JP3378816B2 - Semiconductor device and manufacturing method thereof - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device having a plurality of semiconductor elements arranged in a plane in an island.

[0002]

2. Description of the Related Art In recent years, mold type semiconductor elements have become highly functional, and a package of a plurality of semiconductor elements has been developed.

As this technique, for example, Japanese Patent Laid-Open No. 5-121
There is a conventional example of Japanese Patent No. 645. In this, as shown in FIG. 8, the first semiconductor element 1 and the second semiconductor element 2 are fixed to one island 3. The tips of the bonding pads 4 and 5 and the leads 6 of the first and second semiconductor elements 1 and 2 are realized by thin metal wires 7, and the whole is sealed with resin. The connection between the first semiconductor element 1 and the second semiconductor element 2 is made by connecting the bonding pads 7 and 8 with a thin metal wire 9.

[0004]

However, in the first semiconductor element and the second semiconductor element, the second semiconductor element is, for example, a light emitting element such as a light emitting diode or a semiconductor laser, a photodiode or an optical IC, In the case of being composed of a magnetic sensor, a surface acoustic wave device, an optical writing type memory device, or the like, it is actually difficult to mold them with the same material, and they are individually molded.

Further, IC cards, tags, transmitting / receiving modules using light use a plurality of semiconductor elements and passive elements such as chip resistors, but in reality, resin stress, and in the case of optical elements, they are covered with a light-transmissive resin. In reality, it was necessary to mount a molded discrete on the printed circuit board.

Therefore, there is a problem that an inexpensive module cannot be provided.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and in the case of using an insulating substrate,
The island and the first lead arranged in the lower layer of the second semiconductor element have a space such that the second resin sealing member for sealing the second semiconductor element can be arranged before curing, and The second resin sealing portion is to solve the problem by also covering the thin metal wire.

When a part of the thin metal wire connecting the second semiconductor element and the first lead is covered with the first resin, a disconnection occurs due to a difference in thermal expansion coefficient between the two resin sealing members. . However, if the clearance between the island and the lead is adjusted, the second semiconductor element and the entire metal thin wire connecting the lead and the second semiconductor element can be sealed.

Further, the problem is solved by providing the island with a recess toward the second semiconductor element and extending the first lead in the recess.

If a recess is provided in the island and the first lead is inserted therein, the second resin sealing part can be placed only on the island corresponding to the first lead and the recess.
Therefore, it is not necessary to make the clearance between the other lead and the first lead adjacent to each other equal, and the lead can be widened, so that the withstand voltage characteristic of the other lead is not affected.

Further, the second resin encapsulation part is exposed from the first resin encapsulation part, and the exposed surface and the first resin encapsulation part are made to be the same surface.

In a general resin sealing member, a filler is mixed for the purpose of stress relaxation of the resin. However, this filler is unnecessary for the optical element. However,
If sealing is performed with a filler with a low mixing rate or without a filler, resin stress will be generated this time, resulting in fluctuations in characteristics and chipping. However, according to the present invention, the potting resin is partially potted, and the potting resin is brought into contact with the mold and is molded with the sealing member containing the filler. Therefore, the optical element can efficiently receive and emit light, and other elements Is
With the resin-sealing member containing the filler, it is possible to prevent characteristic changes and chipping of the element. In addition, since the first resin encapsulation portion and the second resin encapsulation portion can be formed on the same surface if they are formed by a mold described later, when the optical element is adopted as the second semiconductor element, High precision injection. Further, when the magnetic sensor is adopted, the distance from the object to be detected can also be maintained with high accuracy, which has the advantage of maintaining the detection accuracy.

In the case where only the lead frame is adopted, the island and the first lead arranged in the lower layer of the second semiconductor element are sealed with the second resin for sealing the second semiconductor element. The problem is solved by providing a space that allows the material of the parts to be arranged between them before curing, and by covering the thin metal wire in the second resin sealing part.

When a part of the thin metal wire connecting the second semiconductor element and the first lead is covered with the first resin, a disconnection occurs due to a difference in thermal expansion coefficient between the two resin sealing members. . However, if the clearance between the island and the lead is adjusted, the second semiconductor element and the entire metal thin wire connecting the lead and the second semiconductor element can be sealed.

Another solution is to fix a chip-shaped passive element between the leads.

Instead of using an insulating substrate, a passive element is attached between the leads so that a simple circuit can be integrally formed.

Further, the island has a recessed portion toward the second semiconductor element, and is solved by extending the first lead in the recessed portion.

