JPS5516465A - Container for semiconductor device - Google Patents

Container for semiconductor device

Info

Publication number
JPS5516465A
JPS5516465A JP8957278A JP8957278A JPS5516465A JP S5516465 A JPS5516465 A JP S5516465A JP 8957278 A JP8957278 A JP 8957278A JP 8957278 A JP8957278 A JP 8957278A JP S5516465 A JPS5516465 A JP S5516465A
Authority
JP
Japan
Prior art keywords
cap
section
protrusion
periphery
ceramic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8957278A
Other languages
Japanese (ja)
Inventor
Katsuhiko Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8957278A priority Critical patent/JPS5516465A/en
Publication of JPS5516465A publication Critical patent/JPS5516465A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To permit an easy alignment of a seal frame and a cap with each other in effecting a seal weld making use of the periphery of the seal frame and the protruding peripheral edge of the cap.
CONSTITUTION: A mount section 2 is formed on the bottom of a central recess of the ceramic substrate 1. A bonding pad section 3 is formed around the amount section 2 to have a height greater than that of the latter, and is connected to an external lead 5 through an intermediate metallized layer of the ceramic substrate 1. A metallized layer 11 is formed around the bonding pad section 3 to have a height greater than that of the latter. A protrusion 13 is formed by a drawing on the periphery of the cap. The sealing of the cap is made by holding the roller electrode 12 in contact with the drawn corner 10 of the protrusion 13.
COPYRIGHT: (C)1980,JPO&Japio
JP8957278A 1978-07-21 1978-07-21 Container for semiconductor device Pending JPS5516465A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8957278A JPS5516465A (en) 1978-07-21 1978-07-21 Container for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8957278A JPS5516465A (en) 1978-07-21 1978-07-21 Container for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5516465A true JPS5516465A (en) 1980-02-05

Family

ID=13974513

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8957278A Pending JPS5516465A (en) 1978-07-21 1978-07-21 Container for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5516465A (en)

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