JP2653769B2 - Solid-state imaging device - Google Patents
Solid-state imaging deviceInfo
- Publication number
- JP2653769B2 JP2653769B2 JP7191428A JP19142895A JP2653769B2 JP 2653769 B2 JP2653769 B2 JP 2653769B2 JP 7191428 A JP7191428 A JP 7191428A JP 19142895 A JP19142895 A JP 19142895A JP 2653769 B2 JP2653769 B2 JP 2653769B2
- Authority
- JP
- Japan
- Prior art keywords
- solid
- imaging device
- state imaging
- base
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003384 imaging method Methods 0.000 title claims description 36
- 239000006059 cover glass Substances 0.000 claims description 22
- 229920003023 plastic Polymers 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 description 17
- 239000004033 plastic Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、固体撮像装置、特
に小型な固体撮像装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state imaging device, and more particularly to a small-sized solid-state imaging device.
【０００２】[0002]
【従来の技術】従来、固体撮像装置は例えば特開昭６０
−６２２７９号として提案されているものがある。この
固体撮像装置はセラミック等の外囲構体上に固体撮像素
子チップを固着し、この外囲構体の開口部を透光性平板
（カバーガラス）で閉塞し、上記チップとカバーガラス
の間に透光性樹脂を充填してある。2. Description of the Related Art Conventionally, a solid-state imaging device is disclosed in
There is one proposed as -62279. In this solid-state imaging device, a solid-state imaging device chip is fixed on an outer structure such as a ceramic, an opening of the outer structure is closed with a light-transmitting flat plate (cover glass), and a transparent film is provided between the chip and the cover glass. Filled with optical resin.
【０００３】[0003]
【発明が解決しようとする課題】しかし、特開昭６０−
６２２７９号の固体撮像装置には外囲構体あるために装
置全体が大型化してしまうという問題点があった。特に
内視鏡先端部に組み込まれるような超小形であることが
望まれる固体撮像装置では不都合であった。本発明は上
記問題点に着目してなされたものであり、パッケージが
小型化された固体撮像装置を提供することを目的とす
る。However, Japanese Patent Application Laid-Open No.
The solid-state imaging device of No. 62279 has a problem that the entire device is enlarged due to the surrounding structure. In particular, it is inconvenient for a solid-state imaging device that is desired to be ultra-small so as to be incorporated into the endoscope end. The present invention has been made in view of the above problems, and has as its object to provide a solid-state imaging device with a reduced package.
【０００４】[0004]
【課題を解決するための手段】側周面にベース側接続部
を設けたベース部材と、前面にイメージエリアとチップ
側接続部とを有し、上記ベース部材の前面に重着された
固体撮像素子チップと、上記固体撮像素子チップ側接続
部と上記ベース側接続部とを接続する接続部材と、上記
イメージエリアをカバーする透明プラスチックと、上記
透明プラスチック上に設けられるとともに前面が上記固
体撮像素子チップの前面と平行に設けられた上記ベース
部材の外形より大きなカバーガラスと、上記ベース部
材、上記固体撮像素子チップ、および上記透明プラスチ
ックの側周面で上記カバーガラスの後面に形成された上
記接続部材を覆う封止樹脂とからなる固体撮像装置であ
る。A base member having a base-side connecting portion to the side peripheral surface SUMMARY OF THE INVENTION, and an image area and the chip-side connecting portion to the front, Juchaku solid state imaging the front of the base member An element chip, a connection member for connecting the solid-state imaging device chip-side connection portion and the base-side connection portion, a transparent plastic covering the image area, and a front surface provided with the solid-state imaging device provided on the transparent plastic. A cover glass that is larger than the outer shape of the base member provided in parallel with the front surface of the chip, and the connection formed on the rear surface of the cover glass on the side peripheral surface of the base member, the solid-state imaging device chip, and the transparent plastic. This is a solid-state imaging device including a sealing resin covering a member.
