JPH11330442A - Optical device - Google Patents

Optical device

Info

Publication number
JPH11330442A
JPH11330442A JP10138220A JP13822098A JPH11330442A JP H11330442 A JPH11330442 A JP H11330442A JP 10138220 A JP10138220 A JP 10138220A JP 13822098 A JP13822098 A JP 13822098A JP H11330442 A JPH11330442 A JP H11330442A
Authority
JP
Japan
Prior art keywords
optical
cover
lens
package
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10138220A
Other languages
Japanese (ja)
Inventor
Hideaki Fujii
英昭 藤井
Original Assignee
Sony Corp
ソニー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp, ソニー株式会社 filed Critical Sony Corp
Priority to JP10138220A priority Critical patent/JPH11330442A/en
Publication of JPH11330442A publication Critical patent/JPH11330442A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16195Flat cap [not enclosing an internal cavity]

Abstract

PROBLEM TO BE SOLVED: To eliminate design limits and constrains of miniaturization concerning the focal distance of the optical device and to reduce the number of man-hours needed to assemble the optical device, without degrading hermetic property of the package wherein the solid-state image-pickup element is contained in an optical device wherein a package which holds an optical element, for example, a solid-state image-pickup element is provided with at least a cover which shields the element from the outside and a lens which forms an object to be imaged on the imaging plane of the optical element. SOLUTION: A cover 9 is integrated with lenses 10, 10 to construct a lens/ cover integrated member 11, which is fixed to a package 1. Then the cover 9 is formed of a plate glass and the lenses 10, 10 are formed of resin, and one main surface of each lens is curved and the other is flat. The flat surfaces of the lenses 10, 10 are fixed, for example, to both main surfaces of the cover 9 so as to construct a lens/cover integrated member 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical device, particularly to a cover for holding at least an optical element in a package holding the optical element, and to form an image of an object outside the cover on an image forming surface of the optical element. The present invention relates to an optical device provided with a lens.

[0002]

2. Description of the Related Art FIG. 3 shows an example of a conventional optical device. In the figure, reference numeral 1 denotes a package, and 2 denotes, for example, a CCD type solid-state imaging device bonded on the inner bottom surface of a storage recess 3 of the package 1, and each electrode thereof is an inner end of a wiring film (not shown) formed on the package 1. Are electrically connected to each other through a wire 4. Reference numeral 5 denotes a cover adhered to the upper surface of the package 1, which shields the housing recess 3 from the outside to form a closed space, and is made of, for example, glass. Reference numeral 6 denotes a lens, which comprises a lens portion 7 and a support portion 8 for supporting the lens portion. The positional relationship is maintained, and the subject can be imaged on the imaging surface of the solid-state imaging device 2 by the lens unit 7. The fixing of the support portion 8 to the package 1 may be performed by using an adhesive, or by using a screw or a method of providing a hook-shaped engaging portion and engaging it. There is also.

[0003]

In the conventional optical device shown in FIG. 3, it is necessary to attach the lens 6 after the solid-state image pickup device 2 in the storage recess 3 is sealed by the cover 5, and the operation is troublesome. There was a problem.

The conventional optical device includes a lens 6.
Is outside the cover 5, the distance (focal length) of the lens unit 7 from the solid-state imaging device 2 is larger than the distance of the cover 5 from the solid-state imaging device 2 (for example, 0.5 to 1.0 m).
m), which is a constraint on the design of the optical device, and has a problem of hindering downsizing of the optical device. On the other hand, if the structure without the cover 5 is used, moisture penetrates into the storage recess 3 and the solid-state imaging device 2 is deteriorated. Therefore, a cover is necessary, and it is necessary to maintain better airtightness. Is preferably made of glass.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem. A package for holding at least the optical element from the outside is provided on a package holding the optical element, and the cover is provided on an image forming surface of the optical element. In an optical device provided with a lens that forms an image of an external subject, the design restrictions and the miniaturization restrictions on the focal length of the optical device can be reduced without reducing the airtightness of the storage space of the optical element stored in the package. It is another object of the present invention to reduce the number of assembling steps of an optical device.

[0006]

According to the first aspect of the present invention, there is provided an optical device comprising:
It is characterized in that the cover and the lens are integrated. Therefore, according to the optical device of the first aspect, since the cover and the lens are integrated, the distance between the lens and the optical element becomes the distance between the cover and the optical element as it is, and the setting of the distance between the lens and the optical element is changed. Also, there is no possibility that the position of the lens is restricted to the outside by the presence of the cover, and the miniaturization of the optical device is not hindered.

Since the cover and the lens are integrated, the step of attaching the cover and the step of attaching the lens to the assembly of the optical device are not required separately, and the cover and the lens are attached to the package in one step. Accordingly, the number of assembling steps of the optical device can be reduced.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The optical device of the present invention basically has
The cover and the lens are integrated, and the cover may be made of resin, but glass is more preferable. I mean,
This is because glass can improve airtightness.
When forming a cover with glass, a plate glass is prepared and polished to a predetermined size as is usually done. The lens may be made of glass or resin, but plastic is preferable because it is easy to form a curved surface necessary for having a lens function. The integration of the cover and the lens can be performed, for example, by bonding the flat surface of a lens having one flat surface and another curved surface to at least one surface of a plate-shaped cover. With this configuration, the airtightness of the optical element storage space can be maintained by the glass cover, and the image of the subject can be formed by the lens adhered to one or both surfaces thereof.

The package may be formed of resin or ceramic, and the material is not particularly limited.
It can be said that ceramic is more preferable in terms of airtightness. The optical element housed in the package is a CCD solid-state image sensor,
Any type of optical element may be used, such as a solid-state imaging device such as a MOS solid-state imaging device or an amplification-type solid-state imaging device, or a filter.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the illustrated embodiments. FIG. 1 is a sectional view showing a first embodiment of the optical apparatus of the present invention. In the figure, reference numeral 1 denotes a package, and 2 denotes, for example, a CCD type solid-state imaging device bonded on the inner bottom surface of a storage recess 3 of the package 1, and each electrode thereof is an inner end of a wiring film (not shown) formed on the package 1. Wire 4
Are electrically connected via

Reference numeral 11 denotes an integrated lens and cover member adhered to the upper surface of the package 1. The housing concave portion 3 is shielded from the outside to form a closed space, and an object is imaged by a solid-state image sensor (2) described later. Fig. 2
(A) and (B), as shown in FIG.
The lenses 10 and 10 made of a resin are adhered to both surfaces of the substrate to be integrated. The bonding for the integration is performed using, for example, an ultraviolet-curable adhesive. The lens 10, 1
Numeral 0 plays a role in imaging an object on the imaging surface of the solid-state imaging device 2. Note that the lens 10 may be provided on only one surface of the cover 9.

According to such an optical device, since the cover 9 and the lenses 10 and 10 are integrated, there is no possibility that the setting of the distance between the lens and the solid-state image sensor 2 is restricted by the presence of the cover. The existence of the cover restricts the position of the lens to be located outside the lens, which hinders miniaturization of the optical device.

Since the cover 9 and the lenses 10 and 10 are integrated, the solid-state imaging device 2 is housed in the housing recess 3 after the lens and cover integrated member 11 are integrated in advance and the wire bonding is completed. By bonding the lens and cover integrated member 11 to the package 1,
The cover and the lens can be assembled at the same time in one step, and the step of attaching the cover and the step of attaching the lens for assembling the optical device are not required separately. Therefore, the number of assembling steps of the optical device can be reduced.

[0014]

According to the optical device of the first aspect, since the cover and the lens are integrated, the distance between the lens and the optical element is the distance between the cover and the solid-state image sensor, and the distance between the lens and the solid-state image sensor is changed. There is no possibility that the setting of the distance is restricted by the presence of the cover, and there is no possibility that the position of the lens is restricted to the outside thereof by the presence of the cover, and the miniaturization of the optical device is not hindered.

According to the optical device of the second aspect, the cover is made of plate-like glass, and the lens is made of a resin whose one main surface is curved and the other main surface is flat, Since the lens is fixed to both main surfaces with flat surfaces, the lens and cover integrated member can be manufactured by a relatively simple operation of bonding the flat surface of the lens to the flat surface of glass.

[Brief description of the drawings]

FIG. 1 is a sectional view showing one embodiment of the optical device of the present invention.

FIGS. 2A and 2B are cross-sectional views sequentially showing an example of a method of manufacturing a cover used in the above embodiment.

FIG. 3 is a cross-sectional view showing one conventional example of an optical device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Package, 2 ... Optical element, 3 ... Closed space, 9 ... Cover, 10 ... Lens, 11 ...
A lens and cover integrated member.

Claims (2)

[Claims]
1. An optical apparatus comprising: a package for holding an optical element; and a cover for shielding at least the optical element from the outside, and a lens for imaging an object outside the cover on an image forming surface of the optical element. An optical device comprising a lens and an integrated lens.
2. The cover is made of a plate-like glass, and the lens is made of a resin whose one main surface is curved and the other main surface is flat, and one or a portion of the cover through which light from a subject passes. 2. The optical device according to claim 1, wherein said lenses are fixed to both main surfaces by flat surfaces.
JP10138220A 1998-05-20 1998-05-20 Optical device Pending JPH11330442A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10138220A JPH11330442A (en) 1998-05-20 1998-05-20 Optical device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10138220A JPH11330442A (en) 1998-05-20 1998-05-20 Optical device

Publications (1)

Publication Number Publication Date
JPH11330442A true JPH11330442A (en) 1999-11-30

Family

ID=15216906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10138220A Pending JPH11330442A (en) 1998-05-20 1998-05-20 Optical device

Country Status (1)

Country Link
JP (1) JPH11330442A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010056292A (en) * 2008-08-28 2010-03-11 Oki Semiconductor Co Ltd Camera module and its manufacturing method
JP2011507219A (en) * 2007-11-27 2011-03-03 ヘプタゴン・オサケ・ユキチュアHeptagon Oy Sealed lens stack
WO2019131488A1 (en) * 2017-12-28 2019-07-04 ソニーセミコンダクタソリューションズ株式会社 Camera package, camera package production method, and electronic device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011507219A (en) * 2007-11-27 2011-03-03 ヘプタゴン・オサケ・ユキチュアHeptagon Oy Sealed lens stack
JP2010056292A (en) * 2008-08-28 2010-03-11 Oki Semiconductor Co Ltd Camera module and its manufacturing method
WO2019131488A1 (en) * 2017-12-28 2019-07-04 ソニーセミコンダクタソリューションズ株式会社 Camera package, camera package production method, and electronic device

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