JPS6365783A - Solid-state image pickup device - Google Patents
Solid-state image pickup deviceInfo
- Publication number
- JPS6365783A JPS6365783A JP61209265A JP20926586A JPS6365783A JP S6365783 A JPS6365783 A JP S6365783A JP 61209265 A JP61209265 A JP 61209265A JP 20926586 A JP20926586 A JP 20926586A JP S6365783 A JPS6365783 A JP S6365783A
- Authority
- JP
- Japan
- Prior art keywords
- solid
- state imaging
- imaging device
- cover glass
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003384 imaging method Methods 0.000 claims description 55
- 238000007789 sealing Methods 0.000 claims description 11
- 239000003566 sealing material Substances 0.000 claims description 7
- 239000006059 cover glass Substances 0.000 abstract description 43
- 229920005989 resin Polymers 0.000 abstract description 16
- 239000011347 resin Substances 0.000 abstract description 16
- 239000011521 glass Substances 0.000 abstract description 6
- 238000012856 packing Methods 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Color Television Image Signal Generators (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、固体撮像装置、特に小型な固体撮像装置に関
するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a solid-state imaging device, particularly a compact solid-state imaging device.
従来、固体撮像装置はたとえば特開昭６０−６２２７９
号として提案されているものがある。この固体撮像装置
はセラミック等の外囲構体上に固体撮像装置チップを固
着し、この外囲構体の開口を透光性平板（カバーガラス
）で閉塞し、上記チップとカバーガラスの間に透光性樹
脂を充填しである。Conventionally, solid-state imaging devices are disclosed in Japanese Patent Application Laid-open No. 60-62279, for example.
Some have been proposed as a number. In this solid-state imaging device, a solid-state imaging device chip is fixed on an outer structure made of ceramic or the like, and the opening of this outer structure is closed with a light-transmitting flat plate (cover glass). It is filled with a synthetic resin.
しかし、特開昭６０−６２２７９号の固体撮像装置を内
視鏡等に組込む場合、カバーガラスの入射面を対物光学
系の枠体に突き当てて固定することが考えられる。この
場合、カバーガラス入射面とチップ入射面（撮像面）と
の平行度が問題となる。この平行度はカバーガラスの肉
厚のクサビ状の変化のみならず、外囲構体、外部導出線
の肉厚のバラツキや平面性、それらの部品の接合部の接
合部のバラツキ等に影響される。この平行度が悪（なる
と対物レンズの光軸に対してチップ撮像面が垂直になら
ずに傾き、片ぼけを生じることになる。また、内視鏡先
端部に組込む固体撮像装置は超小型であることが望まれ
るが、外囲構体があるために装置全体が大型化してしま
う。However, when the solid-state imaging device of JP-A-60-62279 is incorporated into an endoscope or the like, it is conceivable to fix the cover glass by abutting the entrance surface of the cover glass against the frame of the objective optical system. In this case, the parallelism between the cover glass entrance surface and the chip entrance surface (imaging surface) becomes a problem. This parallelism is affected not only by wedge-shaped changes in the thickness of the cover glass, but also by variations in the wall thickness and flatness of the surrounding structure and external lead wires, and variations in the joints of these parts. . If the parallelism is poor (if this happens, the chip imaging surface will not be perpendicular to the optical axis of the objective lens, but will be tilted, resulting in unilateral blurring. Also, the solid-state imaging device built into the tip of the endoscope is extremely small). Although this is desirable, the presence of the outer enclosure structure increases the size of the entire device.
更に、内視鏡先端部に組込む固体撮像装置としては第６
図に示す構造が考えられる。この固体撮像装置１はセラ
ミック等の平板状のベース２の上に固体盪像素子チフプ
３を固定し、そのチップ３のイメージエリア上にカバー
ガラス４を直接設け、ベース２に植設したリード足５と
チップ側ボンディングバンドとの間をボンディングワイ
ヤ６で接続してカバーガラス４の何方にボンディング部
を形成している。このボンディング部のチップ３．リー
ド足５．ワイヤ６等は樹脂等の封止材７で充填、封止さ
れ、その上面がカバーガラスの上面と同一平面を成す様
に成形されている。この場合、固体撮像￥を置１の上面
はカバーガラス４と樹脂封止材７の２部材で構成される
ために平面性が悪く、特に樹脂は成形時の収縮によりヒ
ケ８を生じることがある。Furthermore, it is the sixth solid-state imaging device to be incorporated into the tip of an endoscope.
