-state image sensor 12 is fixed, and the solid-state image sensor 12 is fixed to the conductive adhesive resin 13.
When the solid-state imaging device 12 is fixed to the ceramic package 10 using a method such as the above, the back surface 12b of the solid-state imaging device 12, which is parallel to the light-receiving surface 12a, is exposed through the hole 11. At this time, in order to maintain airtightness inside the ceramic package lo, it is preferable to cover the entire circumference of the back surface 12b with the conductive adhesive resin 13, or to provide a sealing resin at the corner of the hole 11 that contacts the solid-state image sensor 12. Then, the solid-state image sensor 1
2 and the electrode 22 of the ceramic package 10 are made electrically conductive by a conductive wire 23, and then an OB filter (optical black filter) 5 such as a light shielding plate or a light shielding film is interposed as a light control means and protected using the back surface 12b. The incident surface 14a of the glass 14 is kept parallel to the light receiving surface 12a, and the protective glass 14 is fixed to the ceramic package 1°.
固体撮像素子１２の裏面１２ｂと保護ガラス１４の入射
面１４ａの平行の出し方としては、例えば保護ガラス１
４を平行平板ガラスとしてセラミックパッケージ１０よ
り一部或いは全面を大きくするか、又はセラミックパッ
ケージ１ｏに更に孔を設けて、裏面１２ｂと保護ガラス
１４の出射面１４ｂの一部が共に平行に接する治具を用
いる方法や、受光面１２ａの上方に裏面１２ｂと平行な
面をもつ治具を設置し、この治具に保護ガラス１４を吸
着してセラミックパッケージ１ｏに保護ガラス１４を固
着する方法等が有る。更に、ガラスエポキシ等で成るＰ
ＧＡ等のパッケージでも行なうことができる。For example, how to make the back surface 12b of the solid-state image sensor 12 parallel to the incident surface 14a of the protective glass 14 is as follows.
A jig in which the back surface 12b and a part of the output surface 14b of the protective glass 14 are in parallel contact by making a part or the entire surface larger than the ceramic package 10 by making 4 a parallel flat glass, or by further providing a hole in the ceramic package 1o. There is also a method of using a jig having a surface parallel to the back surface 12b above the light-receiving surface 12a, and adhering the protective glass 14 to the jig to fix the protective glass 14 to the ceramic package 1o. . Furthermore, P made of glass epoxy etc.
This can also be done with a package such as GA.
第２図、第３図は本発明の第２、第３実施例を示す側断
面図である。第２図はいわゆるＣＯＢ実装方法であり、
電極１５をもつ絶縁基板１６に孔１１を設けたものであ
る。第３図はプラスチックパッケージといわれるもので
あり、電極であるリードフレーム１７に孔１１を設けた
ものである。FIGS. 2 and 3 are side sectional views showing second and third embodiments of the present invention. Figure 2 shows the so-called COB mounting method.
A hole 11 is provided in an insulating substrate 16 having an electrode 15. FIG. 3 shows what is called a plastic package, in which a hole 11 is provided in a lead frame 17 which is an electrode.
共に受光面１２ａと保護ガラス１４の入射面１４ａの平
行の出し方は第１実施例のセラミックバッケージ１０と
同様にしてできる。In both cases, the parallel arrangement of the light receiving surface 12a and the incident surface 14a of the protective glass 14 can be made in the same manner as in the ceramic package 10 of the first embodiment.
なお、従来は光制御手段を固体撮像素子１２の受光面１
２ａ上に貼り付けていた為、受光面１２ａに当たらない
ようにしなければいけないという作業上の問題点があっ
たが、上記実施例によれば固体撮像素子１２の受光面１
２ａと平行平板の保護ガラス１４の出射面１４ｂは高精
度に平行を保つことができるので、光制御手段としての
ＯＢフィルター５や複数の色光を選択的に透過させる色
フィルターを前記出射面１４ｂに形成することもできる
。Note that conventionally, the light control means is the light receiving surface 1 of the solid-state image sensor 12.
However, according to the above embodiment, the light-receiving surface 1 of the solid-state image sensor 12
2a and the output surface 14b of the protective glass 14, which is a parallel flat plate, can be maintained parallel to each other with high precision. It can also be formed.
なお、第１実施例のセラミックパッケージ１０又は第２
、第３実施例の固体撮像素子１２の受光面１２ａ上に、
保護ガラス１４を貼り付けた後に孔１１に例えばＣｕ５
Ａ１等の放熱板の放熱装置１８を取り付けることにより
、放熱効果をより高めることができる。又放熱装置に孔
に入る突起を設は第３図に示すように外側に面積を広く
すると良い。更に放熱装置は熱伝導性の良いシリコーン
等で接着するとよい。Note that the ceramic package 10 of the first embodiment or the second embodiment
, on the light-receiving surface 12a of the solid-state image sensor 12 of the third embodiment,
After pasting the protective glass 14, fill the holes 11 with, for example, Cu5.
By attaching a heat dissipation device 18 such as a heat dissipation plate such as A1, the heat dissipation effect can be further enhanced. In addition, when providing a projection that fits into the hole in the heat dissipation device, it is preferable to widen the area on the outside as shown in FIG. Furthermore, the heat dissipation device is preferably bonded with silicone or the like having good thermal conductivity.
