JPH11330442A - Optical device - Google Patents

Optical device

Info

Publication number
JPH11330442A
JPH11330442A JP10138220A JP13822098A JPH11330442A JP H11330442 A JPH11330442 A JP H11330442A JP 10138220 A JP10138220 A JP 10138220A JP 13822098 A JP13822098 A JP 13822098A JP H11330442 A JPH11330442 A JP H11330442A
Authority
JP
Japan
Prior art keywords
cover
lens
optical device
package
solid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10138220A
Other languages
Japanese (ja)
Inventor
Hideaki Fujii
英昭 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP10138220A priority Critical patent/JPH11330442A/en
Publication of JPH11330442A publication Critical patent/JPH11330442A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Solid State Image Pick-Up Elements (AREA)

Abstract

PROBLEM TO BE SOLVED: To eliminate design limits and constrains of miniaturization concerning the focal distance of the optical device and to reduce the number of man-hours needed to assemble the optical device, without degrading hermetic property of the package wherein the solid-state image-pickup element is contained in an optical device wherein a package which holds an optical element, for example, a solid-state image-pickup element is provided with at least a cover which shields the element from the outside and a lens which forms an object to be imaged on the imaging plane of the optical element. SOLUTION: A cover 9 is integrated with lenses 10, 10 to construct a lens/ cover integrated member 11, which is fixed to a package 1. Then the cover 9 is formed of a plate glass and the lenses 10, 10 are formed of resin, and one main surface of each lens is curved and the other is flat. The flat surfaces of the lenses 10, 10 are fixed, for example, to both main surfaces of the cover 9 so as to construct a lens/cover integrated member 11.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、光学装置、特に光
学素子を保持するパッケージに少なくとも該光学素子を
外部から遮蔽するカバーと該光学素子の結像面に該カバ
ー外部の被写体を結像するレンズを設けた光学装置に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical device, particularly to a cover for holding at least an optical element in a package holding the optical element, and to form an image of an object outside the cover on an image forming surface of the optical element. The present invention relates to an optical device provided with a lens.

【０００２】[0002]

【従来の技術】光学装置の従来例の一つとして図３に示
すものがある。図において、１はパッケージ、２は該パ
ッケージ１の収納凹部３の内底面上にボンディングされ
た例えばＣＣＤ型固体撮像素子で、その各電極はパッケ
ージ１に形成された図示しない配線膜の内端部にワイヤ
４を介して電気的に接続されている。５は該パッケージ
１の上面に接着されたカバーで、上記収納凹部３を外部
から遮断して密閉空間にするもので、例えばガラスから
なる。６はレンズで、レンズ部７とそれを支持する支持
部８とからなり、該支持部８の脚部をパッケージ１上面
に固定することによってレンズ部７が上記固体撮像素子
２に対して所定の位置関係に保持され、レンズ部７によ
り被写体を固体撮像素子２の撮像面に結像することがで
きるようになっている。尚、支持部８のパッケージ１へ
の固定は接着剤を用いて行う場合もあれば、ネジを用い
たり、或いはフック状の係合部を設け、それを係合させ
るという方法を用いて行う場合もある。2. Description of the Related Art FIG. 3 shows an example of a conventional optical device. In the figure, reference numeral 1 denotes a package, and 2 denotes, for example, a CCD type solid-state imaging device bonded on the inner bottom surface of a storage recess 3 of the package 1, and each electrode thereof is an inner end of a wiring film (not shown) formed on the package 1. Are electrically connected to each other through a wire 4. Reference numeral 5 denotes a cover adhered to the upper surface of the package 1, which shields the housing recess 3 from the outside to form a closed space, and is made of, for example, glass. Reference numeral 6 denotes a lens, which comprises a lens portion 7 and a support portion 8 for supporting the lens portion. The positional relationship is maintained, and the subject can be imaged on the imaging surface of the solid-state imaging device 2 by the lens unit 7. The fixing of the support portion 8 to the package 1 may be performed by using an adhesive, or by using a screw or a method of providing a hook-shaped engaging portion and engaging it. There is also.

