JP2521106B2 - Optical writing head - Google Patents
Optical writing headInfo
- Publication number
- JP2521106B2 JP2521106B2 JP22000887A JP22000887A JP2521106B2 JP 2521106 B2 JP2521106 B2 JP 2521106B2 JP 22000887 A JP22000887 A JP 22000887A JP 22000887 A JP22000887 A JP 22000887A JP 2521106 B2 JP2521106 B2 JP 2521106B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- substrate
- led
- fiber bundle
- optical writing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
- B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Dot-Matrix Printers And Others (AREA)
- Exposure Or Original Feeding In Electrophotography (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、電子写真方式を用いたLEDプリンタ等に使
用される光書込みヘツドに関する。The present invention relates to an optical writing head used for an LED printer or the like using an electrophotographic method.
第3図に光書込みヘツドの一例としてのLEDアレーヘ
ツドを用いたLEDプリンタの概略説明図を示す。FIG. 3 shows a schematic explanatory view of an LED printer using an LED array head as an example of the optical writing head.
図において、1はその表面が光導電性材料からなる感
光ドラムで、図の矢印方向に回転する。このドラム1
は、帯電器2で均一に帯電され、次にLEDアレーヘツド
3により被記録画像情報に対応した露光を受け、これに
より静電潜像が形成される。この潜像は現像器4により
現像されトナー像が得られ、更にこのトナー像は転写器
5の作用下で転写紙6に転写される。そしてトナー像が
転写された転写紙6は定着器7に送られ、ここでトナー
像は紙6に定着される。一方転写後感光ドラム1はクリ
ーニング器8でクリーニングされ再使用される。In the figure, reference numeral 1 is a photosensitive drum whose surface is made of a photoconductive material, and rotates in the direction of the arrow in the figure. This drum 1
Are uniformly charged by the charger 2, and then the LED array head 3 receives an exposure corresponding to the recorded image information, whereby an electrostatic latent image is formed. This latent image is developed by the developing device 4 to obtain a toner image, and this toner image is transferred to the transfer paper 6 under the action of the transfer device 5. Then, the transfer paper 6 onto which the toner image is transferred is sent to the fixing device 7, where the toner image is fixed on the paper 6. On the other hand, after the transfer, the photosensitive drum 1 is cleaned by the cleaning device 8 and reused.
前記LEDアレーヘツド3は、後述するように多数のLED
(発光ダイオード)チツプを印字桁方向に配列したLED
素子列と、この素子列の各LED素子で発光された光を集
束して感光ドラム1上へ露光させる自己集束型ロツドレ
ンズアレーとを備えている。The LED array head 3 has a large number of LEDs as described later.
(Light emitting diode) LED with chips arranged in the print digit direction
An element array and a self-focusing rod lens array that focuses the light emitted by each LED element of the element array and exposes it onto the photosensitive drum 1 are provided.
上述のLEDプリンタに用いられる従来のLEDアレーヘツ
ド3にあつては、第4図に示すようにセラミツク基板21
上にLEDチツプ22をダイボンドし、各LED発光部に対する
通電のために各発光部に対応してワイヤーボンドを行な
うと共にこのLEDチツプ22に接続したボンデイングワイ
ヤーと、このLEDチツプ22を実装したセラミツク基板21
上の導体パターンを保護するためのカバーカラス26とを
アルミニウム等の放熱板23に取り付け、該放熱板に自己
集束型ロツドレンズアレー24の取付け部材25を支持し、
LEDアレーヘツドを構成していた。As shown in FIG. 4, the conventional LED array head 3 used in the above LED printer has a ceramic substrate 21.
LED chip 22 is die-bonded on top, wire bonding is performed corresponding to each light emitting part to energize each LED light emitting part, bonding wire connected to this LED chip 22 and ceramic board mounting this LED chip 22 twenty one
A cover crow 26 for protecting the upper conductor pattern is attached to a radiator plate 23 such as aluminum, and the mounting member 25 of the self-focusing type rod lens array 24 is supported on the radiator plate,
It constituted the LED array head.
上述したようなLEDアレーヘツドにあつてはLEDチツプ
をセラミツク基板上に実装するとき、その直線性等位置
決め精度は±10μm程度必要であり、チツプの幅が0.7
〜1mm程度、ダイボンデイング用パツドの幅が1.2〜1.5m
m程度とかなり大きいため、その位置決めはTVカメラ等
を使つた光学的な手法が不可欠であり、LEDチツプのダ
イボンデイングの効率が低下するばかりでなく、実装装
置は高価な物を使用する必要があつた。For the LED array head as described above, when mounting the LED chip on the ceramic board, the positioning accuracy such as linearity is required to be about ± 10 μm, and the width of the chip is 0.7.
~ 1 mm, width of pad for die bonding is 1.2 ~ 1.5 m
Since it is quite large (about m), the positioning requires an optical method using a TV camera, etc., which not only reduces the efficiency of die bonding of the LED chip, but also requires the use of expensive mounting equipment. Atsuta
また、ワイヤボンデイングはLEDの発光部(通常LEDチ
ツプ1個につき64個形成される)1個につき1回行なう
必要がある。一例として、通常用いられる集積密度300D
PI(約12ドツト/mm)、A4−レターサイズ用のLEDアレー
ヘツドにおいては、2560本のワイヤボンドが必要とな
り、高速のワイヤーボンダーを使用しても40分〜1時間
程度かかるとともに、この2560本のうち1本でもボンデ
イングにミスがあると、LEDアレーヘツド全体が不良と
なるため、細心の注意を必要とするものであり、生産効
率が悪くコストアツプの原因となつていた。Also, wire bonding needs to be performed once for each LED light-emitting part (normally 64 LED chips are formed for each LED chip). As an example, a commonly used integration density of 300D
For LED array heads for PI (approx. 12 dots / mm) and A4-letter size, 2560 wire bonds are required, and even if a high-speed wire bonder is used, it will take about 40 minutes to 1 hour. If even one of them has a mistake in bonding, the LED array head will be defective as a whole, so careful attention is required, resulting in poor production efficiency and cost increase.
更にLEDアレーヘツドのLEDチツプのアライメント精度
及び発光部の高さ方向の直線性のバラ付は共にその幅方
向(A4サイズで216mm)に対して±100μmと高い精度が
必要とされるため、セラミツク基板自体のそりや曲がり
が制限される。そのため、セラミツク基板に高精度のも
のを必要とし、全数の選別が必要になる等、基板を高価
なものにしていた。Furthermore, both the alignment accuracy of the LED chips of the LED array head and the variation in the linearity in the height direction of the light emitting part require high accuracy of ± 100 μm in the width direction (216 mm for A4 size). The sled and bend of itself are limited. Therefore, it is necessary to use a highly accurate ceramic substrate and to select all the substrates, which makes the substrate expensive.
更に、自己集束型ロツドレンズアレーをセラミツク基
板を取付けた放熱板に保持するため、これらの寸法の誤
差が累積し必要な精度が得られないという欠点もある。
現状自己集束型ロツドレンズアレーの位置決め精度は全
長にわたり±0.1mmであり、光学的な取り付け位置精度
の確認が不可欠であるとともに、高精度な位置決めを可
能にする機構をLEDアレーヘツドに設ける必要があり、
組立工数、製造設備、部品点数等の点においてもコスト
アツプをもたらしていた。Further, since the self-focusing type rod lens array is held on the heat dissipation plate to which the ceramic substrate is attached, there is a drawback that errors of these dimensions are accumulated and required accuracy cannot be obtained.
Currently, the positioning accuracy of the self-focusing rod lens array is ± 0.1 mm over the entire length, and it is essential to check the optical mounting position accuracy, and it is necessary to install a mechanism in the LED array head that enables highly accurate positioning. Yes,
It also brought up costs in terms of assembly man-hours, manufacturing equipment, number of parts, and the like.
本発明はこのような問題点に鑑みなされたもので、簡
単な構成で低価格の光書込みヘツドを提供することを目
的とする。The present invention has been made in view of such problems, and an object thereof is to provide a low cost optical writing head with a simple structure.
〔問題点を解決するための手段〕 本発明は、少なくともその一部が複数の光ファイバー
からなるファイバー束を有する基板と、該基板上にその
発光部側が基板面と対向するようにフリップチップ形式
により実装された発光手段を有し、前記ファイバー束の
一端部が前記発光手段の発光部に対向するとともに、そ
の他端部が曲面に形成され、前記曲面に形成された端部
が被露光物となる感光ベルトの表面に摺接していること
を特徴とする。[Means for Solving the Problems] The present invention uses a substrate having a fiber bundle at least a part of which is composed of a plurality of optical fibers, and a flip chip type so that the light emitting portion side of the substrate faces the substrate surface. With the mounted light emitting means, one end of the fiber bundle faces the light emitting portion of the light emitting means, and the other end is formed into a curved surface, and the end formed in the curved surface becomes an exposed object. It is characterized in that it is in sliding contact with the surface of the photosensitive belt.
LEDチツプを基板面にフリツプチツプ形式で実装する
ため、ワイヤーボンデイングが不必要となる。更に、基
板に直接複数の光フアイバー束を埋設するため部品点数
を削減出来、機構を簡単にできる。Since the LED chip is mounted on the board surface in the flip chip format, wire bonding is unnecessary. Furthermore, since a plurality of optical fiber bundles are directly embedded in the substrate, the number of parts can be reduced and the mechanism can be simplified.
以下、本発明の一実施例を第1図及び第2図を用いて
説明する。Hereinafter, an embodiment of the present invention will be described with reference to FIG. 1 and FIG.
第1図において、11はガラス等の透明基板であり、そ
の表面には薄膜工程により、所望の微細な導体パターン
12が形成されている。この導電パターン12の上にLEDチ
ツプ13がその発光部13aが基板11に対向するようにハン
ダバンプ12bにより接続されている。更にLEDチツプ13の
背面電極13bはリード線14によつて基板11のアースパタ
ーン12aに導通される。更に前記LEDチツプ13の発光部13
aには透明な合成樹脂15を介して、後述する直径10〜25
μmの光フアイバー17が多数集合した構造のフアイバー
束16の一端部16aが近接している。なお、該フアイバー
束16は前記基板11に埋設された状態にて保持されてい
る。そして前述の光フアイバー17は第2図に示すように
屈折率の高いガラスよりなるコア17aと、該コア17aの外
周に形成され屈折率の低いガラスよりなるクラツド17b
と、該クラツド17bの外周に形成されカーボン等よりな
る吸収体17cとからなる3層構造となつている。In FIG. 1, reference numeral 11 denotes a transparent substrate such as glass, on the surface of which a desired fine conductor pattern is formed by a thin film process.
12 are formed. The LED chip 13 is connected to the conductive pattern 12 by a solder bump 12b so that its light emitting portion 13a faces the substrate 11. Further, the back electrode 13b of the LED chip 13 is electrically connected to the ground pattern 12a of the substrate 11 by the lead wire 14. Further, the light emitting portion 13 of the LED chip 13
a through a transparent synthetic resin 15 to a diameter of 10 to 25, which will be described later.
One end 16a of a fiber bundle 16 having a structure in which a large number of μm optical fibers 17 are gathered is close to each other. The fiber bundle 16 is held in a state of being embedded in the substrate 11. As shown in FIG. 2, the above-mentioned optical fiber 17 includes a core 17a made of glass having a high refractive index and a cladding 17b made of glass having a low refractive index formed on the outer periphery of the core 17a.
And an absorber 17c made of carbon or the like formed on the outer periphery of the cladding 17b, thereby forming a three-layer structure.
このように構成されたLEDアレーヘツドにあつては、
第1図に示すようにLEDチツプ13の発光部13aより発光さ
れた光は透明な合成樹脂15を介してフアイバー束16の一
端部16aより進入し、該フアイバー束16内を高効率で伝
達され、曲面に形成された他端部16bと接触している感
光ベルト等の被露光物18の表面に照射されている。For an LED array head constructed in this way,
As shown in FIG. 1, the light emitted from the light emitting portion 13a of the LED chip 13 enters from one end portion 16a of the fiber bundle 16 through the transparent synthetic resin 15 and is transmitted in the fiber bundle 16 with high efficiency. The surface of the object to be exposed 18 such as the photosensitive belt which is in contact with the other end 16b formed on the curved surface is irradiated.
本発明においては、上述のように光書込みヘツドを構
成したことにより、以下の様な効果を提供する。In the present invention, the following effects are provided by configuring the optical writing head as described above.
透明基板を用い発光手段をフリツプチツプ形式でこ
の基板に実装したことにより、従来ワイヤボンデイング
工程を必要としていたが、この工程が不必要となり、工
程数の削減がはかれる。By mounting the light emitting means in a flip-chip form on the substrate using a transparent substrate, a wire bonding step has been conventionally required, but this step is unnecessary and the number of steps can be reduced.
特に基板にガラス基板を用いた場合、その表面平滑
度が高いため薄膜工程による微細パターンの形成が容易
であり、更にそり等のない精度の高い基板が容易に得ら
れるため、発光手段の位置決め精度が得易い。In particular, when a glass substrate is used as the substrate, it is easy to form a fine pattern by a thin film process because of its high surface smoothness, and since a highly accurate substrate without warpage can be easily obtained, the positioning accuracy of the light emitting means can be improved. Is easy to obtain.
光フアイバーは自己集束型ロツドレンズアレーのよ
うに焦点を持たないため、発光手段の発光部と被露光物
との距離を小さくすることができ、装置の小型化がはか
れる。Since the optical fiber does not have a focus unlike the self-focusing type rod lens array, the distance between the light emitting portion of the light emitting means and the object to be exposed can be reduced, and the device can be downsized.