The structure shown in the figure is possible. This solid-state imaging device 1 has a solid-state imaging element chip 3 fixed on a flat base 2 made of ceramic or the like, a cover glass 4 is placed directly on the image area of the chip 3, and lead legs are implanted in the base 2. 5 and a chip-side bonding band are connected by a bonding wire 6 to form a bonding portion on either side of the cover glass 4. Chip 3 of this bonding part. Lead foot 5. The wires 6 and the like are filled and sealed with a sealing material 7 such as resin, and are formed so that the upper surface thereof is flush with the upper surface of the cover glass. In this case, the top surface of the solid-state imaging device 1 is composed of two members, the cover glass 4 and the resin sealing material 7, and therefore has poor flatness.In particular, the resin may cause sink marks 8 due to shrinkage during molding. .
この様な固体撮像装置１を対物光学系の枠体９に取付け
た時には撮像面の傾きにより片ぼけを生じる。When such a solid-state imaging device 1 is attached to the frame 9 of the objective optical system, partial blurring occurs due to the inclination of the imaging surface.
本発明は上記問題点に着目してなされたもので、パッケ
ージが小型で、且つカバーガラス入射面と撮像面との平
行度が優れた固体撮像装置を提供することを目的とする
。The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a solid-state imaging device that has a small package and has excellent parallelism between the incident surface of the cover glass and the imaging surface.
本発明は、ベース上に固着した固体撮像素子チップ上に
第１の透光性平面板、ワイヤボンディング部を覆う第２
の透光性平面板を順次Ｍｉ層して接合し、第２の透光性
平面板の下方でワイヤボンディング部に封止材を充填し
た固体撮像装置である。The present invention includes a first light-transmitting flat plate on a solid-state image sensor chip fixed on a base, and a second light-transmitting plate covering a wire bonding part.
This is a solid-state imaging device in which a second light-transmitting flat plate is sequentially bonded with Mi layers, and a wire bonding portion is filled with a sealing material below the second light-transmitting flat plate.
本発明の固体撮像装置は、ベース上のチップに対して直
接に第１．第２の透光性平面板を形成して入射面から撮
像面までの平行度を確保し、第２の透光性平面板の外形
よりも内側にボンディング部を形成して封止材を充填す
ることで全体を小型にすると共に、枠等に固定する時に
第２の透光性平面板の入射面が当接面となり撮像面が傾
かない様にしている。The solid-state imaging device of the present invention directly connects the first chip to the chip on the base. A second light-transmitting flat plate is formed to ensure parallelism from the incident surface to the imaging surface, and a bonding portion is formed inside the outer shape of the second light-transmitting flat plate and the sealing material is filled. This makes the whole device compact, and when it is fixed to a frame or the like, the incident surface of the second light-transmitting flat plate serves as a contact surface to prevent the imaging surface from tilting.
以下、図面に基づいて本発明の一実施例を説明する。第
１図は本発明の固体撮像装置を内蔵した内視鏡先端部の
断面図、第２図は第１図のＡ−Ａ断面図である。内視鏡
１０の挿入部の先端部１１は先端構成部本体１２を存し
、この本体１２には第１の取付孔１３と第２の取付孔１
４とが穿設されている。第１の取付孔１３は先端構成部
本体１２の中心軸に対して偏心して形成されている。こ
の第１の取付孔１３にはカバーガラスレンズ１５、対物
レンズの一部レンズ系１６を内部に保持した明るさ絞り
付のレンズ枠１７が挿入、固着されている。更に、取付
孔１３の後方からも対物レンズの一部レンズ１８が挿入
されている。このレンズ１８の後方の取付孔１３には固
体撮像装置２０等が固定された固体撮像装置枠２１が挿
入、固定されている。この固体撮像装置２０はセラミッ
クまたはガラス繊維を混入したエポキシ樹脂製のベース
２２上に固体描像素子チップ２３が固着されている。Hereinafter, one embodiment of the present invention will be described based on the drawings. FIG. 1 is a sectional view of the distal end of an endoscope incorporating the solid-state imaging device of the present invention, and FIG. 2 is a sectional view taken along the line AA in FIG. The distal end 11 of the insertion section of the endoscope 10 has a distal end component main body 12, and the main body 12 has a first attachment hole 13 and a second attachment hole 1.