【０００５】本発明の固体撮像装置は、側面にベース側
接続部を設けたベース部材と、表面にイメージエリアと
チップ側接続部とを有し、上記ベース部材の表面に重着
された固体撮像素子チップと、上記固体撮像素子チップ
側接続部と上記ベース側接続部とを接続部材によって接
続することで、ベース側接続部・接続部材・チップ側接
続部からなる部分を表側からみたときの寸法を小さくす
る。A solid-state image pickup device according to the present invention has a base member provided with a base-side connection portion on a side surface, an image area and a chip-side connection portion on the surface, and a solid-state image pickup device mounted on the surface of the base member. By connecting the element chip, the solid-state imaging device chip-side connection portion and the base-side connection portion with a connection member, a dimension when a portion including the base-side connection portion, the connection member, and the chip-side connection portion is viewed from the front side Smaller.
【０００６】そして、上記イメージエリアをカバーする
透明プラスチックと、上記透明プラスチック上に設けら
れるとともに表面が上記固体撮像素子チップの表面と平
行に設けられた上記ベース部材の外形より大きなカバー
ガラスと、上記ベース部材、上記固体撮像素子チップ、
および上記透明プラスチックの側面で上記カバーガラス
の裏面に形成された封止樹脂によって上記接続部材を覆
うことで、封止樹脂に表側からの外力が直接加わらず、
かつ透明プラスチックと封止樹脂はどちらもプラスチッ
クであるから、それらの熱膨張率が概ね等しくなる。A transparent plastic covering the image area; a cover glass provided on the transparent plastic and having a surface parallel to the surface of the solid-state imaging device chip and larger than an outer shape of the base member; Base member, the solid-state imaging device chip,
And by covering the connection member with a sealing resin formed on the back surface of the cover glass on the side surface of the transparent plastic, external force from the front side is not directly applied to the sealing resin,
In addition, since both the transparent plastic and the sealing resin are plastics, their thermal expansion coefficients are substantially equal.
【０００７】[0007]
【発明の実施の形態】第２図は、固体撮像装置を内蔵し
た内視鏡先端部の断面図である。内視鏡１０の挿入部の
先端部１１は、先端構成部本体１２を有し、この本体１
２には第１の取付孔１３と第２の取付孔１４とが穿設さ
れている。第１の取付孔は、先端構成部本体１２の中心
軸に対して偏心して形成されている。この第１の取付孔
１３にはカバーガラスレンズ１５、対物レンズの一部レ
ンズ系１６を内部に保持した明るさ絞り付のレンズ枠１
７が挿入、固着されている。更に、取付孔１３の後方か
らも対物レンズ１８が挿入されている。このレンズ１８
の後方の取付孔１３には固体撮像装置２０等が固定され
た固体撮像装置枠２１が挿入、固定されている。FIG. 2 is a sectional view of a distal end portion of an endoscope incorporating a solid-state imaging device. The distal end portion 11 of the insertion section of the endoscope 10 has a distal end component main body 12,
2, a first mounting hole 13 and a second mounting hole 14 are formed. The first mounting hole is formed eccentrically with respect to the central axis of the distal end component main body 12. The first mounting hole 13 has a cover glass lens 15 and a lens frame 1 with a brightness stop which internally holds a partial lens system 16 of the objective lens.
7 is inserted and fixed. Further, an objective lens 18 is inserted from behind the mounting hole 13. This lens 18
A solid-state imaging device frame 21 to which the solid-state imaging device 20 and the like are fixed is inserted and fixed in the rear mounting hole 13.
