JPH11275407A - Camera - Google Patents

Abstract

PROBLEM TO BE SOLVED: To densify the arrangement of electronic parts while effectively utilizing the surface of a substrate and eliminating adverse influences caused by congestion between the electronic parts by attaching a lens for forming a subject image with light from a window on a cover. SOLUTION: A cover 4 for shielding respective solid-state imaging device 2 and electronic chip components 3, 3... on the surface of a ceramic substrate 1 from the others is composed of a resin, for example, and formed with a window 5 on its upper part and the window 5 is sealed with a sealing board 6 composed of glass or transparent resin, for example. Besides, a lens holder (lens attaching part) 7 is fixed on the rear side at the upper part of the cover 4 while being hung down, and the lens holder 7 is formed integrally with an image forming lens 8. An organic solvent, for example, is used for that fixture. Further, the cover 4 is attached and fixed to the ceramic substrate 1 so as to shield its surface from the others. Concerning such a camera, such the phenomenon is avoided that the area on the surface of the ceramic substrate 1 is occupied by attaching the lens 8.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a camera, in particular, a wiring film is formed on at least one surface of a substrate, and a plurality of electronic components including an image pickup device are provided on the surface. The present invention relates to a camera having a window having a light-transmitting window, a cover for shielding the surface from the others, and a lens for forming a subject image by the light passing through the window.

[0002]

2. Description of the Related Art As cameras using an image pickup device such as a CCD solid-state image pickup device as an image pickup means are increasing, it can be said that one of the causes of an increase in demand for such a camera can be downsized. No. Accordingly, there is an ever-increasing demand for miniaturization of manufacturers of such types of cameras.

A conventional small camera using an image pickup device as an image pickup means generally has a solid-state image pickup device and a plurality of chip parts mounted on a ceramic substrate having a wiring film formed on the surface thereof, and further, the ceramic substrate A lens for forming an image on the imaging surface of the solid-state imaging device is mounted thereon via a mounting member, a cover is mounted on the ceramic substrate, and the cover mounts the surface of the ceramic substrate on which the solid-state imaging device, chip components, and the like are mounted. It has a configuration that is shielded from others, and a window for transmitting light from a subject is formed in the cover, and this window is closed by a transparent plate made of, for example, glass or resin.

[0004]

[0006] By the way, the demand for miniaturization of cameras is increasing. However, according to the conventional camera described above, since the lens is mounted on the surface of the ceramic substrate via the mounting member, the bonding portion of the mounting member to the ceramic substrate occupies the surface of the substrate. Hinders the mounting of chip components to the Therefore, the integration is restricted, and there is a limit to miniaturization.

[0005] In particular, since there is a possibility of adverse effects due to radiation between electronic components, it is necessary to consider the arrangement so as to reduce such adverse effects. Is quite difficult.

An organic solvent is generally used for bonding the lens mounting member to the ceramic substrate. However, when heat is generated by the operation of the solid-state imaging device or chip components by using a camera, the organic solvent is removed. There is also a problem that the lens expands due to heat, and as a result, the lens position may be slightly shifted.

The present invention has been made in order to solve such a problem. A wiring film is formed on at least one surface of a substrate, and a plurality of electronic components including an image pickup device are provided on the surface. A camera having a window having a window through which light from the outside is provided on the surface of the substrate and a cover for shielding the surface from others, and a lens having a lens for forming a subject image by the light passing through the window, is miniaturized and highly integrated. One purpose is to make
Another object of the present invention is to eliminate the risk that the adhesive expands due to heat generated during the operation of a solid-state imaging device, a chip component, or the like, causing the lens position to shift.

[0008]

According to a first aspect of the present invention, there is provided a camera wherein a lens is attached to a cover.

Therefore, according to the camera of the first aspect, since the area on the substrate is not occupied for mounting the lens, the surface of the substrate is used more effectively, and the arrangement of the electronic components is less affected by radiation between the electronic components. It is possible to increase the density while avoiding it.

Further, since the lens is attached to the cover, the heat generated during operation of the electronic components on the substrate is less likely to be transmitted to the adhesion portion of the lens to the cover. Almost no thermal expansion occurs.
Therefore, it is difficult for the lens to shift due to the thermal expansion of the organic solvent.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In a camera according to the present invention, a wiring film is formed on at least one surface of a substrate, a plurality of electronic components including an image pickup device are provided on the surface, and light from outside is provided on the surface of the substrate. A camera having a window having a window through which the light passes through the window and a lens that forms a subject image by light passing through the window. The substrate is made of, for example, ceramic, but a material using another material, for example, resin may be used. The imaging device may be a CCD type, an amplification type, or a MOS type as long as it is a solid-state imaging device, and is not necessarily an area sensor, and may be a linear sensor. .