4 is bored. The first attachment hole 13 is formed eccentrically with respect to the central axis of the tip component main body 12. A lens frame 17 with an aperture diaphragm, which holds a cover glass lens 15 and a partial lens system 16 of an objective lens therein, is inserted and fixed into the first mounting hole 13. Further, a part of the objective lens 18 is inserted from the rear of the mounting hole 13 as well. A solid-state imaging device frame 21 to which a solid-state imaging device 20 and the like are fixed is inserted and fixed into the mounting hole 13 at the rear of the lens 18 . This solid-state imaging device 20 has a solid-state imaging element chip 23 fixed on a base 22 made of epoxy resin mixed with ceramic or glass fiber.
このチップ２３には所定面積のイメージエリア２４とチ
ップ側ボンディングバンド２５とが形成される。一方、
ベース２２にはリード足２６がベース２２を貫通して両
側に突出し、チップ２３の固着側はチップ２３の上面と
ほぼ同じ高さに形成しである。An image area 24 of a predetermined area and a chip-side bonding band 25 are formed on this chip 23. on the other hand,
Lead legs 26 pass through the base 22 and protrude from both sides, and the side to which the chip 23 is fixed is formed at approximately the same height as the top surface of the chip 23.
ポンディングパッド２５とリード足２６とはボンディン
グワイヤ２７により接続されている。また、イメージエ
リア２４上には第１のカバーガラス２日が接合されてお
り、さらに第１のカバーガラス２８上に第２のカバーガ
ラス２９がボンディングワイヤ２７によるボンディング
部を覆うように重ねて接合されている。この第１実施例
では固体撮像装置枠２１の内側は円形に成されているの
で、ベース２２、第２のカバーガラス２９は枠２１の内
径より若干小径の円形を成している。この第２のカバー
ガラス２９のチップ２３側の周囲には円形にフレア絞り
３０が形成されている。このフレア絞り３０は、内視鏡
では上下左右方向を均等に観察するのが好ましいので、
正方形のイメージエリア２４のうち内接する円形部分を
表示エリア３１としてモニターに表示するために観察光
が表示エリア３１以外にあたらない様に設けである。フ
レア絞り３０は第２のカバーガラス２９の出射面側の周
辺の黒くする部分を写真腐食により粗面にした後、その
部分に墨入れをすることにより形成される。更に、固体
邊像装Ｗ、２０は、ベース２２と第２のカバーガラス２
９との間にあるボンディング部を封止樹脂３２で充填し
である。The bonding pad 25 and the lead foot 26 are connected by a bonding wire 27. Further, a first cover glass 29 is bonded onto the image area 24, and a second cover glass 29 is bonded over the first cover glass 28 so as to cover the bonding portion formed by the bonding wire 27. has been done. In this first embodiment, the inside of the solid-state imaging device frame 21 is circular, so the base 22 and the second cover glass 29 are circular with a diameter slightly smaller than the inside diameter of the frame 21. A circular flare aperture 30 is formed around the second cover glass 29 on the chip 23 side. This flare diaphragm 30 is preferably used to uniformly observe the top, bottom, left and right directions of an endoscope.
In order to display the inscribed circular part of the square image area 24 on the monitor as the display area 31, the observation light is provided so that it does not fall on anything other than the display area 31. The flare diaphragm 30 is formed by roughening the blackened area around the exit surface side of the second cover glass 29 by photoetching, and then inking the area. Further, the solid-state imaging device W, 20 includes a base 22 and a second cover glass 2.
9 is filled with sealing resin 32.
この様に構成された固体撮像装置２００ベース２２裏面
には回路基板３３が固体盪像装ｆｆ２０のり一ド足２６
をハンダ付は等により接続固定している。A circuit board 33 is mounted on the back side of the base 22 of the solid-state imaging device 200 configured in this manner.
The connection is fixed by soldering etc.
この基板３３上にはＩｃ等の電子部品３４も実装されて
いる。第１図ではチップ・オン・ボード方式で実装され
ている。また基板３３に対しては信号線３５も接続され
、電子部品３４は封止樹脂３６で封止されている。Electronic components 34 such as ICs are also mounted on this board 33. In Figure 1, it is mounted using a chip-on-board method. Further, a signal line 35 is also connected to the substrate 33, and the electronic component 34 is sealed with a sealing resin 36.