【０００３】[0003]

【発明が解決しようとする課題】ところで、図３に示す
従来の光学装置には、カバー５により収納凹部３内の固
体撮像素子２を密閉後、レンズ６を取り付ける必要があ
り、作業が面倒であるという問題があった。In the conventional optical device shown in FIG. 3, it is necessary to attach the lens 6 after the solid-state image pickup device 2 in the storage recess 3 is sealed by the cover 5, and the operation is troublesome. There was a problem.

【０００４】また、その従来の光学装置には、レンズ６
がカバー５の外側にあるが故に、レンズ部７の固体撮像
素子２からの距離（焦点距離）はカバー５の固体撮像素
子２からの距離よりも大きく（例えば０. ５〜１．０ｍ
ｍ程度大きく）せざるを得ず、そのことが、光学装置の
設計上の制約となり、光学装置の小型化を阻む要因とな
るという問題もあった。かといって、カバー５を設けな
い構造にすると、上記収納凹部３内に水分が侵入し、固
体撮像素子２が劣化してしまうので、カバーが必要であ
り、より良好な気密性を保持するには、その材料をガラ
スにすることが好ましい。The conventional optical device includes a lens 6.
Is outside the cover 5, the distance (focal length) of the lens unit 7 from the solid-state imaging device 2 is larger than the distance of the cover 5 from the solid-state imaging device 2 (for example, 0.5 to 1.0 m).
m), which is a constraint on the design of the optical device, and has a problem of hindering downsizing of the optical device. On the other hand, if the structure without the cover 5 is used, moisture penetrates into the storage recess 3 and the solid-state imaging device 2 is deteriorated. Therefore, a cover is necessary, and it is necessary to maintain better airtightness. Is preferably made of glass.

【０００５】本発明はこのような問題点を解決すべく為
されたものであり、光学素子を保持するパッケージに少
なくとも該光学素子を外部から遮蔽するカバーと該光学
素子の結像面に該カバー外部の被写体を結像するレンズ
を設けた光学装置において、パッケージに収納された光
学素子の収納空間の気密性を低下させることなく、光学
装置の焦点距離に関する設計上の制約、小型化の制約を
なくすことを目的とし、更には、光学装置の組立工数を
低減することを目的とする。SUMMARY OF THE INVENTION The present invention has been made to solve such a problem. A package for holding at least the optical element from the outside is provided on a package holding the optical element, and the cover is provided on an image forming surface of the optical element. In an optical device provided with a lens that forms an image of an external subject, the design restrictions and the miniaturization restrictions on the focal length of the optical device can be reduced without reducing the airtightness of the storage space of the optical element stored in the package. It is another object of the present invention to reduce the number of assembling steps of an optical device.

【０００６】[0006]

【課題を解決するための手段】請求項１の光学装置は、
カバーとレンズを一体化してなることを特徴とする。従
って、請求項１の光学装置によれば、カバーとレンズを
一体化したので、レンズの光学素子との距離がそのまま
カバーの光学素子との距離となり、レンズの光学素子と
の距離の設定がカバーの存在により制約されるおそれが
なく、また、カバーの存在によりレンズの位置がその外
側に制約されて光学装置の小型化が阻まれるというおそ
れもない。According to the first aspect of the present invention, there is provided an optical device comprising:
It is characterized in that the cover and the lens are integrated. Therefore, according to the optical device of the first aspect, since the cover and the lens are integrated, the distance between the lens and the optical element becomes the distance between the cover and the optical element as it is, and the setting of the distance between the lens and the optical element is changed. Also, there is no possibility that the position of the lens is restricted to the outside by the presence of the cover, and the miniaturization of the optical device is not hindered.