Electronic components mounted on the surface of the substrate include chip components such as a transistor, an IC chip, a capacitor, and a resistor in addition to the image pickup device. The lens may be formed of glass or a transparent or translucent resin, and may be a spherical lens or an aspherical lens. The cover is preferably made of, for example, resin. For mounting the lens on the cover, for example, a lens mounting portion is suspended from the back side of the upper portion of the cover, and the lens mounting portion is attached to the lens mounting portion, or the side end surface of the flat lens mounting portion is bonded to the inner surface of the cover. Then, there are various attachment forms such as a form in which a lens is attached to the lens attachment portion.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the illustrated embodiments. 1A to 1D show a first embodiment of the camera of the present invention, wherein FIG. 1A is a sectional view of a cover, and FIG.
Is a perspective view of a cover, (C) is a perspective view of a substrate, and (D) is a perspective view showing an appearance of a camera.

In the drawings, reference numeral 1 denotes a ceramic substrate on which a wiring film (not shown) is formed. 2
Is a solid-state imaging device provided on the surface of the ceramic substrate 1,
Reference numerals 3, 3,... Denote electronic chip components provided on the surface of the ceramic substrate 1.

Reference numeral 4 denotes a cover for shielding the solid-state imaging device 2, the electronic chip components 3, 3,... From the surface of the ceramic substrate 1 from others, and is made of, for example, a resin. The window 5 is sealed with a sealing plate 6 made of, for example, glass or transparent resin. Reference numeral 7 denotes a lens holder (lens mounting portion), which is fixed to the upper back surface of the cover 4 in a suspended manner, and the lens holder 7 is formed integrally with the imaging lens 8. An organic solvent is used for the fixation, for example.

As shown in FIG. 1D, the cover 4 is attached and fixed to the ceramic substrate 1 so as to shield the surface from the other.

According to such a camera, since the area on the surface of the ceramic substrate 1 for mounting the lens 8 is not occupied, the surface of the ceramic substrate 1 is used more effectively, and the solid-state imaging device 2, the electronic chip component 3, .. Can be increased in density without disturbing radiation between the solid-state imaging device 2 and the electronic chip components 3, 3,.

Since the lens 8 is attached to the cover 4, the heat generated when the solid-state imaging device 2, the electronic chip components 3, 3,... And the thermal expansion of the organic solvent for bonding hardly occurs. Therefore, the lens holder 7 formed integrally with the lens 8 due to the thermal expansion of the organic solvent is unlikely to shift, and the conventional problem of lens shift can be avoided.

FIGS. 2A and 2B show the second embodiment of the camera of the present invention.
(A) is a cross-sectional view,
(B) is a perspective view. The cover 4 of the present embodiment is formed by fixing the side end surface of a flat lens holder 7 integrally formed with the lens 8 to the inner surface thereof with a stopper 9 and bonding the same with an organic solvent. There is no difference from the example in other respects, and the effect achieved in the first embodiment can also be achieved in the present embodiment.

[0020]

According to the camera of the first aspect, since the area on the substrate is not occupied for mounting the lens, the surface of the substrate is used more effectively, and the arrangement of the electronic components is less affected by radiation between the electronic components. It is possible to increase the density while eliminating the occurrence.

Further, since the lens is attached to the cover, the heat generated during the operation of the electronic components on the substrate is less likely to be transmitted to the bonding portion of the lens to the cover. Almost no thermal expansion occurs.
Therefore, it is difficult for the lens to shift due to the thermal expansion of the organic solvent.

[Brief description of the drawings]

FIGS. 1A to 1D show a first embodiment of the camera of the present invention, in which FIG. 1A is a cross-sectional view of a cover, FIG. 1B is a perspective view of the cover, and FIG. FIG. 3D is a perspective view showing the appearance of the camera.

FIGS. 2A and 2B show a cover of a second embodiment of the camera of the present invention, wherein FIG. 2A is a sectional view and FIG. 2B is a perspective view.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... board | substrate, 2 ... solid-state image sensor, 3 ... electronic components, 4 ... cover, 5 ... window, 8 ... lens.

Claims (1)

[Claims] 1. A wiring film is formed on at least one surface of a substrate, a plurality of electronic components including an imaging element are provided on the surface, and the surface of the substrate has a window through which light from the outside passes. A camera that has a cover that shields the light from the other, and has a lens that forms a subject image by light passing through the window, wherein the lens that forms a subject image by light from the window is attached to the cover. A camera characterized in that: