JP2000164803A - Semiconductor device and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent generation of stresses from resin sealing material in a package, which is formed in a state in which an element disliking stress and scattering of incident light is electrically connected with an ordinary semiconductor element. SOLUTION: On an island 16, an insulating substrate 10 is formed, on which a first semiconductor element 14 and a second semiconductor element 15 are fixed. A second resin sealing material 22 is spread on the second semiconductor element 15. In this state, the substrate is set in metallic molds K1, K2. A second resin sealing material is made to abut against the metal mold K1, and a first resin sealing material 23 is injected. As a result, two resin sealing parts are formed in the same plane.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device in which a plurality of semiconductor elements are arranged in an island in a plane.

[0002]

2. Description of the Related Art In recent years, a mold type semiconductor device has become highly functional, and a device in which a plurality of semiconductor devices are integrated into one package has been developed.

As this technique, for example, Japanese Patent Laid-Open No. 5-121 is disclosed.
There is a conventional example of JP-A-645-645. The first semiconductor element 1 and the second semiconductor element 2 are fixed to one island 3 as shown in FIG. The tips of the bonding pads 4 and 5 and the leads 6 of the first and second semiconductor elements 1 and 2 are realized by fine metal wires 7, and the whole is sealed with resin. In the connection between the first semiconductor element 1 and the second semiconductor element, the bonding pads 7 and 8 are connected by a thin metal wire 9.

[0004]

However, in the first semiconductor element and the second semiconductor element, the second semiconductor element is a light emitting element such as a light emitting diode or a semiconductor laser, a photodiode or an optical IC, or the like. In the case of a magnetic sensor, a surface acoustic wave device or an optical writing type memory device, it is actually difficult to mold them together,
Molded individually.

[0005] IC cards, tags, transmitting / receiving modules using light, etc., use a plurality of semiconductor elements and passive elements such as chip resistors. However, in reality, the stress of resin is used. The reality was that molded discretes were mounted on the printed circuit board.

Therefore, there is a problem that an inexpensive module cannot be provided.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has been made in consideration of the above-mentioned problems. The device is covered with a first resin sealing portion that seals substantially the entire area, and the second semiconductor element is covered with a second resin sealing portion having a different material from the first resin sealing portion. This problem is solved by exposing the second resin sealing portion from the first resin sealing portion and forming the surface of the second resin sealing portion on the same plane as the first resin sealing portion.

For example, a general resin sealing member is mixed with a filler for the purpose of relaxing the stress of the resin. However, this filler is unnecessary for an optical element. However, when sealing is performed with a filler having a reduced or no filler mixing rate, resin stress is generated, which causes a change in characteristics and a chip itself. However, the present invention
Partial potting is performed, and this potting resin is brought into contact with a mold and molded with a sealing member containing a filler, so that an optical element can efficiently receive and emit light, and the other elements include the filler containing the filler. With the resin sealing member described above, it is possible to prevent the characteristic change and chipping of the element.

Another object is to solve the problem by fixing the second semiconductor element to the back surface of the island.

[0010] By mounting on the back surface, stress generated due to a difference in thermal expansion coefficient between the first resin sealing member and the second resin sealing member is not directly applied to the island surface.

The second resin sealing portion can be solved by using a silicone resin or a transparent resin. The former is suitable for a magnetic sensor which is weak against stress, and the latter is suitable for an optical element.

Further, a sealing resin having a predetermined viscosity for sealing the second semiconductor element, the second thin metal wire, and the second lead to which the second thin metal wire is connected is provided, and the lead frame is formed. This problem can be solved by disposing the sealing resin in a mold, and sealing with a resin different from the sealing resin in a state where the sealing resin is in contact with the mold.

A light emitting element, a magnetic sensor, and the like require flatness on the surface of a resin for sealing them, and a potted fluid resin is brought into contact with a mold, and is formed on the contact surface. By sealing with another resin while maintaining a flat surface, both resin surfaces can be formed flat.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below in detail with reference to FIG.

First, there is an insulating substrate 10 on which a Cu foil pattern is formed by an adhesive or the like. This pattern includes lands 11 on which semiconductor elements are mounted, wiring for forming a circuit, bonding pads 12 formed at the ends of the wiring, electrodes 13 for fixing chip capacitors and the like with a brazing material, and the like. Become.

Although the above-described insulating substrate 10 employs a printed substrate here, it may be a flexible sheet, a glass substrate, a ceramic substrate, or the like.

In this pattern, the first semiconductor element 1
4. The second semiconductor element 15, the passive element RC such as a chip capacitor and a chip resistor are fixed, and the brazing material or the thin metal wire W is fixed.
Are electrically connected.

A lead frame mainly composed of Cu is prepared, and the insulating substrate 10 is fixed to an island 16 which is a component of the lead frame. And
The first lead 18 and, for example, the pad 12 are thin metal wires 19.
Thus, the second lead 20 and the second semiconductor element 15 are connected by a thin metal wire 21.

Further, the second semiconductor element 15 is potted with a second resin sealing member 22 made of a transparent epoxy resin, silicone resin, or the like, and the entire first semiconductor element 15 is potted.
3 is sealed.

A feature of the present invention resides in that substantially the entirety is sealed by the first resin sealing portion 23 and that the second semiconductor element 15 is sealed by the second resin sealing portion 22.

In the case where the first semiconductor element 15 is an optical element, the second resin sealing portion is made of a transparent epoxy resin or the like, and is sealed with a mold described later. Together with the stop 23, it is formed stubbornly. Since the filler mixing ratio of the second resin sealing member is smaller than that of the first resin sealing member or does not enter at all, the stress generated in the resin increases, but substantially only the first semiconductor element is sealed. Therefore, the influence on other elements is suppressed.

When the first semiconductor element is a magnetic sensor or the like, the first semiconductor element is covered with a low-stress silicone resin, and is also formed with ease.

Therefore, the surface shape as a product, the flatness of the surface required for an optical element or a magnetic sensor can be maintained, the optical element can emit and receive light satisfactorily, and the magnetic sensor has a good distance from its detection medium. Can be kept constant.

FIG. 2 shows a second embodiment. this is,
The second semiconductor element 15 is moved from the front surface of the island 16 to the back surface, and an insulating material is formed between the two because it is temporarily required to be insulated. Again, the first resin sealing portion 2
The third and second resin sealing portions 22 are formed in a smooth manner.

Next, a third embodiment will be described with reference to FIG. In the present embodiment, the insulating substrate 10 is omitted. The present invention utilizes a lead instead of the Cu pattern on the insulating substrate 10.

Since the insulating substrate 10 has a thickness,
Although the semiconductor device has a large thickness, it has a feature that the thickness can be reduced because the passive element RC is connected to the lead.

A brief description will now be given. A first semiconductor element 14 and a second semiconductor element 15 are mounted on the island 16. Around the second semiconductor element 15,
A resin stopper 30 is formed of the line-shaped resin 30, and the second resin sealing member 22 is applied here.
A chip capacitor, a chip resistor, and the like, which are passive elements RC, are electrically connected and fixed between the leads with a brazing material. For example, a predetermined circuit function is configured in the sealing member. A predetermined circuit function may be realized by attaching an external component to a lead derived from the sealing member.

Further, similarly to the first and second embodiments, a first resin sealing portion 23 and a second resin sealing portion 22 are formed.

In all embodiments, for example, if an optical IC module, IrDA or the like is applied, since these have few passive elements, they can be integrated together to reduce the cost, and a set using this can be assembled. Work can be simplified.

When employed in a tag or the like, it is possible to commercialize the product simply by externally attaching only the coil to a lead led out.

Next, the manner in which the second resin sealing portion 22 and the first resin sealing portion 23 are connected will be briefly described. Here, a description will be given using the first embodiment of FIG. Further, the second and third embodiments are formed by substantially the same method, and thus the description is omitted. However, another embodiment is substantially the same. First, as shown in FIG. 4, the insulating substrate 10 on which the semiconductor elements 14, 15 and the passive element RC are mounted is mounted.
After connecting the fine metal wires, the insulating substrate is fixed to the island 16 of the lead frame, and the second resin sealing member is potted. This resin has a viscosity that does not flow around and maintains a certain height at which the resin can abut the mold K1 or K2.

Subsequently, the lead frame is connected to a mold K1,
The first resin sealing member is poured into K2. As a matter of course, in the structure shown in FIG.
The second resin sealing member 22 may be potted after being incorporated in a mold.

Here, the second resin sealing member is an upper mold K1.
Therefore, the same surface as the first resin sealing portion 23 can be formed.

Here, it is preferable that the second resin sealing member is cured by the heat of the mold before injecting the first resin sealing member 23. This is because the second resin sealing member may be deformed by the injection pressure. In addition, as shown in FIGS. 1 and 2, a relatively large-sized substrate employing an insulating substrate, or a large island without employing an insulating substrate (when the structure shown in FIG. 3 is arranged in a mold) is used. After contacting the mold, it is necessary to provide a means for supporting the back surface of the island 16. This is because there is a problem that a resin leak occurs due to a resin pressure at the time of injection and a semiconductor element on the island is chipped due to the vertical fluctuation of the island.

If the viscosity and the amount of protrusion are controlled by using the dam 30 as shown in FIG. 3, the area of the second resin sealing portion exposed from the first resin sealing portion can be controlled.

That is, in the optical element, the second resin sealing portion 22
Thus, there is an advantage that a transparent window having a fixed area can be realized.

As can be said in all the embodiments,
Fine metal wire 21 connecting second semiconductor element and lead 20
Should be covered with the second resin sealing portion. in this case,
It is preferable to adjust the clearance between the island 16 and the lead 20 so that the potting resin does not flow through the gap. That is, for example, if the gap is set to about 0.2 to 0.1 mm, the potting resin does not flow down from this gap, so that the resin amount can be kept constant and the exposed area can be accurately controlled.

[0038]

As described above, according to the present invention,
Normal semiconductor devices and special semiconductor devices (such as optical devices,
Magnetic sensor etc.) can be integrally molded. In particular, when molding with a mold, since the first resin sealing member is injected after the second resin sealing member is brought into contact with the mold, the exposed surface of the second resin sealing portion is fixed to the first resin sealing member. It can be made with resin sealing part.

Further, since full molding using an insulating substrate and full molding in which passive elements are fixed to leads are possible, they are suitable as components of optical modules, tags, IC cards and the like.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a semiconductor device illustrating a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of a semiconductor device illustrating a second embodiment of the present invention.

FIG. 3 is a cross-sectional view of a semiconductor device illustrating a third embodiment of the present invention.

FIG. 4 is a diagram illustrating a method for manufacturing the semiconductor device.

FIG. 5 is a diagram illustrating a method for manufacturing the semiconductor device.

FIG. 6 is a plan view illustrating a conventional semiconductor device.

 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Hiroshi Inoguchi 2-5-5 Keihanhondori, Moriguchi-shi, Osaka Sanyo Electric Co., Ltd. F-term (reference) 4M109 AA01 BA01 CA04 CA21 EC04 EC11 FA06 GA01 GA02

Claims (7)

[Claims] An island; and a plurality of leads disposed outwardly from at least one side of the island;
An insulating substrate fixed to the island, a conductive pattern attached to the insulating substrate, and a plurality of bare chip semiconductor elements fixed to the insulating substrate and electrically connected to the conductive pattern; And a chip-shaped passive element fixed to the insulating substrate and electrically connected to the conductive pattern, and resin sealing for sealing the lead, the conductive pattern, the plurality of semiconductor elements, and the passive element. Wherein the first semiconductor element of the plurality of semiconductor elements is covered with a first resin sealing part that seals substantially the entire area, and the second semiconductor element is The first resin sealing portion is covered with a second resin sealing portion having a different material from that of the first resin sealing portion. The second resin sealing portion is exposed from the first resin sealing portion, and the surface thereof is the second resin sealing portion. Be made of the same surface as the resin sealing part A semiconductor device characterized by the following. 2. An island, and a plurality of leads disposed outward from at least one side of the island,
A plurality of bare chip-shaped semiconductor elements fixed to the island, a chip-shaped passive element fixed to the lead and electrically connected thereto, and the lead, the plurality of semiconductor elements and the passive element are sealed. A first semiconductor element among the plurality of semiconductor elements is covered with a first resin sealing part that seals substantially the entire area, and the second semiconductor element The element is covered with a second resin sealing portion made of a material different from that of the first resin sealing portion. The second resin sealing portion is exposed from the first resin sealing portion and has a surface. Is a semiconductor device comprising the same surface as the first resin sealing portion. 3. The semiconductor device according to claim 1, wherein said second semiconductor element is fixed to a back surface of said island. 4. The semiconductor device according to claim 1, wherein said second resin sealing portion is made of a silicone resin or a transparent resin. 5. The semiconductor device according to claim 4, wherein said second semiconductor element comprises a light receiving element or a light emitting element. 6. A plurality of semiconductor elements are mounted on an island constituting a lead frame or an insulating substrate mounted on the island, and a first semiconductor element among the semiconductor elements and a first semiconductor constituting the lead frame. 1 lead, a second semiconductor element among the semiconductor elements, and a second
Are connected by a first thin metal wire and a second thin metal wire, and the second semiconductor element, the second thin metal wire, and the second lead to which the second thin metal wire is connected are sealed. A sealing resin having a predetermined viscosity is provided, the lead frame is arranged in a mold, and the sealing resin is sealed with a resin different from the sealing resin in a state where the sealing resin is in contact with the mold. A method for manufacturing a semiconductor device, comprising: 7. The method according to claim 6, wherein the sealing resin is provided after the lead frame is arranged in a mold.