If the island is provided with a recess and the first lead is inserted therein, the second resin sealing part can be placed only on the island corresponding to the first lead and the recess.
Therefore, it is not necessary to make the clearance between the other lead and the first lead adjacent to each other equal, and the lead can be widened, so that the withstand voltage characteristic of the other lead is not affected.

Furthermore, if the clearance between the first lead and the island is prepared in advance with a predetermined interval, the second resin sealing member does not drip and the height of the second resin sealing portion is high. , The exposed area can be kept constant. In addition, the second resin sealing member does not fall into the mold. Therefore, the resin sealing portion that has fallen onto the surface of the finished product will not be formed as a lump.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION A first embodiment of the present invention will be described in detail below with reference to FIG.

First, there is an insulating substrate 10, on which a Cu foil pattern is formed with an adhesive or the like. This pattern is composed of a land 11 on which a semiconductor element is mounted, a wiring for forming a circuit, a bonding pad 12 formed at an end of this wiring, an electrode 13 for fixing a chip capacitor or the like with a brazing material, and the like. Become.

Although a printed circuit board is used as the insulating substrate 10 described above, a flexible sheet, a glass substrate, a ceramic substrate or the like may be used.

In this pattern, the first semiconductor element 1
4, the second semiconductor element 15, the passive element RC such as the chip capacitor and the chip resistor is fixed, and the brazing material or the thin metal wire W
It is electrically connected with.

A lead frame mainly made of Cu is prepared, and the insulating substrate 10 is fixed to the island 16 which is a constituent element of the lead frame. And
The first lead 18 and the second semiconductor element 15 are the thin metal wires 1
It is connected through 9.

The second lead 20 and the pad 12, for example,
Are connected by a thin metal wire 21.

Further, the second semiconductor element 15 is potted with a second resin sealing member 22 such as a transparent epoxy resin or silicone resin, so that the entire first resin sealing member 2 is formed.
It is sealed with 3.

A feature of the present invention is that the first resin encapsulation portion 23 substantially encapsulates the entire structure and the second semiconductor element 15 is encapsulated by the second resin encapsulation portion 22.

When the first semiconductor element 15 is an optical element, the second resin sealing portion is made of a transparent epoxy resin or the like, and is sealed with a mold described later, so that the first resin sealing portion is used. It is formed together with the stop 23. Since the filler mixing ratio of the second resin sealing member is smaller than that of the first resin sealing member or does not exist at all, the stress generated in the resin is large, but substantially only the first semiconductor element is sealed. Therefore, the influence on other elements is suppressed.

When the first semiconductor element is a magnetic sensor or the like, the first semiconductor element is covered with a silicone resin having a low stress, and is also formed with a flat surface.

Therefore, the surface shape as a product and the flatness of the surface required for the optical element and the magnetic sensor can be maintained, the optical element can satisfactorily emit and receive light, and the magnetic sensor can be spaced from the detection medium. Can be kept constant.

Further, the second resin encapsulation portion needs to completely cover not only the second semiconductor element but also the first thin metal wire 19. For example, the metal thin wire 19 on the second semiconductor element 15 side is a second resin sealing portion, and when the metal thin wire 19 on the first lead 18 side is covered with the first resin sealing portion 23, the coefficient of thermal expansion is increased. Disconnection occurs due to the difference in

Therefore, the second resin sealing portion 22 must cover the entire thin metal wire 19 including the connecting portion of the first lead 18. In FIG. 1, the thin metal wire 19 on the right side of the second semiconductor element 15 is on the insulating substrate 10 and is therefore easy to cover, but the thin metal wire on the left side is
There is a gap between the island and the lead, which causes a problem.

According to the present invention, the gap is calculated in advance and the second resin sealing member is set so as not to drop. The second resin sealing member has a certain viscosity and is potted with a dispenser or the like, as is clear from the manufacturing method described later. Therefore, before curing, it should be as fluid as possible and should not drip or fall below the lead.

In the present invention, at least the gap between the first lead 18 and the island 16 is formed narrow, and the resin does not flow out of this gap due to its viscosity and surface tension, so that the fine metal wire 19 can be completely covered. .

Reference numeral 24 is a fishing lead of the island, and 25 is a lead arranged next to the lead 18. These clearances also need to be narrowed depending on the application amount of the second resin sealing portion.

For example, the thickness of the island is 0.125 mm
Then, the clearance that can be punched by the press is 0.1
It is about mm. Therefore, preferably, the gap is 0.2 to 0.
It is necessary to adjust the resin sealing member to a viscosity that does not drop even about 1 mm.

Next, a second embodiment will be described with reference to FIG.