【０００８】この固体撮像装置２０は、セラミックまた
は、ガラス繊維を混入したエポキシ樹脂性のベース上に
固体撮像素子チップ２３が固着されている。このチップ
２３には所定面積のイメージエリアとチップ側ボンディ
ングパッドとが形成される。一方、ベース２２にはリー
ド足２６がベース２２を貫通して両側に突出し、チップ
２３の上面とほぼ同じ高さに形成してある。ボンディン
グパッドとリード足２６とは、ボンディングワイヤ２７
により接続されている。また、イメージエリア上には第
１のカバーガラス２８が接合されており、更に第１のカ
バーガラス２８上に第２のカバーガラス２９がボンディ
ングワイヤ２７によるボンディング部を覆うように重ね
て接合されている。ここで、第１、第２のカバーガラス
２８，２９は、ガラス製ではなく光学プラスチックのよ
うな透明プラスチック板でもよい。但し、その両面の平
面度、平行度は精度よく形成されている必要がある。In this solid-state image pickup device 20, a solid-state image pickup device chip 23 is fixed on a base made of an epoxy resin mixed with ceramic or glass fiber. The chip 23 has an image area of a predetermined area and a chip-side bonding pad. On the other hand, lead feet 26 project from the base 22 to both sides through the base 22 and are formed at substantially the same height as the upper surface of the chip 23. The bonding pad and the lead foot 26 are connected to the bonding wire 27
Connected by Further, a first cover glass 28 is joined on the image area, and a second cover glass 29 is further joined on the first cover glass 28 so as to cover the bonding portion by the bonding wire 27. I have. Here, the first and second cover glasses 28 and 29 may be made of a transparent plastic plate such as optical plastic instead of glass. However, it is necessary that the flatness and parallelism of both surfaces be formed with high accuracy.
【０００９】このように構成された固体撮像装置２０の
ベース２２裏面には回路基板３３が固体撮像装置２０の
リード足２６をハンダ付け等により接続固定している。
この基板３３上にはＩＣ等の電子部品３４も実装されて
いる。第２図ではチップ・オン・ボード方式で実装され
ている。また、基板３３に対しては信号線３５も接続さ
れ、電子部品３４は、封止樹脂３６で封止されている。A circuit board 33 connects and fixes the lead legs 26 of the solid-state image pickup device 20 to the back surface of the base 22 of the solid-state image pickup device 20 having such a configuration by soldering or the like.
Electronic components 34 such as ICs are also mounted on the substrate 33. In FIG. 2, it is mounted in a chip-on-board system. The signal line 35 is also connected to the substrate 33, and the electronic component 34 is sealed with a sealing resin 36.
【００１０】この固体撮像装置２０と回路基板３３等と
の組立体は、固体撮像装置枠２１の前方当接面に第２の
カバーガラス２９の入射面が当接するまで挿入され、補
強樹脂３７等により固定される。The assembly of the solid-state imaging device 20 and the circuit board 33 is inserted into the front abutting surface of the solid-state imaging device frame 21 until the incident surface of the second cover glass 29 abuts. Is fixed by
【００１１】一方、第２の取付孔１４は、第１の取付孔
１３の周囲に三日月状に形成されており、多数のライト
ガイドファイバー３８が挿入、固定されている。このラ
イトガイドファイバー３８の他端からは光源装置（図示
せず）からの照明光が入射され、一端から出射した光束
が観察部位を照明する。On the other hand, the second mounting hole 14 is formed in a crescent shape around the first mounting hole 13, and a number of light guide fibers 38 are inserted and fixed. Illumination light from a light source device (not shown) is incident on the other end of the light guide fiber 38, and a light beam emitted from one end illuminates the observation site.
【００１２】以下、第１図に基づいて本発明の第１の実
施の形態を説明する。前述のような内視鏡先端部等に内
蔵される固体撮像装置において、第１の実施の形態の固
体撮像装置６０は、セラミック製のベース６１上に固体
撮像素子チップ６２を固着して形成されており、このベ
ース６１の側面から裏面にかけて金属メッキからなり、
ベース６１側接続部である導電部６３が形成されてい
る。ベース６１の裏面には各導電部６３に接続するよう
にリード足６４が植設され、ベース６１側面の導電部６
３と固体撮像素子チップ６２側接続部であるボンディン
グパッドとはボンディングワイヤ６５により接続されて
いる。Hereinafter, a first embodiment of the present invention will be described with reference to FIG. In the solid-state imaging device built in the endoscope end portion or the like as described above, the solid-state imaging device 60 of the first embodiment is formed by fixing a solid-state imaging device chip 62 on a ceramic base 61. It consists of metal plating from the side to the back of this base 61,
A conductive portion 63 that is a connection portion on the base 61 side is formed. Lead feet 64 are implanted on the back surface of the base 61 so as to be connected to the respective conductive portions 63, and the conductive portions 6 on the side surfaces of the base 61.