【０００７】そして、カバーとレンズを一体化したの
で、光学装置の組立にカバーを取り付ける工程とレンズ
を取り付ける工程とを別々に要するということがなくな
り、一つの工程でカバー及びレンズをパッケージに取り
付けることができ、延いては光学装置の組立工数を低減
することができる。Since the cover and the lens are integrated, the step of attaching the cover and the step of attaching the lens to the assembly of the optical device are not required separately, and the cover and the lens are attached to the package in one step. Accordingly, the number of assembling steps of the optical device can be reduced.

【０００８】[0008]

【発明の実施の形態】本発明光学装置は、基本的には、
カバーとレンズを一体化してなるものであり、カバーは
樹脂でも良いが、ガラスの方が好ましい。というのは、
ガラスの方が気密性を高めることができるからである。
ガラスによりカバーを形成する場合は、板ガラスを用意
し、通常行われているように、所定の寸法に研磨加工す
る。また、レンズはガラスであっても樹脂であっても良
いが、プラスチックの方がレンズ機能を持つのに必要な
曲面の形成がし易いので好ましいといえる。カバーとレ
ンズとの一体化は、例えば板状のカバーの少なくとも一
方の表面に、片面が平坦でもう一方の面が曲面のレンズ
のその平坦な面を接着することにより行うことができ
る。このようにすれば、ガラスによるカバーで光学素子
収納空間の気密性を保持し、その片面又は両面に接着し
たレンズにより被写体を結像させるようにすることがで
きる。DESCRIPTION OF THE PREFERRED EMBODIMENTS The optical device of the present invention basically has
The cover and the lens are integrated, and the cover may be made of resin, but glass is more preferable. I mean,
This is because glass can improve airtightness.
When forming a cover with glass, a plate glass is prepared and polished to a predetermined size as is usually done. The lens may be made of glass or resin, but plastic is preferable because it is easy to form a curved surface necessary for having a lens function. The integration of the cover and the lens can be performed, for example, by bonding the flat surface of a lens having one flat surface and another curved surface to at least one surface of a plate-shaped cover. With this configuration, the airtightness of the optical element storage space can be maintained by the glass cover, and the image of the subject can be formed by the lens adhered to one or both surfaces thereof.

【０００９】パッケージは樹脂により形成しても、セラ
ミックにより形成しても良く、材料は特に問わないが、
気密性の面からセラミックの方が好ましいといえる。パ
ッケージに収納される光学素子はＣＣＤ固体撮像素子、
ＭＯＳ型固体撮像素子、増幅型固体撮像素子等の固体撮
像素子であっても良いし、フィルタであっても良い等光
学素子の種類を問わない。The package may be formed of resin or ceramic, and the material is not particularly limited.
It can be said that ceramic is more preferable in terms of airtightness. The optical element housed in the package is a CCD solid-state image sensor,
Any type of optical element may be used, such as a solid-state imaging device such as a MOS solid-state imaging device or an amplification-type solid-state imaging device, or a filter.

【００１０】[0010]

【実施例】以下、本発明を図示実施例に従って詳細に説
明する。図１は本発明光学装置の第１の実施例を示す断
面図である。図において、１はパッケージ、２は該パッ
ケージ１の収納凹部３の内底面上にボンディングされた
例えばＣＣＤ型固体撮像素子で、その各電極はパッケー
ジ１に形成された図示しない配線膜の内端部にワイヤ４
を介して電気的に接続されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the illustrated embodiments. FIG. 1 is a sectional view showing a first embodiment of the optical apparatus of the present invention. In the figure, reference numeral 1 denotes a package, and 2 denotes, for example, a CCD type solid-state imaging device bonded on the inner bottom surface of a storage recess 3 of the package 1, and each electrode thereof is an inner end of a wiring film (not shown) formed on the package 1. Wire 4
Are electrically connected via