The uppermost drawing is the one in which the recessed portion HB is provided in FIG. The middle drawing is a cross-sectional view along the first lead, and the lower drawing is a cross-sectional view along the lead 25.

Since the structure is different only in the recess HB, only the description will be given here. That is, the first lead 1
8. Here, the recessed portion HB is provided in the island 16 and the insulating substrate 10 so that the portion of the first lead 18 to which the thin metal wire 19 is connected enters into the island. The gap between this portion and the island 16 is characterized in that the gap is set such that the second resin sealing member does not drop before curing.

That is, in FIG. 1, the clearance is also required for the first lead and other adjacent leads.
In the present embodiment, the first lead 18 and the island 16
Only need to narrow the clearance. In other words, other leads can be connected to ones having a high voltage due to the convenience of the circuit.

Further, if the dam 30 made of resin is surrounded by a thick black circle, when the second resin sealing member is potted, the flow is restrained, and it becomes possible to make complete contact with the mold, and It is possible to suppress the variation in the exposed area which comes into contact and is exposed from the first resin sealing portion.

Next, a third embodiment will be described with reference to FIG. In this embodiment, the insulating substrate 10 is omitted in the structure of FIG. In the present invention, the passive element RC is connected by utilizing the lead instead of the Cu pattern on the insulating substrate 10.

Since the insulating substrate 10 has a thickness,
Although the thickness of the packaged semiconductor device is large, the passive element RC is connected to the leads, so that the thickness can be reduced.

A brief description will be given below. The first semiconductor element 14 and the second semiconductor element 15 are mounted on the island 16. Around this second semiconductor element 15,
A line-shaped resin (dam) 30 forms a resin stopper, and the second resin sealing member 22 is applied thereto. A chip capacitor, a chip resistor, etc., which is a passive element RC, is electrically connected and fixed between the leads with a brazing material. Then, for example, a predetermined circuit function is configured in the sealing member. Further, a predetermined circuit function may be realized by attaching an external component to the lead led out from the sealing member.

Further, similar to the first and second embodiments, the first resin sealing portion 23 and the second resin sealing portion 22 are formed.

In all of the embodiments, if an optical IC module, IrDA, etc. are applied, since these have few passive elements, they can be integrated together, the cost can be reduced, and a set using this can be assembled. Can be simplified.

When it is adopted as a tag or the like, it can be commercialized only by externally attaching only the coil to the lead led out to the outside.

Further, FIG. 3 shows the recess H as in the structure of FIG.
B is provided, and potting can be performed without dropping the second resin sealing member by only considering the gap between the first lead 18 and the island 16 as described above.

In addition, a semiconductor element (for example, a diode) having a two-terminal structure can be connected between the leads.

Next, a fourth embodiment will be described with reference to FIGS.

This corresponds to the island 1 in the structure of FIG.
The semiconductor elements 14 and 15 are mounted on the front and back sides of 6, respectively. For example, it is effective when at least one dislikes radiation noise or dislikes making the IC substrate have the same potential.

In the latter case, either one of the semiconductor elements is insulated with an insulating sheet, an insulating adhesive or the like.

Here, the tab 30 is provided between one island surface and the first lead 18, and the second resin sealing portion is provided therein. In this case, since it is double-sided mounting, its size is smaller than that in FIG.

Next, a brief description will be given of how the second resin encapsulation portion 22 and the first resin encapsulation portion 23 are attached. Here, description will be given using the first embodiment of FIG. Also, the second and third embodiments are omitted because they are formed by substantially the same method.

First, as shown in FIG. 6, semiconductor elements 14 and 1
5. Prepare the insulating substrate 10 on which the passive element RC is mounted, connect the thin metal wires, fix the insulating substrate to the island 16 of the lead frame, and pot the second resin sealing member. This resin does not flow out,
It has a viscosity that can maintain a certain height at which it can contact the mold K1 or K2.

Subsequently, the lead frame is attached to the mold K1,
It is assembled in K2 and the first resin sealing member is poured. As a matter of course, in the structures shown in FIGS. 4 and 5, the side on which the second resin sealing portion is provided faces upward and is arranged in the mold. Further, the second resin sealing member 22 may be potted after being incorporated in a mold.

Here, the second resin sealing member is the upper mold K1.
Since it abuts against, it is possible to form the same surface as the first resin sealing portion 23.