The bonding wire 3 is connected to a bonding pad, which is a connection portion on the solid-state image sensor chip 62 side, by a bonding wire 65.
【００１３】上記固体撮像素子チップ６２のイメージエ
リア上には光学プラスチックのような材質からなる透明
プラスチック６６が接合され、透明プラスチック６６上
にはカバーガラス６７が接合されている。このカバーガ
ラス６７は、ベース６１の外形より大きく形成されてお
りカバーガラス６７の下面からボンディング部を封止す
るように封止樹脂６８が充填されている。A transparent plastic 66 made of a material such as optical plastic is bonded on the image area of the solid-state image sensor chip 62, and a cover glass 67 is bonded on the transparent plastic 66. The cover glass 67 is formed to be larger than the outer shape of the base 61, and is filled with a sealing resin 68 so as to seal the bonding portion from the lower surface of the cover glass 67.
【００１４】この第１の実施の形態によれば、ベース６
１側接続部であるベース６１側面の導電部６３を接続部
材であるボンディングワイヤ６５によって接続し、導電
部６３がベース６１の裏面に植設され後方に延設された
リード足６４と接続している。従って、ベース側接続部
・接続部材・チップ側接続部からなる部分を表側からみ
たときの寸法は、ベース６１の上面にボンディングワイ
ヤ６５を接続するよりも小さくできる、という効果があ
る。According to the first embodiment, the base 6
The conductive portion 63 on the side surface of the base 61 that is the one-side connecting portion is connected by a bonding wire 65 that is a connecting member, and the conductive portion 63 is connected to a lead foot 64 that is planted on the back surface of the base 61 and extends rearward. I have. Accordingly, there is an effect that the size of the portion including the base-side connection portion, the connection member, and the chip-side connection portion when viewed from the front side can be made smaller than when the bonding wire 65 is connected to the upper surface of the base 61.
【００１５】また、カバーガラスが封止樹脂の表側を覆
っているので、封止樹脂に直接表側からの外力が加わら
ることがないので、封止樹脂による封止性が損なわれる
ことがない。そして、透明プラスチックと封止樹脂は、
どちらもプラスチックでありそれらの熱膨張率は概ね等
しいことから、透明プラスチックと封止樹脂からなる部
分は、熱膨張率の差から生じる境界部分の剥離などの封
止性の劣化が起こり難く、封止性能を高く保つことがで
きる。Since the cover glass covers the front side of the sealing resin, no external force is directly applied to the sealing resin from the front side, so that the sealing property of the sealing resin is not impaired. And transparent plastic and sealing resin
Since both are plastics and their thermal expansion coefficients are almost the same, the portion composed of the transparent plastic and the sealing resin hardly suffers from deterioration in sealing properties such as peeling of the boundary portion caused by the difference in the thermal expansion coefficient, and thus the sealing is difficult. The stopping performance can be kept high.
【００１６】尚、本発明は、上記実施の形態に限定され
ることなく、種々の変形が考えられる。透明プラスチッ
ク６６は、赤外カットフィルターでもよく、カバーガラ
ス６７は、モアレ除去フィルター、赤外カットフィルタ
ーとすることもできる。It should be noted that the present invention is not limited to the above embodiment, and various modifications are possible. The transparent plastic 66 may be an infrared cut filter, and the cover glass 67 may be a moiré removal filter or an infrared cut filter.
【００１７】[0017]
【発明の効果】上述したように、本発明は、固体撮像素
子チップの表面とベース部材の側面とを接続部材で接続
したので、固体撮像装置の小型化を図ることができる。
加えて、固体撮像素子チップイメージエリア上に透明プ
ラスチックが接合し、その上にカバーガラスをベース６
１の外形より大きく形成して接合した。そして、カバー
ガラス下面から接続部を封止するように封止樹脂が充填
されているから、封止性能が高い固体撮像装置が得られ
る。As described above, according to the present invention, since the surface of the solid-state imaging device chip and the side surface of the base member are connected by the connecting member, the size of the solid-state imaging device can be reduced.