この固体撮像装置２０と回路基板３３等との組立体は固
体撮像装置枠２１の前方当接面に第２のカーパーガラス
２９の入射面が当接するまで挿入され、補強樹脂３７等
により固定される。The assembly of the solid-state imaging device 20 and the circuit board 33 etc. is inserted until the entrance surface of the second carper glass 29 comes into contact with the front contact surface of the solid-state imaging device frame 21, and is fixed with a reinforcing resin 37 etc. Ru.
一方、第２の取付孔１４は第１の取付孔１３の周囲上三
日月状に形成されており、多数のライトガイドファイバ
ー３８が挿入、固定されている。On the other hand, the second attachment hole 14 is formed in a crescent shape around the first attachment hole 13, and a large number of light guide fibers 38 are inserted and fixed therein.
このライトガイドファイバー３８の他端からは光源装置
（図示せず）からの照明光が入射され、一端から出射し
た光束が観察部位を照明する。Illumination light from a light source device (not shown) enters the other end of the light guide fiber 38, and the light beam emitted from one end illuminates the observation site.
このような本発明によれば、第１．第２のカバーガラス
２８．２９の平行度だけにより入射面と撮像面の平行度
が決まるので、撮像面の傾きによる片ぼけが生じない、
また、封止樹脂３２はボンディング部を封止していれば
よいので、側面の形状はベース２２、第２のカバーガラ
ス２９と同形状でなくともよく、成形性は非常に容易で
ある。更に、外囲構体がないので固体撮像装置２０の外
形は小型になる。According to the present invention, the first. Since the parallelism between the incident surface and the imaging surface is determined only by the parallelism of the second cover glass 28, 29, no one-sided blurring occurs due to the tilt of the imaging surface.
Further, since the sealing resin 32 only needs to seal the bonding portion, the shape of the side surface does not have to be the same as that of the base 22 and the second cover glass 29, and moldability is very easy. Furthermore, since there is no surrounding structure, the solid-state imaging device 20 has a small external size.
第３図は本発明の第２実施例を示す図であり、固体撮像
装置４０はセラミック製のベース４１上に固体撮像素子
チップ４２を固着して形成されており、このベース４１
の側方には上面から裏面にかけて金属メッキから成る導
電部４３が形成されている。ベース４１の裏面には各導
電部４３に対してリード４４が植設され、ベース４１上
面の導電部４３とチップ４２のポンディングパッドとは
ボンディングワイヤ４５により接続されてボンディング
部を形成している。上記固体撮像装置チップ４２のイメ
ージエリア上には第１のカバーガラス４６が接合され、
第１のカバーガラス４６上には第２のカバーガラス４７
が接合されている。この第２のカバーガラス４７はベー
ス４１の外形より大きく形成されており、第２のカバー
ガラス４７の下面からボンディング部を封止するように
封止樹脂４８が充填されている。この際、第２のカバー
ガラス４７０周辺は封止樹脂４８よりも外側にフランジ
として突出して設けられる。FIG. 3 is a diagram showing a second embodiment of the present invention, in which a solid-state imaging device 40 is formed by fixing a solid-state imaging element chip 42 on a ceramic base 41.
A conductive portion 43 made of metal plating is formed on the sides from the top surface to the back surface. A lead 44 is implanted for each conductive portion 43 on the back surface of the base 41, and the conductive portion 43 on the upper surface of the base 41 and the bonding pad of the chip 42 are connected by a bonding wire 45 to form a bonding portion. . A first cover glass 46 is bonded onto the image area of the solid-state imaging device chip 42,
A second cover glass 47 is placed on the first cover glass 46.
are joined. This second cover glass 47 is formed larger than the outer shape of the base 41, and is filled with a sealing resin 48 so as to seal the bonding portion from the bottom surface of the second cover glass 47. At this time, the periphery of the second cover glass 470 is provided to protrude outside the sealing resin 48 as a flange.
この第２実施例によれば、第２のカバーガラス４７０周
辺をフランジとして形成しているので、固体撮像装置４
０を内視鏡等に組込む場合に第２のカバーガラス４７を
挾んで固定できる。従って、固定時に固体撮像素子チッ
プ４２に圧縮力がかからないという効果が生じる。According to this second embodiment, since the periphery of the second cover glass 470 is formed as a flange, the solid-state imaging device 470
0 into an endoscope or the like, the second cover glass 47 can be clamped and fixed. Therefore, there is an effect that no compressive force is applied to the solid-state image sensor chip 42 when it is fixed.