発光手段の発光部より発した光はそのほとんどがフ
アイバー束内に進入し被露光物に効率よく照射されるの
で、発光手段に供給する発光用エネルギーを小さくする
ことができるため、発光手段の寿命が長くなる。Most of the light emitted from the light emitting portion of the light emitting means enters the fiber bundle and is efficiently irradiated to the object to be exposed. Therefore, it is possible to reduce the light emitting energy supplied to the light emitting means, so that the life of the light emitting means is reduced. Becomes longer.
フアイバー束の端部が曲面に形成されているので、
被露光物になめらかに接触し、被露光物を傷つける心配
がない。Since the end of the fiber bundle is formed into a curved surface,
There is no risk of damaging the exposed object by making a smooth contact with it.
【図面の簡単な説明】 第1図は、本発明の一実施例を示す光書込みヘツドの構
造断面図、第2図は同光フアイバーの断面図、第3図は
通常のLEDプリンタの構成を説明する概略構成図であ
り、第4図は従来のLEDアレーヘツドの構造断面図であ
る。 11……透明基板 13……LEDチツプ 13a……発光部 16……フアイバー束 17……光フアイバーBRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a structural sectional view of an optical writing head showing an embodiment of the present invention, FIG. 2 is a sectional view of the same optical fiber, and FIG. 3 is a configuration of an ordinary LED printer. FIG. 4 is a schematic configuration diagram for explaining, and FIG. 4 is a structural sectional view of a conventional LED array head. 11 …… Transparent substrate 13 …… LED chip 13a …… Light emitting part 16 …… Fiber bundle 17 …… Optical fiber
Claims (1)
からなるファイバー束を有する基板と、該基板上にその
発光部側が基板面と対向するようにフリップチップ形式
により実装された発光手段を有し、前記ファイバー束の
一端部が前記発光手段の発光部に対向するとともに、そ
の他端部が曲面に形成され、前記曲面に形成された端部
が被露光物となる感光ベルトの表面に摺接していること
を特徴とする光書込みヘッド。1. A substrate having a fiber bundle at least a part of which comprises a plurality of optical fibers, and a light emitting means mounted on the substrate in a flip chip form so that a light emitting portion side thereof faces a substrate surface, One end of the fiber bundle faces the light emitting part of the light emitting means, the other end is formed into a curved surface, and the end formed in the curved surface is in sliding contact with the surface of the photosensitive belt that is the exposed object. An optical writing head characterized in that
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22000887A JP2521106B2 (en) | 1987-09-02 | 1987-09-02 | Optical writing head |
US07/228,886 US4929965A (en) | 1987-09-02 | 1988-08-04 | Optical writing head |
DE3829553A DE3829553A1 (en) | 1987-09-02 | 1988-08-31 | OPTICAL RECORDING HEAD |
GB8820595A GB2209404B (en) | 1987-09-02 | 1988-08-31 | Optical writing heads |
US07/509,109 US5005029A (en) | 1987-09-02 | 1990-04-13 | Transmitting radiation through a flexible printed circuit to an optical fiber bundle |
US07/509,004 US5045867A (en) | 1987-09-02 | 1990-04-13 | Optical writing head with curved surface formed by one end of any optical fiber bundle |
GB9121294A GB2247959B (en) | 1987-09-02 | 1991-10-07 | Optical writing heads |
GB9121295A GB2247960B (en) | 1987-09-02 | 1991-10-07 | Optical writing heads |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22000887A JP2521106B2 (en) | 1987-09-02 | 1987-09-02 | Optical writing head |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6463173A JPS6463173A (en) | 1989-03-09 |
JP2521106B2 true JP2521106B2 (en) | 1996-07-31 |
Family
ID=16744484
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22000887A Expired - Lifetime JP2521106B2 (en) | 1987-09-02 | 1987-09-02 | Optical writing head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2521106B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2541118Y2 (en) * | 1990-01-18 | 1997-07-09 | 日立電線株式会社 | LED print head |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS598074B2 (en) * | 1979-01-23 | 1984-02-22 | 沖電気工業株式会社 | Light emitting element array device |
JPS60125860A (en) * | 1983-12-12 | 1985-07-05 | Toshiba Corp | Exposing device |
JPS60143982A (en) * | 1983-12-29 | 1985-07-30 | Sanyo Electric Co Ltd | Led head |
JPS60128360U (en) * | 1984-02-06 | 1985-08-28 | 沖電気工業株式会社 | optical recording head |
-
1987
- 1987-09-02 JP JP22000887A patent/JP2521106B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS6463173A (en) | 1989-03-09 |
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