In addition, a transparent plastic is bonded onto the solid-state imaging device chip image area, and a cover glass is
1 and formed and joined together. Since the sealing resin is filled so as to seal the connection portion from the lower surface of the cover glass, a solid-state imaging device having high sealing performance can be obtained.
【図１】本発明の第１の実施の形態の固体撮像装置の断
面図。FIG. 1 is a sectional view of a solid-state imaging device according to a first embodiment of the present invention.
【図２】固体撮像装置を内蔵した内視鏡先端部を説明す
る断面図。FIG. 2 is a cross-sectional view illustrating an endoscope end portion incorporating a solid-state imaging device.
２０，６０ 固体撮像装置 ２２，６１ ベース ２３，６２ 固体撮像素子チップ ６６ 透明プラスチック ６７ カバーガラス ３２，６８ 封止樹脂 20, 60 solid-state imaging device 22, 61 base 23, 62 solid-state imaging device chip 66 transparent plastic 67 cover glass 32, 68 sealing resin
Claims (1)
部材と、前面にイメージエリアとチップ側接続部とを有
し、上記ベース部材の前面に重着された固体撮像素子チ
ップと、上記固体撮像素子チップ側接続部と上記ベース
側接続部とを接続する接続部材と、上記イメージエリア
をカバーする透明プラスチックと、上記透明プラスチッ
ク上に設けられるとともに前面が上記固体撮像素子チッ
プの前面と平行に設けられた上記ベース部材の外形より
大きなカバーガラスと、上記ベース部材、上記固体撮像
素子チップ、および上記透明プラスチックの側周面で上
記カバーガラスの後面に形成された上記接続部材を覆う
封止樹脂とからなることを特徴とする固体撮像装置。And 1. A base provided with base-side connecting portion to the side peripheral surface member, and a image area and the chip-side connecting portion to the front, and the solid-state image sensor chips Juchaku on the front surface of the base member, a connecting member for connecting the solid-state image pickup device chip-side connecting portion and the base-side connecting portion, a transparent plastic covering the image area, the front with provided on the transparent plastic and the front of the solid state imaging device chip A cover glass that is larger than the outer shape of the base member provided in parallel, and a seal that covers the base member, the solid-state imaging device chip, and the connection member formed on the rear surface of the cover glass with a side peripheral surface of the transparent plastic. A solid-state imaging device comprising a resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7191428A JP2653769B2 (en) | 1995-07-27 | 1995-07-27 | Solid-state imaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7191428A JP2653769B2 (en) | 1995-07-27 | 1995-07-27 | Solid-state imaging device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61209265A Division JPH0813107B2 (en) | 1986-09-05 | 1986-09-05 | Solid-state imaging device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08181298A JPH08181298A (en) | 1996-07-12 |
| JP2653769B2 true JP2653769B2 (en) | 1997-09-17 |
Family
ID=16274456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7191428A Expired - Lifetime JP2653769B2 (en) | 1995-07-27 | 1995-07-27 | Solid-state imaging device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2653769B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998020560A1 (en) * | 1996-11-05 | 1998-05-14 | Kureha Kagaku Kogyo Kabushiki Kaisha | Plastic lidding material for solid-state image pickup element package and method for manufacturing the same |
| US7508441B1 (en) | 2002-09-27 | 2009-03-24 | Hoya Corporation | Electronic still camera and image pick-up unit |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6122865A (en) * | 1984-07-11 | 1986-01-31 | 扶桑薬品工業株式会社 | Replenishing solution for artificial kidney apparatus |
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1995
- 1995-07-27 JP JP7191428A patent/JP2653769B2/en not_active Expired - Lifetime
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| Publication number | Publication date |
|---|---|
| JPH08181298A (en) | 1996-07-12 |
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| EXPY | Cancellation because of completion of term |