第４図は本発明の第３実施例を示す図であり、固体撮像
装置５０はベース５１上に固体撮像素子チップ５２を固
着して形成されている。このベース５１はチップ５２の
外形と同形状と成され、ベース５１の裏面にはチップ側
ボンディングバンドに対して必要な数の導電部５３が形
成され、導電部５３に対応してリード足５４がベース５
１の裏面に植設されている。そして、チップ側ポンディ
ングパッドとａＸ部５３とはベース５１の側面を迂回し
てボンディングワイヤ５５により接続され、ベース５１
の側面から裏面にかけてボンディング部を形成している
。また、固体撮像装置チップ５２のイメージエリア上に
は第１のカバーガラス５６が接合され、第１のカバーガ
ラス５６上にはベース５１の外形より大きな第２のカバ
ーガラス５７が接合されている。更に、第２のカバーガ
ラス５７の下面からボンディング部、ベース５１の下面
を覆う様に封止樹脂５８で成形されている。FIG. 4 is a diagram showing a third embodiment of the present invention, in which a solid-state imaging device 50 is formed by fixing a solid-state imaging element chip 52 on a base 51. This base 51 has the same external shape as the chip 52, and the required number of conductive parts 53 for the chip-side bonding band is formed on the back surface of the base 51, and lead legs 54 are formed in correspondence with the conductive parts 53. base 5
It is planted on the back of 1. The chip-side bonding pad and the aX section 53 are connected by a bonding wire 55 bypassing the side surface of the base 51.
A bonding part is formed from the side surface to the back surface. Further, a first cover glass 56 is bonded onto the image area of the solid-state imaging device chip 52, and a second cover glass 57, which is larger than the outer diameter of the base 51, is bonded onto the first cover glass 56. Furthermore, a sealing resin 58 is molded so as to cover the lower surface of the second cover glass 57, the bonding portion, and the lower surface of the base 51.
一般に、固体撮像装置のリード数は１４〜２０もあり、
チップ側ポンディングパッドは０．２鶴ピッチ程度に形
成できるが、リード足はＱ、５ｍピッチ程度にしかでき
ず、リード足に必要な面積は大きなものとなってしまう
、この第３実施例ではリード足５４をチップ５２の外形
内でベース５１の裏面に形成し、ボンディングワイヤ５
５を立体的に引き囲わしたので、リード足の数が多くて
も固体撮像装置５０の外形を小さくできる。Generally, solid-state imaging devices have 14 to 20 leads.
The chip-side bonding pads can be formed at a pitch of about 0.2 meters, but the lead legs can only be formed at a pitch of about 5 m, and the area required for the lead legs is large. In this third embodiment, Lead legs 54 are formed on the back surface of the base 51 within the outer shape of the chip 52, and bonding wires 5
Since the solid-state imaging device 50 is surrounded three-dimensionally, the external size of the solid-state imaging device 50 can be made small even if the number of lead legs is large.
第５図は本発明の第４実施例を示す図であり、固体撮像
装置６０は第３実施例に対してベース６１に設ける導電
部６３がベース６１の裏面から側面にかけて形成され、
チップ６２のポンディングパッドと導電部６３の側面と
の間にボンディングワイヤ６５を接続している。リード
足６４、第１、第２のカバーガラス６６、６７は第３実
施例と同様である。更に、ベース６１、チップ６２、第
１のカバーガラス６６の側面にはボンディングワイヤ６
５を覆う様に封止樹脂６８が充填して形成されている。FIG. 5 is a diagram showing a fourth embodiment of the present invention, in which a solid-state imaging device 60 is different from the third embodiment in that a conductive portion 63 provided on a base 61 is formed from the back surface to the side surface of the base 61.
A bonding wire 65 is connected between the bonding pad of the chip 62 and the side surface of the conductive portion 63. The lead leg 64 and the first and second cover glasses 66 and 67 are the same as those in the third embodiment. Furthermore, bonding wires 6 are provided on the side surfaces of the base 61, the chip 62, and the first cover glass 66.
A sealing resin 68 is filled and formed so as to cover 5 .
この第４実施例では封止樹脂６８をベース６１の裏面に
まで形成していないので、第３実施例に比べて固体撮像
装置６０の厚さを薄くすることができる。In the fourth embodiment, since the sealing resin 68 is not formed on the back surface of the base 61, the thickness of the solid-state imaging device 60 can be made thinner than in the third embodiment.