発明の効果
以上述べてきたように、本発明によれば保護ガラスの入
射面が固体撮像素子の受光面に対して高精度に平行を保
つ固体撮像部品とすることができるので、プリズム部材
への取り付けの調整が簡略化でき、しかも放熱効果を高
めることができる。Effects of the Invention As described above, according to the present invention, a solid-state imaging component can be obtained in which the incident surface of the protective glass is kept parallel to the light-receiving surface of the solid-state imaging device with high accuracy. Installation adjustment can be simplified and the heat dissipation effect can be improved.
又本発明によれば、個体撮像素子の裏面に放熱装置を取
り付けることにより放熱効果をより高めることができる
。Further, according to the present invention, the heat radiation effect can be further enhanced by attaching a heat radiation device to the back surface of the solid-state image sensor.
第１図は本発明の第１実施例においてパッケージを用い
た固体撮像部品の側断面図、第２図は本発明の第２実施
例においてＣＯＢ実装方法による固体撮像部品の側断面
図、第３図はプラスチックパッケージによる本発明の一
実施例における固体撮像部品の側断面図、第４図は従来
の固体撮像部品の斜視図、第５図は同側断面図、第６図
は従来の固体撮像部品を用いた固体撮像装置の側面図で
ある。
１０ 、、、セラミックパッケージ、 １２．、、固体
撮像素子、 １４．、、保護ガラス、 １１．、、孔、
２２．。
電極、２３゜１．導電線、１Ｂ、、、絶縁基板、１７゜
１．リードフレーム、 １８．、、放熱装置。
代理人の氏名 弁理士 粟野重孝 はか１名ＩＩ 図
ノ３Σ−に虜芦試９ジ亡１き２ｊりこ４−ツレク妊１第
図
／Ｊ簿引鍋翔覇扁
δ尤水FIG. 1 is a side sectional view of a solid-state imaging component using a package in a first embodiment of the present invention, FIG. 2 is a side sectional view of a solid-state imaging component using a COB mounting method in a second embodiment of the present invention, and FIG. The figure is a sectional side view of a solid-state imaging component according to an embodiment of the present invention using a plastic package, FIG. 4 is a perspective view of a conventional solid-state imaging component, FIG. 5 is a sectional view of the same side, and FIG. 6 is a conventional solid-state imaging component. FIG. 2 is a side view of a solid-state imaging device using parts. 10. Ceramic package 12. ,, solid-state image sensor, 14. ,,protective glass, 11. ,,hole,
22. . Electrode, 23°1. Conductive wire, 1B, Insulated substrate, 17°1. Lead frame, 18. ,,heat dissipation device. Name of agent: Patent attorney Shigetaka Awano Haka 1 person II Fig. 3
Claims (5)
所に面に孔を設けたパッケージ又は基板と、前記固体撮
像素子の電極と前記パッケージ又は前記基板の電極を導
通可能に接続する導電線と、光を透過する保護ガラスを
備え、前記固体撮像素子の受光面上方に前記保護ガラス
を設置し、この保護ガラスを前記パッケージ又は前記受
光面に固着したことを特徴とする固体撮像部品。(1) A solid-state imaging device, a package or a substrate having a hole in its surface at a location to which the solid-state imaging device is fixed, and a conductive wire that connects the electrodes of the solid-state imaging device and the electrodes of the package or substrate in a conductive manner. A solid-state imaging component, comprising: a protective glass that transmits light; the protective glass is installed above the light-receiving surface of the solid-state image sensor, and the protective glass is fixed to the package or the light-receiving surface.
する請求項１記載の固体撮像部品。(2) The solid-state imaging component according to claim 1, wherein the protective glass is a parallel flat glass.
子の裏面に放熱装置を取り付けたことを特徴とする請求
項１記載の固体撮像部品。(3) The solid-state imaging component according to claim 1, wherein a heat dissipation device is attached to the back surface of the solid-state imaging device exposed through the hole in the package or substrate.
請求項３記載の固体撮像部品。(4) The solid-state imaging component according to claim 3, wherein the heat dissipation device has a projection that fits into the hole.
子の裏面に取り付けたことを特徴とする請求項３記載の
固体撮像部品。(5) The solid-state imaging component according to claim 3, wherein the heat dissipation device is attached to the back surface of the solid-state imaging device using an adhesive resin with good thermal conductivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1083413A JPH02260658A (en) | 1989-03-31 | 1989-03-31 | Solid-state image sensing component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1083413A JPH02260658A (en) | 1989-03-31 | 1989-03-31 | Solid-state image sensing component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02260658A true JPH02260658A (en) | 1990-10-23 |
Family
ID=13801751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1083413A Pending JPH02260658A (en) | 1989-03-31 | 1989-03-31 | Solid-state image sensing component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02260658A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5523608A (en) * | 1992-09-01 | 1996-06-04 | Sharp Kabushiki Kaisha | Solid state imaging device having a solid state image sensor and its peripheral IC mounted on one package |
| CN100376107C (en) * | 2003-02-05 | 2008-03-19 | 夏普株式会社 | Photoelectric acquisition sensor |
| US7821554B2 (en) | 2007-08-14 | 2010-10-26 | Hon Hai Precision Industry Co., Ltd. | Image sensor with cooling element |
-
1989
- 1989-03-31 JP JP1083413A patent/JPH02260658A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5523608A (en) * | 1992-09-01 | 1996-06-04 | Sharp Kabushiki Kaisha | Solid state imaging device having a solid state image sensor and its peripheral IC mounted on one package |
| CN100376107C (en) * | 2003-02-05 | 2008-03-19 | 夏普株式会社 | Photoelectric acquisition sensor |
| US7821554B2 (en) | 2007-08-14 | 2010-10-26 | Hon Hai Precision Industry Co., Ltd. | Image sensor with cooling element |
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