Here, it is preferable that the second resin sealing member is cured by the heat of the mold before injecting the first resin sealing member 23. This is because the second resin sealing member may be deformed by the injection pressure. In addition, as shown in FIGS. 1 and 2, if the insulating substrate is used and the size is relatively large, or if the insulating substrate is not used and the island is large (when the structure of FIG. 3 is arranged in the mold), the It is necessary to provide a means for supporting the back surface of the island 16 after contacting the mold. This is because the up and down movement of the island may cause resin leakage due to the resin pressure at the time of injection or the semiconductor element on the island may be chipped.

If the viscosity and the amount of protrusion are controlled by using the dam 30 as shown in FIG. 3, the area of the second resin sealing portion exposed from the first resin sealing portion can be controlled.

That is, in the optical element, the second resin sealing portion 22
It also has the advantage that a transparent window with a certain area can be realized.

[0061]

As described above, according to the present invention,
Ordinary semiconductor devices and special semiconductor devices (eg optical devices,
Magnetic sensor etc.) can be integrally molded. In particular, when molding with a mold, the first resin sealing member is injected after the second resin sealing member is brought into contact with the mold, so that the exposed surface of the second resin sealing portion is formed into the first resin. It can be made as simple as a resin sealing part.

By setting the clearance between the first lead and the island, it is possible to prevent the second resin sealing member before curing from flowing out from the gap.

Furthermore, since full molding using an insulating substrate and full molding in which passive elements are fixed to the leads are possible, it is suitable as a component of an optical module, tag, IC card, or the like.

[Brief description of drawings]

FIG. 1 is a plan view of a semiconductor device illustrating a first embodiment of the present invention.

FIG. 2 is a diagram of a semiconductor device illustrating a second embodiment of the present invention.

FIG. 3 is a plan view of a semiconductor device illustrating a third embodiment of the present invention.

FIG. 4 is a plan view of a semiconductor device illustrating a fourth embodiment of the present invention.

FIG. 5 is a diagram illustrating the back surface of FIG.

FIG. 6 is a diagram illustrating the manufacturing method of the present semiconductor device.

FIG. 7 is a diagram illustrating the manufacturing method of the present semiconductor device.

FIG. 8 is a plan view for explaining a conventional semiconductor device.

─────────────────────────────────────────────────── ─── Continuation of front page (56) Bibliography 4-107844 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 23/29 H01L 23/31 H01L 25 / 04 H01L 25/18

Claims (4)

(57) [Claims] 1. An island, a plurality of leads arranged outward from the vicinity of at least one side of the island, an insulating substrate fixed to the island, and a conductive material attached to the insulating substrate. Pattern, a plurality of bare chip-shaped semiconductor elements fixed to the insulating substrate and electrically connected to the conductive pattern, and a chip fixed to the insulating substrate and electrically connected to the conductive pattern -Shaped passive element, the lead, the conductive pattern,
In a semiconductor device having a thin metal wire for electrically connecting the plurality of semiconductor elements or the passive element, and a resin sealing portion for sealing the lead, the plurality of semiconductor elements, the passive element and the thin metal wire. The first semiconductor element in the semiconductor element is covered with a first resin sealing portion that seals substantially the entire area, and the second semiconductor element in the semiconductor element is the second semiconductor element.
In the island having a recess toward the semiconductor element
It is fixed and extended in this recess and placed near it.
The first lead connected to the first semiconductor lead via a thin metal wire, and the island and the first lead arranged in the lower layer of the second semiconductor element are the second resin for sealing the second semiconductor element. A semiconductor device, wherein the material of the encapsulating portion has a space that can be arranged before curing, and the second resin encapsulating portion also covers the thin metal wire. 2. The second resin sealing portion is the first resin.
Exposed from the oil sealing portion, the exposed surface and the first resin sealing
The semiconductor device according to claim 1, wherein the parts form the same plane. 3. An island, a plurality of leads arranged outward from the vicinity of at least one side of the island, a plurality of bare chip-shaped semiconductor elements fixed to the island, and a resin seal for sealing the leads. In a semiconductor device having a stopper, the semiconductor element and the lead are sealed with a first resin sealing section that seals substantially the entire area, and a second semiconductor element in the semiconductor element is The second
In the island having a recess toward the semiconductor element
It is fixed and extended in this recess and placed near it.
The first lead connected to the first semiconductor chip and the first lead, which are connected to each other through a thin metal wire, are disposed in the lower layer of the second semiconductor element, and the first lead seals the second semiconductor element. A semiconductor device characterized in that the material of the resin-stopping portion has an interval that can be arranged therebetween before curing, and the second resin sealing portion also covers the thin metal wire. 4. The second resin sealing portion is exposed from the first resin sealing portion, and the exposed surface and the first resin sealing portion form the same surface. Semiconductor device.