尚、本発明は上記各実施例に限定されることなく、種々
の変形が考えられる。第１．第２のカバーガラスはガラ
スでなく、光学プラスチックのような透明プラスチック
板でもよい、但し、両面の平面度、平行度は精度よく出
ている必要がある。また、第１のカバーガラスはカラー
フィルターアレイ、モアレ除去フィルター、赤外カット
フィルターでもよく、第２のカバーガラスはモアレ除去
フィルター、赤外カットフィルターとすることもできる
。更に、封止樹脂は低融点ガラスに替えてボンディング
部を封止してもよい。Note that the present invention is not limited to the above embodiments, and various modifications can be made. 1st. The second cover glass may be made of a transparent plastic plate such as optical plastic instead of glass, but the flatness and parallelism of both surfaces must be accurately achieved. Further, the first cover glass may be a color filter array, a moire removal filter, or an infrared cut filter, and the second cover glass may be a moire removal filter or an infrared cut filter. Furthermore, the sealing resin may be replaced with low melting point glass to seal the bonding portion.
上述した様に、本発明は固体撮像素子チップ上に第１の
透光性平面板と第２の透光性平面板を重ねて設け、第２
の透光性平面板がボンディング部を覆う様にして第２の
透光性平面板の下方のボンディング部に封止材を充填し
て形成したので、小型の固体撮像装置にできると共に、
入射面と撮像面との平行度が優れ、封止材の充填作業性
がよい。As described above, the present invention provides a first light-transmitting flat plate and a second light-transmitting flat plate overlapping each other on a solid-state image sensor chip, and
Since the second transparent flat plate is formed by filling the bonding part below the second transparent flat plate with a sealing material so as to cover the bonding part, a compact solid-state imaging device can be obtained.
The parallelism between the incident surface and the imaging surface is excellent, and the workability of filling the sealing material is good.
第１図は本発明の第１実施例の固体撮像装置を内蔵した
内視鏡先端部の断面図、第２図は第１図のＡ−Ａ断面図
、第３図は本発明の第２実施例を示す断面図、第４図は
本発明の第３実施例を示す断面図、第５図は本発明の第
４実施例を示す断面図、第６図は従来考えられていた固
体撮像装置を示す断面図である。
２０、４０．５０．６０−−−−一固体撮像装置、２２
、 ４１． ５１． ６１−−一・−ベース、２３、４
２．５２．６２−・・・・固体撮像素子チップ、２８、
４６．５６．６６−・・−・第１のカバーガラス、２９
、４７．５７．６７・・−第２のカバーガラス、３２、
４８．５８．６８−ミー一・封止樹脂。FIG. 1 is a sectional view of the distal end of an endoscope incorporating a solid-state imaging device according to a first embodiment of the present invention, FIG. 2 is a sectional view taken along line A-A in FIG. 1, and FIG. 4 is a sectional view showing a third embodiment of the present invention, FIG. 5 is a sectional view showing a fourth embodiment of the present invention, and FIG. 6 is a conventional solid-state imaging system. FIG. 2 is a cross-sectional view showing the device. 20, 40.50.60-----solid-state imaging device, 22
, 41. 51. 61--1・-base, 23, 4
2.52.62-...Solid-state image sensor chip, 28,
46.56.66--First cover glass, 29
, 47.57.67...-second cover glass, 32,
48.58.68-Me-Sealing resin.
Claims (4)
撮像素子チップと、上記チップと上記ベース部材側導電
部材とを電気的に接続するボンディング部と、少なくと
も上記チップのイメージエリアをカバーして上記チップ
に重着した第１の透光性平面板と、少なくとも上記第１
の透光性平面板とボンディング部をカバーして上記第１
の透光性平面板に重着した第２の透光性平面板と、上記
ボンディング部を封止する封止材とから成ることを特徴
とする固体撮像装置。(1) A base member, a solid-state image sensor chip fixed to the base member, a bonding portion that electrically connects the chip and the base member side conductive member, and a bonding portion that covers at least an image area of the chip. a first light-transmitting flat plate heavily attached to the chip;
Covering the light-transmitting flat plate and the bonding part, the first
1. A solid-state imaging device comprising: a second light-transmitting flat plate superimposed on the light-transmitting flat plate; and a sealing material sealing the bonding portion.
イであることを特徴とする特許請求の範囲第１項記載の
固体撮像装置。(2) The solid-state imaging device according to claim 1, wherein the first light-transmitting flat plate is a color filter array.
、または赤外カットフィルターであることを特徴とする
特許請求の範囲第１項記載の固体撮像装置。(3) The solid-state imaging device according to claim 1, wherein the first light-transmitting flat plate is a moire removal filter or an infrared cut filter.
、または赤外カットフィルターであることを特徴とする
特許請求の範囲第１項乃至第３項のうちの１項記載の固
体撮像装置。(4) The solid-state imaging device according to any one of claims 1 to 3, wherein the second light-transmitting flat plate is a moire removal filter or an infrared cut filter. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61209265A JPH0813107B2 (en) | 1986-09-05 | 1986-09-05 | Solid-state imaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61209265A JPH0813107B2 (en) | 1986-09-05 | 1986-09-05 | Solid-state imaging device |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7191428A Division JP2653769B2 (en) | 1995-07-27 | 1995-07-27 | Solid-state imaging device |
| JP7191427A Division JP2729035B2 (en) | 1995-07-27 | 1995-07-27 | Imaging device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6365783A true JPS6365783A (en) | 1988-03-24 |
| JPH0813107B2 JPH0813107B2 (en) | 1996-02-07 |
Family
ID=16570082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61209265A Expired - Lifetime JPH0813107B2 (en) | 1986-09-05 | 1986-09-05 | Solid-state imaging device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0813107B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04114623A (en) * | 1990-09-06 | 1992-04-15 | Fuji Photo Optical Co Ltd | Camera for endoscope |
| JPH09130683A (en) * | 1995-11-06 | 1997-05-16 | Konica Corp | Optical element-integrated image pickup element and image pickup device |
| EP0886323A3 (en) * | 1997-06-16 | 1999-02-17 | Eastman Kodak Company | Imager package substrate |
| JP2006505126A (en) * | 2002-10-29 | 2006-02-09 | フリースケール セミコンダクター インコーポレイテッド | Optical sensor package |
| JP2012095177A (en) * | 2010-10-28 | 2012-05-17 | Sony Corp | Imaging device package, imaging device package manufacturing method, and electronic device |
| JP2012124501A (en) * | 2009-04-15 | 2012-06-28 | Olympus Medical Systems Corp | Semiconductor device |
| JP2014067898A (en) * | 2012-09-26 | 2014-04-17 | Aoi Electronics Co Ltd | Semiconductor device and manufacturing method of the same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2007043509A1 (en) * | 2005-10-14 | 2009-04-16 | コニカミノルタオプト株式会社 | Imaging device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5629563U (en) * | 1979-08-10 | 1981-03-20 | ||
| JPS61123288A (en) * | 1984-11-20 | 1986-06-11 | Toshiba Corp | Solid-state pick up device |
-
1986
- 1986-09-05 JP JP61209265A patent/JPH0813107B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5629563U (en) * | 1979-08-10 | 1981-03-20 | ||
| JPS61123288A (en) * | 1984-11-20 | 1986-06-11 | Toshiba Corp | Solid-state pick up device |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04114623A (en) * | 1990-09-06 | 1992-04-15 | Fuji Photo Optical Co Ltd | Camera for endoscope |
| JPH09130683A (en) * | 1995-11-06 | 1997-05-16 | Konica Corp | Optical element-integrated image pickup element and image pickup device |
| EP0886323A3 (en) * | 1997-06-16 | 1999-02-17 | Eastman Kodak Company | Imager package substrate |
| JP2006505126A (en) * | 2002-10-29 | 2006-02-09 | フリースケール セミコンダクター インコーポレイテッド | Optical sensor package |
| JP4705784B2 (en) * | 2002-10-29 | 2011-06-22 | タング スング キャピタル エルエルシー | Manufacturing method of image sensor device |
| JP2012124501A (en) * | 2009-04-15 | 2012-06-28 | Olympus Medical Systems Corp | Semiconductor device |
| JP2012095177A (en) * | 2010-10-28 | 2012-05-17 | Sony Corp | Imaging device package, imaging device package manufacturing method, and electronic device |
| JP2014067898A (en) * | 2012-09-26 | 2014-04-17 | Aoi Electronics Co Ltd | Semiconductor device and manufacturing method of the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0813107B2 (en) | 1996-02-07 |
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| EXPY | Cancellation because of completion of term |