【００１１】１１は該パッケージ１の上面に接着された
レンズ及びカバー一体部材であり、上記収納凹部３を外
部から遮断して密閉空間にすると共に、被写体を後述す
る固体撮像素子（２）の撮像面に結像するもので、図２
（Ａ）、（Ｂ）に示すように、ガラスからなるカバー９
の両面に樹脂からなるレンズ１０、１０を接着すること
により一体化してなる。この一体化のための接着は例え
ば紫外線硬化型接着剤を用いて行う。該レンズ１０、１
０は被写体を固体撮像素子２の撮像面に結像させる役割
を果たす。尚、レンズ１０はカバー９の片面のみに設け
ても良い。Reference numeral 11 denotes an integrated lens and cover member adhered to the upper surface of the package 1. The housing concave portion 3 is shielded from the outside to form a closed space, and an object is imaged by a solid-state image sensor (2) described later. Fig. 2
(A) and (B), as shown in FIG.
The lenses 10 and 10 made of a resin are adhered to both surfaces of the substrate to be integrated. The bonding for the integration is performed using, for example, an ultraviolet-curable adhesive. The lens 10, 1
Numeral 0 plays a role in imaging an object on the imaging surface of the solid-state imaging device 2. Note that the lens 10 may be provided on only one surface of the cover 9.

【００１２】このような光学装置によれば、カバー９と
レンズ１０、１０を一体化したので、レンズの固体撮像
素子２との距離の設定がカバーの存在により制約される
おそれがなく、また、カバーの存在によりレンズの位置
がその外側に位置するように制約されて光学装置の小型
化が阻まれるという従来例において存在したおそれもな
い。According to such an optical device, since the cover 9 and the lenses 10 and 10 are integrated, there is no possibility that the setting of the distance between the lens and the solid-state image sensor 2 is restricted by the presence of the cover. The existence of the cover restricts the position of the lens to be located outside the lens, which hinders miniaturization of the optical device.

【００１３】そして、カバー９とレンズ１０、１０を一
体化したので、予め一体化してレンズ及びカバー一体部
材１１を構成した後、収納凹部３内に固体撮像素子２が
収納されワイヤボンディングが済んだパッケージ１に該
レンズ及びカバー一体部材１１を接着することにより、
一つの工程でカバー及びレンズを同時に組み付けること
ができ、光学装置の組立にカバーを取り付ける工程とレ
ンズを取り付ける工程とを別々に要するということがな
くなる。従って、光学装置の組立工数を低減することが
できる。Since the cover 9 and the lenses 10 and 10 are integrated, the solid-state imaging device 2 is housed in the housing recess 3 after the lens and cover integrated member 11 are integrated in advance and the wire bonding is completed. By bonding the lens and cover integrated member 11 to the package 1,
The cover and the lens can be assembled at the same time in one step, and the step of attaching the cover and the step of attaching the lens for assembling the optical device are not required separately. Therefore, the number of assembling steps of the optical device can be reduced.

【００１４】[0014]

【発明の効果】請求項１の光学装置によれば、カバーと
レンズを一体化したので、レンズの光学素子との距離が
そのままカバーの固体撮像素子との距離となり、レンズ
の固体撮像素子との距離の設定がカバーの存在により制
約されるおそれがなく、また、カバーの存在によりレン
ズの位置がその外側に制約されて光学装置の小型化が阻
まれるというおそれもない。According to the optical device of the first aspect, since the cover and the lens are integrated, the distance between the lens and the optical element is the distance between the cover and the solid-state image sensor, and the distance between the lens and the solid-state image sensor is changed. There is no possibility that the setting of the distance is restricted by the presence of the cover, and there is no possibility that the position of the lens is restricted to the outside thereof by the presence of the cover, and the miniaturization of the optical device is not hindered.

【００１５】請求項２の光学装置によれば、カバーが板
状のガラスからなり、レンズが一方の主面が曲面にされ
他方の主面が平坦にされた樹脂からなり、上記カバーの
一方又は両方の主面に上記レンズを平坦な面にて固定し
てなるので、ガラスの平坦面にレンズの平坦面を接着す
るという比較的簡単な作業によりレンズ及びカバー一体
部材をつくることができる。According to the optical device of the second aspect, the cover is made of plate-like glass, and the lens is made of a resin whose one main surface is curved and the other main surface is flat, Since the lens is fixed to both main surfaces with flat surfaces, the lens and cover integrated member can be manufactured by a relatively simple operation of bonding the flat surface of the lens to the flat surface of glass.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明光学装置の一つの実施例を示す断面図で
ある。FIG. 1 is a sectional view showing one embodiment of the optical device of the present invention.

【図２】（Ａ）、（Ｂ）は上記実施例に用いたカバーの
製造方法の一例を順に示す断面図である。FIGS. 2A and 2B are cross-sectional views sequentially showing an example of a method of manufacturing a cover used in the above embodiment.

【図３】光学装置の従来例の一つを示す断面図である。FIG. 3 is a cross-sectional view showing one conventional example of an optical device.

【符号の説明】[Explanation of symbols]

１・・・パッケージ、２・・・光学素子、３・・・密閉
空間、９・・・カバー、１０・・・レンズ、１１・・・
レンズ及びカバー一体部材。DESCRIPTION OF SYMBOLS 1 ... Package, 2 ... Optical element, 3 ... Closed space, 9 ... Cover, 10 ... Lens, 11 ...
A lens and cover integrated member.

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 光学素子を保持するパッケージに少なく
とも該光学素子を外部から遮蔽するカバーと該光学素子
の結像面に該カバー外部の被写体を結像するレンズを設
けた光学装置において、 上記カバーとレンズを一体化してなることを特徴とする
光学装置。1. An optical apparatus comprising: a package for holding an optical element; and a cover for shielding at least the optical element from the outside, and a lens for imaging an object outside the cover on an image forming surface of the optical element. An optical device comprising a lens and an integrated lens. 【請求項２】 カバーが板状のガラスからなり、 レンズが一方の主面が曲面にされ他方の主面が平坦にさ
れた樹脂からなり、 上記カバーの被写体からの光を通す部分の一方又は両方
の主面に上記レンズを平坦な面にて固定してなることを
特徴とする請求項１記載の光学装置。2. The cover is made of a plate-like glass, and the lens is made of a resin whose one main surface is curved and the other main surface is flat, and one or a portion of the cover through which light from a subject passes. 2. The optical device according to claim 1, wherein said lenses are fixed to both main surfaces by flat surfaces.
JP10138220A 1998-05-20 1998-05-20 Optical device Pending JPH11330442A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10138220A JPH11330442A (en) 1998-05-20 1998-05-20 Optical device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10138220A JPH11330442A (en) 1998-05-20 1998-05-20 Optical device

Publications (1)

Publication Number Publication Date
JPH11330442A true JPH11330442A (en) 1999-11-30

Family

ID=15216906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10138220A Pending JPH11330442A (en) 1998-05-20 1998-05-20 Optical device

Country Status (1)

Country Link
JP (1) JPH11330442A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002252338A (en) * 2000-12-18 2002-09-06 Canon Inc Imaging device and imaging system
KR20020071475A (en) * 2001-03-05 2002-09-12 캐논 가부시끼가이샤 Image pickup model and image pickup device
JP2010056292A (en) * 2008-08-28 2010-03-11 Oki Semiconductor Co Ltd Camera module and its manufacturing method
JP2011507219A (en) * 2007-11-27 2011-03-03 ヘプタゴン・オサケ・ユキチュア Sealed lens stack
WO2019131488A1 (en) * 2017-12-28 2019-07-04 ソニーセミコンダクタソリューションズ株式会社 Camera package, camera package production method, and electronic device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002252338A (en) * 2000-12-18 2002-09-06 Canon Inc Imaging device and imaging system
KR20020071475A (en) * 2001-03-05 2002-09-12 캐논 가부시끼가이샤 Image pickup model and image pickup device
JP2011507219A (en) * 2007-11-27 2011-03-03 ヘプタゴン・オサケ・ユキチュア Sealed lens stack
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